WO2004001101A3 - Electrolytic bath for the electrodeposition of noble metals and their alloys - Google Patents

Electrolytic bath for the electrodeposition of noble metals and their alloys Download PDF

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Publication number
WO2004001101A3
WO2004001101A3 PCT/EP2003/006637 EP0306637W WO2004001101A3 WO 2004001101 A3 WO2004001101 A3 WO 2004001101A3 EP 0306637 W EP0306637 W EP 0306637W WO 2004001101 A3 WO2004001101 A3 WO 2004001101A3
Authority
WO
WIPO (PCT)
Prior art keywords
electrodeposition
alloys
noble metals
electrolytic bath
bath
Prior art date
Application number
PCT/EP2003/006637
Other languages
French (fr)
Other versions
WO2004001101A2 (en
Inventor
Pietro Luigi Cavallotti
Massimiliano Bestetti
Antonello Vicenzo
Luca Magagnin
Massimo Seregni
Original Assignee
Milano Politecnico
Pietro Luigi Cavallotti
Massimiliano Bestetti
Antonello Vicenzo
Luca Magagnin
Massimo Seregni
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Milano Politecnico, Pietro Luigi Cavallotti, Massimiliano Bestetti, Antonello Vicenzo, Luca Magagnin, Massimo Seregni filed Critical Milano Politecnico
Priority to AU2003242749A priority Critical patent/AU2003242749A1/en
Publication of WO2004001101A2 publication Critical patent/WO2004001101A2/en
Publication of WO2004001101A3 publication Critical patent/WO2004001101A3/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Cosmetics (AREA)

Abstract

The present invention herein refers to an electrolytic bath for the electrodeposition of noble metals, of their alloys, with or without tin and to the electrodeposition of noble metals and their alloys with tin using said bath. In an embodiment the electrolytic bath for the electrodeposition of noble metals and their alloys comprises: noble metal sources; halides; stabilizing additives; thiourea; acids.
PCT/EP2003/006637 2002-06-24 2003-06-23 Electrolytic bath for the electrodeposition of noble metals and their alloys WO2004001101A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003242749A AU2003242749A1 (en) 2002-06-24 2003-06-23 Electrolytic bath for the electrodeposition of noble metals and their alloys

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ITMI2002A001388 2002-06-24
IT2002MI001388A ITMI20021388A1 (en) 2002-06-24 2002-06-24 ELECTROLYTIC BATH FOR THE ELECTRODEPOSITION OF NOBLE METALS AND LOROLEGHE WITH POND

Publications (2)

Publication Number Publication Date
WO2004001101A2 WO2004001101A2 (en) 2003-12-31
WO2004001101A3 true WO2004001101A3 (en) 2004-03-18

Family

ID=11450075

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2003/006637 WO2004001101A2 (en) 2002-06-24 2003-06-23 Electrolytic bath for the electrodeposition of noble metals and their alloys

Country Status (3)

Country Link
AU (1) AU2003242749A1 (en)
IT (1) ITMI20021388A1 (en)
WO (1) WO2004001101A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4367457B2 (en) 2006-07-06 2009-11-18 パナソニック電工株式会社 Silver film, silver film manufacturing method, LED mounting substrate, and LED mounting substrate manufacturing method
US10260159B2 (en) * 2013-07-05 2019-04-16 The Boeing Company Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated surfaces by doping tin with gold
CN104120463B (en) * 2014-06-25 2016-06-22 济南大学 The one of steel substrate is without the cuprous electroplated copper surface method of modifying of cyanogen
CN104120468B (en) * 2014-06-25 2016-08-03 济南大学 A kind of without cyanogen cuprous electro-coppering zinc alloy solution
CN110396705B (en) * 2019-08-07 2021-08-31 中国科学院合肥物质科学研究院 Method for preparing nano porous silver by electrodeposition

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CS263723B1 (en) * 1987-10-21 1989-04-14 Dostal Jaroslav Glossforming additive forming with ions of bivalent zinc sufficient strong complexes
JPH09143786A (en) * 1995-11-15 1997-06-03 Ebara Yuujiraito Kk Silver and silver alloy plating bath
JP2000080493A (en) * 1998-09-02 2000-03-21 Daiwa Kasei Kenkyusho:Kk Tin or tin alloy plating bath
EP1001054A2 (en) * 1998-11-05 2000-05-17 C. Uyemura & Co, Ltd Tin-copper alloy electroplating bath and plating process therewith

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CS263723B1 (en) * 1987-10-21 1989-04-14 Dostal Jaroslav Glossforming additive forming with ions of bivalent zinc sufficient strong complexes
JPH09143786A (en) * 1995-11-15 1997-06-03 Ebara Yuujiraito Kk Silver and silver alloy plating bath
JP2000080493A (en) * 1998-09-02 2000-03-21 Daiwa Kasei Kenkyusho:Kk Tin or tin alloy plating bath
EP1001054A2 (en) * 1998-11-05 2000-05-17 C. Uyemura & Co, Ltd Tin-copper alloy electroplating bath and plating process therewith

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
DATABASE CA [online] CHEMICAL ABSTRACTS SERVICE, COLUMBUS, OHIO, US; BESTETTI, M. ET AL: "Electrodeposition of Cu-Sn and Ag-Sn alloys from thiourea containing electrolytes", XP002266576, retrieved from STN Database accession no. 137:328035 CA *
DATABASE CA [online] CHEMICAL ABSTRACTS SERVICE, COLUMBUS, OHIO, US; DOSTAL, JAROSLAV ET AL: "Gloss-forming additive forming sufficiently strong complexes with ions of bivalent zinc", XP002266578, retrieved from STN Database accession no. 118:156813 CA *
DATABASE CA [online] CHEMICAL ABSTRACTS SERVICE, COLUMBUS, OHIO, US; ONO, KANJI ET AL: "Cyanide-free baths for electroplating silver and silver alloys", XP002266577, retrieved from STN Database accession no. 127:72195 CA *
DATABASE CA [online] CHEMICAL ABSTRACTS SERVICE, COLUMBUS, OHIO, US; TAKEUCHI, TAKAO ET AL: "Tin or tin alloy electroplating baths and electroplated products obtained by using them", XP002266575, retrieved from STN Database accession no. 132:225887 CA *
PROCEEDINGS - AESF SUR/FIN ANNUAL INTERNATIONAL TECHNICAL CONFERENCE (2002) 745-754, 2002 *

Also Published As

Publication number Publication date
AU2003242749A1 (en) 2004-01-06
ITMI20021388A1 (en) 2003-12-24
ITMI20021388A0 (en) 2002-06-24
AU2003242749A8 (en) 2004-01-06
WO2004001101A2 (en) 2003-12-31

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