AU2002365457A1 - Electrolysis bath for electrodepositing silver-tin alloys - Google Patents

Electrolysis bath for electrodepositing silver-tin alloys

Info

Publication number
AU2002365457A1
AU2002365457A1 AU2002365457A AU2002365457A AU2002365457A1 AU 2002365457 A1 AU2002365457 A1 AU 2002365457A1 AU 2002365457 A AU2002365457 A AU 2002365457A AU 2002365457 A AU2002365457 A AU 2002365457A AU 2002365457 A1 AU2002365457 A1 AU 2002365457A1
Authority
AU
Australia
Prior art keywords
electrolysis bath
tin alloys
electrodepositing silver
electrodepositing
silver
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002365457A
Other versions
AU2002365457A8 (en
Inventor
Marc De Vogelaere
Christian Hansen
Volkmar Sommer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of AU2002365457A1 publication Critical patent/AU2002365457A1/en
Publication of AU2002365457A8 publication Critical patent/AU2002365457A8/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
AU2002365457A 2001-11-15 2002-11-06 Electrolysis bath for electrodepositing silver-tin alloys Abandoned AU2002365457A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10158227.7 2001-11-15
DE10158227A DE10158227A1 (en) 2001-11-15 2001-11-15 Electrolysis bath for the electrodeposition of silver-tin alloys
PCT/DE2002/004163 WO2003046260A2 (en) 2001-11-15 2002-11-06 Electrolysis bath for electrodepositing silver-tin alloys

Publications (2)

Publication Number Publication Date
AU2002365457A1 true AU2002365457A1 (en) 2003-06-10
AU2002365457A8 AU2002365457A8 (en) 2003-06-10

Family

ID=7707178

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002365457A Abandoned AU2002365457A1 (en) 2001-11-15 2002-11-06 Electrolysis bath for electrodepositing silver-tin alloys

Country Status (6)

Country Link
US (1) US20050077186A1 (en)
EP (1) EP1442160A2 (en)
JP (1) JP2005510632A (en)
AU (1) AU2002365457A1 (en)
DE (1) DE10158227A1 (en)
WO (1) WO2003046260A2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4756886B2 (en) * 2005-03-22 2011-08-24 石原薬品株式会社 Non-cyan tin-silver alloy plating bath
DE102005055742A1 (en) * 2005-11-23 2007-05-24 Robert Bosch Gmbh Electrochemical process to coat electrical connector metal component with tin or silver
JP6088295B2 (en) * 2013-03-07 2017-03-01 ローム・アンド・ハース電子材料株式会社 Tin alloy plating solution
CN108350591B (en) * 2015-09-02 2021-05-25 席勒斯材料科学有限公司 Plating or coating method
TWI728217B (en) 2016-12-28 2021-05-21 德商德國艾托特克公司 Tin plating bath and a method for depositing tin or tin alloy onto a surface of a substrate
EP3578693B1 (en) 2018-06-08 2020-04-15 ATOTECH Deutschland GmbH Aqueous composition for depositing a tin silver alloy and method for electrolytically depositing such an alloy
EP3770298A1 (en) 2019-07-24 2021-01-27 ATOTECH Deutschland GmbH Tin plating bath and a method for depositing tin or tin alloy onto a surface of a substrate
US20220220617A1 (en) 2019-05-28 2022-07-14 Atotech Deutschland Gmbh Tin plating bath and a method for depositing tin or tin alloy onto a surface of a substrate
US11242609B2 (en) 2019-10-15 2022-02-08 Rohm and Hass Electronic Materials LLC Acidic aqueous silver-nickel alloy electroplating compositions and methods
CN117888094B (en) * 2023-12-22 2024-10-29 中山博美新材料科技有限公司 Composite solution for electroless tin deposition, tin deposition process and application thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0666342B1 (en) * 1994-02-05 1998-05-06 W.C. Heraeus GmbH Bath for electroplating silver-tin alloys
US6099713A (en) * 1996-11-25 2000-08-08 C. Uyemura & Co., Ltd. Tin-silver alloy electroplating bath and tin-silver alloy electroplating process
JP3301707B2 (en) * 1997-01-20 2002-07-15 ディップソール株式会社 Tin-silver alloy acid electroplating bath
US6087714A (en) * 1998-04-27 2000-07-11 Matsushita Electric Industrial Co., Ltd. Semiconductor devices having tin-based solder film containing no lead and process for producing the devices
JP3816241B2 (en) * 1998-07-14 2006-08-30 株式会社大和化成研究所 Aqueous solution for reducing and precipitating metals

Also Published As

Publication number Publication date
US20050077186A1 (en) 2005-04-14
WO2003046260A2 (en) 2003-06-05
AU2002365457A8 (en) 2003-06-10
EP1442160A2 (en) 2004-08-04
DE10158227A1 (en) 2003-06-05
JP2005510632A (en) 2005-04-21
WO2003046260A3 (en) 2003-08-28

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase