AU2002365457A8 - Electrolysis bath for electrodepositing silver-tin alloys - Google Patents

Electrolysis bath for electrodepositing silver-tin alloys

Info

Publication number
AU2002365457A8
AU2002365457A8 AU2002365457A AU2002365457A AU2002365457A8 AU 2002365457 A8 AU2002365457 A8 AU 2002365457A8 AU 2002365457 A AU2002365457 A AU 2002365457A AU 2002365457 A AU2002365457 A AU 2002365457A AU 2002365457 A8 AU2002365457 A8 AU 2002365457A8
Authority
AU
Australia
Prior art keywords
electrolysis bath
tin alloys
electrodepositing silver
electrodepositing
silver
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002365457A
Other versions
AU2002365457A1 (en
Inventor
Marc De Vogelaere
Volkmar Sommer
Christian Hansen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of AU2002365457A1 publication Critical patent/AU2002365457A1/en
Publication of AU2002365457A8 publication Critical patent/AU2002365457A8/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
AU2002365457A 2001-11-15 2002-11-06 Electrolysis bath for electrodepositing silver-tin alloys Abandoned AU2002365457A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10158227A DE10158227A1 (en) 2001-11-15 2001-11-15 Electrolysis bath for the electrodeposition of silver-tin alloys
DE10158227.7 2001-11-15
PCT/DE2002/004163 WO2003046260A2 (en) 2001-11-15 2002-11-06 Electrolysis bath for electrodepositing silver-tin alloys

Publications (2)

Publication Number Publication Date
AU2002365457A1 AU2002365457A1 (en) 2003-06-10
AU2002365457A8 true AU2002365457A8 (en) 2003-06-10

Family

ID=7707178

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002365457A Abandoned AU2002365457A1 (en) 2001-11-15 2002-11-06 Electrolysis bath for electrodepositing silver-tin alloys

Country Status (6)

Country Link
US (1) US20050077186A1 (en)
EP (1) EP1442160A2 (en)
JP (1) JP2005510632A (en)
AU (1) AU2002365457A1 (en)
DE (1) DE10158227A1 (en)
WO (1) WO2003046260A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4756886B2 (en) * 2005-03-22 2011-08-24 石原薬品株式会社 Non-cyan tin-silver alloy plating bath
DE102005055742A1 (en) * 2005-11-23 2007-05-24 Robert Bosch Gmbh Electrochemical process to coat electrical connector metal component with tin or silver
JP6088295B2 (en) * 2013-03-07 2017-03-01 ローム・アンド・ハース電子材料株式会社 Tin alloy plating solution
WO2017039460A1 (en) * 2015-09-02 2017-03-09 Auckland Uniservices Limited A plating or coating method
EP3562974B1 (en) 2016-12-28 2020-10-07 ATOTECH Deutschland GmbH Tin plating bath and a method for depositing tin or tin alloy onto a surface of a substrate
EP3578693B1 (en) 2018-06-08 2020-04-15 ATOTECH Deutschland GmbH Aqueous composition for depositing a tin silver alloy and method for electrolytically depositing such an alloy
EP3770298A1 (en) 2019-07-24 2021-01-27 ATOTECH Deutschland GmbH Tin plating bath and a method for depositing tin or tin alloy onto a surface of a substrate
TW202106928A (en) 2019-05-28 2021-02-16 德商德國艾托特克公司 Tin plating bath and a method for depositing tin or tin alloy onto a surface of a substrate
US11242609B2 (en) 2019-10-15 2022-02-08 Rohm and Hass Electronic Materials LLC Acidic aqueous silver-nickel alloy electroplating compositions and methods

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2117995T3 (en) * 1994-02-05 1998-09-01 Heraeus Gmbh W C BATH FOR GALVANIC DEPOSIT OF SILVER-TIN ALLOYS.
US6099713A (en) * 1996-11-25 2000-08-08 C. Uyemura & Co., Ltd. Tin-silver alloy electroplating bath and tin-silver alloy electroplating process
JP3301707B2 (en) * 1997-01-20 2002-07-15 ディップソール株式会社 Tin-silver alloy acid electroplating bath
US6087714A (en) * 1998-04-27 2000-07-11 Matsushita Electric Industrial Co., Ltd. Semiconductor devices having tin-based solder film containing no lead and process for producing the devices
JP3816241B2 (en) * 1998-07-14 2006-08-30 株式会社大和化成研究所 Aqueous solution for reducing and precipitating metals

Also Published As

Publication number Publication date
AU2002365457A1 (en) 2003-06-10
DE10158227A1 (en) 2003-06-05
WO2003046260A2 (en) 2003-06-05
EP1442160A2 (en) 2004-08-04
US20050077186A1 (en) 2005-04-14
JP2005510632A (en) 2005-04-21
WO2003046260A3 (en) 2003-08-28

Similar Documents

Publication Publication Date Title
EP1591563A4 (en) Tin-containing plating bath
AU2003226367A8 (en) Electropolishing and electroplating methods
EP1538229A4 (en) High-strength copper alloy
AU2003286738A8 (en) Molten metal pump system
AP2004002966A0 (en) Process for direct electrowinning of copper.
ZA200603262B (en) Molten cryolitic bath probe
EP1696047A4 (en) Roll for molten metal plating bath
HK1086043A1 (en) Electrolytic process for preparing metal sulfonates
AU2002365457A8 (en) Electrolysis bath for electrodepositing silver-tin alloys
AU2003244119A8 (en) Copper-tin-oxygen based alloy plating
GB0210569D0 (en) Bath lift
GB0225950D0 (en) Bath
EP1363298A4 (en) Electrolysis solution for electrolytic capacitors
AU2003291062A8 (en) Reduction of surface oxidation during electroplating
GB2346620B (en) Sn-Bi alloy plating bath and method of plating using the same
AU2003242749A8 (en) Electrolytic bath for the electrodeposition of noble metals and their alloys
EP1483430A4 (en) Non-cyanide copper plating process for zinc and zinc alloys
AU2003262712A8 (en) Cast ceramic anode for metal oxide electrolytic reduction
GC0000387A (en) Electrolytic cell regulation method
GB0121717D0 (en) Electrodeposition of metals
SG111103A1 (en) Limiting the loss of tin through oxidation in tin or tin alloy electroplating bath solutions
GB0006826D0 (en) Electrodeposition of metals
AU2002351115A8 (en) Electrochemical process for preparation of zinc metal
GB2351503B (en) Alloy plating
GB0113496D0 (en) Bath

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase