MY120262A - Lead-free solder powder and process for preparing the same - Google Patents

Lead-free solder powder and process for preparing the same

Info

Publication number
MY120262A
MY120262A MYPI9904553A MY120262A MY 120262 A MY120262 A MY 120262A MY PI9904553 A MYPI9904553 A MY PI9904553A MY 120262 A MY120262 A MY 120262A
Authority
MY
Malaysia
Prior art keywords
lead
preparing
same
free solder
solder powder
Prior art date
Application number
Inventor
Kenzo Hanawa
Kiyotaka Yanagi
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Priority to MYPI9904553 priority Critical patent/MY120262A/en
Publication of MY120262A publication Critical patent/MY120262A/en

Links

Landscapes

  • Powder Metallurgy (AREA)
  • Chemically Coating (AREA)

Abstract

LEAD-FREE SOLDER POWDER CHARACTERIZED IN THAT SOLDER ALLOY POWDER HAVING TIN-ZINC OR TIN-ZINC-BISMUTH AS A MAIN COMPOSITION AND CONTAINING NO LEAD HAS FORMED ON THE SURFACE THEREOF AN ORGANOMETALLIC COMPOUND FORMED OF MALONIC ACID AND A METAL OF SAID SOLDER ALLOY AND A PROCESS FOR PREPARING THE SAME.
MYPI9904553 1999-10-21 1999-10-21 Lead-free solder powder and process for preparing the same MY120262A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
MYPI9904553 MY120262A (en) 1999-10-21 1999-10-21 Lead-free solder powder and process for preparing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI9904553 MY120262A (en) 1999-10-21 1999-10-21 Lead-free solder powder and process for preparing the same

Publications (1)

Publication Number Publication Date
MY120262A true MY120262A (en) 2005-09-30

Family

ID=47227341

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI9904553 MY120262A (en) 1999-10-21 1999-10-21 Lead-free solder powder and process for preparing the same

Country Status (1)

Country Link
MY (1) MY120262A (en)

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