WO2001034310A1 - Process for the non-galvanic tin plating of copper or copper alloys - Google Patents
Process for the non-galvanic tin plating of copper or copper alloys Download PDFInfo
- Publication number
- WO2001034310A1 WO2001034310A1 PCT/US2000/030983 US0030983W WO0134310A1 WO 2001034310 A1 WO2001034310 A1 WO 2001034310A1 US 0030983 W US0030983 W US 0030983W WO 0134310 A1 WO0134310 A1 WO 0134310A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- tin
- copper
- thiourea
- accordance
- precipitation
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
Definitions
- a tin bath is suggested for the formation of a tin layer by chemical precipitation, which contains at least one foreign metal.
- the addition of foreign metals to the tin bath achieves an advantageous suppression of the diffusion processes, and thus a diffusion barrier is built which prevents the liberation of metals from the base material to a large extent.
- the advantages thus gained are good soldering characteristics at the surface and good durability of the tin layer.
- a diffusion-stable tin layer is produced which prevents the liberation of materials from the base layer to a large extent. This is an advantage especially in view of the copper liberation from potable water carrying copper tubing. However, an out-diffusion of lead and zinc from basic brass materials is prevented by a diffusion-stable tin layer.
- a metal of the group silver, bismuth, nickel, titanium, zirconium and indium is suggested as the foreign metal, whereby the use of indium has shown to be especially effective.
- the foreign metal for the formation of a diffusion barrier within the tin layer, at least one of the above metals is added to the tin bath as a foreign metal.
- thiourea and/or its derivative is used as the complexing agent.
- Thiourea as the complexing agent enables the liberation of positively charged copper ions.
- a copper thiourea complex forms which is soluble in electrolytes at a temperature of >28°C.
- As a result of the complexing of the copper its potential compared to that of tin is reduced.
- the then more noble tin precipitates, forming a layer of tin on the copper.
- the liberated copper ions concentrate in the electrolyte, whereby at a 3 copper concentration above 7 g/1 economical working is no longer possible since at these concentrations tin is no longer precipitated at satisfactory rates.
- a tin bath which preferably contains the following components:
- a source of tin preferably a bivalent tin salt, for example tin methanesulfonate, with 1 to 30 g/1 of tin in the tin bath;
- An acid preferably methanesulphomc acid with 5 to 200 g/1 in the tin bath, whereby the tin bath assumes a pH value of 0 to 3 ;
- a complexing agent preferably thiourea or a derivative in quantities of 10 to 200 g/1;
- a wetting agent in quantities of 1 to 10 g/1; 5. At least one foreign metal, preferably a metal in the group Ag, Bi, Ni, Ti, Zr and In in a proportion of
- a working temperature of the tin bath of 35 to 80°C is suggested.
- already known measures common to the state of the art can be taken when using the process described. This includes, for example, rinsing, pickling and drying of the work pieces.
- the process described by the invention makes it possible to produce diffusion-stable tin layers by means of chemical precipitation, whereby the diffusion barrier generated by the addition of foreign metals prevents the liberation of metals from the base materials in an advantageous manner.
- thiourea as complexing agent it becomes possible to remove the 5 copper ions liberated from the copper from the electrolyte by filtration, and thus to achieve a substantially extended useful life. Furthermore, in this manner a substantial acceleration of the process is achieved.
Abstract
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE60044943T DE60044943D1 (en) | 1999-11-12 | 2000-11-09 | METHOD FOR THE ELECTRICIZING OF COPPER OR COPPER ALLOY |
JP2001536299A JP4084569B2 (en) | 1999-11-12 | 2000-11-09 | Non-electric tin plating method for copper or copper alloy |
US10/129,998 US6821323B1 (en) | 1999-11-12 | 2000-11-09 | Process for the non-galvanic tin plating of copper or copper alloys |
EP00978519A EP1230034B1 (en) | 1999-11-12 | 2000-11-09 | Process for the non-galvanic tin plating of copper or copper alloys |
AT00978519T ATE480340T1 (en) | 1999-11-12 | 2000-11-09 | METHOD FOR ELECTROLESS TINNING OF COPPER OR COPPER ALLOYS |
AU15975/01A AU1597501A (en) | 1999-11-12 | 2000-11-09 | Process for the non-galvanic tin plating of copper or copper alloys |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19954613.4 | 1999-11-12 | ||
DE19954613A DE19954613A1 (en) | 1999-11-12 | 1999-11-12 | Process for electroless tinning of copper or copper alloys |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2001034310A1 true WO2001034310A1 (en) | 2001-05-17 |
Family
ID=7928903
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2000/030983 WO2001034310A1 (en) | 1999-11-12 | 2000-11-09 | Process for the non-galvanic tin plating of copper or copper alloys |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP1230034B1 (en) |
JP (1) | JP4084569B2 (en) |
CN (1) | CN1192125C (en) |
AT (1) | ATE480340T1 (en) |
AU (1) | AU1597501A (en) |
DE (2) | DE19954613A1 (en) |
WO (1) | WO2001034310A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010031181A1 (en) | 2010-07-09 | 2012-01-12 | Atotech Deutschland Gmbh | Method and arrangement for depositing a metal layer |
EP2882420A4 (en) * | 2012-08-13 | 2016-06-01 | Teni Boulikas | Improved methods for treating cancer with reduced renal toxicity |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4998704B2 (en) | 2007-01-22 | 2012-08-15 | 上村工業株式会社 | Method for forming substituted tin alloy plating film, substituted tin alloy plating bath, and method for maintaining plating performance |
US9175400B2 (en) * | 2009-10-28 | 2015-11-03 | Enthone Inc. | Immersion tin silver plating in electronics manufacture |
JP5830242B2 (en) * | 2010-12-28 | 2015-12-09 | ローム・アンド・ハース電子材料株式会社 | Method for removing impurities from plating solution |
JP5715411B2 (en) * | 2010-12-28 | 2015-05-07 | ローム・アンド・ハース電子材料株式会社 | Method for removing impurities from plating solution |
JP5937320B2 (en) * | 2011-09-14 | 2016-06-22 | ローム・アンド・ハース電子材料株式会社 | Method for removing impurities from plating solution |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5160422A (en) * | 1989-05-29 | 1992-11-03 | Shimizu Co., Ltd. | Bath for immersion plating tin-lead alloys |
US5217751A (en) * | 1991-11-27 | 1993-06-08 | Mcgean-Rohco, Inc. | Stabilized spray displacement plating process |
US5266103A (en) * | 1991-07-04 | 1993-11-30 | C. Uyemura & Co., Ltd. | Bath and method for the electroless plating of tin and tin-lead alloy |
EP0715003A1 (en) * | 1993-06-01 | 1996-06-05 | Dipsol Chemical Co., Ltd | Sn-Bi alloy-plating bath and plating method using the same |
JPH10245683A (en) * | 1997-03-06 | 1998-09-14 | Electroplating Eng Of Japan Co | Formation of tin alloy coating and tin alloy plating bath |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4749626A (en) | 1985-08-05 | 1988-06-07 | Olin Corporation | Whisker resistant tin coatings and baths and methods for making such coatings |
JP2833026B2 (en) | 1989-07-05 | 1998-12-09 | 上村工業株式会社 | Electroless tin plating method |
US5211831A (en) | 1991-11-27 | 1993-05-18 | Mcgean-Rohco, Inc. | Process for extending the life of a displacement plating bath |
US5391402A (en) * | 1993-12-03 | 1995-02-21 | Motorola | Immersion plating of tin-bismuth solder |
JP3419995B2 (en) | 1996-05-10 | 2003-06-23 | 株式会社大和化成研究所 | Electroless tin-silver alloy plating bath |
-
1999
- 1999-11-12 DE DE19954613A patent/DE19954613A1/en not_active Withdrawn
-
2000
- 2000-11-09 JP JP2001536299A patent/JP4084569B2/en not_active Expired - Lifetime
- 2000-11-09 DE DE60044943T patent/DE60044943D1/en not_active Expired - Lifetime
- 2000-11-09 AU AU15975/01A patent/AU1597501A/en not_active Abandoned
- 2000-11-09 AT AT00978519T patent/ATE480340T1/en not_active IP Right Cessation
- 2000-11-09 CN CNB008154627A patent/CN1192125C/en not_active Expired - Lifetime
- 2000-11-09 WO PCT/US2000/030983 patent/WO2001034310A1/en active Application Filing
- 2000-11-09 EP EP00978519A patent/EP1230034B1/en not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5160422A (en) * | 1989-05-29 | 1992-11-03 | Shimizu Co., Ltd. | Bath for immersion plating tin-lead alloys |
US5266103A (en) * | 1991-07-04 | 1993-11-30 | C. Uyemura & Co., Ltd. | Bath and method for the electroless plating of tin and tin-lead alloy |
US5217751A (en) * | 1991-11-27 | 1993-06-08 | Mcgean-Rohco, Inc. | Stabilized spray displacement plating process |
EP0715003A1 (en) * | 1993-06-01 | 1996-06-05 | Dipsol Chemical Co., Ltd | Sn-Bi alloy-plating bath and plating method using the same |
JPH10245683A (en) * | 1997-03-06 | 1998-09-14 | Electroplating Eng Of Japan Co | Formation of tin alloy coating and tin alloy plating bath |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010031181A1 (en) | 2010-07-09 | 2012-01-12 | Atotech Deutschland Gmbh | Method and arrangement for depositing a metal layer |
WO2012004325A2 (en) | 2010-07-09 | 2012-01-12 | Atotech Deutschland Gmbh | Method and arrangement for depositing a metal coating |
WO2012004325A3 (en) * | 2010-07-09 | 2012-03-22 | Atotech Deutschland Gmbh | Method and arrangement for depositing a metal coating |
US20130164451A1 (en) * | 2010-07-09 | 2013-06-27 | Helmut Bruckner | Method and Arrangement for Depositing a Metal Coating |
EP2882420A4 (en) * | 2012-08-13 | 2016-06-01 | Teni Boulikas | Improved methods for treating cancer with reduced renal toxicity |
Also Published As
Publication number | Publication date |
---|---|
DE60044943D1 (en) | 2010-10-21 |
ATE480340T1 (en) | 2010-09-15 |
EP1230034B1 (en) | 2010-09-08 |
DE19954613A1 (en) | 2001-05-17 |
EP1230034A1 (en) | 2002-08-14 |
JP4084569B2 (en) | 2008-04-30 |
EP1230034A4 (en) | 2003-01-08 |
AU1597501A (en) | 2001-06-06 |
CN1387465A (en) | 2002-12-25 |
CN1192125C (en) | 2005-03-09 |
JP2003514120A (en) | 2003-04-15 |
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