EP1230034A4 - Procede destine a l'etamage non galvanique du cuivre ou d'alliages de cuivre - Google Patents
Procede destine a l'etamage non galvanique du cuivre ou d'alliages de cuivreInfo
- Publication number
- EP1230034A4 EP1230034A4 EP00978519A EP00978519A EP1230034A4 EP 1230034 A4 EP1230034 A4 EP 1230034A4 EP 00978519 A EP00978519 A EP 00978519A EP 00978519 A EP00978519 A EP 00978519A EP 1230034 A4 EP1230034 A4 EP 1230034A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- copper
- tin
- tin plating
- galvanic
- copper alloys
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electrolytic Production Of Metals (AREA)
- Conductive Materials (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19954613A DE19954613A1 (de) | 1999-11-12 | 1999-11-12 | Verfahren zur stromlosen Verzinnung von Kupfer oder Kupferlegierungen |
DE19954613 | 1999-11-12 | ||
PCT/US2000/030983 WO2001034310A1 (fr) | 1999-11-12 | 2000-11-09 | Procede destine a l'etamage non galvanique du cuivre ou d'alliages de cuivre |
Publications (3)
Publication Number | Publication Date |
---|---|
EP1230034A1 EP1230034A1 (fr) | 2002-08-14 |
EP1230034A4 true EP1230034A4 (fr) | 2003-01-08 |
EP1230034B1 EP1230034B1 (fr) | 2010-09-08 |
Family
ID=7928903
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP00978519A Expired - Lifetime EP1230034B1 (fr) | 1999-11-12 | 2000-11-09 | Procede destine a l'etamage non galvanique du cuivre ou d'alliages de cuivre |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP1230034B1 (fr) |
JP (1) | JP4084569B2 (fr) |
CN (1) | CN1192125C (fr) |
AT (1) | ATE480340T1 (fr) |
AU (1) | AU1597501A (fr) |
DE (2) | DE19954613A1 (fr) |
WO (1) | WO2001034310A1 (fr) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4998704B2 (ja) | 2007-01-22 | 2012-08-15 | 上村工業株式会社 | 置換錫合金めっき皮膜の形成方法、置換錫合金めっき浴及びめっき性能の維持方法 |
US9175400B2 (en) * | 2009-10-28 | 2015-11-03 | Enthone Inc. | Immersion tin silver plating in electronics manufacture |
DE102010031181A1 (de) * | 2010-07-09 | 2012-01-12 | Atotech Deutschland Gmbh | Verfahren und Anordnung zum Abscheiden einer Metallschicht |
JP5830242B2 (ja) * | 2010-12-28 | 2015-12-09 | ローム・アンド・ハース電子材料株式会社 | めっき液中から不純物を除去する方法 |
JP5715411B2 (ja) * | 2010-12-28 | 2015-05-07 | ローム・アンド・ハース電子材料株式会社 | めっき液中から不純物を除去する方法 |
JP5937320B2 (ja) * | 2011-09-14 | 2016-06-22 | ローム・アンド・ハース電子材料株式会社 | めっき液中から不純物を除去する方法 |
MA37931A1 (fr) * | 2012-08-13 | 2016-07-29 | Teni Boulikas | Procédés améliorés permettant de traiter un cancer avec une toxicité rénale réduite |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5435838A (en) * | 1993-12-03 | 1995-07-25 | Motorola, Inc. | Immersion plating of tin-bismuth solder |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4749626A (en) | 1985-08-05 | 1988-06-07 | Olin Corporation | Whisker resistant tin coatings and baths and methods for making such coatings |
US5160422A (en) * | 1989-05-29 | 1992-11-03 | Shimizu Co., Ltd. | Bath for immersion plating tin-lead alloys |
JP2833026B2 (ja) | 1989-07-05 | 1998-12-09 | 上村工業株式会社 | 無電解錫めっき方法 |
US5266103A (en) * | 1991-07-04 | 1993-11-30 | C. Uyemura & Co., Ltd. | Bath and method for the electroless plating of tin and tin-lead alloy |
US5211831A (en) | 1991-11-27 | 1993-05-18 | Mcgean-Rohco, Inc. | Process for extending the life of a displacement plating bath |
US5217751A (en) * | 1991-11-27 | 1993-06-08 | Mcgean-Rohco, Inc. | Stabilized spray displacement plating process |
JP3274232B2 (ja) * | 1993-06-01 | 2002-04-15 | ディップソール株式会社 | 錫−ビスマス合金めっき浴及びそれを使用するめっき方法 |
JP3419995B2 (ja) | 1996-05-10 | 2003-06-23 | 株式会社大和化成研究所 | 無電解錫−銀合金めっき浴 |
JP3660777B2 (ja) * | 1997-03-06 | 2005-06-15 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | 錫合金膜の形成方法およびその錫合金めっき浴 |
-
1999
- 1999-11-12 DE DE19954613A patent/DE19954613A1/de not_active Withdrawn
-
2000
- 2000-11-09 AU AU15975/01A patent/AU1597501A/en not_active Abandoned
- 2000-11-09 WO PCT/US2000/030983 patent/WO2001034310A1/fr active Application Filing
- 2000-11-09 CN CNB008154627A patent/CN1192125C/zh not_active Expired - Lifetime
- 2000-11-09 AT AT00978519T patent/ATE480340T1/de not_active IP Right Cessation
- 2000-11-09 DE DE60044943T patent/DE60044943D1/de not_active Expired - Lifetime
- 2000-11-09 EP EP00978519A patent/EP1230034B1/fr not_active Expired - Lifetime
- 2000-11-09 JP JP2001536299A patent/JP4084569B2/ja not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5435838A (en) * | 1993-12-03 | 1995-07-25 | Motorola, Inc. | Immersion plating of tin-bismuth solder |
Also Published As
Publication number | Publication date |
---|---|
EP1230034A1 (fr) | 2002-08-14 |
CN1192125C (zh) | 2005-03-09 |
ATE480340T1 (de) | 2010-09-15 |
CN1387465A (zh) | 2002-12-25 |
AU1597501A (en) | 2001-06-06 |
JP2003514120A (ja) | 2003-04-15 |
DE60044943D1 (de) | 2010-10-21 |
WO2001034310A1 (fr) | 2001-05-17 |
EP1230034B1 (fr) | 2010-09-08 |
JP4084569B2 (ja) | 2008-04-30 |
DE19954613A1 (de) | 2001-05-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE275214T1 (de) | Bad und verfahren zur stromlosen plattierung von silber auf metallischen oberflächen | |
CN1848305B (zh) | 电子部件用导线以及由该导线构成的扁平电缆 | |
CN101636514B (zh) | 印刷基板端子 | |
EP1230034A4 (fr) | Procede destine a l'etamage non galvanique du cuivre ou d'alliages de cuivre | |
US6821323B1 (en) | Process for the non-galvanic tin plating of copper or copper alloys | |
EP1024211A3 (fr) | Bain de placage d'un alliage d'argent et méthode pour obtenir un film en alliage d'argent l'utilisant | |
WO2002072923A3 (fr) | Milieu electrolytique de depot d'alliages d'etain et procedes de depot de ces alliages | |
JP2011111663A (ja) | リフローSnめっき部材 | |
JP2003049280A5 (fr) | ||
EP1091023A3 (fr) | Composition d'alliage et procédé de plaquage | |
Liu et al. | Evolution of interfacial morphology of Sn–8.5 Zn–0.5 Ag–0.1 Al–xGa/Cu system during isothermal aging | |
AU2001296025A1 (en) | Method for removing lead from plated cylindrical article made of lead-containingcopper alloy and metal fitting for hydrant, and method for preventing leaching of lead from article made of lead-containing copper alloy and metal fitting for hydrant | |
JP2001131663A (ja) | リードメッキ用Sn合金 | |
JP2006265616A5 (ja) | 鉛フリーのスズ合金電気メッキ浴、及び当該メッキ浴を用いた溶解電流抑制式のスズ合金電気メッキ方法 | |
Tanaka et al. | Pb-free surface-finishing on electronic components’ terminals for Pb-free soldering assembly | |
IL98645A0 (en) | Alkaline corrosive solution | |
JPH0711477A (ja) | 貴金属めっき品 | |
JPH0611920B2 (ja) | 半田付け性に優れた複層めっき鋼板 | |
HUP0302517A2 (hu) | Gyengén ötvözött rézötvözet és ebből előállított üreges profilú építőelem | |
EP0638656A4 (fr) | Alliage a plaquer, son procede de placage et solution de placage. | |
MY120262A (en) | Lead-free solder powder and process for preparing the same | |
KR100193189B1 (ko) | 동 합금 및 철-니켈 합금 소재의 팔라듐-주석 합금도금조성물및도금방법 | |
GB2426766A (en) | Sn-zn alloy hot dip plated steel sheet | |
Selivanova | Tin-zinc electroplating of parts for soldering from acid bath | |
Mayes | Tin and tin alloy plating |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20020508 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR |
|
AX | Request for extension of the european patent |
Free format text: AL;LT;LV;MK;RO;SI |
|
A4 | Supplementary search report drawn up and despatched |
Effective date: 20021121 |
|
AK | Designated contracting states |
Kind code of ref document: A4 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR |
|
RIC1 | Information provided on ipc code assigned before grant |
Free format text: 7B 05D 1/18 A, 7C 23C 18/31 B, 7C 23C 18/48 B |
|
17Q | First examination report despatched |
Effective date: 20040820 |
|
GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
GRAS | Grant fee paid |
Free format text: ORIGINAL CODE: EPIDOSNIGR3 |
|
TPAC | Observations filed by third parties |
Free format text: ORIGINAL CODE: EPIDOSNTIPA |
|
GRAJ | Information related to disapproval of communication of intention to grant by the applicant or resumption of examination proceedings by the epo deleted |
Free format text: ORIGINAL CODE: EPIDOSDIGR1 |
|
17Q | First examination report despatched |
Effective date: 20040820 |
|
17Q | First examination report despatched |
Effective date: 20040820 |
|
TPAC | Observations filed by third parties |
Free format text: ORIGINAL CODE: EPIDOSNTIPA |
|
GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
GRAS | Grant fee paid |
Free format text: ORIGINAL CODE: EPIDOSNIGR3 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR |
|
REG | Reference to a national code |
Ref country code: GB Ref legal event code: FG4D |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: EP |
|
REG | Reference to a national code |
Ref country code: IE Ref legal event code: FG4D |
|
REF | Corresponds to: |
Ref document number: 60044943 Country of ref document: DE Date of ref document: 20101021 Kind code of ref document: P |
|
REG | Reference to a national code |
Ref country code: NL Ref legal event code: VDEP Effective date: 20100908 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20100908 Ref country code: AT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20100908 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: CY Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20100908 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: NL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20100908 Ref country code: GR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20101209 Ref country code: SE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20100908 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 20101118 Year of fee payment: 11 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: PT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20110110 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: BE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20100908 Ref country code: ES Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20101219 Ref country code: MC Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20101130 |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |
|
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LI Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20101130 Ref country code: CH Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20101130 |
|
26N | No opposition filed |
Effective date: 20110609 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: DK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20100908 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R097 Ref document number: 60044943 Country of ref document: DE Effective date: 20110609 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20101109 |
|
GBPC | Gb: european patent ceased through non-payment of renewal fee |
Effective date: 20111109 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LU Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20101109 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20111109 Ref country code: TR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20100908 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: PLFP Year of fee payment: 16 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: PLFP Year of fee payment: 17 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: PLFP Year of fee payment: 18 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R082 Ref document number: 60044943 Country of ref document: DE Representative=s name: RAUSCH WANISCHECK-BERGMANN BRINKMANN PARTNERSC, DE |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 20191127 Year of fee payment: 20 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: IT Payment date: 20191125 Year of fee payment: 20 Ref country code: FR Payment date: 20191125 Year of fee payment: 20 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R071 Ref document number: 60044943 Country of ref document: DE |