DE60044943D1 - Verfahren zur stromlosen verzinnung von kupfer oder kupferlegierungen - Google Patents

Verfahren zur stromlosen verzinnung von kupfer oder kupferlegierungen

Info

Publication number
DE60044943D1
DE60044943D1 DE60044943T DE60044943T DE60044943D1 DE 60044943 D1 DE60044943 D1 DE 60044943D1 DE 60044943 T DE60044943 T DE 60044943T DE 60044943 T DE60044943 T DE 60044943T DE 60044943 D1 DE60044943 D1 DE 60044943D1
Authority
DE
Germany
Prior art keywords
copper
tin
electricizing
electrolytes
tin layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60044943T
Other languages
English (en)
Inventor
Jane Bell
Joachim Heyer
Jurgen Hupe
Ingo Kalker
Marlies Kleinfeld
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Enthone Inc
Original Assignee
Enthone Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7928903&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE60044943(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Enthone Inc filed Critical Enthone Inc
Priority to DE60044943T priority Critical patent/DE60044943D1/de
Application granted granted Critical
Publication of DE60044943D1 publication Critical patent/DE60044943D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
DE60044943T 1999-11-12 2000-11-09 Verfahren zur stromlosen verzinnung von kupfer oder kupferlegierungen Expired - Lifetime DE60044943D1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE60044943T DE60044943D1 (de) 1999-11-12 2000-11-09 Verfahren zur stromlosen verzinnung von kupfer oder kupferlegierungen

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19954613A DE19954613A1 (de) 1999-11-12 1999-11-12 Verfahren zur stromlosen Verzinnung von Kupfer oder Kupferlegierungen
PCT/US2000/030983 WO2001034310A1 (en) 1999-11-12 2000-11-09 Process for the non-galvanic tin plating of copper or copper alloys
DE60044943T DE60044943D1 (de) 1999-11-12 2000-11-09 Verfahren zur stromlosen verzinnung von kupfer oder kupferlegierungen

Publications (1)

Publication Number Publication Date
DE60044943D1 true DE60044943D1 (de) 2010-10-21

Family

ID=7928903

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19954613A Withdrawn DE19954613A1 (de) 1999-11-12 1999-11-12 Verfahren zur stromlosen Verzinnung von Kupfer oder Kupferlegierungen
DE60044943T Expired - Lifetime DE60044943D1 (de) 1999-11-12 2000-11-09 Verfahren zur stromlosen verzinnung von kupfer oder kupferlegierungen

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE19954613A Withdrawn DE19954613A1 (de) 1999-11-12 1999-11-12 Verfahren zur stromlosen Verzinnung von Kupfer oder Kupferlegierungen

Country Status (7)

Country Link
EP (1) EP1230034B1 (de)
JP (1) JP4084569B2 (de)
CN (1) CN1192125C (de)
AT (1) ATE480340T1 (de)
AU (1) AU1597501A (de)
DE (2) DE19954613A1 (de)
WO (1) WO2001034310A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4998704B2 (ja) 2007-01-22 2012-08-15 上村工業株式会社 置換錫合金めっき皮膜の形成方法、置換錫合金めっき浴及びめっき性能の維持方法
US9175400B2 (en) * 2009-10-28 2015-11-03 Enthone Inc. Immersion tin silver plating in electronics manufacture
DE102010031181A1 (de) * 2010-07-09 2012-01-12 Atotech Deutschland Gmbh Verfahren und Anordnung zum Abscheiden einer Metallschicht
JP5830242B2 (ja) * 2010-12-28 2015-12-09 ローム・アンド・ハース電子材料株式会社 めっき液中から不純物を除去する方法
JP5715411B2 (ja) * 2010-12-28 2015-05-07 ローム・アンド・ハース電子材料株式会社 めっき液中から不純物を除去する方法
JP5937320B2 (ja) * 2011-09-14 2016-06-22 ローム・アンド・ハース電子材料株式会社 めっき液中から不純物を除去する方法
MA37931A1 (fr) * 2012-08-13 2016-07-29 Teni Boulikas Procédés améliorés permettant de traiter un cancer avec une toxicité rénale réduite

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4749626A (en) 1985-08-05 1988-06-07 Olin Corporation Whisker resistant tin coatings and baths and methods for making such coatings
US5160422A (en) * 1989-05-29 1992-11-03 Shimizu Co., Ltd. Bath for immersion plating tin-lead alloys
JP2833026B2 (ja) 1989-07-05 1998-12-09 上村工業株式会社 無電解錫めっき方法
US5266103A (en) * 1991-07-04 1993-11-30 C. Uyemura & Co., Ltd. Bath and method for the electroless plating of tin and tin-lead alloy
US5217751A (en) * 1991-11-27 1993-06-08 Mcgean-Rohco, Inc. Stabilized spray displacement plating process
US5211831A (en) 1991-11-27 1993-05-18 Mcgean-Rohco, Inc. Process for extending the life of a displacement plating bath
JP3274232B2 (ja) * 1993-06-01 2002-04-15 ディップソール株式会社 錫−ビスマス合金めっき浴及びそれを使用するめっき方法
US5391402A (en) * 1993-12-03 1995-02-21 Motorola Immersion plating of tin-bismuth solder
JP3419995B2 (ja) 1996-05-10 2003-06-23 株式会社大和化成研究所 無電解錫−銀合金めっき浴
JP3660777B2 (ja) * 1997-03-06 2005-06-15 日本エレクトロプレイテイング・エンジニヤース株式会社 錫合金膜の形成方法およびその錫合金めっき浴

Also Published As

Publication number Publication date
CN1387465A (zh) 2002-12-25
EP1230034A1 (de) 2002-08-14
ATE480340T1 (de) 2010-09-15
JP4084569B2 (ja) 2008-04-30
CN1192125C (zh) 2005-03-09
WO2001034310A1 (en) 2001-05-17
AU1597501A (en) 2001-06-06
EP1230034B1 (de) 2010-09-08
DE19954613A1 (de) 2001-05-17
EP1230034A4 (de) 2003-01-08
JP2003514120A (ja) 2003-04-15

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