DE69925107D1 - Bleifreies lötpulver und herstellungsverfahren dafür - Google Patents

Bleifreies lötpulver und herstellungsverfahren dafür

Info

Publication number
DE69925107D1
DE69925107D1 DE69925107T DE69925107T DE69925107D1 DE 69925107 D1 DE69925107 D1 DE 69925107D1 DE 69925107 T DE69925107 T DE 69925107T DE 69925107 T DE69925107 T DE 69925107T DE 69925107 D1 DE69925107 D1 DE 69925107D1
Authority
DE
Germany
Prior art keywords
lead
solder
tin
zinc
free solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69925107T
Other languages
English (en)
Other versions
DE69925107T2 (de
Inventor
Kenzo Hanawa
Kiyotaka Yanagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Mining and Smelting Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Publication of DE69925107D1 publication Critical patent/DE69925107D1/de
Application granted granted Critical
Publication of DE69925107T2 publication Critical patent/DE69925107T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/32—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/14—Treatment of metallic powder
    • B22F1/145—Chemical treatment, e.g. passivation or decarburisation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Powder Metallurgy (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adornments (AREA)
  • Lead Frames For Integrated Circuits (AREA)
DE69925107T 1998-10-01 1999-10-01 Bleifreies lötpulver und herstellungsverfahren dafür Expired - Fee Related DE69925107T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP27982998 1998-10-01
JP27982998A JP4138965B2 (ja) 1998-10-01 1998-10-01 無鉛ハンダ粉及びその製造方法
PCT/JP1999/005406 WO2000020161A1 (fr) 1998-10-01 1999-10-01 Poudre a souder sans plomb et son procede de production

Publications (2)

Publication Number Publication Date
DE69925107D1 true DE69925107D1 (de) 2005-06-09
DE69925107T2 DE69925107T2 (de) 2006-03-02

Family

ID=17616509

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69925107T Expired - Fee Related DE69925107T2 (de) 1998-10-01 1999-10-01 Bleifreies lötpulver und herstellungsverfahren dafür

Country Status (9)

Country Link
US (1) US6334905B1 (de)
EP (1) EP1038628B1 (de)
JP (1) JP4138965B2 (de)
KR (1) KR100375157B1 (de)
CN (1) CN1105619C (de)
AT (1) ATE294664T1 (de)
DE (1) DE69925107T2 (de)
TW (1) TW429196B (de)
WO (1) WO2000020161A1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6416597B1 (en) 2000-08-18 2002-07-09 Visteon Global Tech., Inc. Solder composition and a method for making the same
US6361626B1 (en) * 2000-10-24 2002-03-26 Fujitsu Limited Solder alloy and soldered bond
JP4684439B2 (ja) * 2001-03-06 2011-05-18 富士通株式会社 伝導性粒子、伝導性組成物および、電子機器の製造方法
US6676772B2 (en) * 2001-03-27 2004-01-13 Kabushiki Kaisha Toshiba Magnetic material
JP2002361476A (ja) * 2001-06-08 2002-12-18 Showa Denko Kk ハンダ金属、ハンダペースト、ハンダ付け方法、ハンダ付けした回路板、及びハンダ付けした接合物
JP3888573B2 (ja) * 2001-06-29 2007-03-07 富士電機ホールディングス株式会社 ハンダ組成物
JP4590133B2 (ja) * 2001-07-02 2010-12-01 日本金属工業株式会社 錫―亜鉛系鉛フリーはんだ合金粉末およびその製造方法
JP2003234433A (ja) * 2001-10-01 2003-08-22 Matsushita Electric Ind Co Ltd 半導体装置、半導体装置の実装方法、ならびに実装体およびその製造方法
JP4042418B2 (ja) * 2002-01-30 2008-02-06 昭和電工株式会社 ハンダ付けフラックス
US7357291B2 (en) 2002-01-30 2008-04-15 Showa Denko K.K. Solder metal, soldering flux and solder paste
SG107581A1 (en) 2002-03-26 2004-12-29 Inst Of High Performance Compu Lead free tin based solder composition
US20040149084A1 (en) * 2002-09-05 2004-08-05 Massachusetts Institute Of Technology Apparatus and process for manufacturing solder balls
JP2004165637A (ja) * 2002-10-21 2004-06-10 Matsushita Electric Ind Co Ltd 半導体装置
CN1313241C (zh) * 2005-01-20 2007-05-02 东南大学 低熔点锡锌无铅焊料合金及其焊膏
CN100453246C (zh) * 2006-07-13 2009-01-21 昆山成利焊锡制造有限公司 无铅软钎焊料
US7569164B2 (en) 2007-01-29 2009-08-04 Harima Chemicals, Inc. Solder precoating method
CN101234455B (zh) * 2007-01-30 2012-03-28 播磨化成株式会社 焊锡膏组合物及焊锡预涂法
EP1952935B1 (de) * 2007-02-01 2016-05-11 Harima Chemicals, Inc. Lötpastenzusammensetzung und Lötvorbeschichtungsverfahren
JP5160201B2 (ja) * 2007-11-20 2013-03-13 株式会社豊田中央研究所 はんだ材料及びその製造方法、接合体及びその製造方法、並びにパワー半導体モジュール及びその製造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2782259B2 (ja) * 1990-01-18 1998-07-30 千住金属工業株式会社 クリームはんだ
US5045127A (en) * 1990-06-04 1991-09-03 Quantum Materials, Inc. Non-ionic, water washable soldering paste
JPH04111993A (ja) 1990-08-31 1992-04-13 Showa Alum Corp フラックス被覆粉末ろう材及びその製造方法及び該ろう材を用いたろう付方法
US5272007A (en) 1992-02-21 1993-12-21 Union Carbide Chemicals & Plastics Technology Corporation Solder powder coated with parylene
JP3182899B2 (ja) 1992-08-12 2001-07-03 昭和電工株式会社 クリームはんだ
JP3216292B2 (ja) 1993-01-22 2001-10-09 豊田合成株式会社 ドアロアモール
US5390080A (en) * 1993-05-03 1995-02-14 Motorola Tin-zinc solder connection to a printed circuit board of the like
US5527628A (en) * 1993-07-20 1996-06-18 Iowa State University Research Foudation, Inc. Pb-free Sn-Ag-Cu ternary eutectic solder
US5439639A (en) * 1994-01-05 1995-08-08 Sandia Corporation Tin-silver-bismuth solders for electronics assembly
US5435857A (en) * 1994-01-06 1995-07-25 Qualitek International, Inc. Soldering composition
JPH08164496A (ja) 1994-10-11 1996-06-25 Hitachi Ltd Ｓｎ−Ｚｎ系、Ｓｎ−Ｚｎ−Ｂｉ系はんだ及びその表面処理方法並びにそれを用いた実装品
US5922403A (en) * 1996-03-12 1999-07-13 Tecle; Berhan Method for isolating ultrafine and fine particles
JP3379679B2 (ja) 1996-06-10 2003-02-24 千住金属工業株式会社 ソルダペースト
JPH106074A (ja) 1996-06-20 1998-01-13 Harima Chem Inc ソルダペースト組成物
JP3493101B2 (ja) * 1996-08-15 2004-02-03 三井金属鉱業株式会社 半田粉及びその製造方法、及びその半田粉を用いた半田ペースト
KR100209241B1 (ko) * 1996-09-25 1999-07-15 구자홍 무연솔더 조성물
US5837191A (en) * 1996-10-22 1998-11-17 Johnson Manufacturing Company Lead-free solder
JP3592486B2 (ja) * 1997-06-18 2004-11-24 株式会社東芝 ハンダ付け装置

Also Published As

Publication number Publication date
KR100375157B1 (ko) 2003-03-08
CN1286655A (zh) 2001-03-07
ATE294664T1 (de) 2005-05-15
EP1038628A4 (de) 2004-08-25
JP2000107882A (ja) 2000-04-18
CN1105619C (zh) 2003-04-16
WO2000020161A1 (fr) 2000-04-13
JP4138965B2 (ja) 2008-08-27
EP1038628A1 (de) 2000-09-27
EP1038628B1 (de) 2005-05-04
KR20010031965A (ko) 2001-04-16
US6334905B1 (en) 2002-01-01
TW429196B (en) 2001-04-11
DE69925107T2 (de) 2006-03-02

Similar Documents

Publication Publication Date Title
DE69925107D1 (de) Bleifreies lötpulver und herstellungsverfahren dafür
Zoran Miric et al. Lead‐free alloys
US4759490A (en) Method for soldering electronic components onto a printed wiring board using a solder paste
HUP0401432A2 (en) Improvements in or relating to solders
EP1001054A3 (de) Zinn-Kupfer-Legierung Elektroplattierungsbad und Plattierungsverfahren mit diesem Bad
US6428911B2 (en) Soldering method and soldered joint
EP1487646B1 (de) Verfahren zur entfernung von silber von einer leiterplatte
EP0363740A1 (de) Niedrigschmelzende Weichlotlegierung
JP4844842B2 (ja) プリント回路板及びプリント回路板の表面処理方法
JP4392020B2 (ja) 鉛フリーはんだボール
JP2007105750A (ja) Ｓｎ−Ｉｎ系はんだ合金
ATE249308T1 (de) Verfahren zum verkapseln von lotmetallpulver und danach hergestelltes lotmetallpulver
Takemoto et al. Dissolution rates of iron plating on soldering iron tips in molten lead‐free solders
JP2909351B2 (ja) はんだ付用フラックス
JP2004082134A (ja) 錫−亜鉛系鉛フリーはんだ合金及びその混合物
DE60044943D1 (de) Verfahren zur stromlosen verzinnung von kupfer oder kupferlegierungen
ATE365378T1 (de) Verfahren zur kontaktierung eines halbleiterbauelementes
JP2007175776A (ja) はんだ接合方法およびはんだ接合部
Puttlitz Overview of lead-free solder issues including selection
ATE34783T1 (de) Verfahren zur erhaltung der loetbarkeit von bleizinn-ueberzuegen; sowie durchkontaktierte leiterplatte.
JP3827487B2 (ja) はんだコーティング長尺材の製造方法
JP2004156094A (ja) Ｓｎ又はＳｎ合金に対する表面処理剤及び表面処理方法
JP2005296960A (ja) 金属表面処理剤、金属表面処理方法、はんだ接合剤、はんだペースト及び半導体電子部品の実装方法
Vianco et al. A methodology to establish baseline metrics for assessing the isothermally aging of Sn‐Pb solder interconnects
KR100560708B1 (ko) 납땜방법

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee