JP2003049280A5 - - Google Patents

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Publication number
JP2003049280A5
JP2003049280A5 JP2001179341A JP2001179341A JP2003049280A5 JP 2003049280 A5 JP2003049280 A5 JP 2003049280A5 JP 2001179341 A JP2001179341 A JP 2001179341A JP 2001179341 A JP2001179341 A JP 2001179341A JP 2003049280 A5 JP2003049280 A5 JP 2003049280A5
Authority
JP
Japan
Prior art keywords
electroless plating
semiconductor device
plating solution
cobalt
alkali metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001179341A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003049280A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2001179341A priority Critical patent/JP2003049280A/ja
Priority claimed from JP2001179341A external-priority patent/JP2003049280A/ja
Priority to KR1020037015760A priority patent/KR100891344B1/ko
Priority to PCT/JP2002/005250 priority patent/WO2002099164A2/fr
Priority to TW091111514A priority patent/TW543091B/zh
Priority to CNB028111192A priority patent/CN1285764C/zh
Publication of JP2003049280A publication Critical patent/JP2003049280A/ja
Publication of JP2003049280A5 publication Critical patent/JP2003049280A5/ja
Pending legal-status Critical Current

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JP2001179341A 2001-06-01 2001-06-13 無電解めっき液及び半導体装置 Pending JP2003049280A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2001179341A JP2003049280A (ja) 2001-06-01 2001-06-13 無電解めっき液及び半導体装置
KR1020037015760A KR100891344B1 (ko) 2001-06-01 2002-05-30 무전해 도금액 및 반도체 디바이스
PCT/JP2002/005250 WO2002099164A2 (fr) 2001-06-01 2002-05-30 Solution de depot autocatalytique et dispositif a semi-conducteurs
TW091111514A TW543091B (en) 2001-06-01 2002-05-30 Electroless-plating solution and semiconductor device
CNB028111192A CN1285764C (zh) 2001-06-01 2002-05-30 无电电镀溶液

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001167355 2001-06-01
JP2001-167355 2001-06-01
JP2001179341A JP2003049280A (ja) 2001-06-01 2001-06-13 無電解めっき液及び半導体装置

Publications (2)

Publication Number Publication Date
JP2003049280A JP2003049280A (ja) 2003-02-21
JP2003049280A5 true JP2003049280A5 (fr) 2005-02-17

Family

ID=26616238

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001179341A Pending JP2003049280A (ja) 2001-06-01 2001-06-13 無電解めっき液及び半導体装置

Country Status (5)

Country Link
JP (1) JP2003049280A (fr)
KR (1) KR100891344B1 (fr)
CN (1) CN1285764C (fr)
TW (1) TW543091B (fr)
WO (1) WO2002099164A2 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004304021A (ja) * 2003-03-31 2004-10-28 Ebara Corp 半導体装置の製造方法及び製造装置
JP4663965B2 (ja) * 2003-02-27 2011-04-06 株式会社荏原製作所 基板処理方法及び基板処理装置
JP2005015885A (ja) * 2003-06-27 2005-01-20 Ebara Corp 基板処理方法及び装置
KR100859259B1 (ko) 2005-12-29 2008-09-18 주식회사 엘지화학 캡층 형성을 위한 코발트 계열 합금 무전해 도금 용액 및이를 이용하는 무전해 도금 방법
JP2007246981A (ja) * 2006-03-15 2007-09-27 Jsr Corp 無電解めっき液
JP2007246978A (ja) * 2006-03-15 2007-09-27 Jsr Corp 無電解めっき液
JP2007246979A (ja) * 2006-03-15 2007-09-27 Jsr Corp 無電解めっき液
JP2007246980A (ja) * 2006-03-15 2007-09-27 Jsr Corp 無電解めっき液
KR100774651B1 (ko) 2006-07-21 2007-11-08 동부일렉트로닉스 주식회사 반도체 소자의 구리배선 형성방법 및 구조
TW200825207A (en) * 2006-09-29 2008-06-16 Wako Pure Chem Ind Ltd Composition for nonelectrolytic plating and method of forming metallic protection film using the same
US7794530B2 (en) 2006-12-22 2010-09-14 Lam Research Corporation Electroless deposition of cobalt alloys
US9496145B2 (en) 2014-03-19 2016-11-15 Applied Materials, Inc. Electrochemical plating methods

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3917464A (en) * 1973-07-20 1975-11-04 Us Army Electroless deposition of cobalt boron
US4232060A (en) * 1979-01-22 1980-11-04 Richardson Chemical Company Method of preparing substrate surface for electroless plating and products produced thereby
JPH04503379A (ja) * 1989-02-17 1992-06-18 ポリメタルズ　テクノロジィ　リミテッド メッキ組成物およびメッキ方法
JPH051384A (ja) * 1991-06-21 1993-01-08 Nec Corp 無電解めつき浴
US5203911A (en) * 1991-06-24 1993-04-20 Shipley Company Inc. Controlled electroless plating
US5240497A (en) * 1991-10-08 1993-08-31 Cornell Research Foundation, Inc. Alkaline free electroless deposition
JP3514800B2 (ja) * 1994-01-27 2004-03-31 哲彌 逢坂 軟磁性薄膜およびその製造方法
US5695810A (en) * 1996-11-20 1997-12-09 Cornell Research Foundation, Inc. Use of cobalt tungsten phosphide as a barrier material for copper metallization
KR19990015599A (ko) * 1997-08-07 1999-03-05 윤종용 무전해 도금을 이용한 반도체장치의 듀얼 다마슨금속 배선층 형성방법
US6342733B1 (en) * 1999-07-27 2002-01-29 International Business Machines Corporation Reduced electromigration and stressed induced migration of Cu wires by surface coating

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