EP1230034A1 - Procede destine a l'etamage non galvanique du cuivre ou d'alliages de cuivre - Google Patents

Procede destine a l'etamage non galvanique du cuivre ou d'alliages de cuivre

Info

Publication number
EP1230034A1
EP1230034A1 EP00978519A EP00978519A EP1230034A1 EP 1230034 A1 EP1230034 A1 EP 1230034A1 EP 00978519 A EP00978519 A EP 00978519A EP 00978519 A EP00978519 A EP 00978519A EP 1230034 A1 EP1230034 A1 EP 1230034A1
Authority
EP
European Patent Office
Prior art keywords
tin
copper
thiourea
accordance
precipitation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP00978519A
Other languages
German (de)
English (en)
Other versions
EP1230034A4 (fr
EP1230034B1 (fr
Inventor
Jane Bell
Joachim Heyer
Jurgen Hupe
Ingo Kalker
Marlies Kleinfeld
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Enthone Inc
Original Assignee
Enthone Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7928903&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=EP1230034(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Enthone Inc filed Critical Enthone Inc
Publication of EP1230034A1 publication Critical patent/EP1230034A1/fr
Publication of EP1230034A4 publication Critical patent/EP1230034A4/fr
Application granted granted Critical
Publication of EP1230034B1 publication Critical patent/EP1230034B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys

Definitions

  • a tin bath is suggested for the formation of a tin layer by chemical precipitation, which contains at least one foreign metal.
  • the addition of foreign metals to the tin bath achieves an advantageous suppression of the diffusion processes, and thus a diffusion barrier is built which prevents the liberation of metals from the base material to a large extent.
  • the advantages thus gained are good soldering characteristics at the surface and good durability of the tin layer.
  • a diffusion-stable tin layer is produced which prevents the liberation of materials from the base layer to a large extent. This is an advantage especially in view of the copper liberation from potable water carrying copper tubing. However, an out-diffusion of lead and zinc from basic brass materials is prevented by a diffusion-stable tin layer.
  • a metal of the group silver, bismuth, nickel, titanium, zirconium and indium is suggested as the foreign metal, whereby the use of indium has shown to be especially effective.
  • the foreign metal for the formation of a diffusion barrier within the tin layer, at least one of the above metals is added to the tin bath as a foreign metal.
  • thiourea and/or its derivative is used as the complexing agent.
  • Thiourea as the complexing agent enables the liberation of positively charged copper ions.
  • a copper thiourea complex forms which is soluble in electrolytes at a temperature of >28°C.
  • As a result of the complexing of the copper its potential compared to that of tin is reduced.
  • the then more noble tin precipitates, forming a layer of tin on the copper.
  • the liberated copper ions concentrate in the electrolyte, whereby at a 3 copper concentration above 7 g/1 economical working is no longer possible since at these concentrations tin is no longer precipitated at satisfactory rates.
  • a tin bath which preferably contains the following components:
  • a source of tin preferably a bivalent tin salt, for example tin methanesulfonate, with 1 to 30 g/1 of tin in the tin bath;
  • An acid preferably methanesulphomc acid with 5 to 200 g/1 in the tin bath, whereby the tin bath assumes a pH value of 0 to 3 ;
  • a complexing agent preferably thiourea or a derivative in quantities of 10 to 200 g/1;
  • a wetting agent in quantities of 1 to 10 g/1; 5. At least one foreign metal, preferably a metal in the group Ag, Bi, Ni, Ti, Zr and In in a proportion of
  • a working temperature of the tin bath of 35 to 80°C is suggested.
  • already known measures common to the state of the art can be taken when using the process described. This includes, for example, rinsing, pickling and drying of the work pieces.
  • the process described by the invention makes it possible to produce diffusion-stable tin layers by means of chemical precipitation, whereby the diffusion barrier generated by the addition of foreign metals prevents the liberation of metals from the base materials in an advantageous manner.
  • thiourea as complexing agent it becomes possible to remove the 5 copper ions liberated from the copper from the electrolyte by filtration, and thus to achieve a substantially extended useful life. Furthermore, in this manner a substantial acceleration of the process is achieved.

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Conductive Materials (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
EP00978519A 1999-11-12 2000-11-09 Procede destine a l'etamage non galvanique du cuivre ou d'alliages de cuivre Expired - Lifetime EP1230034B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19954613A DE19954613A1 (de) 1999-11-12 1999-11-12 Verfahren zur stromlosen Verzinnung von Kupfer oder Kupferlegierungen
DE19954613 1999-11-12
PCT/US2000/030983 WO2001034310A1 (fr) 1999-11-12 2000-11-09 Procede destine a l'etamage non galvanique du cuivre ou d'alliages de cuivre

Publications (3)

Publication Number Publication Date
EP1230034A1 true EP1230034A1 (fr) 2002-08-14
EP1230034A4 EP1230034A4 (fr) 2003-01-08
EP1230034B1 EP1230034B1 (fr) 2010-09-08

Family

ID=7928903

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00978519A Expired - Lifetime EP1230034B1 (fr) 1999-11-12 2000-11-09 Procede destine a l'etamage non galvanique du cuivre ou d'alliages de cuivre

Country Status (7)

Country Link
EP (1) EP1230034B1 (fr)
JP (1) JP4084569B2 (fr)
CN (1) CN1192125C (fr)
AT (1) ATE480340T1 (fr)
AU (1) AU1597501A (fr)
DE (2) DE19954613A1 (fr)
WO (1) WO2001034310A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4998704B2 (ja) 2007-01-22 2012-08-15 上村工業株式会社 置換錫合金めっき皮膜の形成方法、置換錫合金めっき浴及びめっき性能の維持方法
US9175400B2 (en) * 2009-10-28 2015-11-03 Enthone Inc. Immersion tin silver plating in electronics manufacture
DE102010031181A1 (de) * 2010-07-09 2012-01-12 Atotech Deutschland Gmbh Verfahren und Anordnung zum Abscheiden einer Metallschicht
JP5830242B2 (ja) * 2010-12-28 2015-12-09 ローム・アンド・ハース電子材料株式会社 めっき液中から不純物を除去する方法
JP5715411B2 (ja) * 2010-12-28 2015-05-07 ローム・アンド・ハース電子材料株式会社 めっき液中から不純物を除去する方法
JP5937320B2 (ja) * 2011-09-14 2016-06-22 ローム・アンド・ハース電子材料株式会社 めっき液中から不純物を除去する方法
MA37931A1 (fr) * 2012-08-13 2016-07-29 Teni Boulikas Procédés améliorés permettant de traiter un cancer avec une toxicité rénale réduite

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4749626A (en) 1985-08-05 1988-06-07 Olin Corporation Whisker resistant tin coatings and baths and methods for making such coatings
JPH0339488A (ja) 1989-07-05 1991-02-20 C Uyemura & Co Ltd 無電解錫めっき方法
US5211831A (en) 1991-11-27 1993-05-18 Mcgean-Rohco, Inc. Process for extending the life of a displacement plating bath
JPH09302476A (ja) 1996-05-10 1997-11-25 Daiwa Kasei Kenkyusho:Kk 無電解錫−銀合金めっき浴

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5160422A (en) * 1989-05-29 1992-11-03 Shimizu Co., Ltd. Bath for immersion plating tin-lead alloys
US5266103A (en) * 1991-07-04 1993-11-30 C. Uyemura & Co., Ltd. Bath and method for the electroless plating of tin and tin-lead alloy
US5217751A (en) * 1991-11-27 1993-06-08 Mcgean-Rohco, Inc. Stabilized spray displacement plating process
JP3274232B2 (ja) * 1993-06-01 2002-04-15 ディップソール株式会社 錫−ビスマス合金めっき浴及びそれを使用するめっき方法
US5391402A (en) * 1993-12-03 1995-02-21 Motorola Immersion plating of tin-bismuth solder
JP3660777B2 (ja) * 1997-03-06 2005-06-15 日本エレクトロプレイテイング・エンジニヤース株式会社 錫合金膜の形成方法およびその錫合金めっき浴

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4749626A (en) 1985-08-05 1988-06-07 Olin Corporation Whisker resistant tin coatings and baths and methods for making such coatings
JPH0339488A (ja) 1989-07-05 1991-02-20 C Uyemura & Co Ltd 無電解錫めっき方法
US5211831A (en) 1991-11-27 1993-05-18 Mcgean-Rohco, Inc. Process for extending the life of a displacement plating bath
JPH09302476A (ja) 1996-05-10 1997-11-25 Daiwa Kasei Kenkyusho:Kk 無電解錫−銀合金めっき浴

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DR. MANFRED JORDAN: "The Electrodeposition of Tin and its Alloys", March 1992, EUGEN G. LEUZEN PUBLISHERS, ISBN: 3-87480-118-7, article "Whiskers", XP003025396

Also Published As

Publication number Publication date
EP1230034A4 (fr) 2003-01-08
CN1192125C (zh) 2005-03-09
ATE480340T1 (de) 2010-09-15
CN1387465A (zh) 2002-12-25
AU1597501A (en) 2001-06-06
JP2003514120A (ja) 2003-04-15
DE60044943D1 (de) 2010-10-21
WO2001034310A1 (fr) 2001-05-17
EP1230034B1 (fr) 2010-09-08
JP4084569B2 (ja) 2008-04-30
DE19954613A1 (de) 2001-05-17

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