GB2382353A - Palladium Plating Solution - Google Patents

Palladium Plating Solution

Info

Publication number
GB2382353A
GB2382353A GB0128788A GB0128788A GB2382353A GB 2382353 A GB2382353 A GB 2382353A GB 0128788 A GB0128788 A GB 0128788A GB 0128788 A GB0128788 A GB 0128788A GB 2382353 A GB2382353 A GB 2382353A
Authority
GB
United Kingdom
Prior art keywords
liter
palladium
salt
plating solution
palladium plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB0128788A
Other versions
GB2382353B (en
GB0128788D0 (en
Inventor
Takeumi Akimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kojima Chemicals Co Ltd
Original Assignee
Kojima Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000211927A external-priority patent/JP3601005B2/en
Application filed by Kojima Chemicals Co Ltd filed Critical Kojima Chemicals Co Ltd
Publication of GB0128788D0 publication Critical patent/GB0128788D0/en
Publication of GB2382353A publication Critical patent/GB2382353A/en
Application granted granted Critical
Publication of GB2382353B publication Critical patent/GB2382353B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C25D3/52—Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys

Abstract

A palladium plating solution, characterized in that it comprises a soluble palladium salt in an amount of 0.1 to 40.0 g/liter in terms of palladium, 0.01 to 10 g/liter of a pyridine-carboxylic acid and/or at least one selected from among a soluble iron salt, zinc salt, thallium salt and tellurium salt and the like in an amount of 0.002 to 1.0 g/liter in terms of metal, 0.005 to 10 g/liter of amine derivative of pyridine-carboxylic acid, an aldehydobenzoic acid derivative, and 0.001 to 1.2 g/liter of an anionic surfactant or an amphoteric surfactant. The palladium plating solution allows the preparation of a highly pure and stable palladium precipitate which is excellent in specular gloss, forms a plating film having a thickness of 5 žm or more and is free from the occurrence of a crack.
GB0128788A 1999-10-27 2001-06-15 Palladium Plating Solution Expired - Fee Related GB2382353B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP34239299 1999-10-27
JP2000211927A JP3601005B2 (en) 1999-10-27 2000-06-09 Palladium plating solution
PCT/JP2001/005107 WO2002103084A1 (en) 1999-10-27 2001-06-15 Palladium plating solution

Publications (3)

Publication Number Publication Date
GB0128788D0 GB0128788D0 (en) 2002-01-23
GB2382353A true GB2382353A (en) 2003-05-28
GB2382353B GB2382353B (en) 2004-10-27

Family

ID=27278780

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0128788A Expired - Fee Related GB2382353B (en) 1999-10-27 2001-06-15 Palladium Plating Solution

Country Status (4)

Country Link
EP (1) EP1396559A4 (en)
CN (1) CN1249270C (en)
GB (1) GB2382353B (en)
WO (1) WO2002103084A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102400190A (en) * 2010-09-17 2012-04-04 日本电镀工程股份有限公司 Iridium plating solution and electroplate method thereof
GB201200482D0 (en) * 2012-01-12 2012-02-22 Johnson Matthey Plc Improvements in coating technology
ITFI20120098A1 (en) * 2012-05-22 2013-11-23 Bluclad Srl GALVANIC BATH WITH BASE OF PALLADIUM AND PHOSPHORUS, ITS USE IN GALVANIC PROCESSES AND ALLOYS OBTAINED BY APPLYING THE GALVANIC PROCESS TO THOSE BATHROOMS.
JP6620103B2 (en) * 2014-09-04 2019-12-11 日本高純度化学株式会社 Palladium plating solution and palladium film obtained using the same
AT516876B1 (en) * 2015-03-09 2016-11-15 Ing W Garhöfer Ges M B H Deposition of decorative palladium-iron alloy coatings on metallic substances
CN105441998A (en) * 2015-10-30 2016-03-30 无锡市嘉邦电力管道厂 Palladium plating containing sodium nitrite and tetra-n-propylammonium bromide and plating method thereof
CN105332023A (en) * 2015-11-20 2016-02-17 无锡市嘉邦电力管道厂 Palladium electroplating solution containing tetra-n-propylammonium bromide and electroplating method thereof
CN105332021A (en) * 2015-11-20 2016-02-17 无锡市嘉邦电力管道厂 Palladium electroplating solution containing sodium nitrite and tetraphenylarsonium bromide and electroplating method thereof
CN105316722A (en) * 2015-11-20 2016-02-10 无锡市嘉邦电力管道厂 Palladium electroplating solution containing tetraphenylarsonium bromide and electroplating method of palladium electroplating solution
CN105332024A (en) * 2015-11-20 2016-02-17 无锡市嘉邦电力管道厂 Palladium electroplating liquid containing isopentyltriphenylphosphonium bromide and electroplating method thereof
CN105543913A (en) * 2016-02-25 2016-05-04 盈昌集团有限公司 Palladium-cobalt alloy electroplating liquid and technology of electroplating spectacle frame with same
CN106757204A (en) * 2016-11-29 2017-05-31 江苏澳光电子有限公司 It is a kind of to cross liquid and its application in stainless steel surfaces plating palladium
CN106757203A (en) * 2016-11-29 2017-05-31 江苏澳光电子有限公司 A kind of molybdenum alloy surface chemical palladium-plating crosses liquid and its application
CN106757207A (en) * 2016-11-29 2017-05-31 江苏澳光电子有限公司 A kind of method for pcb board chemical nickel plating palldium alloy
CN108004573B (en) * 2017-12-12 2020-10-16 安徽启东热能科技有限公司 Surface treatment process for gas-liquid separation disc body

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4491507A (en) * 1983-05-13 1985-01-01 W. C. Heraeus Gmbh Galvanic depositing of palladium coatings
US4911799A (en) * 1989-08-29 1990-03-27 At&T Bell Laboratories Electrodeposition of palladium films
JPH0711476A (en) * 1993-06-23 1995-01-13 Kojima Kagaku Yakuhin Kk Palladium plating solution
JPH07278870A (en) * 1994-04-08 1995-10-24 Kojima Kagaku Yakuhin Kk Palladium plating solution
JP2000026991A (en) * 1998-07-10 2000-01-25 Daiwa Kasei Kenkyusho:Kk Tin and tin alloy plating bath
JP2000303199A (en) * 1999-02-17 2000-10-31 Nisshin Kasei Kk Palladium alloy plating solution, palladium-copper alloy plated member and antibacterial member
US6159623A (en) * 1997-05-30 2000-12-12 Matsushita Electric Industrial Co., Ltd. Palladium plating solution, palladium plating film formed using the solution and lead frame for semiconductor apparatuses having the palladium plating film
JP2001192885A (en) * 1999-10-27 2001-07-17 Kojima Kagaku Yakuhin Kk Palladium plating solution

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19528800C2 (en) * 1995-08-04 1999-05-06 Ami Doduco Gmbh Alkaline or neutral bath for the galvanic deposition of palladium or alloys of palladium

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4491507A (en) * 1983-05-13 1985-01-01 W. C. Heraeus Gmbh Galvanic depositing of palladium coatings
US4911799A (en) * 1989-08-29 1990-03-27 At&T Bell Laboratories Electrodeposition of palladium films
JPH0711476A (en) * 1993-06-23 1995-01-13 Kojima Kagaku Yakuhin Kk Palladium plating solution
JPH07278870A (en) * 1994-04-08 1995-10-24 Kojima Kagaku Yakuhin Kk Palladium plating solution
US6159623A (en) * 1997-05-30 2000-12-12 Matsushita Electric Industrial Co., Ltd. Palladium plating solution, palladium plating film formed using the solution and lead frame for semiconductor apparatuses having the palladium plating film
JP2000026991A (en) * 1998-07-10 2000-01-25 Daiwa Kasei Kenkyusho:Kk Tin and tin alloy plating bath
JP2000303199A (en) * 1999-02-17 2000-10-31 Nisshin Kasei Kk Palladium alloy plating solution, palladium-copper alloy plated member and antibacterial member
JP2001192885A (en) * 1999-10-27 2001-07-17 Kojima Kagaku Yakuhin Kk Palladium plating solution

Also Published As

Publication number Publication date
EP1396559A4 (en) 2006-10-11
WO2002103084A1 (en) 2002-12-27
CN1420947A (en) 2003-05-28
WO2002103084A9 (en) 2003-04-24
GB2382353B (en) 2004-10-27
EP1396559A1 (en) 2004-03-10
GB0128788D0 (en) 2002-01-23
CN1249270C (en) 2006-04-05

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20120615