CN106757207A - A kind of method for pcb board chemical nickel plating palldium alloy - Google Patents
A kind of method for pcb board chemical nickel plating palldium alloy Download PDFInfo
- Publication number
- CN106757207A CN106757207A CN201611068399.2A CN201611068399A CN106757207A CN 106757207 A CN106757207 A CN 106757207A CN 201611068399 A CN201611068399 A CN 201611068399A CN 106757207 A CN106757207 A CN 106757207A
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- Prior art keywords
- pcb board
- nickel plating
- chemical nickel
- palladium
- alloy
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention discloses a kind of method of the chemical nickel plating palldium alloy for wiring board, it is characterised in that (1) oil removing：Pcb board is put into degreaser, ultrasonically treated 10~15min；(2) microetch：Pcb board is put into micro-corrosion liquid, 1~2h is stood；(3) activate：Pcb board is put into palladium activating solution and is activated, activation temperature is 25 ~ 30 DEG C；(4) chemical nickel plating palladium；(5) washing drying：With water irrigation lines plate surface, dried at 55~65 DEG C.Palladium content is 80% or so in coating, and quality is careful, flawless, and color is uniform, and coating is without peeling, bubbling phenomenon, and adhesive force is good.
Description
Technical field
The invention belongs to metal plating liquid technical field, and in particular to a kind of side of chemical nickel plating palldium alloy for pcb board
Method.
Background technology
Gold plate is widely used in electronics industry, jewellery and horological industry.Development, people's lives water with electronics industry
Flat raising, it is necessary to gold amount it is increasing, for save resources, reduce product cost, countries in the world all take much arranges
Apply saving gold.The selection of cash equivalent material has caused the attention of people abroad, such as using electrosilvering, tin, terne metal, tin
The coating such as nickel alloy, palladium, palladium-nickel alloy replace gold or part cash equivalent coating.And, some replacement coating has been used for production.It is such as right
Quality of coating requirement connector higher, gold plate is replaced with palladium or palladium-nickel alloy coating, is applied in the industrial production.
China begins one's study to palladium-nickel alloy cash equivalent coating in late 1970s.Palladium-nickel alloy coating and proof gold coating
Compare, cost can reduce by 20%~80% (palladium valency is usually the l/3 of price of gold), be a kind of comparatively ideal cash equivalent coating.In recent years,
Domestic and international plating worker has made extensive work to aspects such as the performance test of palladium-nickel alloy coating and electroplating technologies, and obtains one
Determine effect.
In the prior art, the surface treatment being suitable on wiring board mainly has：1st, organic solder protective agent；2nd, displacement plating
Silver；3rd, immersion tin；4th, chemical nickel/immersion gold plating；5th, chemical NiPdAu (Ni/Pd/Au) technique.Preceding 4 kinds of surface treatments are all each
From there is certain defect, in recent years popular chemical NiPdAu technique, because coating has good wear resistance and corrosion resistance and solderable row,
It is widely used, but uses the noble metal Au of high price, and technique slightly complicated.It is a kind of for wiring board it is therefore desirable to provide
The alternative techniques of surface layer gold.
The content of the invention
The technical problem to be solved in the present invention is to provide a kind of chemical nickel plating palldium alloy and crosses liquid and its application.
In order to solve the above technical problems, the present invention is adopted the following technical scheme that：
A kind of method of chemical nickel plating palldium alloy for pcb board, comprises the following steps：
(1) oil removing：Pcb board is put into degreaser, ultrasonically treated 10~15min；
(2) microetch：Pcb board is put into micro-corrosion liquid, 1~2h is stood；
(3) activate：Pcb board is put into palladium activating solution and is activated, activation temperature is 25~30 DEG C；
(4) chemical nickel plating palladium：Line pcb board is put into Ni-Pd alloy plating solution and is electroplated, described Ni-Pd alloy crosses liquid to be included
Following component：
0.3~0.5mol/L of nickel sulfamic acid, the 0.3~0.6mol/L of ammino palladium of dichloro four, sodium diacetate 0.01
~0.05mol/L, 0.1~0.5mol/L of sal-ammoniac, 0.002~0.003mol/L of boric acid, sodium sulphate 0.0001~
0.0002mol/L, 0.002~0.004mol/L of hydrocinnamamide, 0.0002~0.0003mol/L of glutaraldehyde, brightener, complexing
Agent, pH7.5~8.5, solvent is water；
(5) washing drying：With water irrigation lines plate surface, dried at 55~65 DEG C.
In step (2), described palladium activating solution includes following component：Stannous chloride 3mol/L, hydrochloric acid 0.5mol/L.
The microetch time is 20~30min in step (2).
In step (4), described brightener is sodium polydithio-dipropyl sulfonate, the mixing of phenyl dithiopropane sodium sulfonate
Thing, wherein, 0.005~0.008mol/L of sodium polydithio-dipropyl sulfonate, 0.05~0.08mol/ of phenyl dithiopropane sodium sulfonate
L。
In step (4), described complexing agent is 1,10- Phens, acetylacetone,2,4-pentanedione, the mixture of triethanolamine, wherein,
1,10- 0.001~0.005mol/L of Phen, 0.02~0.03mol/L of acetylacetone,2,4-pentanedione, 0.01~0.02mol/ of triethanolamine
L。
In step (4), plating conditions are：
Electroplating temperature is 20~35 DEG C, and current density is 0.1~1A/dm 2, and voltage is 4~6V.
Beneficial effect：
The present invention provide palladium cross liquid electroplating technology it is simple, it is easy to expanding production, and utilization this cross liquid energy in metal zero
The high-purity light Ni-Pd alloy coating of part surface formation reason function admirable.
Specific embodiment
According to following embodiments, the present invention may be better understood.However, as it will be easily appreciated by one skilled in the art that real
Apply the content described by example and be merely to illustrate the present invention, without should also without limitation on sheet described in detail in claims
Invention.
Embodiment 1：
A kind of method of chemical nickel plating palldium alloy for pcb board, comprises the following steps：
(1) oil removing：Pcb board is put into degreaser, ultrasonically treated 10~15min；
(2) microetch：Pcb board is put into micro-corrosion liquid, 1~2h is stood；
(3) activate：Pcb board is put into palladium activating solution and is activated, activation temperature is 25~30 DEG C；
(4) chemical nickel plating palladium：Line pcb board is put into Ni-Pd alloy plating solution and is electroplated, described Ni-Pd alloy crosses liquid to be included
Following component：
0.3~0.5mol/L of nickel sulfamic acid, the 0.3~0.6mol/L of ammino palladium of dichloro four, sodium diacetate 0.01
~0.05mol/L, 0.1~0.5mol/L of sal-ammoniac, 0.002~0.003mol/L of boric acid, sodium sulphate 0.0001~
0.0002mol/L, 0.002~0.004mol/L of hydrocinnamamide, 0.0002~0.0003mol/L of glutaraldehyde, brightener, complexing
Agent, pH7.5~8.5, solvent is water；
(5) washing drying：With water irrigation lines plate surface, dried at 55~65 DEG C.
In step (2), described palladium activating solution includes following component：Stannous chloride 3mol/L, hydrochloric acid 0.5mol/L.
The microetch time is 20~30min in step (2).
In step (4), described brightener is sodium polydithio-dipropyl sulfonate, the mixing of phenyl dithiopropane sodium sulfonate
Thing, wherein, 0.005~0.008mol/L of sodium polydithio-dipropyl sulfonate, 0.05~0.08mol/ of phenyl dithiopropane sodium sulfonate
L。
In step (4), described complexing agent is 1,10- Phens, acetylacetone,2,4-pentanedione, the mixture of triethanolamine, wherein,
1,10- 0.001~0.005mol/L of Phen, 0.02~0.03mol/L of acetylacetone,2,4-pentanedione, 0.01~0.02mol/ of triethanolamine
L。
In step (4), plating conditions are：Electroplating temperature is 20~35 DEG C, and current density is 0.1~1A/dm 2, and voltage is
4~6V.
Embodiment 2：Influences of the pH to coating composition and current efficiency.
Electroplate liquid composition is as follows, and other conditions are with embodiment 1：
Nickel sulfamic acid 0.3mol/L, the ammino palladium 0.3mol/L of dichloro four, sodium diacetate 0.01mol/L, chlorination
Ammonia 0.1mol/L, boric acid 0.002mol/L, sodium sulphate 0.0001mol/L, hydrocinnamamide 0.002mol/L, glutaraldehyde
It is 0.0002mol/L, 1,10- Phens 0.004mol/L, acetylacetone,2,4-pentanedione 0.024mol/L, triethanolamine 0.015mol/L, poly-
The propane sulfonic acid sodium 0.006mol/L of two sulphur two, phenyl dithiopropane sodium sulfonate 0.06mol/L, pH7.5~8.5, solvent is water；
Electro-plating method：
The copper sheet that will be cleaned is put into palladium and crosses in liquid, and current density is 0.5A/dm-2, cross 28 DEG C of liquid temperature degree, groove pressure 4V.
Electroplating effect：From table 1 it follows that pH value electroplating effect between 7.5~9.5.
Influences of the pH of table 1 to coating composition and current efficiency
Embodiment 3：
Electroplate liquid composition is as follows, and other conditions are with embodiment 1：
0.3~0.5mol/L of nickel sulfamic acid, the 0.3~0.6mol/L of ammino palladium of dichloro four, sodium diacetate 0.01
~0.05mol/L, 0.1~0.5mol/L of sal-ammoniac, 0.002~0.003mol/L of boric acid, sodium sulphate 0.0001~
0.0002mol/L, 0.002~0.004mol/L of hydrocinnamamide, 0.0002~0.0003mol/L of glutaraldehyde, 1,10- Phens
0.001~0.005mol/L, 0.02~0.03mol/L of acetylacetone,2,4-pentanedione, 0.01~0.02mol/L of triethanolamine, poly- two sulphur dipropyl
0.005~0.008mol/L of alkyl sulfonic acid sodium, phenyl dithiopropane 0.05~0.08mol/L of sodium sulfonate, pH7.5~8.5, solvent is
Water.
Electro-plating method：The copper alloy that will be cleaned is put into palladium and crosses in liquid, and current density is 0.1~0.5.A/dm-2, cross liquid temperature
35 DEG C of degree, groove pressure 4V.
Electroplating effect：Current density electroplating effect between 0.1~0.5 is best as can be seen from Table 2.
Influence of the current density of table 2 to coating composition and current efficiency
Embodiment 4：
Electroplate liquid composition is as follows, and other conditions are with embodiment 1：：
Nickel sulfamic acid 0.4mol/L, the ammino palladium 0.5mol/L of dichloro four, sodium diacetate 0.04mol/L, chlorination
Ammonia 0.4mol/L, boric acid 0.0025mol/L, sodium sulphate 0.00012mol/L, hydrocinnamamide 0.003mol/L, glutaraldehyde
It is 0.0002mol/L, 1,10- Phens 0.003mol/L, acetylacetone,2,4-pentanedione 0.025mol/L, triethanolamine 0.013mol/L, poly-
The propane sulfonic acid sodium 0.006mol/L of two sulphur two, phenyl dithiopropane sodium sulfonate 0.08mol/L, pH7.5~8.5, solvent is water.
Electro-plating method：
The copper alloy that will be cleaned is put into palladium and crosses in liquid, and current density is 0.5.A/dm-2, cross 20~40 DEG C of liquid temperature degree, groove
Pressure 4V.
Electroplating effect：Testing result is shown in Table 3.
Influence of the temperature of table 3 to coating composition and current efficiency
Claims (6)
1. a kind of method of chemical nickel plating palldium alloy for pcb board, it is characterised in that comprise the following steps：
(1) oil removing：Pcb board is put into degreaser, ultrasonically treated 10~15min；
(2) microetch：Pcb board is put into micro-corrosion liquid, 1~2h is stood；
(3) activate：Pcb board is put into palladium activating solution and is activated, activation temperature is 25 ~ 30 DEG C；
(4) chemical nickel plating palladium：Line pcb board is put into Ni-Pd alloy plating solution and is electroplated, described Ni-Pd alloy crosses liquid including as follows
Component：
0.3 ~ 0.5mol/L of nickel sulfamic acid, the 0.3 ~ 0.6mol/L of ammino palladium of dichloro four, sodium diacetate 0.01 ~ 0.05
Mol/L, 0.1 ~ 0.5mol/L of sal-ammoniac, 0.002 ~ 0.003mol/L of boric acid, 0.0001 ~ 0.0002mol/L of sodium sulphate, phenylpropyl alcohol acyl
0.002 ~ 0.004mol/L of amine, 0.0002 ~ 0.0003mol/L of glutaraldehyde, brightener, complexing agent, pH7.5 ~ 8.5, solvent is water；
(5) washing drying：With water irrigation lines plate surface, dried at 55~65 DEG C.
2. the method for the chemical nickel plating palldium alloy for pcb board according to claim 1, it is characterised in that step (2)
In, described palladium activating solution includes following component：Stannous chloride 3mol/L, hydrochloric acid 0.5mol/L.
3. the method for the chemical nickel plating palldium alloy for wiring board according to claim 1, it is characterised in that step (2)
The middle microetch time is 20~30min.
4. the method for the chemical nickel plating palldium alloy for pcb board according to claim 1, it is characterised in that step (4)
In, described brightener is sodium polydithio-dipropyl sulfonate, the mixture of phenyl dithiopropane sodium sulfonate, wherein, poly- two sulphur two
0.005 ~ 0.008mol/L of propane sulfonic acid sodium, 0.05 ~ 0.08mol/L of phenyl dithiopropane sodium sulfonate.
5. the method for the chemical nickel plating palldium alloy for pcb board according to claim 1, it is characterised in that step (4)
In, described complexing agent is 1,10- Phens, acetylacetone,2,4-pentanedione, the mixture of triethanolamine, wherein, 1,10- Phen
0.001 ~ 0.005mol/L, 0.02 ~ 0.03mol/L of acetylacetone,2,4-pentanedione, 0.01 ~ 0.02mol/L of triethanolamine.
6. the method for the chemical nickel plating palldium alloy for pcb board according to claim 4, it is characterised in that step (4)
In, plating conditions are：
Electroplating temperature is 20 ~ 35 DEG C, and current density is 0.1 ~ 1A/dm 2, and voltage is 4 ~ 6V.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611068399.2A CN106757207A (en) | 2016-11-29 | 2016-11-29 | A kind of method for pcb board chemical nickel plating palldium alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611068399.2A CN106757207A (en) | 2016-11-29 | 2016-11-29 | A kind of method for pcb board chemical nickel plating palldium alloy |
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| CN106757207A true CN106757207A (en) | 2017-05-31 |
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ID=58904907
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| CN201611068399.2A Pending CN106757207A (en) | 2016-11-29 | 2016-11-29 | A kind of method for pcb board chemical nickel plating palldium alloy |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1420947A (en) * | 1999-10-27 | 2003-05-28 | 小岛化学药品株式会社 | Palladium plating solution |
| CN101838830A (en) * | 2010-05-07 | 2010-09-22 | 厦门大学 | Electrolyte of electroplating palladium-nickel alloy |
| CN103103585A (en) * | 2012-12-29 | 2013-05-15 | 上海新阳半导体材料股份有限公司 | High-speed embossment electroplating method applied to copper interconnection |
| CN104018193A (en) * | 2014-06-23 | 2014-09-03 | 哈尔滨工业大学 | Non-cyanide bright electroplated silver composite additive and application method thereof in non-cyanide silver electroplating system |
| CN105401182A (en) * | 2015-10-14 | 2016-03-16 | 佛山科学技术学院 | Plating solution formula and electroplating method for electroplating thick palladium on stainless steel |
-
2016
- 2016-11-29 CN CN201611068399.2A patent/CN106757207A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1420947A (en) * | 1999-10-27 | 2003-05-28 | 小岛化学药品株式会社 | Palladium plating solution |
| CN101838830A (en) * | 2010-05-07 | 2010-09-22 | 厦门大学 | Electrolyte of electroplating palladium-nickel alloy |
| CN103103585A (en) * | 2012-12-29 | 2013-05-15 | 上海新阳半导体材料股份有限公司 | High-speed embossment electroplating method applied to copper interconnection |
| CN104018193A (en) * | 2014-06-23 | 2014-09-03 | 哈尔滨工业大学 | Non-cyanide bright electroplated silver composite additive and application method thereof in non-cyanide silver electroplating system |
| CN105401182A (en) * | 2015-10-14 | 2016-03-16 | 佛山科学技术学院 | Plating solution formula and electroplating method for electroplating thick palladium on stainless steel |
Non-Patent Citations (2)
| Title |
|---|
| 屠振密: "《电镀合金原理与工艺》", 31 August 1993, 国防工业出版社 * |
| 赖福东等: "PCB化学镀镍钯合金涂覆层的研究", 《电镀与涂覆》 * |
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Application publication date: 20170531 |