CN106480439A - A kind of chemical nickel plating palldium alloy crosses liquid and its application - Google Patents
A kind of chemical nickel plating palldium alloy crosses liquid and its application Download PDFInfo
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- CN106480439A CN106480439A CN201611071807.XA CN201611071807A CN106480439A CN 106480439 A CN106480439 A CN 106480439A CN 201611071807 A CN201611071807 A CN 201611071807A CN 106480439 A CN106480439 A CN 106480439A
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- Prior art keywords
- acid
- liquid
- nickel plating
- chemical nickel
- palldium alloy
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
Abstract
The invention discloses a kind of chemical nickel plating palldium alloy crosses liquid, including following component：Nickel sulfamic acid 0.05 ~ 0.07mol/L, oxalic acid diamino palladium 0.3 ~ 0.5mol/L, ammonia chloride 0.02 ~ 0.03 mol/L, Allyl thiourea 0.002 ~ 0.003mol/L, nicotinic acid 0.003 ~ 0.005mol/L, to amino sulfanilamide 0.005 ~ 0.008mol/L, methionine 0.001 ~ 0.003mol/L, brightener, chelating agent, pH8.5 ~ 9.2, solvent is water.In coating, palladium content is 80% about, and quality is careful, flawless, color even, coating no peeling, bubbling phenomenon, and adhesive force is good.
Description
Technical field
The invention belongs to metal plating liquid technical field is and in particular to a kind of chemical nickel plating palldium alloy crosses liquid and its application.
Background technology
Gold plate is widely used in electronics industry, jewelry and horological industry.With the development of electronics industry, people's lives water
Flat raising, the gold amount of needs is increasing, for save resources, reduces product cost, countries in the world all take and much arrange
Apply saving gold.The selection of cash equivalent material has caused the attention of people abroad, such as using electrosilvering, stannum, terne metal, stannum
The coating such as nickel alloy, palladium, palladium-nickel alloy replace gold or part cash equivalent coating.And, some replacement coating has been used for producing.As right
Quality of coating requires higher connector, replaces gold plate with palladium or palladium-nickel alloy coating, is applied in the industrial production.
China begins one's study in late 1970s to palladium-nickel alloy cash equivalent coating.Palladium-nickel alloy coating and proof gold coating
Compare, cost can reduce by 20%～80% (palladium valency is usually the l/3 of price of gold), is a kind of comparatively ideal cash equivalent coating.In recent years,
Both at home and abroad plating worker has made extensive work to aspects such as the performance test of palladium-nickel alloy coating and electroplating technologies, and obtains one
Determine effect.
Content of the invention
The technical problem to be solved in the present invention is to provide a kind of chemical nickel plating palldium alloy and crosses liquid and its application.
For solving above-mentioned technical problem, the present invention adopts the following technical scheme that：
A kind of chemical nickel plating palldium alloy crosses liquid, including following component：
Nickel sulfamic acid 0.05～0.07mol/L, oxalic acid diamino palladium 0.3～0.5mol/L, ammonia chloride 0.02～
0.03mol/L, Allyl thiourea 0.002～0.003mol/L, nicotinic acid 0.003～0.005mol/L, to amino sulfanilamide 0.005～
0.008mol/L, methionine 0.001～0.003mol/L, brightener, chelating agent, pH8.5～9.2, solvent is water.
Preferably, including following component：
Nickel sulfamic acid 0.06mol/L, oxalic acid diamino palladium 0.4mol/L, ammonia chloride 0.025mol/L, Allyl thiourea
0.003mol/L, nicotinic acid 0.004mol/L, to amino sulfanilamide 0.006mol/L, methionine 0.002mol/L, brightener, complexation
Agent, pH8.5～9.2, solvent is water.
Preferably, including following component：
Nickel sulfamic acid 0.05mol/L, oxalic acid diamino palladium 0.3mol/L, ammonia chloride 0.02mol/L, Allyl thiourea
0.002mol/L, nicotinic acid 0.003mol/L, to amino sulfanilamide 0.005mol/L, methionine 0.001mol/L, brightener, complexation
Agent, pH8.5～9.2, solvent is water.
Preferably, including following component：
Nickel sulfamic acid 0.07mol/L, oxalic acid diamino palladium 0.5mol/L, ammonia chloride 0.03mol/L, Allyl thiourea
0.003mol/L, nicotinic acid 0.005mol/L, to amino sulfanilamide 0.006mol/L, methionine 0.003mol/L, brightener, complexation
Agent, pH8.5～9.2, solvent is water.
Wherein, described chelating agent is EDTA, sodium thiosulfate, the mixture of tertiary sodium phosphate, wherein, EDTA0.003～
0.005mol/L, sodium thiosulfate 0.05～0.07mol/L, tertiary sodium phosphate 0.03～0.05mol/L.
Wherein, described brightener is saccharin sodium, the mixture of pyridine-3-sulphonic acid, wherein, saccharin sodium 0.002～
0.003mol/L, pyridine-3-sulphonic acid 0.002～0.005mol/L.
Above-mentioned chemical nickel plating palldium alloy crosses applying within protection scope of the present invention in the field of electroplating of liquid.
Wherein, electroplating temperature is 28～35 DEG C, and electric current density is 0.1～1A/dm 2, and voltage is 4～6V.
Beneficial effect：
The palladium that the present invention provides cross liquid electroplating technology simple it is easy to expanding production, and cross liquid energy in metal zero using this
Part surface formation manages the high-purity light Ni-Pd alloy coating of function admirable.
Specific embodiment
According to following embodiments, the present invention may be better understood.However, it is as it will be easily appreciated by one skilled in the art that real
Apply the content described by example and be merely to illustrate the present invention, and should not be also without limitation on basis described in detail in claims
Invention.
Embodiment 1：The impact to coating composition and current efficiency for the pH.
Electroplate liquid composition is as follows：
Nickel sulfamic acid 0.05mol/L, oxalic acid diamino palladium 0.3mol/L, ammonia chloride 0.03mol/L, Allyl thiourea
0.002mol/L, nicotinic acid 0.003mol/L, to amino sulfanilamide 0.008mol/L, methionine 0.002mol/L, EDTA
0.004mol/L, sodium thiosulfate 0.06mol/L, tertiary sodium phosphate 0.03mol/L, saccharin sodium 0.002mol/L, pyridine-3-sulphonic acid
0.002mol/L, pH8.5～9.2, solvent is water.
Electro-plating method：
The copper sheet cleaning is put into palladium and crosses in liquid, electric current density is 0.5A/dm-2, cross 28 DEG C of liquid temp, groove presses 4V.
Electroplating effect：From table 1 it follows that pH value electroplating effect between 7.5～9.5.
The impact to coating composition and current efficiency for table 1 pH
Embodiment 2：
Electroplate liquid composition is as follows：
Nickel sulfamic acid 0.07mol/L, oxalic acid diamino palladium 0.5mol/L, ammonia chloride 0.03mol/L, Allyl thiourea
0.003mol/L, nicotinic acid 0.005mol/L, to amino sulfanilamide 0.008mol/L, methionine 0.001mol/L, EDTA
0.005mol/L, sodium thiosulfate 0.05mol/L, tertiary sodium phosphate 0.03mol/L, saccharin sodium 0.003mol/L, pyridine-3-sulphonic acid
0.002mol/L, pH8.5～9.2, solvent is water.
Electro-plating method：The copper alloy cleaning is put into palladium and crosses in liquid, electric current density is 0.1～0.5.A/dm-2, cross liquid temperature
35 DEG C of degree, groove presses 4V.
Electroplating effect：Electric current density effect in 0.5～1.0 is best as can be seen from Table 2.
The impact to coating composition and current efficiency for table 2 electric current density
Embodiment 3：
Electroplate liquid composition is as follows：
Nickel sulfamic acid 0.06mol/L, oxalic acid diamino palladium 0.4mol/L, ammonia chloride 0.025mol/L, Allyl thiourea
0.0025mol/L, nicotinic acid 0.004mol/L, to amino sulfanilamide 0.006mol/L, methionine 0.002mol/L, EDTA
0.004mol/L, sodium thiosulfate 0.06mol/L, tertiary sodium phosphate 0.04mol/L, saccharin sodium 0.0025mol/L, pyridine -3- sulphur
Sour 0.004mol/L, pH8.5～9.2, solvent is water.
Electro-plating method：
The copper alloy cleaning is put into palladium and crosses in liquid, electric current density is 0.5.A/dm-2, cross 20～40 DEG C of liquid temp, groove
Pressure 4V.
Electroplating effect：Testing result is shown in Table 3
The impact to coating composition and current efficiency for table 3 temperature
Claims (8)
1. a kind of chemical nickel plating palldium alloy crosses liquid it is characterised in that including following component：
Nickel sulfamic acid 0.05 ~ 0.07mol/L, oxalic acid diamino palladium 0.3 ~ 0.5mol/L, ammonia chloride 0.02 ~ 0.03 mol/L,
Allyl thiourea 0.002 ~ 0.003mol/L, nicotinic acid 0.003 ~ 0.005mol/L, to amino sulfanilamide 0.005 ~ 0.008mol/L, first
Methyllanthionine 0.001 ~ 0.003mol/L, brightener, chelating agent, pH8.5 ~ 9.2, solvent is water.
2. chemical nickel plating palldium alloy according to claim 1 crosses liquid it is characterised in that including following component：
Nickel sulfamic acid 0.06mol/L, oxalic acid diamino palladium 0.4mol/L, ammonia chloride 0.025mol/L, Allyl thiourea
0.003mol/L, nicotinic acid 0.004mol/L, to amino sulfanilamide 0.006mol/L, methionine 0.002mol/L, brightener, complexation
Agent, pH8.5 ~ 9.2, solvent is water.
3. chemical nickel plating palldium alloy according to claim 1 crosses liquid it is characterised in that including following component：
Nickel sulfamic acid 0.05mol/L, oxalic acid diamino palladium 0.3mol/L, ammonia chloride 0.02 mol/L, Allyl thiourea
0.002mol/L, nicotinic acid 0.003mol/L, to amino sulfanilamide 0.005mol/L, methionine 0.001mol/L, brightener, complexation
Agent, pH8.5 ~ 9.2, solvent is water.
4. chemical nickel plating palldium alloy according to claim 1 crosses liquid it is characterised in that including following component：
Nickel sulfamic acid 0.07mol/L, oxalic acid diamino palladium 0.5mol/L, ammonia chloride 0.03 mol/L, Allyl thiourea
0.003mol/L, nicotinic acid 0.005mol/L, to amino sulfanilamide 0.006mol/L, methionine 0.003mol/L, brightener, complexation
Agent, pH8.5 ~ 9.2, solvent is water.
5. liquid is crossed it is characterised in that described chelating agent is according to the arbitrary described chemical nickel plating palldium alloy of claim 1 ~ 4
EDTA, sodium thiosulfate, the mixture of tertiary sodium phosphate, wherein, EDTA 0.003 ~ 0.005 mol/L, sodium thiosulfate 0.05 ~
0.07 mol/L, tertiary sodium phosphate 0.03 ~ 0.05 mol/L.
6. liquid is crossed according to the arbitrary described Ni-Pd alloy of claim 1 ~ 4 it is characterised in that described brightener be saccharin sodium,
The mixture of pyridine-3-sulphonic acid, wherein, saccharin sodium 0.002 ~ 0.003mol/L, pyridine-3-sulphonic acid 0.002 ~ 0.005mol/L.
7. the arbitrary described chemical nickel plating palldium alloy of claim 1 ~ 4 crosses the application in the field of electroplating of liquid.
8. it is characterised in that electroplating temperature is 28 ~ 35 DEG C, electric current density is 0.1 ~ 1A/ for application according to claim 5
Dm 2, voltage is 4 ~ 6V.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611071807.XA CN106480439A (en) | 2016-11-29 | 2016-11-29 | A kind of chemical nickel plating palldium alloy crosses liquid and its application |
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| CN201611071807.XA CN106480439A (en) | 2016-11-29 | 2016-11-29 | A kind of chemical nickel plating palldium alloy crosses liquid and its application |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107723760A (en) * | 2017-11-28 | 2018-02-23 | 江苏澳光电子有限公司 | A kind of Au Ag alloy surfaces electroplate liquid and its application |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4297179A (en) * | 1980-09-02 | 1981-10-27 | American Chemical & Refining Company Incorporated | Palladium electroplating bath and process |
| US4699697A (en) * | 1984-05-24 | 1987-10-13 | Electroplating Engineers Of Japan, Limited | High-purity palladium-nickel alloy plating solution and process |
| US5342504A (en) * | 1992-03-30 | 1994-08-30 | Yazaki Corporation | Palladium-nickel alloy plating solution |
| CN101838830A (en) * | 2010-05-07 | 2010-09-22 | 厦门大学 | Electrolyte of electroplating palladium-nickel alloy |
| CN104928659A (en) * | 2014-11-28 | 2015-09-23 | 广东致卓精密金属科技有限公司 | Chemical nickel-plating palladium alloy plating solution and technology |
-
2016
- 2016-11-29 CN CN201611071807.XA patent/CN106480439A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4297179A (en) * | 1980-09-02 | 1981-10-27 | American Chemical & Refining Company Incorporated | Palladium electroplating bath and process |
| US4699697A (en) * | 1984-05-24 | 1987-10-13 | Electroplating Engineers Of Japan, Limited | High-purity palladium-nickel alloy plating solution and process |
| US5342504A (en) * | 1992-03-30 | 1994-08-30 | Yazaki Corporation | Palladium-nickel alloy plating solution |
| CN101838830A (en) * | 2010-05-07 | 2010-09-22 | 厦门大学 | Electrolyte of electroplating palladium-nickel alloy |
| CN104928659A (en) * | 2014-11-28 | 2015-09-23 | 广东致卓精密金属科技有限公司 | Chemical nickel-plating palladium alloy plating solution and technology |
Non-Patent Citations (5)
| Title |
|---|
| 吴水清: ""钯及其合金电镀的研究进展"", 《宇航材料工艺》 * |
| 张允诚等: "《电镀手册》", 31 January 2007, 北京：国防工业出版社 * |
| 李凤凌等: ""钯-镍合金电镀的研究进展"", 《电镀与环保》 * |
| 李利军等: "《现代家庭食品安全指南》", 29 February 2012, 陕西科学技术出版社 * |
| 潘继民等: "《电镀工技能提高必读》", 31 August 2011, 机械工业出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107723760A (en) * | 2017-11-28 | 2018-02-23 | 江苏澳光电子有限公司 | A kind of Au Ag alloy surfaces electroplate liquid and its application |
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Application publication date: 20170308 |