CN1420947A - Palladium plating solution - Google Patents
Palladium plating solution Download PDFInfo
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- CN1420947A CN1420947A CN01801111A CN01801111A CN1420947A CN 1420947 A CN1420947 A CN 1420947A CN 01801111 A CN01801111 A CN 01801111A CN 01801111 A CN01801111 A CN 01801111A CN 1420947 A CN1420947 A CN 1420947A
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- palladium
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- plating solution
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
- C25D3/52—Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
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- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
A palladium plating solution, characterized in that it comprises a soluble palladium salt in an amount of 0.1 to 40.0 g/liter in terms of palladium, 0.01 to 10 g/liter of a pyridine-carboxylic acid and/or at least one selected from among a soluble iron salt, zinc salt, thalium salt and tellurium salt and the like in an amount of 0.002 to 1.0 g/liter in terms of metal, 0.005 to 10 g/liter of amine derivative of pyridine-carboxylic acid, an aldehydobenzoic acid derivative, and 0.001 to 1.2 g/liter of an anionic surfactant or an amphoteric surfactant. The palladium plating solution allows the preparation of a highly pure and stable palladium precipitate which is excellent in specular gloss, forms a plating film having a thickness of 5 um or more and is free from the occurrence of a crack.
Description
Technical field
The present invention relates to a kind of palladium plating solution, more particularly, relate to a kind of palladium plating solution that is applicable to the decorative material that the plating palladium is provided, the anaphylaxis problem of wherein relevant with decorative material nickel is solved.
Background technology
Since very early, just palladium plating solution has been carried out comparatively extensive studies.The settling that plating obtains has excellent physicals, as photostabilization, and erosion resistance, discoloration-resistant, wear resistance or the like.Therefore, palladium plating solution had been applied to comparatively in the extensive fields already, as decorative material, electronic unit electrically contact junctor, circuit card or the like.For with conventional process for treating surface to ornament such as watchcase, watchband, the eyes frame, necklace, earrings and ring carry out white plating, use palladium plating solution usually, palladium-nickelalloy plating bath, palladium-cobalt alloy plating solution, rhodium plating bath, platinum plating bath, silver plating solution or the like.
Above-mentioned solution and coating method has following defective: the rhodium plating bath can't actually use, because it is very expensive.In silver plating solution, the material of plating is owing to final sulfide is easy to variable color.In palladium-nickelalloy plating bath, the anaphylaxis of nickel may take place in some cases, therefore ban use of palladium-nickelalloy plating bath in Europe.In palladium plating solution and platinum plating bath, resulting film has heavily stressed, if therefore the film that forms has bigger thickness, then this film is easy to fragmentation.
Suggestion makes solution and coating method be suitable for reducing the sedimental internal stress of palladium or considers above-mentioned defective and improve the gloss of film by convention.In a kind of solution and coating method of suggestion, with sulphite, the salt of nitrous acid and sodium and potassium joins (is 1-47557 referring to Japanese Unexamined Patent Publication No) in the plating bath.In the solution and coating method of another kind suggestion, cerium is joined (referring to Japanese Unexamined Patent Publication No 2-43393) in the plating bath.Yet even in the conventional process for treating surface of this kind, the cracking problem that causes owing to the internal stress in the thick palladium settling or under for the physical condition that keeps surface luster can not be satisfactorily resolved.
Recently, the shape of the various decorative materials that made by palladium plating solution is quite complicated.Therefore, require to place the palladium settling of processing or work to have excellent unit elongation, and when suitable bending process, do not produce the crack.
In Europe, for such as watchcase, watchband, the eyes frame, necklace, the ornament of earrings and ring and so on needs to form the stable and thick sedimental palladium plating solution of high purity as preventing the anaphylactoid white metal plating bath of nickel.
Therefore, the purpose of this invention is to provide a kind of palladium plating solution, can form the palladium settling of high purity stable physical performance by this plating bath.
Summary of the invention
Even the inventor provides a kind of palladium plating solution that also can practical application in commercial scale production through research repeatedly, and in these cases, it can form high purity palladium settling, consequently, have found that by to wherein adding soluble palladium salt, pyridine carboxylic acid and/or its soluble trace-metal salt, the palladium plating solution that the amide derivatives of pyridine carboxylic acid and anion surfactant or amphoterics make has suitable sedimentation rate, stability with excellence, and can produce high purity palladium deposit film, its thickness is equal to or greater than 5 μ m, and has the excellent the same gloss of mirror, wherein produces the crack hardly.The present invention is achieved thus.
The invention provides:
(1) a kind of palladium plating solution, contain solvable palladium salt in palladium 0.1～40.0g/l, 0.01 the pyridine carboxylic acid of～10g/l and/or be selected from: soluble iron, zinc, thallium, selenium and tellurium salt at least a salt of metal 0.002～1.0g/l, 0.005 the sulfonamide derivatives of the pyridine carboxylic acid of～10g/l, and anion surfactant or the amphoterics of the aldehyde benzoic acid derivative of 0.001～1.2g/l and 0.001～1.2g/l;
(2) according to the palladium plating solution of claim 1, wherein solvable palladium salt is to be selected from Palladous chloride, at least a in dichloro diamines palladium (dichlorodiamine palladium) and the dichloro tetramine palladium (dichlorotetraamine palladium);
(3) according to the palladium plating solution of claim 1, wherein pyridine carboxylic acid is to be selected from nicotinic acid, and pyridine carboxylic acid is different-nicotinic acid, 2, and 3-quinolinic acid, 2,4-dinicotinic acid and 2, at least a in the dipicolimic acid 2;
(4) according to a kind of palladium plating solution of claim 1, every kind in wherein soluble iron, zinc, thallium, selenium and the tellurium salt is to be selected from ferric sulfate or ferrous sulfate, ferrous ammonium sulphate, zinc sulfate, thallic sulfate, thaliium acetate, selenic acid, selenous acid, at least a in Sodium Selenite and the potassium selenite;
(5) according to a kind of palladium plating solution of claim 1, wherein the sulfonamide derivatives of pyridine carboxylic acid is to be selected from nicotinamide (nicotinamide), picolinamide, at least a in different-niacinamide and the niacinamide (nicotinic acid amide);
(6) according to a kind of palladium plating solution of claim 1, wherein the aldehyde benzoic acid derivative is to be selected from right-phthalaldehyde, neighbour-phthalaldehyde, and neighbour-phthalaldehydic acid, right-phthalaldehydic acid ,-phthalaldehyde, at least a in different-phthalaldehydic acid and the phthalaldehyde ammonium;
(7) according to a kind of palladium plating solution of claim 1, wherein anion surfactant or amphoterics are to be selected from n-Laurylamine acetate, hexadecyl pyridinium bromide (cetylpyridium bromide), two-2-ethylhexyl sodium sulfosuccinate, the anhydro sorbitol monopalmitin, the polyoxyethylene stearate, the anhydro sorbitol monostearate, at least a in dimethyl alkyl betaine and lauryl trimethyl ammonium chloride and the polyoxyethylene anhydro sorbitol monopalmitin;
(8) according to each a kind of palladium plating solution in the claim 1～7, wherein palladium plating solution contains a kind of conducting salt, and it is to be selected from ammonium nitrate, ammonium sulfate, ammonium chloride, Ammonium sulfamate, boric acid, ammonium borate, saltpetre, vitriolate of tartar, at least a in Repone K and the thionamic acid potassium.
Implement best mode of the present invention
The example that is used for solvable palladium salt of the present invention is a Palladous chloride, dichloro diamines palladium, dichloro tetramine palladium or the like.These salt can use separately or two or more are used in combination.The concentration of solvable palladium salt is preferably 1.0～40.0g/l in palladium in palladium plating solution.If this concentration is equal to or less than 1.0g/l, then film deposition rate is lower, so this kind concentration is not preferred.If this concentration is equal to or greater than 40.0g/l, then rate of film build can not improve, so this kind concentration is unpractical.
The example of pyridine carboxylic acid is a nicotinic acid, and pyridine carboxylic acid is different-nicotinic acid, 2, and 3-quinolinic acid, 2,4-dinicotinic acid and 2, dipicolimic acid 2.These pyridine carboxylic acids can use separately or two or more are used in combination.
The concentration of pyridine carboxylic acid is 0.01～20.0g/l in palladium plating solution, is preferably 1.0～10.0g/l.If this concentration is equal to or less than 0.01g/l, then can not provide the gloss enhancement.If this concentration is equal to or greater than 20.0g/l, then gloss can not be improved, so this kind concentration is unpractical.
According to the present invention, in order to reduce the internal stress in the palladium settling, soluble metal salt is used in combination with pyridine carboxylic acid, or replaces pyridine carboxylic acid to use.This soluble metal salt can be, for example, and any soluble iron, rhodium, selenium and thallium salt.The specific examples of soluble metal salt is ferric sulfate or ferrous sulfate, ferrous ammonium sulphate, zinc sulfate, thallic sulfate, thaliium acetate, selenic acid, selenous acid, Sodium Selenite, potassium selenite or the like.This soluble metal salt can use separately or two or more are used in combination.
The concentration of this soluble metal salt is counted 0.002～1.0g/l with metal, is preferably 0.005～0.7g/l.If the concentration of soluble metal salt is equal to or less than 0.002g/l, then can not provide the effect that reduces internal stress in the palladium settling.On the other hand, if this concentration is equal to or greater than 1.0g/l, then can not increase the internal stress in the palladium settling, so this kind concentration is unpractical.
The example of the amide derivatives of pyridine carboxylic acid is nicotinamide (nicotinamide), picolinamide, different-niacinamide and niacinamide (nicotinic acid amide).The amide derivatives of these pyridine carboxylic acids can use separately or two or more are used in combination.The concentration of the amide derivatives of pyridine carboxylic acid is 0.002～20.0g/l in palladium plating solution, is preferably 0.005～10.0g/l.If the concentration of amide derivatives is equal to or less than 0.002g/l, then can not provide the gloss enhancement, even and the concentration of amide derivatives surpass 20.0g/l, can not improve gloss, the concentration that therefore surpasses 20.0g/l is unpractical.
In addition, the example of aldehyde benzoic acid derivative is right-phthalaldehyde, neighbour-phthalaldehyde, and neighbour-phthalaldehydic acid, right-phthalaldehydic acid ,-phthalaldehyde, different-phthalaldehydic acid and aldehyde ammonium.This aldehyde benzoic acid derivative can use separately or two or more are used in combination.
The concentration of aldehyde benzoic acid derivative is 0.002～20.0g/l in palladium plating solution, is preferably 0.005～10.0g/l.If the concentration of aldehyde benzoic acid derivative is equal to or less than 0.002g/l, then can not provide the gloss enhancement.Even the concentration of aldehyde benzoic acid derivative surpasses 20.0g/l, can not improve gloss, the concentration that therefore surpasses 20.0g/l is unpractical.
In addition, anion surfactant of Shi Yonging or amphoterics are used to prevent spot corrosion in the present invention, and the most effective for the decorative material with complicated shape.The specific examples of anion surfactant or amphoterics is a n-Laurylamine acetate, the hexadecyl pyridinium bromide, two-2-ethylhexyl sodium sulfosuccinate, the anhydro sorbitol monopalmitin, the polyoxyethylene stearate, the anhydro sorbitol monostearate, dimethyl alkyl betaine and lauryl trimethyl ammonium chloride and polyoxyethylene anhydro sorbitol monopalmitin.Anion surfactant or amphoterics can use separately or two or more are used in combination.
The concentration of anion surfactant or amphoterics is 0.001～1.2g/l in palladium plating solution.
Surfactant concentrations is equal to or less than 0.001g/l and is not enough to prevent spot corrosion, even and the tensio-active agent that adopts concentration to be equal to or greater than 1.2g/l can not improve the performance that prevents of spot corrosion, thus surfactant concentrations to be equal to or greater than 1.2g/l be unpractical.
According to the present invention, can be with any potassiumphosphate, sal enixum, ammonium hydrogen phosphate, ammonium chloride, ammonium sulfate, boric acid, ammonium borate, ammonium nitrate, Ammonium sulfamate, saltpetre, vitriolate of tartar, Repone K, thionamic acid potassium or the like joins in the plating bath, so that provide electroconductibility and shock-absorbing capacity to plating bath.These additives can use separately or two or more are used in combination.
The concentration of conducting salt is 15.0～300.0g/l in plating bath.If the concentration of conducting salt is equal to or less than 15.0g/l, the poorly conductive of plating bath then.If the concentration of conducting salt is equal to or greater than 300.0g/l, then the proportion of plating bath increases, and produces corrosion, mist formation, and incipient scorch etc., the concentration that therefore is equal to or greater than 300.0g/l is not preferred.
Plating bath according to the present invention uses in pH is 7～12 scope, preferably uses in 7.5～9.5 scope.In this pH scope, can form good plated film.The acid of the pH value of plating bath, as spirit of salt and sulfuric acid, or alkaline matter, as sodium hydroxide, potassium hydroxide and ammoniacal liquor are regulated.
It is during 30～55 ℃ of plating in the scope are handled that plating bath according to the present invention is used in temperature.More particularly, when the temperature of plating bath is 40～55 ℃, can form the plated film smooth, that gloss is good.Along with the rising of bath temperature, the film sedimentation rate is tending towards increasing.The appropriate value that is set in the above-mentioned scope by the temperature with plating bath can provide any film sedimentation rate.In addition, in plating bath of the present invention, except bath temperature, the film sedimentation rate depends on the concentration of palladium.Therefore, the film sedimentation rate also can be set at appropriate value and regulate by the concentration with palladium, therefore controls the thickness of plated film easily.
The current density that plating is handled is 0.3～1.2A/dm
2
Embodiment
The present invention will be described in detail by following embodiment.
Embodiment 1
Plating bath is formed
Dichloro diamines palladium 10g/l (in Pd)
Tellurous acid 0.05g/l (in Te)
Ammonium chloride 80g/l
Ammonium hydrogen phosphate 20g/l
Niacinamide 0.8g/l
Two-2-ethylhexyl sodium sulfosuccinate 0.01g/l
With the pH regulator to 8.3 of ammoniacal liquor with plating bath, and the sheet brass that will be of a size of 25 * 35mm nickel preplating flooded in plating bath 30 minutes, and bath temperature is that 45 ℃ and current density are 1.0A/dm
2Consequently, prepare the glossiness palladium plated film that mean thickness is 7 μ m.This palladium plated film is carried out ammonia expose test (at room temperature carrying out 12 hours), consequently, do not observe and produce the crack.
Embodiment 2
Plating bath is formed
Dichloro diamines palladium 10g/l (in Pd)
Ammonium chloride 90g/l
Boric acid 10g/l
Nicotinamide 1.0g/l
2, dipicolimic acid 2 0.5g/l
Lauryl trimethyl ammonium chloride 0.1g/l
With the pH regulator to 8.3 of ammoniacal liquor with plating bath, and the sheet brass that will be of a size of 25 * 35mm nickel preplating flooded in plating bath 30 minutes, and bath temperature is that 42 ℃ and current density are 1.0A/dm
2Consequently, prepare the glossiness palladium plated film that mean thickness is 7 μ m.This palladium plated film is carried out ammonia expose test (at room temperature carrying out 12 hours), consequently, do not observe and produce the crack.
Embodiment 3
Plating bath is formed
Dichloro diamines palladium 10g/l (in Pd)
Ferrous ammonium sulphate 0.1g/l (in Fe)
Ammonium chloride 90g/l
Boric acid 10g/l
Nicotinamide 1.0g/l
2, dipicolimic acid 2 0.5g/l
Lauryl trimethyl ammonium chloride 0.1g/l
With the pH regulator to 8.3 of ammoniacal liquor with plating bath, and the sheet brass that will be of a size of 25 * 35mm nickel preplating flooded in plating bath 30 minutes, and bath temperature is that 42 ℃ and current density are 1.0A/dm
2Consequently, prepare the glossiness palladium plated film that mean thickness is 7 μ m.This palladium plated film is carried out ammonia expose test (at room temperature carrying out 12 hours), consequently, do not observe and produce the crack.
Embodiment 4
Plating bath is formed
Dichloro diamines palladium 10g/l (in Pd)
Ammonium sulfate 60g/l
Boric acid 20g/l
Ammonium hydrogen phosphate 30g/l
Nicotinic acid 1.0g/l
Picolinamide 0.5g/l
Two-2-ethylhexyl sodium sulfosuccinate 0.01g/l
With the pH regulator to 8.2 of ammoniacal liquor with plating bath, and the sheet brass that will be of a size of 25 * 35mm nickel preplating flooded in plating bath 30 minutes, and bath temperature is that 50 ℃ and current density are 1.0A/dm
2Consequently, prepare the glossiness palladium plated film that mean thickness is 7 μ m.This palladium plated film is carried out ammonia expose test (at room temperature carrying out 12 hours), consequently, do not observe and produce the crack.Also the palladium plated film is carried out artificial sweat dipping test (at room temperature carrying out 48 hours), consequently, do not observe variable color.
Embodiment 5
Plating bath is formed
Dichloro diamines palladium 10g/l (in Pd)
Thallic sulfate 0.035g/l (in Tl)
Ammonium sulfate 60g/l
Boric acid 20g/l
Ammonium hydrogen phosphate 30g/l
Nicotinic acid 1.0g/l
Picolinamide 0.5g/l
Two-2-ethylhexyl sodium sulfosuccinate 0.1g/l
With the pH regulator to 8.2 of ammoniacal liquor with plating bath, and the sheet brass that will be of a size of 25 * 35mm nickel preplating flooded in plating bath 30 minutes, and bath temperature is that 50 ℃ and current density are 1.0A/dm
2Consequently, prepare the glossiness palladium plated film that mean thickness is 7 μ m.This palladium plated film is carried out ammonia expose test (at room temperature carrying out 12 hours), consequently, do not observe and produce the crack.Also the palladium plated film is carried out artificial sweat dipping test (at room temperature carrying out 48 hours), consequently, do not observe variable color.
Embodiment 6
Plating bath is formed
Dichloro diamines palladium 10g/l (in Pd)
Ammonium chloride 40g/l
Ammonium sulfate 20g/l
Nicotinic acid 0.5g/l
Different-niacinamide 0.2g/l
Two-2-ethylhexyl sodium sulfosuccinate 0.1g/l
With the pH regulator to 8.5 of ammoniacal liquor with plating bath, and the sheet brass that will be of a size of 25 * 35mm nickel preplating flooded in plating bath 30 minutes, and bath temperature is that 50 ℃ and current density are 1.0A/dm
2Consequently, prepare the glossiness palladium plated film that mean thickness is 7 μ m.This palladium plated film is carried out ammonia expose test (at room temperature carrying out 12 hours), consequently, do not observe and produce the crack.
Comparative example 1
Under the condition identical, consist of tellurous acid and niacinamide are removed the EDTA that replaces 1.0g/l from the palladium plating solution of embodiment 1 palladium plating solution by use and carry out plating and handle with embodiment 1.The palladium plated film that makes is carried out ammonia expose test, consequently, produced the crack at room temperature 6 hours.
Comparative example 2
Under the condition identical, consist of the palladium plating solution that nicotinamide is removed by use from the palladium plating solution of embodiment 2 and carry out plating and handle with embodiment 2.The palladium plated film that makes is inhomogeneous and lackluster.
Comparative example 3
Under the condition identical, consist of ferrous ammonium sulphate and nicotinamide are removed the EDTA that replaces 1.0g/l from the palladium plating solution of embodiment 3 palladium plating solution by use and carry out plating and handle with embodiment 3.The palladium plated film that makes is carried out ammonia expose test, consequently, produced the crack at room temperature 6 hours.
Comparative example 4
Under the condition identical, consist of the palladium plating solution that nicotinic acid is removed by use from the palladium plating solution of embodiment 6 and carry out plating and handle with embodiment 6.The palladium plated film that makes is inhomogeneous and lackluster.
Industrial applicibility
As mentioned above, improve palladium plating solution of the present invention and have extraordinary storage stability and performance Go out good processability and good working environment. Sedimentation rate depends on concentration and the plating bath of palladium Temperature, therefore be easy to control the thickness of plated film. Even the film that plating bath forms according to the present invention Thickness is 5 μ m or thicker, and it also has gloss, lower stress, and free from flaw produces and is excellent Different percentage elongation, and show the same gloss of mirror of beautiful white. Even at room temperature The ammonia that plated film was carried out 12 hours exposes test, and also free from flaw produces. In this test, plated film In at room temperature the artificial sweat of dipping 48 hours wholly or in part, variable color does not take place, therefore can To produce excellent palladium film.
Claims (8)
1, a kind of palladium plating solution, contain solvable palladium salt in palladium 0.1～40.0g/l, 0.01 the pyridine carboxylic acid of～10g/l and/or be selected from: soluble iron, zinc, thallium, selenium and tellurium salt at least a salt of metal 0.002～1.0g/l, 0.005 the sulfonamide derivatives of the pyridine carboxylic acid of～10g/l, and anion surfactant or the amphoterics of the aldehyde benzoic acid derivative of 0.001～1.2g/l and 0.001～1.2g/l.
2, according to the palladium plating solution of claim 1, wherein said solvable palladium salt is to be selected from: Palladous chloride, at least a in dichloro diamines palladium and the dichloro tetramine palladium.
3, according to the palladium plating solution of claim 1, wherein said pyridine carboxylic acid is to be selected from: nicotinic acid, and pyridine carboxylic acid, different-nicotinic acid, 2,3-quinolinic acid, 2,4-dinicotinic acid and 2, at least a in the dipicolimic acid 2.
4, according to the palladium plating solution of claim 1, every kind in wherein soluble iron, zinc, thallium, selenium and the tellurium salt is to be selected from: ferric sulfate or ferrous sulfate, ferrous ammonium sulphate, zinc sulfate, thallic sulfate, thaliium acetate, selenic acid, selenous acid, at least a in Sodium Selenite and the potassium selenite.
5, according to the palladium plating solution of claim 1, the sulfonamide derivatives of wherein said pyridine carboxylic acid is to be selected from: nicotinamide, picolinamide, at least a in different-niacinamide and the niacinamide.
6, according to a kind of palladium plating solution of claim 1, wherein said aldehyde benzoic acid derivative is to be selected from: right-phthalaldehyde, and neighbour-phthalaldehyde, neighbour-phthalaldehydic acid, right-phthalaldehydic acid ,-phthalaldehyde, at least a in different-phthalaldehydic acid and the phthalaldehyde ammonium.
7, according to the palladium plating solution of claim 1, wherein said anion surfactant or described amphoterics are to be selected from: n-Laurylamine acetate, the hexadecyl pyridinium bromide, two-2-ethylhexyl sodium sulfosuccinate, the anhydro sorbitol monopalmitin, the polyoxyethylene stearate, anhydro sorbitol monostearate, at least a in dimethyl alkyl betaine and lauryl trimethyl ammonium chloride and the polyoxyethylene anhydro sorbitol monopalmitin.
8, according to each palladium plating solution in the claim 1～7, wherein said palladium plating solution contains a kind of conducting salt, and it is to be selected from: ammonium nitrate, ammonium sulfate, ammonium chloride, Ammonium sulfamate, boric acid, ammonium borate, saltpetre, vitriolate of tartar, at least a in Repone K and the thionamic acid potassium.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34239299 | 1999-10-27 | ||
| JP2000211927A JP3601005B2 (en) | 1999-10-27 | 2000-06-09 | Palladium plating solution |
| PCT/JP2001/005107 WO2002103084A1 (en) | 1999-10-27 | 2001-06-15 | Palladium plating solution |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1420947A true CN1420947A (en) | 2003-05-28 |
| CN1249270C CN1249270C (en) | 2006-04-05 |
Family
ID=27278780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB01801111XA Expired - Fee Related CN1249270C (en) | 1999-10-27 | 2001-06-15 | Palladium plating solution |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP1396559A4 (en) |
| CN (1) | CN1249270C (en) |
| GB (1) | GB2382353B (en) |
| WO (1) | WO2002103084A1 (en) |
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| CN105332024A (en) * | 2015-11-20 | 2016-02-17 | 无锡市嘉邦电力管道厂 | Palladium electroplating liquid containing isopentyltriphenylphosphonium bromide and electroplating method thereof |
| CN105332021A (en) * | 2015-11-20 | 2016-02-17 | 无锡市嘉邦电力管道厂 | Palladium electroplating solution containing sodium nitrite and tetraphenylarsonium bromide and electroplating method thereof |
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| CN106757203A (en) * | 2016-11-29 | 2017-05-31 | 江苏澳光电子有限公司 | A kind of molybdenum alloy surface chemical palladium-plating crosses liquid and its application |
| CN106757204A (en) * | 2016-11-29 | 2017-05-31 | 江苏澳光电子有限公司 | It is a kind of to cross liquid and its application in stainless steel surfaces plating palladium |
| CN106757207A (en) * | 2016-11-29 | 2017-05-31 | 江苏澳光电子有限公司 | A kind of method for pcb board chemical nickel plating palldium alloy |
| CN108004573A (en) * | 2017-12-12 | 2018-05-08 | 安徽启东热能科技有限公司 | A kind of process of surface treatment of gas-liquid separation disk disk body |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB201200482D0 (en) * | 2012-01-12 | 2012-02-22 | Johnson Matthey Plc | Improvements in coating technology |
| ITFI20120098A1 (en) * | 2012-05-22 | 2013-11-23 | Bluclad Srl | GALVANIC BATH WITH BASE OF PALLADIUM AND PHOSPHORUS, ITS USE IN GALVANIC PROCESSES AND ALLOYS OBTAINED BY APPLYING THE GALVANIC PROCESS TO THOSE BATHROOMS. |
| AT516876B1 (en) * | 2015-03-09 | 2016-11-15 | Ing W Garhöfer Ges M B H | Deposition of decorative palladium-iron alloy coatings on metallic substances |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3317493A1 (en) * | 1983-05-13 | 1984-11-15 | W.C. Heraeus Gmbh, 6450 Hanau | GALVANIC DEPOSITION OF PALLADIUM COVERS |
| US4911799A (en) * | 1989-08-29 | 1990-03-27 | At&T Bell Laboratories | Electrodeposition of palladium films |
| JPH0711476A (en) * | 1993-06-23 | 1995-01-13 | Kojima Kagaku Yakuhin Kk | Palladium plating solution |
| JPH07278870A (en) * | 1994-04-08 | 1995-10-24 | Kojima Kagaku Yakuhin Kk | Palladium plating solution |
| DE19528800C2 (en) * | 1995-08-04 | 1999-05-06 | Ami Doduco Gmbh | Alkaline or neutral bath for the galvanic deposition of palladium or alloys of palladium |
| JP3379412B2 (en) * | 1997-05-30 | 2003-02-24 | 松下電器産業株式会社 | Palladium plating solution, palladium plating film using the same, and lead frame for semiconductor device having the palladium plating film |
| JP4249292B2 (en) * | 1998-07-10 | 2009-04-02 | 株式会社大和化成研究所 | Tin and tin alloy plating bath |
| JP2000303199A (en) * | 1999-02-17 | 2000-10-31 | Nisshin Kasei Kk | Palladium alloy plating solution, palladium-copper alloy plated member and antibacterial member |
| JP3601005B2 (en) * | 1999-10-27 | 2004-12-15 | 小島化学薬品株式会社 | Palladium plating solution |
-
2001
- 2001-06-15 GB GB0128788A patent/GB2382353B/en not_active Expired - Fee Related
- 2001-06-15 EP EP01941060A patent/EP1396559A4/en not_active Withdrawn
- 2001-06-15 WO PCT/JP2001/005107 patent/WO2002103084A1/en active Search and Examination
- 2001-06-15 CN CNB01801111XA patent/CN1249270C/en not_active Expired - Fee Related
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| CN102400190A (en) * | 2010-09-17 | 2012-04-04 | 日本电镀工程股份有限公司 | Iridium plating solution and electroplate method thereof |
| CN106661735A (en) * | 2014-09-04 | 2017-05-10 | 日本高纯度化学株式会社 | Palladium plating solution and palladium coating obtained using same |
| CN105441998A (en) * | 2015-10-30 | 2016-03-30 | 无锡市嘉邦电力管道厂 | Palladium plating containing sodium nitrite and tetra-n-propylammonium bromide and plating method thereof |
| CN105316722A (en) * | 2015-11-20 | 2016-02-10 | 无锡市嘉邦电力管道厂 | Palladium electroplating solution containing tetraphenylarsonium bromide and electroplating method of palladium electroplating solution |
| CN105332023A (en) * | 2015-11-20 | 2016-02-17 | 无锡市嘉邦电力管道厂 | Palladium electroplating solution containing tetra-n-propylammonium bromide and electroplating method thereof |
| CN105332024A (en) * | 2015-11-20 | 2016-02-17 | 无锡市嘉邦电力管道厂 | Palladium electroplating liquid containing isopentyltriphenylphosphonium bromide and electroplating method thereof |
| CN105332021A (en) * | 2015-11-20 | 2016-02-17 | 无锡市嘉邦电力管道厂 | Palladium electroplating solution containing sodium nitrite and tetraphenylarsonium bromide and electroplating method thereof |
| CN105543913A (en) * | 2016-02-25 | 2016-05-04 | 盈昌集团有限公司 | Palladium-cobalt alloy electroplating liquid and technology of electroplating spectacle frame with same |
| CN106757203A (en) * | 2016-11-29 | 2017-05-31 | 江苏澳光电子有限公司 | A kind of molybdenum alloy surface chemical palladium-plating crosses liquid and its application |
| CN106757204A (en) * | 2016-11-29 | 2017-05-31 | 江苏澳光电子有限公司 | It is a kind of to cross liquid and its application in stainless steel surfaces plating palladium |
| CN106757207A (en) * | 2016-11-29 | 2017-05-31 | 江苏澳光电子有限公司 | A kind of method for pcb board chemical nickel plating palldium alloy |
| CN108004573A (en) * | 2017-12-12 | 2018-05-08 | 安徽启东热能科技有限公司 | A kind of process of surface treatment of gas-liquid separation disk disk body |
| CN108004573B (en) * | 2017-12-12 | 2020-10-16 | 安徽启东热能科技有限公司 | Surface treatment process for gas-liquid separation disc body |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1396559A4 (en) | 2006-10-11 |
| WO2002103084A1 (en) | 2002-12-27 |
| GB2382353A (en) | 2003-05-28 |
| CN1249270C (en) | 2006-04-05 |
| EP1396559A1 (en) | 2004-03-10 |
| GB2382353B (en) | 2004-10-27 |
| WO2002103084A9 (en) | 2003-04-24 |
| GB0128788D0 (en) | 2002-01-23 |
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