ITFI20120098A1 - GALVANIC BATH WITH BASE OF PALLADIUM AND PHOSPHORUS, ITS USE IN GALVANIC PROCESSES AND ALLOYS OBTAINED BY APPLYING THE GALVANIC PROCESS TO THOSE BATHROOMS. - Google Patents
GALVANIC BATH WITH BASE OF PALLADIUM AND PHOSPHORUS, ITS USE IN GALVANIC PROCESSES AND ALLOYS OBTAINED BY APPLYING THE GALVANIC PROCESS TO THOSE BATHROOMS. Download PDFInfo
- Publication number
- ITFI20120098A1 ITFI20120098A1 IT000098A ITFI20120098A ITFI20120098A1 IT FI20120098 A1 ITFI20120098 A1 IT FI20120098A1 IT 000098 A IT000098 A IT 000098A IT FI20120098 A ITFI20120098 A IT FI20120098A IT FI20120098 A1 ITFI20120098 A1 IT FI20120098A1
- Authority
- IT
- Italy
- Prior art keywords
- palladium
- galvanic
- phosphorus
- bath according
- galvanic bath
- Prior art date
Links
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 title claims description 74
- 229910052763 palladium Inorganic materials 0.000 title claims description 33
- 238000000034 method Methods 0.000 title claims description 13
- 229910052698 phosphorus Inorganic materials 0.000 title claims description 13
- 239000011574 phosphorus Substances 0.000 title claims description 13
- 230000008569 process Effects 0.000 title claims description 12
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims description 11
- 229910045601 alloy Inorganic materials 0.000 title description 6
- 239000000956 alloy Substances 0.000 title description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 27
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 229910052759 nickel Inorganic materials 0.000 claims description 14
- 150000002739 metals Chemical class 0.000 claims description 12
- 150000001412 amines Chemical class 0.000 claims description 11
- 239000000243 solution Substances 0.000 claims description 8
- 150000003839 salts Chemical class 0.000 claims description 7
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims description 5
- 150000002940 palladium Chemical class 0.000 claims description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- PVNIIMVLHYAWGP-UHFFFAOYSA-N Niacin Chemical compound OC(=O)C1=CC=CN=C1 PVNIIMVLHYAWGP-UHFFFAOYSA-N 0.000 claims description 4
- 229910001096 P alloy Inorganic materials 0.000 claims description 4
- 229910001252 Pd alloy Inorganic materials 0.000 claims description 4
- DFPAKSUCGFBDDF-ZQBYOMGUSA-N [14c]-nicotinamide Chemical compound N[14C](=O)C1=CC=CN=C1 DFPAKSUCGFBDDF-ZQBYOMGUSA-N 0.000 claims description 4
- 239000000654 additive Substances 0.000 claims description 4
- 150000001342 alkaline earth metals Chemical class 0.000 claims description 4
- 239000008139 complexing agent Substances 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- TWBYWOBDOCUKOW-UHFFFAOYSA-N isonicotinic acid Chemical compound OC(=O)C1=CC=NC=C1 TWBYWOBDOCUKOW-UHFFFAOYSA-N 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 150000003017 phosphorus Chemical class 0.000 claims description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims description 3
- 239000003513 alkali Substances 0.000 claims description 3
- ONBDEXUUNGGFRN-UHFFFAOYSA-N amino nitrite Chemical compound NON=O.NON=O ONBDEXUUNGGFRN-UHFFFAOYSA-N 0.000 claims description 3
- 239000007864 aqueous solution Substances 0.000 claims description 3
- SNICXCGAKADSCV-JTQLQIEISA-N (-)-Nicotine Chemical compound CN1CCC[C@H]1C1=CC=CN=C1 SNICXCGAKADSCV-JTQLQIEISA-N 0.000 claims description 2
- MVQVNTPHUGQQHK-UHFFFAOYSA-N 3-pyridinemethanol Chemical compound OCC1=CC=CN=C1 MVQVNTPHUGQQHK-UHFFFAOYSA-N 0.000 claims description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 2
- 229910019142 PO4 Inorganic materials 0.000 claims description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 150000001242 acetic acid derivatives Chemical class 0.000 claims description 2
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- 125000003118 aryl group Chemical group 0.000 claims description 2
- 238000005282 brightening Methods 0.000 claims description 2
- 150000004649 carbonic acid derivatives Chemical class 0.000 claims description 2
- 150000001805 chlorine compounds Chemical class 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- VFQXVTODMYMSMJ-UHFFFAOYSA-N isonicotinamide Chemical compound NC(=O)C1=CC=NC=C1 VFQXVTODMYMSMJ-UHFFFAOYSA-N 0.000 claims description 2
- 229960002715 nicotine Drugs 0.000 claims description 2
- SNICXCGAKADSCV-UHFFFAOYSA-N nicotine Natural products CN1CCCC1C1=CC=CN=C1 SNICXCGAKADSCV-UHFFFAOYSA-N 0.000 claims description 2
- 235000001968 nicotinic acid Nutrition 0.000 claims description 2
- 229960003512 nicotinic acid Drugs 0.000 claims description 2
- 239000011664 nicotinic acid Substances 0.000 claims description 2
- 229960004738 nicotinyl alcohol Drugs 0.000 claims description 2
- HBEQXAKJSGXAIQ-UHFFFAOYSA-N oxopalladium Chemical compound [Pd]=O HBEQXAKJSGXAIQ-UHFFFAOYSA-N 0.000 claims description 2
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 claims description 2
- INIOZDBICVTGEO-UHFFFAOYSA-L palladium(ii) bromide Chemical compound Br[Pd]Br INIOZDBICVTGEO-UHFFFAOYSA-L 0.000 claims description 2
- GPNDARIEYHPYAY-UHFFFAOYSA-N palladium(ii) nitrate Chemical compound [Pd+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O GPNDARIEYHPYAY-UHFFFAOYSA-N 0.000 claims description 2
- 235000021317 phosphate Nutrition 0.000 claims description 2
- 150000003013 phosphoric acid derivatives Chemical class 0.000 claims description 2
- 229920001223 polyethylene glycol Polymers 0.000 claims description 2
- 229960005206 pyrazinamide Drugs 0.000 claims description 2
- IPEHBUMCGVEMRF-UHFFFAOYSA-N pyrazinecarboxamide Chemical compound NC(=O)C1=CN=CC=N1 IPEHBUMCGVEMRF-UHFFFAOYSA-N 0.000 claims description 2
- 125000001453 quaternary ammonium group Chemical group 0.000 claims description 2
- 150000003467 sulfuric acid derivatives Chemical class 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims 2
- 150000004885 piperazines Chemical class 0.000 claims 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 claims 1
- 229940066771 systemic antihistamines piperazine derivative Drugs 0.000 claims 1
- 239000010410 layer Substances 0.000 description 11
- 235000002639 sodium chloride Nutrition 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- -1 degreasing Substances 0.000 description 5
- 238000005238 degreasing Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 150000007522 mineralic acids Chemical class 0.000 description 3
- 150000007524 organic acids Chemical class 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical class C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 235000019270 ammonium chloride Nutrition 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 239000007853 buffer solution Substances 0.000 description 2
- 230000000536 complexating effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- OPCJOXGBLDJWRM-UHFFFAOYSA-N 1,2-diamino-2-methylpropane Chemical compound CC(C)(N)CN OPCJOXGBLDJWRM-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 206010020751 Hypersensitivity Diseases 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229920000388 Polyphosphate Polymers 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000007815 allergy Effects 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- ULEAQRIQMIQDPJ-UHFFFAOYSA-N butane-1,2-diamine Chemical compound CCC(N)CN ULEAQRIQMIQDPJ-UHFFFAOYSA-N 0.000 description 1
- GHWVXCQZPNWFRO-UHFFFAOYSA-N butane-2,3-diamine Chemical compound CC(N)C(C)N GHWVXCQZPNWFRO-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910021446 cobalt carbonate Inorganic materials 0.000 description 1
- ZOTKGJBKKKVBJZ-UHFFFAOYSA-L cobalt(2+);carbonate Chemical compound [Co+2].[O-]C([O-])=O ZOTKGJBKKKVBJZ-UHFFFAOYSA-L 0.000 description 1
- 238000010668 complexation reaction Methods 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- VONWDASPFIQPDY-UHFFFAOYSA-N dimethyl methylphosphonate Chemical compound COP(C)(=O)OC VONWDASPFIQPDY-UHFFFAOYSA-N 0.000 description 1
- 235000011180 diphosphates Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 230000005802 health problem Effects 0.000 description 1
- JVQUBHIPPUVHCN-UHFFFAOYSA-N hexane-1,2-diamine Chemical compound CCCCC(N)CN JVQUBHIPPUVHCN-UHFFFAOYSA-N 0.000 description 1
- CZQPFXAHULAFHQ-UHFFFAOYSA-N hexane-2,3-diamine Chemical compound CCCC(N)C(C)N CZQPFXAHULAFHQ-UHFFFAOYSA-N 0.000 description 1
- IWCAQTQMDRGMPI-UHFFFAOYSA-N hexane-3,4-diamine Chemical compound CCC(N)C(N)CC IWCAQTQMDRGMPI-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 125000000468 ketone group Chemical group 0.000 description 1
- FEWJPZIEWOKRBE-LWMBPPNESA-N levotartaric acid Chemical compound OC(=O)[C@@H](O)[C@H](O)C(O)=O FEWJPZIEWOKRBE-LWMBPPNESA-N 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- UQUPIHHYKUEXQD-UHFFFAOYSA-N n,n′-dimethyl-1,3-propanediamine Chemical compound CNCCCNC UQUPIHHYKUEXQD-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000006259 organic additive Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- LPGZAWSMGCIBOF-UHFFFAOYSA-N pentane-1,2-diamine Chemical compound CCCC(N)CN LPGZAWSMGCIBOF-UHFFFAOYSA-N 0.000 description 1
- ZNUSBSVDROQNFN-UHFFFAOYSA-N pentane-2,3-diamine Chemical compound CCC(N)C(C)N ZNUSBSVDROQNFN-UHFFFAOYSA-N 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical class O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 239000001205 polyphosphate Substances 0.000 description 1
- 235000011176 polyphosphates Nutrition 0.000 description 1
- 229920000137 polyphosphoric acid Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229960003975 potassium Drugs 0.000 description 1
- 239000001508 potassium citrate Substances 0.000 description 1
- 229960002635 potassium citrate Drugs 0.000 description 1
- QEEAPRPFLLJWCF-UHFFFAOYSA-K potassium citrate (anhydrous) Chemical compound [K+].[K+].[K+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O QEEAPRPFLLJWCF-UHFFFAOYSA-K 0.000 description 1
- 235000011082 potassium citrates Nutrition 0.000 description 1
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 150000003222 pyridines Chemical class 0.000 description 1
- 230000007420 reactivation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000001476 sodium potassium tartrate Substances 0.000 description 1
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- UEUXEKPTXMALOB-UHFFFAOYSA-J tetrasodium;2-[2-[bis(carboxylatomethyl)amino]ethyl-(carboxylatomethyl)amino]acetate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O UEUXEKPTXMALOB-UHFFFAOYSA-J 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Agricultural Chemicals And Associated Chemicals (AREA)
Description
Bagno galvanico a base di palladio e fosforo, suo uso in processi galvanici e leghe ottenute applicando il processo galvanico a detti bagni. Galvanic bath based on palladium and phosphorus, its use in galvanic processes and alloys obtained by applying the galvanic process to said baths.
Campo dell'invenzione Field of the invention
L'invenzione si riferisce al campo dei composti utilizzati per processi galvanici in particolare composti contenenti palladio e fosforo e alle leghe ottenute con tali bagni. The invention relates to the field of compounds used for galvanic processes, in particular compounds containing palladium and phosphorus and to the alloys obtained with such baths.
Stato dell'arte State of the art
Le conseguenze deleterie dell'ossidazione e degli stress chimici e fisici in generale sulle superfici metalliche sono ben conosciuti e vari modi sono stati studiati ed applicati per contrastarne gli effetti. The deleterious consequences of oxidation and chemical and physical stresses in general on metal surfaces are well known and various ways have been studied and applied to counteract their effects.
Per eliminare, o almeno limitare, le conseguenze suddette le superfici vengono generalmente ricoperte di altri materiali che possono essere, a seconda dei casi e dell'utilizzo finale, sia vernici che altri metalli, quest'ultimi di solito applicati per via elettrochimica. To eliminate, or at least limit, the aforementioned consequences, the surfaces are generally covered with other materials which can be, depending on the case and the final use, both paints and other metals, the latter usually applied electrochemically.
In particolare nel caso della galvanizzazione, i metalli utilizzati a tale scopo possono essere o non essere preziosi a seconda dello scopo finale dell'oggetto trattato e della qualità desiderata; la ricerca di alternative sia per motivi estetici sia per ragioni economiche ha portato allo sviluppo di bagni galvanici diversamente formulati che generano strati di composizione e spessore differenti, in particolare che non prevedano l'utilizzo dell'oro a causa del suo elevato costo. In particular in the case of galvanization, the metals used for this purpose may or may not be precious depending on the final purpose of the treated object and the desired quality; the search for alternatives both for aesthetic and economic reasons has led to the development of differently formulated galvanic baths that generate layers of different composition and thickness, in particular that do not involve the use of gold due to its high cost.
Tra i trattamenti presenti in letteratura si trovano in particolare bagni di nichel e di palladio che danno leghe diverse di questi due metalli, in associazione tra di sé o ciascuno dei due in lega con altri metalli ed elementi; in ogni caso però questi bagni e i depositi con essi ottenuti presentano difetti come per esempio la difficoltà di gestione, i lunghi tempi di deposizione, gli alti costi o la presenza di metalli sgraditi. Among the treatments present in the literature there are in particular nickel and palladium baths which give different alloys of these two metals, in association with each other or each of the two alloys with other metals and elements; in any case, however, these baths and the deposits obtained with them show defects such as management difficulties, long deposition times, high costs or the presence of unwelcome metals.
Inoltre, quando si utilizza la tecnica galvanica, va considerata anche l'importanza dell'aderenza degli strati galvanici. Furthermore, when using the galvanic technique, the importance of adherence of the galvanic layers must also be considered.
Per incrementare l'aderenza fra la superficie da trattare e lo strato protettivo applicato oggigiorno normalmente si attuano nella pratica comune svariate operazioni, come il decapaggio, il passaggio in ultrasuoni e tensioattivi, la sgrassatura, la riattivazione acida di superfici che facilmente vanno incontro a problemi di passivazione e formazione di ossidi superficiali. In order to increase the adhesion between the surface to be treated and the protective layer applied today, various operations are normally carried out in common practice, such as pickling, ultrasound and surfactants, degreasing, acid reactivation of surfaces that easily encounter problems of passivation and formation of surface oxides.
Oltre all'accurata pulizia chimica e meccanica della superficie da galvanizzare, viene normalmente applicato uno strato intermedio tra questa e il successivo strato di copertura finale, che di solito è costituito da un sottile strato di nichel, grazie all'utilizzo di bagni detti “nichel Wood”, di semplice formulazione e gestione e di rapida applicazione: sono questi infatti bagni definiti “flash” o “strike” proprio per i tempi ridottissimi di utilizzo, di solito non superiori al minuto. In addition to the accurate chemical and mechanical cleaning of the surface to be galvanized, an intermediate layer is normally applied between this and the next final covering layer, which usually consists of a thin layer of nickel, thanks to the use of so-called "nickel" baths. Wood ”, easy to formulate and manage and quick to apply: these baths are in fact defined as“ flash ”or“ strike ”precisely because of the very short times of use, usually no more than one minute.
Tuttavia il crescente presentarsi di problemi sanitari, quali allergie causate dal nichel, ha portato i legislatori a emanare leggi che limitano il rilascio di nichel dagli oggetti con esso trattati, causando quindi restrizioni nell'utilizzo del bagni di nichel in generale, compreso pure il nichel Wood che, per quanto vada a costituire solo una minima percentuale dell'oggetto finito, impedisce di dichiarare l'oggetto “nickel - free” e costringe di conseguenza il produttore a testare gli oggetti con esso trattati per poterne garantirne l'anallergenicità - senza peraltro avere la certezza del risultato positivo. However, the growing emergence of health problems, such as allergies caused by nickel, has led legislators to enact laws that limit the release of nickel from objects treated with it, thus causing restrictions in the use of nickel baths in general, including nickel as well. Wood which, although it only constitutes a minimum percentage of the finished object, prevents the object from being declared "nickel - free" and consequently forces the manufacturer to test the objects treated with it in order to guarantee their non-allergenicity - without however be sure of a positive result.
Nei contesti Nickel - free si è quindi imposta la necessità di usare altri metalli alternativi al nichel che consentano di poter galvanizzare in sicurezza superfici problematiche garantendo sia l'aderenza degli strati successivamente depositati, sia una aumentata resistenza degli oggetti ai danneggiamenti ossidativi e chimici. In Nickel-free contexts, therefore, the need has arisen to use other alternative metals to nickel that allow to safely galvanize problematic surfaces, guaranteeing both the adherence of the layers subsequently deposited, and an increased resistance of the objects to oxidative and chemical damage.
Il metallo più usato per entrambi gli scopi è stato per lungo tempo l'oro, ma le recenti traversie deN'economia mondiale ne hanno innalzato il prezzo a livelli tale da renderne molto svantaggioso l'utilizzo nelle quantità che fino a non molto tempo addietro erano invece normali. The metal most used for both purposes has been gold for a long time, but the recent troubles of the world economy have raised its price to such levels as to make it very disadvantageous to use it in quantities that until not long ago were instead normal.
Tutto questo ha creato problemi in svariati ambiti produttivi e tecnologici nei quali l'utilizzo di tali prodotti e l'applicazione di tali processi è una pratica non solo normale, ma anche l'unica applicabile per l'ottenimento del prodotto finito desiderato: ne risultano coinvolti in modo importante fra i vari settori quello elettronico, automobilistico, deN'arredamento, deN'abbigliamento, gioielleria e bigiotteria. All this has created problems in various production and technological fields in which the use of these products and the application of these processes is not only a normal practice, but also the only one applicable for obtaining the desired finished product: involved in an important way among the various sectors: electronics, automotive, furniture, clothing, jewelery and costume jewelery.
E' evidente quindi, alla luce di quanto detto sopra, l'importanza di poter disporre di prodotti per bagni galvanici capaci di garantire: It is therefore evident, in the light of the above, the importance of having products for galvanic baths capable of guaranteeing:
- miglior aderenza tra superficie e strato di placcatura, indipendentemente dalla natura del substrato e dalla natura del metallo successivamente applicato; - better adhesion between the surface and the plating layer, regardless of the nature of the substrate and the nature of the metal subsequently applied;
minor passivazione della superficie placcata; less passivation of the plated surface;
riduzione dei tempi di lavorazione e dei costi del materiale, reduction of processing times and material costs,
- eliminazione delle sostanze sgradite. - elimination of unwanted substances.
DESCRIZIONE DELL'INVENZIONE DESCRIPTION OF THE INVENTION
La presente invenzione consente di superare i problemi suddetti grazie ad un bagno galvanico contenente palladio e fosforo da utilizzarsi per elettrodeposizioni statiche e a rotobarile ad alta velocità o a spessore, su substrati metallici di varia natura ed in particolare quelli facilmente passivabili e ossidabili come, per esempio ma non solo, nichel, cromo, bronzo, acciaio, per migliorare l'aderenza, la brillantezza e la resistenza dello strato finale, che può essere il deposito così ottenuto o altri strati successivamente depositati, in particolare in contesti Nickel - free; la formulazione è tale da consentire la deposizione di una lega di palladio - fosforo o palladio - fosforo ed altri metalli dalle caratteristiche di aderenza, brillantezza e resistenza superiori a quelle del solo palladio o di altre sue leghe ottenibili per via elettrochimica. The present invention allows to overcome the aforementioned problems thanks to a galvanic bath containing palladium and phosphorus to be used for static and barrel electrodepositions at high speed or thickness, on metal substrates of various kinds and in particular those that are easily passivated and oxidisable such as, for example, but not only that, nickel, chromium, bronze, steel, to improve the adhesion, the brilliance and the resistance of the final layer, which can be the deposit thus obtained or other layers subsequently deposited, in particular in Nickel - free contexts; the formulation is such as to allow the deposition of an alloy of palladium - phosphorus or palladium - phosphorus and other metals with characteristics of adhesion, brilliance and resistance superior to those of palladium alone or of its other alloys obtainable by electrochemical means.
Per “bagno galvanico” secondo l'invenzione si intendono le soluzioni acquose in cui vengono immersi le superfici da trattare con il processo galvanico. By "galvanic bath" according to the invention we mean the aqueous solutions in which the surfaces to be treated with the galvanic process are immersed.
In particolare il bagno galvanico secondo l'invenzione è una soluzione acquosa comprendete sali di palladio e sali di metalli alcalini, alcalino-terrosi, ammonio e complessi amminici con acidi di fosforo, eventualmente in combinazione con i corrispondenti acidi di fosforo, o loro miscele. In particular, the galvanic bath according to the invention is an aqueous solution comprising palladium salts and salts of alkaline, alkaline-earth metals, ammonium and amine complexes with phosphorus acids, optionally in combination with the corresponding phosphorus acids, or mixtures thereof.
I sali di palladio possono essere sali semplici o complessi ad esempio scelti fra: palladio cloruro, palladio bromuro, palladio solfato, palladio nitrato, palladio monossido idrato, palladio diammino idrossido, palladio diammino dicloruro, palladio diammino dinitrito, palladio tetraammino cloruro, palladio tetrammino tetracloro palladiato, ed altri complessi di palladio stabili in soluzione acida. The palladium salts can be simple or complex salts, for example selected from: palladium chloride, palladium bromide, palladium sulfate, palladium nitrate, palladium monoxide hydrate, palladium diamino hydroxide, palladium diamino dichloride, palladium diamino dinitrite, palladium tetraamino chloride, palladium tetracl. palladium, and other palladium complexes stable in acid solution.
II contenuto in soluzione di palladio come metallo varia da 0,2 a 5 g/L, preferibilmente tra 0,3 e 1 ,2 g/L. The content in solution of palladium as metal ranges from 0.2 to 5 g / L, preferably between 0.3 and 1.2 g / L.
Come detto sopra, la fonte di fosforo è costituita dai sali formati da acidi di fosforo con metalli alcalini, alcalino-terrosi, ammonio e complessi amminici. Detti sali sono ad esempio i corrispondenti: fosfiti, ipofosfiti, pirofosfati, polifosfati eventualmente in opportuna combinazione con i corrispondenti acidi in modo da garantire la concentrazione ottimale di fosforo che è normalmente compresa fra 1 g/l e 30g/L , preferibilmente fra 5 g/L - e 15 g/L. As mentioned above, the source of phosphorus is constituted by the salts formed by acids of phosphorus with alkali, alkaline-earth metals, ammonium and amine complexes. Said salts are, for example, the corresponding: phosphites, hypophosphites, pyrophosphates, polyphosphates possibly in appropriate combination with the corresponding acids in order to guarantee the optimal concentration of phosphorus which is normally between 1 g / l and 30g / L, preferably between 5 g / L - and 15 g / L.
Per metalli alcalini o alcalino-terrosi utili secondo l'invenzione si intendono ad esempio: sodio, potassio, magnesio, litio. By alkali or alkaline earth metals useful according to the invention are meant for example: sodium, potassium, magnesium, lithium.
Il pH della soluzione è normalmente compreso fra 1 e 7, più preferibilmente da 3,5 a 5,5; eventuali variazioni vengono corrette con soluzioni di sodio idrossido, potassio idrossido o ammonio idrossido per alzare il pH, o con acidi inorganici quali acido cloridrico, acido solforico, o acido fosforico per abbassarlo. The pH of the solution is normally comprised between 1 and 7, more preferably from 3.5 to 5.5; any variations are corrected with solutions of sodium hydroxide, potassium hydroxide or ammonium hydroxide to raise the pH, or with inorganic acids such as hydrochloric acid, sulfuric acid, or phosphoric acid to lower it.
Preferibilmente la soluzione contiene anche un agente complessante di natura amminica che in combinazione con acidi organici e inorganici provvede anche alla creazione del giusto sistema tampone nell'intervallo di pH specificato. Preferably the solution also contains an amine complexing agent which in combination with organic and inorganic acids also provides for the creation of the right buffer system in the specified pH range.
L'agente complessante di natura amminica può avere più gruppi amminici presenti nella molecola, e può essere scelto nella categoria dei complessanti amminici: 1 ,2- diammino propano, 1 ,2- diammino butano, 1 ,2- diammino etano, 1 ,2- diammino- 2- metil propano, 1 ,2- diammino pentano, 1,2- diammino esano, 2,3- diammino butano, 2,3- diammino pentano, 2,3- diammino esano, 3,4- diammino esano, e altre ammine alifatiche a più lunga catena, nonché poliammine secondarie e terziarie come per esempio N, N'- dimetile- 1 ,3-propan diammina, N, N, Ν', N'- tetrametil etil diammina. The complexing agent of an amine nature can have several amino groups present in the molecule, and can be chosen from the category of amine complexing agents: 1, 2- diamino propane, 1, 2- diamino butane, 1, 2- diamino ethane, 1, 2 - diamino- 2- methyl propane, 1, 2- diamino pentane, 1,2- diamino hexane, 2,3- diamino butane, 2,3- diamino pentane, 2,3- diamino hexane, 3,4- diamino hexane, and other longer chain aliphatic amines, as well as secondary and tertiary polyamines such as N, N'-dimethyl-1, 3-propan diamine, N, N, ', N'-tetramethyl ethyl diamine.
Le ammine suddette possono inoltre presentare altri gruppi funzionali sulla molecola come per esempio ossidrili, gruppi carbossilici, gruppi chetonici che migliorino l'azione deN'ammina stessa. The above amines can also present other functional groups on the molecule such as for example hydroxyls, carboxylic groups, ketone groups which improve the action of the amine itself.
La quantità di ammina da utilizzare varia in base al potere complessante deN'ammina stessa, generalmente si utilizzano concentrazioni comprese tra 4 mL/L e 40 mL/L. The amount of amine to be used varies according to the complexing power of the amine itself, concentrations between 4 mL / L and 40 mL / L are generally used.
Inoltre per migliorare la brillantezza del deposito possono essere aggiunte anche piccole quantità di additivi organici di varia natura. Furthermore, small quantities of organic additives of various kinds can also be added to improve the gloss of the deposit.
Gli additivi utilizzati per migliorare la brillantezza del deposito e ridurne la porosità sono di varia natura ed utilizzabili in opportuna combinazione. The additives used to improve the gloss of the deposit and reduce its porosity are of various kinds and can be used in appropriate combinations.
Si utilizzano composti tratti dalla serie dei derivati della piridina e della piperazina quali per esempio acido nicotinico, acido isonicotinico, nicotinammide, isonicotinammide, nicotinilalcol, nicotina, 2,2'-bipiridolo, pirazinammide ed altri suoi derivati; altre sostanze che svolgono azione sia brillantante sia tensioattiva sono i polietilenglicoli a vario peso molecolare sufficientemente solubili in acqua, e i composti alchilici e arilici deN'ammonio quaternario normalmente usati come tensioattivi. Compounds taken from the series of derivatives of pyridine and piperazine are used, such as for example nicotinic acid, isonicotinic acid, nicotinamide, isonicotinamide, nicotinylalcohol, nicotine, 2,2'-bipyridole, pyrazinamide and other derivatives thereof; other substances which perform both a brightening and a surfactant action are polyethylene glycols of various molecular weight sufficiently soluble in water, and the alkyl and aryl compounds of quaternary ammonium normally used as surfactants.
Le concentrazioni degli additivi variano in base alla natura dell'additivo stesso e alle combinazioni che si vengono a creare, comunque in concentrazioni che variano da 1 a 500 mg/L. The concentrations of the additives vary according to the nature of the additive itself and the combinations that are created, however in concentrations ranging from 1 to 500 mg / L.
Tra gli acidi organici da utilizzare per creare l'opportuno sistema tampone come suddetto, possiamo ricordare: acido citrico, tartarico, malico, maionico, gluconico, acetico, acetoacetico, ed altri che siano sufficientemente solubili in acqua nelle condizioni di lavoro del bagno, in concentrazioni che variano dai 20 ai 200 g/L, più opportunamente dai 50 ai 120 g/L. Among the organic acids to be used to create the appropriate buffer system as mentioned above, we can mention: citric, tartaric, malic, mayionic, gluconic, acetic, acetoacetic, and others that are sufficiently soluble in water in the working conditions of the bathroom, in concentrations ranging from 20 to 200 g / L, more appropriately from 50 to 120 g / L.
Utilizzando i bagni come sopra descritti si ottengono per deposito al catodo della cella galvanica leghe palladio/fosforo in cui il palladio varia dal 80% al 99% ed il fosforo varia dal 1% al 20% rispettivamente; particolarmente preferite per gli scopi dell’invenzione come sopra descritti sono le leghe palladio/fosforo nelle quali la percentuale di palladio va dal 94% al 88% e la percentuale di fosforo va dal 6% al 12% (ove le percentuali sono espresse in peso). Using the baths as described above, palladium / phosphorus alloys are obtained by depositing at the cathode of the galvanic cell in which the palladium varies from 80% to 99% and the phosphorus varies from 1% to 20% respectively; particularly preferred for the purposes of the invention as described above are the palladium / phosphorus alloys in which the percentage of palladium ranges from 94% to 88% and the percentage of phosphorus ranges from 6% to 12% (where the percentages are expressed by weight ).
Benché la lega palladio - fosforo come sopra descritta sia dotata di per sé delle caratteristiche di aderenza, assenza di porosità e resistenza peculiari, è possibile aggiungere a questa uno o più altri metalli che ne esaltino le caratteristiche. Although the palladium-phosphorus alloy as described above has its own characteristics of adhesion, absence of porosity and peculiar resistance, it is possible to add to this one or more other metals that enhance its characteristics.
I metalli da usare a tal scopo possono essere, per esempio ma non solo, nichel, indio, oro, cobalto, ferro, zinco, ed altri, da aggiungersi al bagno sotto forma dei loro più comuni sali come cloruri, solfati, carbonati, acetati, fosfati ed altri tipi di sale che si possono vantaggiosamente usare nelle condizioni operative del bagno. The metals to be used for this purpose can be, for example but not limited to, nickel, indium, gold, cobalt, iron, zinc, and others, to be added to the bath in the form of their most common salts such as chlorides, sulphates, carbonates, acetates. , phosphates and other types of salt which can be advantageously used in the operating conditions of the bath.
Le quantità di metallo da aggiungere in soluzione vanno da 0,05 a 5 g/L, più precisamente da 0,1 a 1 g/L, più vantaggiosamente da 0,1 a 0,5 g/L di metallo. The quantities of metal to be added in solution range from 0.05 to 5 g / L, more precisely from 0.1 to 1 g / L, more advantageously from 0.1 to 0.5 g / L of metal.
Allo scopo di ottenere una miglior complessazione dei metalli sopra riportati, sono utilizzabili composti quali acido etilendiammino tetraacetico, acido 1 ,1 -idrossietiliden- 1 ,1-difosfonico, acido etilendiammino tetrametilen fosfonico, acido nitrilotriacetico, acido nitrilo trimetil fosfonico, ed i sali di questi. In order to obtain a better complexation of the above metals, compounds such as ethylenediamino tetraacetic acid, 1, 1 -hydroxyethyliden- 1, 1-diphosphonic acid, ethylenediamino tetramethylene phosphonic acid, nitrilotriacetic acid, nitrile trimethyl phosphonic acid, and the salts of these.
Gli acidi organici ed inorganici sopra elencati fungono anche da aiuto al sistema complessante sopra descritto. The organic and inorganic acids listed above also serve as an aid to the complexing system described above.
L'intervallo di temperatura di lavoro del bagno va da 30*C a 50*0, più preferibilmente tra 35*C e 45<<>C. The bath working temperature range is from 30 * C to 50 * 0, more preferably between 35 * C and 45 <<> C.
Nei processi di galvanica che utilizzano i bagni suddetti la densità di corrente applicata è normalmente compresa fra 0,5 e 5 A/dmq, più preferibilmente fra 1 e 2 A/dmq; l'intervallo di durata dell'applicazione della corrente va da 10 secondi a 180 secondi, più adeguatamente da 40 secondi a 120 secondi. In the galvanic processes that use the aforementioned baths, the applied current density is normally between 0.5 and 5 A / dmq, more preferably between 1 and 2 A / dmq; the current application duration range is from 10 seconds to 180 seconds, more appropriately from 40 seconds to 120 seconds.
L'invenzione viene ora più specificamente illustrata dai seguenti esempi. The invention is now more specifically illustrated by the following examples.
ESEMPIO 1 EXAMPLE 1
Una lastra di rame di dimensioni 10 x 10 cm fu placcata con un bagno di bronzo bianco commerciale, lavorando a 1 A/dmq per 15 minuti a 50° ed ottenendo un deposito bianco e lucido. Tale lastra fu asciugata in forno a 80*0 per 10 minuti e quindi lasciata a temperatura ambiente in atmosfera di laboratorio per 1 giorno, in modo da ottenere una superficie sufficientemente passiva. La lastra fu quindi nuovamente sgrassata con sgrassatura elettrolitica, risciacquata con acqua deionizzata e quindi trattata col bagno di palladio “flash” secondo l'invenzione. Il bagno conteneva le seguenti concentrazioni: Pd 1 ,6 g/L come palladio diammino dinitrito, 7 mL/L 2,3 - diammino butano, 40 g/L acido tartarico, 30 g/L tartrato sodio e potassio, 0,2 g/L nicotinammide, 10 g/L acido polifosforico, 20 g/L ammonio cloruro. A 10 x 10 cm copper plate was plated with a commercial white bronze bath, working at 1 A / dmq for 15 minutes at 50 ° and obtaining a white and glossy deposit. This plate was dried in an oven at 80 ° C for 10 minutes and then left at room temperature in a laboratory atmosphere for 1 day, in order to obtain a sufficiently passive surface. The plate was then again degreased with electrolytic degreasing, rinsed with deionized water and then treated with the “flash” palladium bath according to the invention. The bath contained the following concentrations: Pd 1, 6 g / L as palladium diamino dinitrite, 7 mL / L 2.3 - diamino butane, 40 g / L tartaric acid, 30 g / L sodium potassium tartrate, 0.2 g / L nicotinamide, 10 g / L polyphosphoric acid, 20 g / L ammonium chloride.
Le condizioni di lavoro applicate erano le seguenti: 48*0, 30 secondi, 1 A/dmq. The working conditions applied were the following: 48 * 0, 30 seconds, 1 A / dmq.
Il deposito ottenuto era bianco e lucido e privo di qualsivoglia difetto. The deposit obtained was white and shiny and free of any defect.
Dopo che fu placcata con tale bagno, la lastrina fu asciugata in forno per 10 minuti a 80*C e quindi lasciata freddare in atmosfera di laboratorio per 20 minuti. La lastrina fu quindi nuovamente sgrassata in sgrassatura elettrolitica e placcata con un bagno commerciale di palladio puro fino al raggiungimento di 2 micron lavorando a 30*0, 0,8 A/dmq. After it was plated with this bath, the plate was dried in an oven for 10 minutes at 80 ° C and then left to cool in a laboratory atmosphere for 20 minutes. The plate was then again degreased by electrolytic degreasing and plated with a commercial bath of pure palladium until reaching 2 microns working at 30 * 0, 0.8 A / dmq.
La lastra fu nuovamente asciugata in forno per 10 minuti a 80*0 e quindi fu applicato il Tape - test: sulla superficie della lastrina fu incisa con una punta acuminata una griglia 2 x 2 cm avente ogni settore 1 x 1 mm; sulla griglia fu quindi applicata una porzione di nastro adesivo, fatto aderire con pressione delle dita per evitare la presenza di bolle d'aria sottostanti, e quindi questa fu rimossa con gesto rapido e deciso. Non si ebbe alcun distacco degli strati depositati. The plate was again dried in the oven for 10 minutes at 80 ° C and then the Tape - test was applied: on the surface of the plate a 2 x 2 cm grid having each sector 1 x 1 mm was engraved with a sharp point; a portion of adhesive tape was then applied to the grid, made to adhere with finger pressure to avoid the presence of air bubbles underneath, and then this was removed with a quick and decisive gesture. There was no detachment of the deposited layers.
ESEMPIO 2 EXAMPLE 2
Una lastrina di rame delle dimensioni 10 x 10 cm fu trattata secondo lo stesso processo riportato nell'Esempio 1 evitando però il passaggio nel bagno di palladio “flash”. A 10 x 10 cm copper plate was treated according to the same process reported in Example 1, avoiding, however, the passage in the “flash” palladium bath.
La lastra fu sottoposta al Tape - Test nelle stesse condizioni: si ebbe il distacco di 1/3 della quadrettatura della griglia. The plate was subjected to the Tape - Test under the same conditions: 1/3 of the grid was detached.
ESEMPIO 3 EXAMPLE 3
Una lastra di acciaio inox di dimensioni 10 x 10 cm fu decapata in acido nitrico diluito al 50% con acqua demineralizzata, risciacquata in acqua demineralizzata, quindi sgrassata con sgrassatura elettrolitica, risciacquata con acqua deionizzata, dopodiché trattata col bagno di palladio secondo l'invenzione. Il bagno conteneva le seguenti concentrazioni: Pd 5 g/L come palladio tetrammino dicloruro, 12 mL/L 1 ,2 - diammino propano, 60 g/L acido citrico, 50 g/L citrato di potassio, 0,4 g/L nicotinammide, 30 g/L EDTA tetrasodico, 25 g/L ammonio cloruro, 13 g/L acido fosforoso, 3g/L Cobalto carbonato, 2 g/L acido nitrilotriacetico. A 10 x 10 cm stainless steel plate was pickled in nitric acid diluted 50% with demineralized water, rinsed in demineralized water, then degreased with electrolytic degreasing, rinsed with deionized water, then treated with the palladium bath according to the invention . The bath contained the following concentrations: Pd 5 g / L as palladium tetramino dichloride, 12 mL / L 1, 2 - diamino propane, 60 g / L citric acid, 50 g / L potassium citrate, 0.4 g / L nicotinamide , 30 g / L tetrasodium EDTA, 25 g / L ammonium chloride, 13 g / L phosphorous acid, 3g / L Cobalt carbonate, 2 g / L nitrilotriacetic acid.
Le condizioni di lavoro applicate erano le seguenti: 50*0, 1 minuto, 0,8 A/dmq; il deposito ottenuto era bianco e lucido e privo di difetti. The working conditions applied were the following: 50 * 0, 1 minute, 0.8 A / dmq; the deposit obtained was white and shiny and free of defects.
Dopo che fu placcata con tale bagno, la lastrina fu asciugata in forno per 20 minuti a 80*0 e quindi lasciata freddare in atmosfera di laboratorio per 30 minuti. La lastrina fu quindi nuovamente sgrassata in sgrassatura elettrolitica e placcata con un bagno commerciale di palladio - nichel fino al raggiungimento di 2 micron lavorando a 35Ό, 1 A/dmq. After it was plated with this bath, the plate was dried in an oven for 20 minutes at 80 ° C and then left to cool in a laboratory atmosphere for 30 minutes. The plate was then again degreased by electrolytic degreasing and plated with a commercial palladium-nickel bath until reaching 2 microns working at 35Ό, 1 A / dmq.
La lastra fu nuovamente asciugata in forno per 20 minuti a 80*0 e quindi fu applicato il Tape - test: sulla superficie della lastrina fu incisa con una punta acuminata una griglia 2 x 2 cm avente ogni settore 1 x 1 mm; sulla griglia fu quindi applicata una porzione di nastro adesivo, fatto aderire con pressione delle dita per evitare la presenza di bolle d'aria sottostanti, e quindi questa fu rimossa con gesto rapido e deciso. Non si ebbe alcun distacco degli strati depositati. The plate was again dried in the oven for 20 minutes at 80 ° C and then the Tape test was applied: on the surface of the plate a 2 x 2 cm grid with 1 x 1 mm each sector was engraved with a sharp point; a portion of adhesive tape was then applied to the grid, made to adhere with finger pressure to avoid the presence of air bubbles underneath, and then this was removed with a quick and decisive gesture. There was no detachment of the deposited layers.
ESEMPIO 4 EXAMPLE 4
Una lastrina di acciaio inox delle dimensioni 10 x 10 cm fu trattata secondo lo stesso processo riportato nell'Esempio 3 evitando però il passaggio nel bagno di palladio “flash”. La lastra fu sottoposta al Tape - Test nelle stesse condizioni: si ebbe il distacco di 2/3 della quadrettatura della griglia. A 10 x 10 cm stainless steel plate was treated according to the same process reported in Example 3, avoiding however the passage in the “flash” palladium bath. The plate was subjected to the Tape - Test under the same conditions: 2/3 of the grid pattern detachment.
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT000098A ITFI20120098A1 (en) | 2012-05-22 | 2012-05-22 | GALVANIC BATH WITH BASE OF PALLADIUM AND PHOSPHORUS, ITS USE IN GALVANIC PROCESSES AND ALLOYS OBTAINED BY APPLYING THE GALVANIC PROCESS TO THOSE BATHROOMS. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT000098A ITFI20120098A1 (en) | 2012-05-22 | 2012-05-22 | GALVANIC BATH WITH BASE OF PALLADIUM AND PHOSPHORUS, ITS USE IN GALVANIC PROCESSES AND ALLOYS OBTAINED BY APPLYING THE GALVANIC PROCESS TO THOSE BATHROOMS. |
Publications (1)
Publication Number | Publication Date |
---|---|
ITFI20120098A1 true ITFI20120098A1 (en) | 2013-11-23 |
Family
ID=46582805
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT000098A ITFI20120098A1 (en) | 2012-05-22 | 2012-05-22 | GALVANIC BATH WITH BASE OF PALLADIUM AND PHOSPHORUS, ITS USE IN GALVANIC PROCESSES AND ALLOYS OBTAINED BY APPLYING THE GALVANIC PROCESS TO THOSE BATHROOMS. |
Country Status (1)
Country | Link |
---|---|
IT (1) | ITFI20120098A1 (en) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3972787A (en) * | 1974-06-14 | 1976-08-03 | Lea-Ronal, Inc. | Palladium electrolyte baths utilizing quaternized pyridine compounds as brighteners |
GB1534452A (en) * | 1976-11-17 | 1978-12-06 | Amp Inc | Electroplating palladium |
US4278514A (en) * | 1980-02-12 | 1981-07-14 | Technic, Inc. | Bright palladium electrodeposition solution |
US4715935A (en) * | 1985-01-25 | 1987-12-29 | Omi International Corporation | Palladium and palladium alloy plating |
JPH06232311A (en) * | 1993-02-02 | 1994-08-19 | Shinko Electric Ind Co Ltd | Lead frame for semiconductor device |
US6159623A (en) * | 1997-05-30 | 2000-12-12 | Matsushita Electric Industrial Co., Ltd. | Palladium plating solution, palladium plating film formed using the solution and lead frame for semiconductor apparatuses having the palladium plating film |
GB2382353B (en) * | 1999-10-27 | 2004-10-27 | Kojima Chemicals Co Ltd | Palladium Plating Solution |
-
2012
- 2012-05-22 IT IT000098A patent/ITFI20120098A1/en unknown
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3972787A (en) * | 1974-06-14 | 1976-08-03 | Lea-Ronal, Inc. | Palladium electrolyte baths utilizing quaternized pyridine compounds as brighteners |
GB1534452A (en) * | 1976-11-17 | 1978-12-06 | Amp Inc | Electroplating palladium |
US4278514A (en) * | 1980-02-12 | 1981-07-14 | Technic, Inc. | Bright palladium electrodeposition solution |
US4715935A (en) * | 1985-01-25 | 1987-12-29 | Omi International Corporation | Palladium and palladium alloy plating |
JPH06232311A (en) * | 1993-02-02 | 1994-08-19 | Shinko Electric Ind Co Ltd | Lead frame for semiconductor device |
US6159623A (en) * | 1997-05-30 | 2000-12-12 | Matsushita Electric Industrial Co., Ltd. | Palladium plating solution, palladium plating film formed using the solution and lead frame for semiconductor apparatuses having the palladium plating film |
GB2382353B (en) * | 1999-10-27 | 2004-10-27 | Kojima Chemicals Co Ltd | Palladium Plating Solution |
Non-Patent Citations (2)
Title |
---|
XU Y ET AL: "Preparation and growth behavior of amorphous Pd40Ni40P20 film by electrodeposition", JOURNAL OF SOLID STATE ELECTROCHEMISTRY ; CURRENT RESEARCH AND DEVELOPMENT IN SCIENCE AND TECHNOLOGY, SPRINGER, BERLIN, DE, vol. 13, no. 5, 24 June 2008 (2008-06-24), pages 713 - 720, XP019661141, ISSN: 1433-0768 * |
YONG XU ET AL: "Kinetic surface roughening of electrodeposited amorphous PdP and NiP films - A comparative study", ELECTROCHEMISTRY COMMUNICATIONS, vol. 12, no. 3, 1 March 2010 (2010-03-01), pages 442 - 445, XP055042511, ISSN: 1388-2481, DOI: 10.1016/j.elecom.2010.01.015 * |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CA2875317C (en) | Plating bath for electroless deposition of nickel layers | |
US9644279B2 (en) | Zinc-nickel alloy plating solution and plating method | |
JP2012504701A (en) | Method for depositing a palladium-rhodium layer with improved whiteness | |
US3230098A (en) | Immersion plating with noble metals | |
CN102808203A (en) | Gold-plating process using gold potassium citrate | |
CN105378152A (en) | Method for cathodic corrosion protection of chromium surfaces | |
TWI391533B (en) | High speed method for plating palladium and palladium alloys | |
TW201319318A (en) | Surface treatment for aluminum or aluminum alloy and product manufactured by the aluminum or aluminum alloy | |
KR101692262B1 (en) | BLACKENING TREATMENT SOLUTION FOR BLACK Cr-Co ALLOY PLATING FILM | |
WO2009139384A1 (en) | Copper‑zinc alloy electroplating bath and plating method using same | |
CN103484901A (en) | Nickel-plating process for hardware | |
EP2781629B1 (en) | Solution for the electrodeposition of a gold alloy and the alloy derived therefrom | |
JP5449130B2 (en) | Method for depositing electrolyte and decorative and technical layers of black ruthenium | |
WO2015000010A1 (en) | Electrolyte bath and objects or articles coated with the aid of the bath | |
ITFI20120098A1 (en) | GALVANIC BATH WITH BASE OF PALLADIUM AND PHOSPHORUS, ITS USE IN GALVANIC PROCESSES AND ALLOYS OBTAINED BY APPLYING THE GALVANIC PROCESS TO THOSE BATHROOMS. | |
CN108495952A (en) | As the water solubility of electroless metal deposition stabilizer and the phospha-adamantane of air-stable | |
KR20140044785A (en) | Processes and compositions for improving corrosion performance of zirconium oxide pretreated zinc surfaces | |
EP3445582A1 (en) | Phosphorous-cobalt-nickel alloy and use thereof in plating processes of non-precious metal objects with precious metals | |
JP2011099126A (en) | Trivalent chromium plating bath | |
TWI645078B (en) | Functional chromium layer with improved corrosion resistance | |
JP6925985B2 (en) | Additives for alkaline galvanization | |
JP2015021178A (en) | ELECTROLESS Ni-P-Sn PLATING SOLUTION | |
JP4226063B1 (en) | Production method of hot dip galvanized products | |
JP6338397B2 (en) | Black plating solution and plating method for gold / palladium alloy plating | |
US7645371B2 (en) | Process of ceramic coating for silver or silver plated |