JP2002285377A5 - - Google Patents
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- Publication number
- JP2002285377A5 JP2002285377A5 JP2001093293A JP2001093293A JP2002285377A5 JP 2002285377 A5 JP2002285377 A5 JP 2002285377A5 JP 2001093293 A JP2001093293 A JP 2001093293A JP 2001093293 A JP2001093293 A JP 2001093293A JP 2002285377 A5 JP2002285377 A5 JP 2002285377A5
- Authority
- JP
- Japan
- Prior art keywords
- copper
- copper plating
- electrolytic copper
- electrolytic
- plating solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 31
- 229910052802 copper Inorganic materials 0.000 claims 31
- 239000010949 copper Substances 0.000 claims 31
- 238000007747 plating Methods 0.000 claims 18
- 239000000919 ceramic Substances 0.000 claims 12
- 238000000034 method Methods 0.000 claims 11
- 239000008139 complexing agent Substances 0.000 claims 9
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims 7
- 229910001431 copper ion Inorganic materials 0.000 claims 7
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims 6
- RGHNJXZEOKUKBD-SQOUGZDYSA-N D-gluconic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 claims 4
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims 4
- 229910010293 ceramic material Inorganic materials 0.000 claims 4
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 claims 2
- RGHNJXZEOKUKBD-UHFFFAOYSA-N D-gluconic acid Natural products OCC(O)C(O)C(O)C(O)C(O)=O RGHNJXZEOKUKBD-UHFFFAOYSA-N 0.000 claims 2
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims 2
- 239000004471 Glycine Substances 0.000 claims 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 2
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims 2
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 claims 2
- 235000015165 citric acid Nutrition 0.000 claims 2
- 239000002131 composite material Substances 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 2
- 238000009713 electroplating Methods 0.000 claims 2
- 239000000174 gluconic acid Substances 0.000 claims 2
- 235000012208 gluconic acid Nutrition 0.000 claims 2
- 239000001630 malic acid Substances 0.000 claims 2
- 235000011090 malic acid Nutrition 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 150000002739 metals Chemical class 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 239000011975 tartaric acid Substances 0.000 claims 2
- 235000002906 tartaric acid Nutrition 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 150000007513 acids Chemical class 0.000 claims 1
- 150000001412 amines Chemical class 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000000084 colloidal system Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 claims 1
- 239000011135 tin Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001093293A JP4207394B2 (ja) | 2001-03-28 | 2001-03-28 | セラミック電子部品の銅電極形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001093293A JP4207394B2 (ja) | 2001-03-28 | 2001-03-28 | セラミック電子部品の銅電極形成方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002285377A JP2002285377A (ja) | 2002-10-03 |
| JP2002285377A5 true JP2002285377A5 (enExample) | 2005-09-22 |
| JP4207394B2 JP4207394B2 (ja) | 2009-01-14 |
Family
ID=18947646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001093293A Expired - Lifetime JP4207394B2 (ja) | 2001-03-28 | 2001-03-28 | セラミック電子部品の銅電極形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4207394B2 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI229150B (en) * | 2003-03-05 | 2005-03-11 | Tdk Corp | Rare earth metal magnet and plating bath |
| JP4704761B2 (ja) * | 2005-01-19 | 2011-06-22 | 石原薬品株式会社 | 電気銅メッキ浴、並びに銅メッキ方法 |
| FR2890983B1 (fr) * | 2005-09-20 | 2007-12-14 | Alchimer Sa | Composition d'electrodeposition destinee au revetement d'une surface d'un substrat par un metal. |
| US7579274B2 (en) * | 2006-02-21 | 2009-08-25 | Alchimer | Method and compositions for direct copper plating and filing to form interconnects in the fabrication of semiconductor devices |
| JP4977885B2 (ja) * | 2007-07-18 | 2012-07-18 | 奥野製薬工業株式会社 | 電気銅めっき方法 |
| CN110062820B (zh) * | 2016-12-16 | 2021-07-20 | 柯尼卡美能达株式会社 | 透明导电膜的形成方法以及电镀用镀敷液 |
-
2001
- 2001-03-28 JP JP2001093293A patent/JP4207394B2/ja not_active Expired - Lifetime
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