1242048 玖、發明說明： 【發明所屬之技術領域】 本發明係關於在基板表面蒸鍍低分子有機E L (電致發光 元件：E 1 e c t r ο 1 u m i n e s c e n c e )材料、電極形成用材料、電介 質材料、絕緣體材料等時所使用之蒸鍍用光罩之製造方法 及蒸鍍用光罩。 【先前技術】 具備藉由電壓的施加而發光的低分子有機E L材料組成 的有機發光層的有機EL顯示面板，係利用在透明基板上 形成透明電極層，在該透明電極層上形成低分子有機EL 材料組成的有機發光層，並在該有機發光層上再形成金屬 電極層所製造。在該有機EL顯示面板之製造步驟中，透 明電極層上之有機發光層的形成，一般係由使用具有指定 圖案之多數微細透孔的蒸鍍用金屬光罩以使低分子有機 EL材料蒸鍍於基板上的方法來進行。 在有機發光層之形成步驟所使用的蒸鍍用光罩，係藉由 光#刻加工處理金屬薄板材，製作具有形成指定圖案的多 數微細透孔的一或複數光罩區域的光罩薄板，並將該光罩 薄板固定於支持框架上的方法所製造。另*卜，例如，如曰 本國專利申請案公開2 0 0 1 - 2 3 7 0 7 3號公報所揭示，具有複 數光罩區域的多倒角用蒸鍍用光罩，係由如下的方法所製 造，該方法係藉由光蝕刻處理製作複數片具有單一光罩區 域的單位光罩薄板，同時，製作由緣部支持單位光罩薄板 的具有複數開口部的基材部，並將該複數片單位光罩薄板 312/發明說明書(補件)/93-07/93111230 1242048 分別固定於基材部的各開口 【發明内容】 (發明所欲解決之問題） 在藉由光蝕刻處理而於金 以製造蒸鍍用光罩的情況， 工精度的面看越為有利。另 檢查時等之金屬薄板材的手 形等的不良發生，有必須使 的與上述相反的要求。 在此，本發明係鑒於上述 蒸鍍用光罩之製造方法及蒸 度，同時作業性良好，且可 不良發生。 (解決問題之手段） 申請專利範圍第1項之發 面蒸鍍時所使用之蒸鍍用光 以下步驟：使用介插入具有 解性的材料所形成的中間層 層層疊的薄板素材，從兩面 屬層上形成使蒸鍍材料依所 時，以在上述第2金屬層之 的形成區域以外的區域内殘 料通過用的開孔部的步驟； 的曝露部分溶解並除去的步 部的緣部。 屬薄板材形成多數微細透孔 金屬薄板材的厚度越薄，從加 一方面，若考慮#刻加工時或 工操作良好性或防止折斷、變 用具有一定厚度的金屬薄板材 問題點，其目的在於提供一種 鍍用光罩，其可獲得高加工精 防止薄板材的折斷、變形等的 明，係在將蒸鍍材料於被蒸鍍 罩之製造方法，其特徵為具備 耐蝕刻性且對指定藥液具有溶 ，而將第1金屬層與第2金屬 蝕刻上述薄板素材，於第1金 需要求通過用的開孔部，同 上述第1金屬層之上述開孔部 存框部的方式，形成使蒸鍍材 及藉由指定藥液使上述中間層 驟0 312/發明說明書(補件)/93-07/931〗1230 7 1242048 申請專利範圍第2項之發明，係在將蒸鍍材料於被 面蒸鍍時所使用之蒸鍍用光罩之製造方法，其特徵為 以下步驟：使用介插入具有耐蝕刻性且對指定藥液具 解性的材料所形成的中間層，而將第1金屬層與第2 層層疊的薄板素材，從單面側蝕刻上述薄板素材，於 第2金屬層，以殘存框部的方式，形成使蒸鍍材料通 的開孔部的步驟；從與上述相同的單面側，藉由指定 使上述中間層的曝露部分溶解並除去的步驟；及從與 相同的單面側蝕刻上述薄板素材，在上述第1金屬層 述第2金屬層之上述開孔部的形成區域内，形成使蒸 料依所需要求通過用的開孔部的步驟。 申請專利範圍第3項之發明，係在將蒸鍍材料於被 面蒸鍍時所使用之蒸鍍用光罩之製造方法，其特徵為 以下步驟：使用介插入具有耐蝕刻性且對指定藥液具 解性的材料所形成的中間層，而將第1金屬層與第2 層層疊的薄板素材，從單面側或兩面姓刻上述薄板素 於上述第1金屬層，形成使蒸鍍材料依所需要求通過 開孔部的步驟；藉由具有耐蝕刻性的保護膜以被覆上 板素材之形成有上述開孔部的第1金屬層面的步驟； 由保護膜被覆上述第1金屬層面的上述薄板素材，以 述第2金屬層之上述第1金屬層之上述開孔部的形成 以外的區域内殘存框部的方式，形成使蒸鍍材料通過 開孔部的步驟；從上述薄板素材之第1金屬層面剝離 去上述保護膜的步驟；及藉由指定藥液使上述中間層 312/發明說明書(補件)/93-07/9311】230 蒸鍍 具備 有溶 金屬 上述 過用 藥液 上述 之上 鍵材 蒸鍍 具備 有溶 金屬 材， 用的 述薄 I虫刻 在上 區域 用的 並除 的曝 8 1242048 露部分溶解並除去的步驟。 若根據申請專利範圍第1至3項之各發明的製造方法， 藉由減薄形成有使蒸鍍材料依所需要求通過用的開孔部的 第1金屬層，可提高蝕刻的加工精度。另一方面，因為以 殘存框部的方式形成有開孔部的第2金屬層係層疊於第1 金屬層上，因此可確保薄板素材全體的厚度，在蝕刻加工 時或檢查時等中，薄板素材的手工操作性良好，另夕卜，發 生薄板素材被折彎、變形等的不良的擔憂減少。 申請專利範圍第4項之發明，係於申請專利範圍第1至 3項中任一項之製造方法，其特徵為：形成於上述第1金 屬層的開孔部，係具有指定圖案的複數微細開孔部。 申請專利範圍第5項之發明，係於申請專利範圍第1至 3項中任一項之製造方法，其特徵為：形成於上述第1金 屬層的開孔部，係黏性狀開孔部。 申請專利範圍第6項之發明，係於申請專利範圍第1至 3項中任一項之製造方法，其特徵為：具備僅在薄板材之 一軸方向具有張力而將分別形成有開孔部於上述第1金屬 層及上述第2金屬層的薄板材接合於支持框架的單面側的 步驟。 在該製造方法中，與使在二軸方向分別具有張力而將薄 板材接合於支持框架的情況比較，其將薄板材接合於支持 框架的接合作業變為容易。另外，在二軸方向分別賦予張 力而將薄板材接合於支持框架的情況，若在各自的軸方向 的張力不均等，欲以設計要求精度良好地再現開孔部的尺 9 312/發明說明書(補件)/93-07/93111230 1242048 寸變得困難，但本發明僅在一軸方向具有張力而將薄板材 接合於支持框架，因此只要適宜調整一軸方向的張力，即 可容易依設計要求精度良好地再現開孔部的尺寸。 申請專利範圍第7項之發明，係於申請專利範圍第1至 3項中任一項之製造方法，其特徵為：上述薄板素材之上 述第2金屬層的厚度係較上述第1金屬層的厚度厚。 在該製造方法中，因為減薄形成有使蒸鍍材料依所需要 求通過用的開孔部的第1金屬層，且將薄板素材全體的厚 度增厚，因此可較佳地提高蝕刻的加工精度，薄板素材的 手工操作性良好，發生薄板素材被折彎、變形等的不良的 擔憂減少。 申請專利範圍第8項之發明，係於申請專利範圍第1至 3項中任一項之製造方法，其特徵為：上述薄板素材之中 間層係由鈦形成，並由氟化氨系或的氫氧化納系薄膜液溶 解除去其中間層的曝露部分。 申請專利範圍第9項之發明，係於申請專利範圍第1至 3項中任一項之製造方法，其特徵為：上述薄板素材之中 間層係由樹脂材料形成，並由氫氧化納系薄膜液溶解除去 其中間層的曝露部分。 申請專利範圍第1 0項之發明，係在將蒸鍍材料於被蒸 鍍面蒸鍍時所使用之蒸鍍用光罩，其特徵為：由層疊蒸鍍 用金屬層、支持用金屬層及中間層而成的薄板材料構成， 其中，蒸鍍用金屬層，係由蝕刻處理形成使蒸鍍材料依所 需要求通過用的開孔部且密接於被蒸鍍面；支持用金屬 10 312/發明說明書(補件)/93-07/93111230 1242048 層，係以在該蒸鍍用金屬層之上述開孔部的形成區域以外 的區域内殘存框部的方式，藉由蝕刻形成使蒸鍍材料通過 用的開孔部，以便補強支持上述蒸鍍用金屬層；及中間層， 係溶解除去對應於該支持用金屬層之上述開孔部的部分， 且介插入該支持用金屬層與上述蒸鍍用金屬層之間。 申請專利範圍第1 1項之發明，係於申請專利範圍第1〇 項之蒸鍍用光罩，其特徵為：形成於上述蒸鍍用金屬層的 開孔部，係具有指定圖案的複數微細開孔部。 申請專利範圍第1 2項之發明，係於申請專利範圍第1 0 項之蒸鍍用光罩，其特徵為：形成於上述蒸鍍用金屬層的 開孔部，係黏性狀開孔部。 申請專利範圍第1 3項之發明，係於申請專利範圍第1 0 至1 2項中任一項之蒸鍍用光罩，其特徵為：僅在上述薄板 材之一軸方向具有張力而將支持框架接合於上述支持用金 屬層側。 申請專利範圍第1 4項之發明，係於申請專利範圍第1 〇 至1 2項中任一項之蒸鍍用光罩，其特徵為：上述薄板材之 上述第2金屬層的厚度係較上述第1金屬層的厚度厚。 【實施方式】 以下，參照圖式說明本發明之較佳實施形態。 圖1及圖2顯示本發明之一實施形態，圖1同時顯示蒸 鍍用光罩的俯視圖，及將其部分放大的俯視圖，圖2為顯 示蒸鍍用光罩之薄板材的一部分的示意剖面圖。該蒸鍍用 光罩1 0係於矩形狀之支持框架（未圖示）的單面側固接具 312/發明說明書(補件)/93-07/93111230 11 1242048 有複數光罩區域1 4的薄板材1 2。 如圖2所示，薄板材1 2具有層疊蒸鍍用金屬層1 6、支 持用金屬層1 8及中間層2 0而成的3層構造。蒸鍍用金屬 層1 6係於蒸鍍處理時形成密接於基板表面的面，在該蒸鍍 用金屬層1 6之各個光罩區域1 4，如圖1中之A部分的放 大圖所示，以指定圖案加工形成使蒸鍵材料依所需要求通 過用的多數微細開孔部2 2。形成於該蒸鍍用金屬層1 6之 微細開？L部22的形狀，在圖示例子中為矩形狀，但也可為 狹槽狀或開縫狀。 支持用金屬層1 8，係於蒸鍍處理時形成成為蒸鍍源侧的 面，以在該蒸鍍用金屬層1 6之微細開孔2 2的形成區域 以外的區域内殘存框部24的方式，形成使蒸鍵材料通過用 的大開孔部2 6。該支持用金屬層1 8係確保薄板材1 2全體 之厚度以便補強支持蒸鍍用金屬層1 6者。因此，支持用金 屬層18之厚度最好較蒸鍍用金屬層16的厚度厚。另一方 面，形成於蒸鍍用金屬層1 6之多數微細開孔部2 2，係使 以所需圖案蒸鍍於基板表面的蒸鍍材料通過用者，因此有 提高其加工精度的必要，為此最好在可能的範圍減薄蒸鍍 用金屬層1 6的厚度。例如，蒸鍍用金屬層1 6的厚度最好 為5 // m〜5 0 /i m的範圍，支持用金屬層1 8之厚度最好為 2 0 β m〜3 0 0 // m的範圍。蒸鍍用金屬層1 6之微細開孔部 2 2及支持用金屬層1 8之開孔部2 6，如後述般係分別由光 姓刻形成。另外，蒸銀用金屬層1 6及支持用金屬層1 8係 分別由F e (鐵）或棕土（ i n v a 1·)合金等的F e / N i (鐵/鎳）合金等 12 312/發明說明書(補件)/93-07/93111230 1242048 可姓刻的金屬材料形成。 在上述之蒸鍍用金屬層16及支持用金屬層18之間，介 插入中間層。該中間層2 0係對三層構造之薄板素材執行如 後述之光蝕刻法而製作薄板材1 2的結果，殘留於蒸鍍用金 屬層1 6及支持用金屬層1 8之間，具有除去對應於支持用 金屬層1 8之開孔部2 6的部分的平面及剖面形狀。該中間 層2 0係由具有耐蝕刻性且對蝕刻液以外的指定藥液具有 溶解性的材料所形成。作為此種材料，例如使用對氫氧化 納等的鹼液可溶解的T i (鈦）或樹脂材料等。 關於形成中間層2 0的材料，若更為詳細地說明時，從 耐蝕刻性或形成蒸鍍用金屬層1 6及支持用金屬層1 8的金 屬材料，例如與3 6 N i鐵合金等的接合性等的觀點考慮，金 屬材料最好為T i。作為在形成蒸鍍用金屬層1 6之第1金 屬層及形成支持用金屬層18之第2金屬層之間介插入Ti 構成的中間層的三層構造的薄板材料的製造方法，例如， 採用在2片金屬薄板中間藉由真空蒸鍍法、離子塗敷法、 濺鍍法等不斷成膜Ti，與此同時，強壓2片金屬薄板與Ti 薄膜的方法。如此般製造的薄板素材之形成中間層的T i， 係可使用氟化氨系或氫氧化納系薄膜液予以溶解。 另外，樹脂材料係使用對驗系薄膜液具有溶解性且在I虫 刻液不溶解的熱架橋型的合成樹脂或天然樹脂。更為具體 而言，一般被稱為乾式薄膜的丙烯系薄膜狀抗蝕劑可簡單 使用而較佳。為使用該丙稀系薄膜狀抗姓劑製造三層構造 的薄板素材，係以在2片金屬薄板中間夾入薄膜狀抗蝕劑 13 312/發明說明書(補件)/93-07/93111230 1242048 的方式進行層疊並予以熱硬化。形成如此般所製造的薄板 素材的中間層的丙烯系薄膜狀抗蝕劑，係可使用氫氧化納 系的薄膜液予以溶解。另外，在2片金屬薄板中一者的單 面上黏貼上述以外的可溶性接合膠帶或塗敷液狀的接合 劑，並介由該接合膠帶或接合劑接合另一的金屬薄板，強 壓接合此等即可製造三層構造的薄板素材。形成中間層之 接合膠帶或接合劑，係可由強鹼液所溶解。又，在2片金 屬薄板中一者的單面上塗敷抗钱劑（無感光性），並介由該 抗I虫劑接合另一的金屬薄板，強壓接合此等也可製造三層 構造的薄板素材。此種抗蝕劑係可使用鹼性顯像液所溶解。 該蒸鍍用光罩1 0係於基板表面以指定圖案蒸鍍低分子 有機E L材料、電極形成用材料、電介質材料、絕緣體材 料等時所使用。例如，在有機EL顯示面板之製造步驟中， 在透明基板（玻璃基板）上形成I Τ Ο (銦錫氧化物）等的透明 電極層後，使該蒸鍍用光罩1 0之薄板材1 2之蒸鍍用金屬 層1 6面侧與透明基板之透明電極層側進行位置對準並密 接，通過薄板材1 2之微細開孔部2 2使低分子有機E L材 料蒸鍍於透明電極層上，以便在透明電極層上形成指定圖 案的有機發光層。若形成有機發光層後，於該有機發光層 上再形成金屬電極層而製造有機EL顯示面板。 圖1及圖2所示之蒸鍍用光罩1 0之薄板材1 2，係藉由 光触刻在三層構造的薄板素材的第1金屬層及第2金屬層 分別形成開孔部所製造。參照圖3及圖4，詳細說明蒸鍍 用光罩之製造方法的一例。 14 312/發明說明書(補件)/93-07/931〗1230 1242048 首先，如圖3(a)所示，準備在第1金屬層32及第2金屬 層3 4之間介插入中間層3 6的薄板素材3 0。第1金屬層3 2 及第2金屬層3 4係由棕土合金或鐵-鎳、鈷合金等的熱膨 脹少的金屬材料所形成，中間層3 6係由如上述的鈦或樹脂 材料所形成。第1金屬層3 2的厚度，例如係為5 " ni〜5 0 // m，第2金屬層3 4之厚度例如係為2 0 // m〜3 0 0 // m。在 如此之薄板素材3 0的兩面，如圖3 (b)所示，分別塗敷感 光液並進行乾燥，在薄板素材3 0的兩面分別被覆形成光阻 膜 38、 40。 其次，如圖3 (c)所示，使曝光用光罩4 2密接在薄板素材 3 0的第1金屬層3 2面側，同時，使曝光用光罩4 4密接在 薄板素材3 0的第2金屬層3 4面側，其中，曝光用光罩4 2 具有對應欲形成之多數微細開孔部的指定圖案，曝光用光 罩44具有以在微細開孔部的形成區域以外的區域内殘存 框部的方式形成大開孔部用的指定·圖案。然後，介由各曝 光用光罩42、44分別曝光各光阻膜38、40，如圖3(d)所 示，分別依指定圖案將各光阻膜3 8 a、4 0 a硬化（不溶化） 後，如圖3 (e)所示，進行顯像，在薄板素材3 0的兩面分別 形成具有指定圖案的耐腐蝕性抗蝕劑膜3 8 b、4 0 b。 接著，藉由使用氣化二鐵水溶液等的蝕刻液進行喷霧式 蝕刻處理，如圖4(f)所示，在第1金屬層32形成微細開孔 部4 6，同時，在第2金屬層3 4以殘留框部的方式形成大 開孔部4 8。然後，使用氫氧化納等的薄膜液，如圖4 (g) 所示，從薄板素材3 0的兩面分別剝離腐蝕性抗蝕劑膜 15 312/發明說明書(補件)/93-07/93111230 1242048 3 8 b、4 0 b。然後再使用氫氧化納等的薄膜液，如圖4 ( h )所 示，藉由溶解並除去中間層3 6的曝露部分，以連通第1 金屬層3 2之微細開孔部4 6與第2金屬層3 4之開孔部4 8 ’ 獲得薄板材5 0。如圖4 (i)所示，藉由將如此般製作的薄板 材5 0接合於矩形狀支持框架5 2的單面側，完成蒸鍍用光 罩5 4。支持框架1 2如係使用由不鏽鋼或棕土合金等形成 框架。 將薄板材5 0接合於矩形支持框架5 2的作業，例如，係 依如下方式進行。亦即，如圖5 (a)之立體圖所示，以將薄 板材5 0重疊於支持框架5 2的單面側的方式進行。此時， 如圖5 (b)所示，以僅在其一軸方向具有張力的方式將薄板 材5 0重疊於支持框架5 2的單面側。然後，如圖5 ( c)所示， 在薄板材5 0上具有張力的狀態下，將薄板材5 0 —體接合 於矩形支持框架5 2。此時，將支持框架5 2之在對薄板材 5 0施予張力方向的相互對向的一對框部與薄板材5 0的兩 端邊部接合。圖中之元件符號5 6係支持框架5 2與薄板材 5 0的接合部分。另外，薄板材5 0對支持框架5 2的接合係 藉由使用焊接（例如點焊接）、接合劑或接合膠帶的接合等 來進行。 接著，參照圖6至圖8，說明蒸鍍用光罩之製造方法的 另一例。 如圖6(a)所示，準備在第1金屬層32及第2金屬層34 之間介插入中間層3 6的薄板素材3 0。如圖6 (b )所示，分 別塗敷感光液並進行乾燥，在薄板素材3 0的兩面分別被覆 16 312/發明說明書(補件)/93-07/93111230 1242048 形成光阻膜3 8、4 0。 其次，如圖6 ( c)所示，使曝光用光罩4 4密接在薄板素材 3 0的第2金屬層3 4面側，該曝光用光罩4 4具有以在微細 開孔部的形成區域以外的區域内殘存框部的方式形成大開 孔部用的指定圖案。然後，在薄板素材3 0的第1金屬層 3 2面側直接全面曝光光阻膜3 8，同時，在薄板素材3 0的 第2金屬層34面側，介由曝光用光罩44曝光光阻膜40, 如圖6 (d)所示，在薄板素材3 0的第1金屬層3 2面側全面 將光阻膜3 8硬化（不溶化），形成被覆第1金屬層3 2全面 的耐腐蝕性抗蝕劑膜3 8 c。另一方面，在薄板素材3 0的第 2金屬層3 4面側，依指定圖案將各光阻膜4 0 a硬化後，如 圖6 (e)所示，進行顯像，在薄板素材3 0的第2金屬層3 4 面形成具有指定圖案的耐腐蝕性抗蝕劑膜4 0 b。又，關於 薄板素材3 0的第1金屬層3 2面側，係在被覆形成光阻膜 3 8後進行全面曝光以形成耐腐蝕性抗蝕劑膜3 8 c，但也可 取代此，以在第1金屬層3 2面黏貼具耐酸性的耐蝕刻薄膜 的方式來進行，在後述之蝕刻處理結束後，只要從第1金 屬層3 2面剝離該耐蝕刻薄膜即可。 接著，藉由使用氣化二鐵水溶液等的蝕刻液進行喷霧式 蝕刻處理，如圖7(f)所示，在第2金屬層 34以殘留框部的 方式形成大開孔部4 8。然後，使用氫氧化納等的薄膜液， 如圖7 (g)所示，從薄板素材3 0的第2金屬層3 4面剝離腐 蝕性抗蝕劑膜40b。然後再使用氫氧化納等的薄膜液，如 圖7 ( h )所示，溶解並除去中間層3 6的曝露部分。 17 312/發明說明書(補件)/93-07/93 ] 11230 1242048 其次，如圖7(i)所示，在薄板素材30白< 面側塗敷感光液並進行乾燥，在第2金屬/ 成也填充於開孔部4 8内的光阻膜5 8。接 示，使曝光用光罩4 2密接在薄板素材3 0 面側，該曝光用光罩42具有對應欲形成之 的指定圖案。然後，從薄板素材3 0的第： 介由曝光用光罩42曝光光阻膜56，如圖 定圖案將光阻膜5 6 a硬化（不溶化）後，如 行顯像，在薄板素材3 0的第2金屬層3 4 圖案的耐腐#性抗I虫劑膜5 8 b。 接著，藉由使用氣化二鐵水溶液等的蝕 触刻處理，如圖8 (m)所示，在第1金屬層 部6 0。然後，使用氫氧化納等的薄膜液， 從薄板素材3 0的第2金屬層3 4面剝離腐 5 8 b，獲得薄板材6 2。如圖8 ( 〇 )所示，藉 的薄板材6 2接合於矩形狀支持框架5 2的 鍍用光罩64 。 以上述方式製造的蒸鍍用光罩6 4，如圖 之B部分的剖面圖所示，形成於薄板素材 層3 2的微細開孔部6 0的剖面成為錐面， 框架5 2之接合面側的面（係蒸鍍處理時成 面，在圖8(〇)及圖9中為下面）朝向另一 δ 9中為上面），其開口尺寸漸漸變小。使用 有如此之剖面形狀的微細開孔部60之薄相 312/發明說明書(補件)/93-07/93111230 )第2金屬層34 I 34面側被覆形 著，如圖7(j)所 的第2金屬層3 4 多數微細開孔部 2金屬層3 4面側 8 ( k )所示，依指 圖 8(1)所示，進 面形成具有指定 刻液進行噴霧式 3 2形成微細孔 如圖 8 ( η )所示， I虫性抗钱劑膜 由將如此般製作 單面側，完成蒸 9之放大圖8(〇) 3 0的第1金屬 係從成為與支持 為蒸鍍源側的 丨（在圖8(〇)及圖 具備形成多數具 ί材6 2之蒸鍍用 18 1242048 光罩64，例如，在形成於透明基板上之透明電極層上蒸鍍 低分子有機EL材料時，薄板材62之微細開孔部60之開 口面積小側的面（在圖8 (〇)及圖9中為上面）與透明電極層 成為對面。因此，彳&分子有機EL材料氣體均勻且良好地 進入薄板材62之多數微細開孔部60。另外，因為薄板材 6 2之微細開孔部6 0之開口周緣與透明電極層的密接變得 良好，因此，具有可精度良好地再現由微細開孔部60之開 口周緣所規定的有機發光層的圖案形狀的有利點。 再者，參照圖1 0及圖11，說明蒸鍍用光罩之製造方法 的另一例。該製造方法與基於圖3及圖4說明之上述製造 方法，在途中的步驟、亦即圖3 ( a )〜（e )所示步驟相同，故 省略此等步驟相關的圖示及說明。 如圖3 ( e)所示，當在薄板素材3 0的兩面分別形成具有指 定圖案的耐腐蝕性抗蝕劑膜3 8 b、4 0 b時，藉由使用氣化二 鐵水溶液等的蝕刻液進行喷霧式蝕刻處理，如圖1 0 ( f)所 示，在第1金屬層3 2形成微細開孔部4 6。此時，雖與第2 金屬層34同時，在厚度方向上作局部蝕刻，但因為第2 金屬層34的厚度較第1金屬層32的厚度厚，利用在第1 金屬層3 2形成微細開孔部4 6的時點結束蝕刻，因此在第 2金屬層3 4未形成到達中間層3 6的開孔部。又，在第1 金屬層32的厚度與第2金屬層34的厚度相差不大的情 況，也可在第2金屬層3 4面黏貼具耐酸性的耐蝕刻薄膜等 用以保護第2金屬層34的表面後，進行噴霧式蝕刻處理， 在蝕刻處理結束後再從第2金屬層3 4面剝離腐蝕性薄膜。 19 312/發明說明書(補件)/93-07/93111230 1242048 當於薄板素材3 0的第1金屬層3 2形成微細開孔4 6時， 如圖1 0 ( g )所示，藉由具有耐蝕刻性的保護膜6 6被覆第1 金屬層3 2的表面。該保護膜6 6係例如藉由在第1金屬層 3 2面側塗敷可溶鹼性的蒸發乾燥型樹脂後予以乾燥，或， 在第1金屬層3 2面側塗敷可溶鹼性的紫外線硬化型樹脂後 以紫外線予以曝光，將保護黏接薄膜黏貼於第1金屬層3 2 面所形成。接著，藉由使用氯化二鐵水溶液等的蝕刻液進 行喷霧式蝕刻處理，如圖1 〇 (h)所示，在第2金屬層3 4以 殘留框部的方式形成大開孔部4 8。然後，藉由使用鹼液溶 解第1金屬層3 2面上的樹脂膜或從第1金屬層3 2面剝離 保護黏接薄膜，如圖1 〇 (i)所示，從第1金屬層3 2面剝離 並除去保護膜6 6。接著，使用氫氧化納等的薄膜液，如圖 1 〇 (j)所示，從薄板素材3 0的兩面分別剝離腐蝕性抗蝕劑 膜3 8b、40b。又，在使用可溶鹼性樹脂形成保護膜66時， 藉由使用氫氧化納等的鹼液，可在一個步驟中進行從第1 金屬層3 2面剝除去保護膜6 6及從薄板素材3 0的兩面剝離 腐蝕性抗蝕劑膜3 8 b、4 0 b的作業。 然後再使用氫氧化納等的薄膜液，如圖1 1 (k)所示，藉 由溶解中間層36的曝露部分而予以除去，以連通第1金屬 層3 2之微細開孔部4 6與第2金屬層3 4之開孔部4 8，獲 得薄板材5 0。如圖1 1 (1)所示，藉由將如此般製作的薄板 材5 0接合於矩形狀支持框架5 2的單面側，完成蒸鍍用光 罩54。 在根據該製造方法時，形成微細開孔部4 6之第1金屬 20 312/發明說明書(補件)/93-07/93111230 1242048 層3 2在步驟的同中獲得保護，可防止在薄的第1金屬層 3 2產生折彎或受傷等的缺陷的情況。 又，在上述實施形態中，說明了於薄板材之蒸鍍用金屬 層（第1金屬層）形成多數微細開孔部，主要在基板表面蒸 鍍低分子有機EL材料時所使用的蒸鍍用光罩及其製造方 法，但是，例如，關於在薄板材之蒸鍵用金屬層（第1金屬 層）形成黏性狀開孔部，使電極形成用材料蒸鍍於基板的表 面以形成電極時所使用之蒸鍍用光罩等，同樣可適用於本 發明。 又，在上述實施形態中，在藉由光蝕刻製作薄板材後， 係採用將薄板材接合於支持框架的方式，但是，也可採用 在蝕刻加工前預先將薄板素材接合於支持框架，對接合於 支持框架之狀態下的薄板素材施以姓刻加工的方式。 (發明效果） 若根據申請專利範圍第1至3項之各發明之蒸鍍用光罩 的製造方法，可獲得具有高加工精度之蒸鍍用光罩，同時， 作業性也良好，且可防止薄板素材被折彎、變形等不良的 產生。另外，根據該製造方法，即使為大型蒸鍍用光罩仍 可無障礙地進行製造。 在申請專利範圍第4項之發明之製造方法中，具備形成 具指定圖案的複數微細開孔部的光罩區域，例如，可以高 加工精度獲得在基板表面蒸鍍低分子有機EL材料時所使 用的蒸鍍用光罩。 在申請專利範圍第5項之發明之製造方法中，形成有黏 21 312/發明說明書(補件)/93-07/93111230 1242048 性狀開孔部，例如，可以高加工精度獲得在基板表面蒸鍍 電極形成用材料以形成電極時所使用的蒸鍍用光罩。 在申請專利範圍第6項之發明之製造方法中，其將薄板 材接合於支持框架單面側的接合作業變為容易。另外，可 容易依設計要求精度良好地再現開孔部的尺寸。 在申請專利範圍第7項之發明之製造方法中，可較佳地 提高蝕刻的加工精度，薄板素材的手工操作性變得良好， 發生薄板素材被折彎、變形等的不良的擔憂減少。 在申請專利範圍第8及9項之發明之製造方法中，申請 專利範圍第1至3項之各發明之各步驟的處理被確實執 行，可獲得上述效果。 申請專利範圍第1 〇項之發明之蒸鍍用光罩，其加工精 度高，且其製造步驟的作業性良好，在製造步驟中無薄板 素材被折彎、變形等的不良的產生。 申請專利範圍第1 1項之發明之蒸鍍用光罩，因為具有高 加工精度，例如，可在基板表面良好地蒸鍍低分子有機EL 材料以形成高品質的有機發光層。 申請專利範圍第1 2項之發明之蒸鍍用光罩，因為具有 高加工精度，例如，可在基板表面良好地蒸鍍電極形成用 材料以形成南品質的電極。 申請專利範圍第1 3項之發明之蒸鍍用光罩，可依設計 要求精度良好地再現開孔部的尺寸，該製造步驟的作業也 變得容易。 申請專利範圍第1 4項之發明之蒸鍍用光罩，可確保高 22 312/發明說明書(補件)/93-07/93111230 1242048 加工精度，且其製造步驟的作業性良好，在製造步驟中無 薄板素材被折彎、變形等的不良的產生。 【圖式簡單說明】 圖1顯示本發明之一實施形態，圖1為同時顯示蒸鍍用 光罩的俯視圖，及將其部分放大的俯視圖。 圖2為顯示圖1所示蒸鍍用光罩之薄板材的一部分的示 意剖面圖。 圖3 ( a )〜（e )為說明本發明之蒸鍍用光罩之製造方法的 一例的說明圖，為分別顯示各步驟的剖面圖。 圖4 ( f)〜（i)同樣為分別顯示各步驟的剖面圖。 圖5 ( a )〜（c )為有關將薄板材接合於支持框架的作業的 說明圖，為分別顯示各步驟的立體圖。 圖6 ( a )〜（e )為說明本發明之蒸鍍用光罩之製造方法的 另一例的說明圖，為分別顯示各步驟的剖面圖。 圖7 ( f)〜（j )同樣為分別顯示各步驟的剖面圖。 圖8 ( k )〜（〇 )同樣為分別顯示各步驟的剖面圖。 圖9為藉由圖6至圖8所示製造方法所製造之蒸鍍光罩 的薄板材的局部放大剖面圖，為放大圖8(〇)之B部分的剖 面圖 。 圖1 0 ( f)〜（j )為說明本發明之蒸鍍用光罩之製造方法的 又一例的說明圖，為分別顯示各步驟的剖面圖。 圖1 1 ( k )〜（1)同樣為分別顯示各步驟的剖面圖。 (元件符號說明） 10 蒸鍍用光罩 231242048 发明 Description of the invention: [Technical field to which the invention belongs] The present invention relates to a method for depositing a low-molecular organic EL (electroluminescence element: E 1 ectr ο 1 uminescence) material, a material for electrode formation, a dielectric material, and an insulator on a substrate surface. A method for producing a photomask for vapor deposition used for materials and the like and a photomask for vapor deposition. [Prior art] An organic EL display panel having an organic light-emitting layer composed of a low-molecular organic EL material that emits light upon application of a voltage is formed by forming a transparent electrode layer on a transparent substrate, and forming a low-molecular organic on the transparent electrode layer. An organic light emitting layer composed of an EL material, and a metal electrode layer is further formed on the organic light emitting layer. In the manufacturing step of the organic EL display panel, the formation of the organic light-emitting layer on the transparent electrode layer is generally performed by using a metal mask for vapor deposition with a plurality of fine through holes having a specified pattern to evaporate a low-molecular organic EL material. The method is performed on a substrate. The photomask for evaporation used in the step of forming the organic light-emitting layer is a photomask with a metal thin plate processed by photolithography to produce a photomask sheet having one or a plurality of photomask regions with a plurality of fine through holes forming a specified pattern. It is manufactured by a method of fixing the mask sheet on a supporting frame. In addition, for example, as disclosed in Japanese Patent Application Publication No. 2000-1 2 3 7 0 7 3, a multi-chamfering vapor deposition mask having a plurality of mask regions is prepared by the following method The method is to produce a plurality of unit mask sheets having a single mask region by photoetching, and simultaneously to produce a base portion having a plurality of openings supporting the unit mask sheet by an edge portion, and the plurality of Sheet unit reticle sheet 312 / Invention specification (Supplement) / 93-07 / 93111230 1242048 Each is fixed to each opening of the substrate part [Summary of the Invention] (Problems to be Solved by the Invention) In the case of manufacturing a photomask for vapor deposition, it is more advantageous in terms of work accuracy. In addition, defects such as the hand shape of the sheet metal during inspection must be reversed. Herein, the present invention is based on the manufacturing method and the evaporation rate of the above-mentioned photomask for vapor deposition, and at the same time, the workability is good and defects can occur. (Means of Solving the Problem) The following steps are used for vapor deposition during the vapor deposition of the first surface of the patent application: Use the sheet material laminated with an intermediate layer formed by interposing a decomposable material, A step of forming an opening portion for allowing the vapor deposition material to pass through in a region other than the region where the second metal layer is formed, and forming an edge portion of the step portion where the exposed portion is dissolved and removed. It is a thin sheet that forms the most thin through-hole metal sheet. The thinner the thickness is, on the one hand, if you consider the #engraving process or the good workmanship or prevent breakage and use of a thin sheet of metal with a certain thickness, the purpose is The invention is to provide a photomask for plating, which can obtain high processing precision to prevent breakage and deformation of a thin plate, and is a method for manufacturing a vapor-deposited material on a vapor-deposited mask. The chemical solution is soluble, and the first metal layer and the second metal are used to etch the thin plate material. The opening portion for the first gold to be passed is the same as the frame portion of the opening portion of the first metal layer. Forming a vapor deposition material and making the above intermediate layer step by a designated chemical solution 0 312 / Invention Specification (Supplement) / 93-07 / 931〗 1230 7 1242048 The invention in the second scope of the patent application is for the vapor deposition material The method for manufacturing a photomask for vapor deposition used on a surface to be vapor-deposited is characterized by the following steps: an intermediate layer formed by interposing a material having resistance to etching and decomposability to a specified chemical solution, and 1 metal layer and 2 layer A step of forming the laminated sheet material from one side by etching the above sheet material, and forming a hole portion through which the vapor deposition material passes through in the second metal layer so that the frame portion remains; from the same single side as above, The step of dissolving and removing the exposed portion of the intermediate layer is specified; and etching the thin plate material from the same single-sided side as that in the region where the openings of the first metal layer and the second metal layer are formed are formed. The step of passing the steamed material through the perforated portion as required. The invention of claim 3 in the scope of patent application is a method for manufacturing a photomask for vapor deposition used for vapor deposition of a vapor deposition material on a surface. An intermediate layer formed of a liquid-resolving material, and a thin plate material in which the first metal layer and the second layer are laminated, and the above-mentioned thin plate is engraved on the first metal layer from one side or both sides to form a vapor deposition material. The step of passing the openings as required; the step of coating the plate material with the first metal layer on which the above-mentioned openings are formed by a protective film having an etching resistance; the step of covering the first metal layer with the protective film The thin plate material is formed by a step of passing a vapor deposition material through the opening portion such that a frame portion remains in a region other than the formation of the opening portion of the first metal layer of the second metal layer; The step of peeling off the protective film on the first metal layer; and making the intermediate layer 312 / Invention (Supplement) / 93-07 / 9311] by a specified chemical solution] 230 vapor deposition is provided with the dissolving metal and the used chemical solution described above Up key The material vapor deposition is provided with a step of dissolving the metal material, and the thin film I used to inscribe the upper area and remove the exposed area. 8 1242048 The step of dissolving and removing the exposed portion. According to the manufacturing method of each of the inventions in claims 1 to 3, by reducing the thickness of the first metal layer formed with the openings for allowing the vapor deposition material to pass as required, the accuracy of the etching process can be improved. On the other hand, since the second metal layer having the openings formed as the remaining frame portion is laminated on the first metal layer, the thickness of the entire thin plate material can be ensured, and the thin plate can be used during etching or inspection. The material has good manual operability. In addition, there is less concern that the thin plate material may be bent or deformed. The invention claimed in item 4 of the scope of patent application is a manufacturing method in any of claims 1 to 3 of the scope of patent application, and is characterized in that the openings formed in the first metal layer described above are provided with a plurality of fine patterns having a specified pattern. Openings. The invention in the fifth scope of the patent application is a manufacturing method in any one of the first to third scopes of the patent application, and is characterized in that the openings formed in the first metal layer are viscous openings. The invention in the patent application No. 6 belongs to the manufacturing method in any one of the patent application scope Nos. 1 to 3, and is characterized in that it has a tension only in one axial direction of the thin plate, and an opening portion is formed in each of them. The step of joining the thin metal plates of the first metal layer and the second metal layer to one side of the support frame. This manufacturing method makes it easier to join the thin plate to the support frame than when the thin plate is joined to the support frame with tension in the two-axis directions. In addition, when tension is applied to the support frame in the two axial directions, if the tension in the respective axial directions is not equal, the rule 9 312 / Invention specification of the opening part is to be reproduced with high accuracy in design requirements. (Supplement) / 93-07 / 93111230 1242048 inches becomes difficult, but the present invention only has tension in one axis direction to join the thin plate to the support frame, so as long as the tension in one axis direction is appropriately adjusted, the accuracy can be easily achieved according to the design requirements To reproduce the size of the opening. The invention of the seventh scope of the patent application is the manufacturing method of any one of the first to third scopes of the patent scope, characterized in that the thickness of the second metal layer of the thin plate material is greater than that of the first metal layer. Thick. In this manufacturing method, since the first metal layer having an opening portion for allowing the vapor deposition material to pass through as required is thinned and the thickness of the entire sheet material is increased, it is possible to improve the etching process. The precision and manual operability of the sheet material are good, and there is less concern that the sheet material may be bent or deformed. The invention of the eighth scope of the patent application is the manufacturing method of any one of the first to third scopes of the patent scope, characterized in that the intermediate layer of the thin sheet material is formed of titanium, and is made of ammonia fluoride or The sodium hydroxide-based thin film solution was dissolved to remove the exposed portion of the intermediate layer. The invention claimed in item 9 of the scope of patent application is the manufacturing method of any of items 1 to 3 in the scope of patent application, characterized in that the intermediate layer of the above sheet material is formed of a resin material, and is made of a sodium hydroxide film The liquid dissolves to remove the exposed portion of the intermediate layer. The invention of claim 10 in the scope of patent application is a photomask for vapor deposition used for vapor deposition of a vapor deposition material on a vapor-deposited surface, and is characterized in that a metal layer for vapor deposition, a metal layer for support, and The middle layer is composed of a thin plate material. Among them, the metal layer for vapor deposition is formed by an etching process so that the vapor deposition material can pass through according to the required requirements and is in close contact with the vapor-deposited surface. Supporting metal 10 312 / Invention Specification (Supplement) / 93-07 / 93111230 1242048 layer is formed by etching to form a vapor deposition material in such a manner that a frame portion remains in a region other than the formation region of the above-mentioned opening portion of the metal layer for vapor deposition. The opening portion used for reinforcing the metal layer for vapor deposition; and the intermediate layer, which dissolves and removes the portion corresponding to the opening portion of the metal layer for support, and inserts the metal layer for support and the vapor deposition Between metal layers for plating. The invention of item 11 in the scope of patent application is a photomask for vapor deposition which is in item 10 of the scope of patent application, and is characterized in that the openings formed in the above-mentioned metal layer for vapor deposition have a plurality of fine patterns with a specified pattern. Openings. The invention of item 12 in the scope of patent application is a photomask for vapor deposition which is in item 10 of the scope of patent application, and is characterized in that the opening portion formed in the metal layer for vapor deposition is a viscous opening portion. The invention of item 13 in the scope of patent application, which is a photomask for vapor deposition in any one of the scope of patent applications 10 to 12, is characterized in that it will support only the axial direction of one of the above thin plates and will support it. The frame is joined to the supporting metal layer side. The invention claimed in item 14 of the scope of patent application is a photomask for vapor deposition in any one of the scope of applied patents 10 to 12, and is characterized in that the thickness of the second metal layer of the thin sheet is relatively small. The thickness of the first metal layer is thick. [Embodiment] Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. FIG. 1 and FIG. 2 show an embodiment of the present invention. FIG. 1 also shows a plan view of a photomask for vapor deposition, and a partially enlarged plan view. FIG. 2 is a schematic cross-section showing a part of a thin plate of a photomask for vapor deposition. Illustration. This vapor deposition mask 10 is a single-sided fixing device 312 / Invention Manual (Supplement) / 93-07 / 93111230 11 1242048 in a rectangular support frame (not shown). There are multiple mask areas 1 4 Thin sheet 1 2. As shown in Fig. 2, the thin plate 12 has a three-layer structure in which a metal layer 16 for vapor deposition, a metal layer 18 for support, and an intermediate layer 20 are stacked. The metal layer 16 for vapor deposition forms a surface that is in close contact with the substrate surface during the vapor deposition process, and each photomask area 14 of the metal layer 16 for vapor deposition is shown in an enlarged view of part A in FIG. 1. In a specific pattern, a large number of fine openings 22 are formed so that the steam-bonding material can pass as required. Are fine openings formed on the metal layer 16 for vapor deposition? The shape of the L portion 22 is rectangular in the example shown in the figure, but may be a slot shape or a slit shape. The supporting metal layer 18 is formed on the surface to be a source of the evaporation during the vapor deposition process, so that the frame portion 24 is left in a region other than the area where the fine openings 22 of the metal layer 16 for vapor deposition are formed. In this way, the large openings 26 for passing the vapor bonding material are formed. The supporting metal layer 18 is to ensure the thickness of the entire thin plate 12 to reinforce the supporting metal layer 16 for vapor deposition. Therefore, the thickness of the supporting metal layer 18 is preferably thicker than that of the metal layer 16 for vapor deposition. On the other hand, most of the fine openings 22 formed in the metal layer 16 for vapor deposition pass through the vapor deposition material deposited on the substrate surface in a desired pattern. Therefore, it is necessary to improve the processing accuracy. For this reason, it is desirable to reduce the thickness of the metal layer 16 for vapor deposition to the extent possible. For example, the thickness of the metal layer 16 for vapor deposition is preferably in the range of 5 // m to 50 / im, and the thickness of the support metal layer 18 is preferably in the range of 20 β m to 3 0 0 // m. . The fine opening portions 22 of the metal layer 16 for vapor deposition and the opening portions 26 of the supporting metal layer 18 are formed by the light name as described below. In addition, the metallic layer 16 for steaming silver and the supporting metal layer 18 are made of F e / N i (iron / nickel) alloy such as F e (iron) or brown earth (inva 1 ·) alloy, etc. 12 312 / Description of the Invention (Supplement) / 93-07 / 93111230 1242048 Metal material can be engraved. An intermediate layer is interposed between the above-described metal layer 16 for deposition and the metal layer 18 for support. This intermediate layer 20 is a result of the thin plate material 12 produced by performing a photo-etching method as described later on a thin plate material having a three-layer structure, which remains between the metal layer 16 for vapor deposition and the metal layer 18 for support, and has a removal The plane and cross-sectional shape of the portion corresponding to the opening portion 26 of the supporting metal layer 18. The intermediate layer 20 is formed of a material having an etching resistance and a solubility in a predetermined chemical solution other than an etching solution. As such a material, for example, Ti (titanium) which is soluble in an alkali solution such as sodium hydroxide or a resin material is used. Regarding the material for forming the intermediate layer 20, if it is described in more detail, the metal materials such as the resistance to etching or the formation of the metal layer 16 for vapor deposition and the metal layer 18 for support, such as 3 6 N i iron alloy, etc. From the viewpoints of bonding properties and the like, the metal material is preferably T i. As a method for manufacturing a thin-layer material having a three-layer structure with an intermediate layer made of Ti interposed between the first metal layer 16 forming the vapor deposition metal layer 16 and the second metal layer forming the support metal layer 18, for example, A method in which Ti is continuously formed between two metal thin plates by a vacuum evaporation method, an ion coating method, a sputtering method, and the like, and at the same time, two metal thin plates and a Ti thin film are strongly pressed. The Ti forming the intermediate layer of the thin plate material manufactured in this manner can be dissolved using an ammonia fluoride-based or sodium hydroxide-based thin film solution. In addition, as the resin material, a thermal bridge type synthetic resin or a natural resin that is soluble in the test film liquid and is insoluble in the insect solution is used. More specifically, an acrylic-based thin film resist generally referred to as a dry film is preferable because it can be easily used. In order to use this acrylic-based thin film anti-surname agent to produce a three-layer structure of a thin plate material, a thin film resist is sandwiched between two metal thin plates 13 312 / Invention Manual (Supplement) / 93-07 / 93111230 1242048 Laminate and heat-harden. The propylene-based thin-film resist forming the intermediate layer of the thin-plate material thus manufactured can be dissolved using a sodium hydroxide-based thin-film solution. In addition, a soluble bonding tape other than the above or a liquid bonding agent is affixed to one side of one of the two metal thin plates, and the other metal thin plate is bonded by the bonding tape or the bonding agent, and the pressure bonding This produces a three-layer structure of sheet material. The adhesive tape or adhesive forming the intermediate layer can be dissolved by a strong alkaline solution. A three-layer structure can also be produced by coating an anti-money agent (non-photosensitive) on one side of one of the two metal sheets, and bonding the other metal sheet through the anti-I insecticide. Sheet material. Such a resist can be dissolved using an alkaline developing solution. This vapor deposition mask 10 is used when a low-molecular organic EL material, an electrode formation material, a dielectric material, an insulator material, and the like are vapor-deposited in a predetermined pattern on a substrate surface. For example, in the manufacturing step of the organic EL display panel, a transparent electrode layer such as ITO (indium tin oxide) is formed on a transparent substrate (glass substrate), and then the thin plate 1 of the photomask 10 for vapor deposition is made. The metal layer for vapor deposition 16 of 2 is aligned with the transparent electrode layer side of the transparent substrate and is in close contact with each other, and the low-molecular organic EL material is vapor-deposited on the transparent electrode layer through the thin openings 2 of the thin plate 1 2 So as to form an organic light emitting layer in a specified pattern on the transparent electrode layer. After the organic light emitting layer is formed, a metal electrode layer is further formed on the organic light emitting layer to manufacture an organic EL display panel. The thin plates 12 of the photomask 10 for vapor deposition shown in FIG. 1 and FIG. 2 are formed by openings in the first metal layer and the second metal layer of a thin plate material with a three-layer structure formed by photo-touch. Manufacturing. An example of a method for manufacturing a photomask for vapor deposition will be described in detail with reference to Figs. 3 and 4. 14 312 / Description of the Invention (Supplement) / 93-07 / 931〗 1230 1242048 First, as shown in FIG. 3 (a), an intermediate layer 3 is prepared to be interposed between the first metal layer 32 and the second metal layer 34. Sheet material of 6 3 0. The first metal layer 3 2 and the second metal layer 34 are formed of a metal material having little thermal expansion such as brown earth alloy, iron-nickel, and cobalt alloy, and the intermediate layer 36 is formed of the above-mentioned titanium or resin material. . The thickness of the first metal layer 32 is, for example, 5 " ni ~ 5 0 // m, and the thickness of the second metal layer 34 is, for example, 2 0 // m to 3 0 0 // m. As shown in FIG. 3 (b), the two sides of such a thin plate material 30 are coated with a photosensitive liquid and dried, respectively, and the two sides of the thin plate material 30 are covered with photoresist films 38 and 40, respectively. Next, as shown in FIG. 3 (c), the exposure mask 42 is brought into close contact with the first metal layer 32 of the sheet material 30, and the exposure mask 44 is brought into close contact with the sheet material 30. The second metal layer 34 has a predetermined pattern corresponding to a plurality of fine openings to be formed on the surface side of the second metal layer 34, and the exposure mask 44 has a region other than the area where the fine openings are formed. The designation and pattern for the large-opening part are formed in the form of the remaining frame part. Then, each photoresist film 38, 40 is exposed through each exposure mask 42, 44. As shown in FIG. 3 (d), each photoresist film 3 8a, 40a is hardened (insolubilized) according to a designated pattern. ), As shown in FIG. 3 (e), development is performed, and a corrosion-resistant resist film 3 8 b, 40 b having a predetermined pattern is formed on both sides of the thin plate material 30, respectively. Next, by performing a spray etching process using an etching solution such as a vaporized ferrous iron aqueous solution, as shown in FIG. 4 (f), fine openings 46 are formed in the first metal layer 32, and at the same time, the second metal is formed in the second metal. The layer 34 forms a large opening portion 48 so that the frame portion remains. Then, using a thin film solution such as sodium hydroxide, as shown in FIG. 4 (g), the corrosive resist film 15 is removed from both sides of the sheet material 30 30 312 / Invention Specification (Supplement) / 93-07 / 93111230 1242048 3 8 b, 4 0 b. Then, as shown in FIG. 4 (h), a thin film liquid such as sodium hydroxide is used to dissolve and remove the exposed portion of the intermediate layer 36 to communicate the fine openings 46 and 6 of the first metal layer 32. 2 metal layer 3 4 has an opening 4 8 ′ to obtain a thin plate 50. As shown in Fig. 4 (i), the thus-produced thin plate material 50 is bonded to one side of the rectangular support frame 52, thereby completing a vapor deposition mask 54. If the support frame 12 is used, a frame made of stainless steel or brown earth alloy is used. The operation of joining the thin plate 50 to the rectangular support frame 52 is performed, for example, as follows. That is, as shown in the perspective view of Fig. 5 (a), the thin plate material 50 is superimposed on one side of the support frame 52. At this time, as shown in FIG. 5 (b), the thin plate material 50 is superposed on one side of the support frame 52 so as to have tension in only one axial direction. Then, as shown in FIG. 5 (c), the sheet material 50 is integrally bonded to the rectangular support frame 52 while the sheet material 50 is under tension. At this time, a pair of frame portions of the support frame 52 that face each other in the direction of applying tension to the thin plate 50 are joined to both end portions of the thin plate 50. The reference numeral 5 6 in the figure is a joint between the support frame 52 and the thin plate 50. In addition, the joining of the thin plate 50 to the support frame 52 is performed by welding (for example, spot welding), joining with an adhesive, or an adhesive tape. Next, another example of a method for manufacturing a photomask for vapor deposition will be described with reference to Figs. 6 to 8. As shown in FIG. 6 (a), a thin plate material 30 is prepared with an intermediate layer 36 interposed between the first metal layer 32 and the second metal layer 34. As shown in FIG. 6 (b), the photosensitive liquid is coated and dried separately, and both sides of the sheet material 30 are covered with 16 312 / Invention Specification (Supplement) / 93-07 / 93111230 1242048 to form a photoresist film 3 8, 4 0. Next, as shown in FIG. 6 (c), an exposure mask 44 is brought into close contact with the second metal layer 34 surface side of the sheet material 30, and the exposure mask 44 has a formation of fine openings. A designated pattern for a large opening portion is formed so that a frame portion remains in an area other than the area. Then, the entire surface of the first metal layer 32 of the sheet material 30 is directly exposed to the photoresist film 38, and at the same time, the light of the second metal layer 34 of the sheet material 30 is exposed to light through the exposure mask 44. The resist film 40, as shown in FIG. 6 (d), hardens (insolubilizes) the photoresist film 38 on the entire surface of the first metal layer 3 2 of the sheet material 30 to form the first metal layer 3 2 covering the entire surface. Corrosive resist film 3 8 c. On the other hand, on the surface side of the second metal layer 34 of the sheet material 30, each photoresist film 40a is hardened according to a specified pattern. As shown in FIG. 6 (e), development is performed, and the sheet material 3 is developed. The second metal layer 3 4 of 0 is formed with a corrosion-resistant resist film 4 0 b having a predetermined pattern. In addition, as for the first metal layer 32 surface side of the sheet material 30, after the photoresist film 38 is covered and covered, a full exposure is performed to form a corrosion-resistant resist film 3 8c. This is performed by attaching an acid-resistant etch-resistant film to the first metal layer 32 surface. After the etching process described below is completed, the etch-resistant film may be peeled off from the first metal layer 32 surface. Next, as shown in Fig. 7 (f), by performing a spray type etching treatment using an etchant such as a vaporized ferric iron aqueous solution, a large opening portion 48 is formed in the second metal layer 34 so as to leave a frame portion. Then, using a thin film solution such as sodium hydroxide, as shown in FIG. 7 (g), the corrosive resist film 40b is peeled from the second metal layer 34 surface of the sheet material 30. Then, using a thin film solution of sodium hydroxide or the like, as shown in Fig. 7 (h), the exposed portion of the intermediate layer 36 is dissolved and removed. 17 312 / Invention Specification (Supplement) / 93-07 / 93] 11230 1242048 Next, as shown in FIG. 7 (i), a thin film material 30 white < side is coated with a photosensitive liquid and dried, and then the second metal is dried. A photoresist film 5 8 is also filled in the opening portion 4 8. Then, the exposure mask 42 is brought into close contact with the sheet material 30 surface side, and the exposure mask 42 has a predetermined pattern to be formed. Then, from the sheet material 30, the photoresist film 56 is exposed through the exposure mask 42. As shown in the figure, the photoresist film 5 6a is hardened (insolubilized), and if it is developed, the sheet material 3 0 The second metal layer 3 4 patterned anti-corrosive # anti-I insecticide film 5 8 b. Next, as shown in Fig. 8 (m), the first metal layer portion 60 is subjected to an etching treatment using a vaporized ferric iron aqueous solution or the like. Then, using a thin film solution such as sodium hydroxide, the corrosion 5 8 b is peeled off from the second metal layer 3 4 surface of the thin plate material 30 to obtain a thin plate 62. As shown in FIG. 8 (), the thin sheet material 6 2 is bonded to the plating mask 64 for the rectangular support frame 52. As shown in the cross-sectional view of part B of the vapor deposition mask 64 manufactured in the above manner, the cross-section of the fine hole portion 60 formed in the thin material layer 32 is a tapered surface, and the joint surface of the frame 52 is formed. The side surface (the surface formed during the vapor deposition process is the bottom surface in FIG. 8 (0) and FIG. 9) faces the other δ 9 is the upper surface), and the opening size gradually becomes smaller. The thin phase 312 / Invention Specification (Supplement) / 93-07 / 93111230 with the thin opening portion 60 having such a cross-sectional shape is used. The second metal layer 34 I 34 is coated on the side, as shown in FIG. 7 (j). The second metal layer 3 4 of most fine openings 2 metal layer 3 is shown on the 4 side 8 (k), as shown in FIG. 8 (1). The holes are shown in Fig. 8 (η). The I insect-resistant money-resistant film is made on one side in the same way to complete the enlargement of the steam. Fig. 8 (〇) 30 The first metal system becomes and supports the evaporation. On the source side, (Figure 8 (〇) and the figure include a large number of masks for deposition 18 1242048, which are formed with a material 6 2. For example, a low-molecular organic EL is vapor-deposited on a transparent electrode layer formed on a transparent substrate. In the case of materials, the small-side surface (the upper surface in FIG. 8 (0) and FIG. 9) of the fine opening portion 60 of the thin plate 62 faces the transparent electrode layer. Therefore, 彳 & molecular organic EL material gas Evenly and well into most of the fine openings 60 of the thin plate 62. In addition, the opening periphery of the fine openings 60 of the thin plate 62 and the transparent electrode Since the close contact is good, there is an advantage that the pattern shape of the organic light-emitting layer defined by the opening periphery of the fine opening portion 60 can be accurately reproduced. In addition, the vapor deposition will be described with reference to FIGS. 10 and 11. Another example of a manufacturing method using a photomask. This manufacturing method is the same as the above-described manufacturing method described with reference to FIGS. 3 and 4, and the steps in the middle, that is, the steps shown in FIGS. 3 (a) to (e), are omitted As shown in FIG. 3 (e), when a corrosion-resistant resist film 3 8 b, 40 b with a predetermined pattern is formed on both sides of the sheet material 30, as shown in FIG. 3 (e), As shown in FIG. 10 (f), a spray-type etching process is performed using an etchant such as a vaporized ferric iron aqueous solution. As shown in FIG. 10 (f), fine openings 46 are formed in the first metal layer 32. At this time, although the same as the second metal At the same time, the layer 34 is partially etched in the thickness direction. However, since the thickness of the second metal layer 34 is thicker than that of the first metal layer 32, the etching is ended at the time when the fine openings 46 are formed in the first metal layer 32. Therefore, no openings are formed in the second metal layer 34 to reach the intermediate layer 36. In addition, in the first If the thickness of the first metal layer 32 is not significantly different from the thickness of the second metal layer 34, the surface of the second metal layer 34 may be adhered to the second metal layer 34 by protecting it with an acid-resistant, etching-resistant film or the like. After the etching process is finished, the corrosive film is peeled off from the second metal layer 34. 19 312 / Invention Specification (Supplement) / 93-07 / 93111230 1242048 When the 1 metal layer 3 2 forms fine openings 4 6, as shown in FIG. 10 (g), the surface of the first metal layer 32 is covered with a protective film 6 6 having an etching resistance. This protective film 66 is, for example, coated with a soluble alkaline evaporative drying type resin on the first metal layer 32 surface side and dried, or a soluble metal is applied on the first metal layer 32 surface side. The UV-curable resin is exposed to ultraviolet light, and the protective adhesive film is formed by sticking to the surface of the first metal layer 3 2. Next, as shown in FIG. 10 (h), by performing a spray etching process using an etchant such as an aqueous solution of ferric chloride, a large opening portion 4 8 is formed in the second metal layer 34 so that a frame portion remains. . Then, by using an alkali solution to dissolve the resin film on the 2nd surface of the first metal layer 32 or to peel off the protective adhesive film from the 2nd surface of the first metal layer 32, as shown in FIG. 10 (i), from the first metal layer 3 The protective film 6 6 was peeled off from both sides. Next, using a thin film solution such as sodium hydroxide, as shown in FIG. 10 (j), the corrosive resist films 38, 40b are peeled from both sides of the sheet material 30, respectively. When the protective film 66 is formed using a soluble alkaline resin, the protective film 66 can be peeled off from the first metal layer 32 and the sheet material in one step by using an alkaline solution such as sodium hydroxide. The operation of peeling off the corrosion resist films 3 8 b and 40 b on both sides of 30. Then, a thin film liquid such as sodium hydroxide is used, as shown in FIG. 1 (k), and the exposed portion of the intermediate layer 36 is dissolved and removed to communicate the fine openings 46 and 6 of the first metal layer 32. The opening portion 48 of the second metal layer 34 is obtained as a thin plate 50. As shown in FIG. 11 (1), the thin plate material 50 produced in this manner is bonded to one side of the rectangular support frame 52 to complete the vapor deposition mask 54. In this manufacturing method, the first metal 20 of the fine openings 4 6 20 312 / Invention specification (Supplement) / 93-07 / 93111230 1242048 The layer 3 2 is protected in the same step as the step, and can be prevented in the thin The first metal layer 32 may have defects such as bending or injury. Furthermore, in the above-mentioned embodiment, it has been described that for forming a thin metal plate (first metal layer) of a thin plate, a large number of fine openings are formed, and mainly used for vapor deposition of a low-molecular organic EL material on a substrate surface. Photomask and manufacturing method thereof, however, for example, when forming a viscous opening portion in a metal layer (first metal layer) for vapor bonding of a thin plate, and depositing an electrode forming material on a surface of a substrate to form an electrode The used vapor deposition mask and the like are also applicable to the present invention. Moreover, in the above-mentioned embodiment, after the thin plate is produced by photoetching, the thin plate is joined to the support frame. However, the thin plate material may be joined to the support frame before the etching process, and the joining may be performed. The sheet material in the state of supporting the frame is processed by the last name. (Effects of the Invention) According to the method for manufacturing a photomask for vapor deposition of each of the inventions in claims 1 to 3, it is possible to obtain a photomask for vapor deposition with high processing accuracy, and at the same time, it has good workability and can prevent Defects such as bending and deformation of thin plate materials. In addition, according to this manufacturing method, even a large-scale vapor deposition mask can be manufactured without any problems. In the manufacturing method of the fourth invention, a photomask region having a plurality of minute openings with a specified pattern is provided. For example, it can be used to obtain a low-molecular organic EL material deposited on the substrate surface with high processing accuracy. Mask with vapor deposition. In the manufacturing method of the invention claimed in item 5 of the patent, a hole 21 312 / Invention Specification (Supplement) / 93-07 / 93111230 1242048 is formed. For example, the substrate can be vapor-deposited with high processing accuracy. The material for electrode formation is used for the vapor deposition mask used when forming an electrode. In the manufacturing method of the invention as claimed in claim 6 of the present invention, the joining operation for joining the thin plate material to one side of the support frame is facilitated. In addition, the size of the opening can be easily reproduced with high accuracy in accordance with design requirements. In the manufacturing method of the invention claimed in claim 7, the processing accuracy of the etching can be improved, the manual operability of the sheet material becomes good, and there is less concern that the sheet material will be bent or deformed. In the manufacturing methods of the inventions claimed in the scope of patent applications Nos. 8 and 9, the processing of each step of the inventions in the scope of patent applications Nos. 1 to 3 is carried out reliably, and the above-mentioned effects can be obtained. The mask for vapor deposition of the invention in the scope of patent application No. 10 has high processing accuracy and good workability in the manufacturing steps, and no defects such as bending or deformation of the sheet material are caused during the manufacturing steps. The photomask for vapor deposition of the invention claimed in claim 11 has high processing accuracy. For example, a low-molecular organic EL material can be vapor-deposited on a substrate surface to form a high-quality organic light-emitting layer. Since the photomask for vapor deposition of the invention claimed in claim 12 has high processing accuracy, for example, a material for electrode formation can be satisfactorily vapor-deposited on the surface of a substrate to form an electrode of South quality. The photomask for vapor deposition of the invention claimed in claim 13 can reproduce the size of the opening portion accurately according to the design requirements, and the operation in this manufacturing step becomes easy. The photomask for vapor deposition of inventions with the scope of patent application No. 14 can ensure a high processing accuracy of 22 312 / Invention Specification (Supplement) / 93-07 / 93111230 1242048, and its workability in manufacturing steps is good. No thin plate material was bent or deformed. [Brief Description of the Drawings] Fig. 1 shows an embodiment of the present invention, and Fig. 1 is a plan view showing a vapor deposition mask and an enlarged plan view of a part thereof. Fig. 2 is a schematic cross-sectional view showing a part of a thin plate material of a vapor deposition mask shown in Fig. 1. Figs. 3 (a) to (e) are explanatory diagrams illustrating an example of a method for manufacturing a photomask for vapor deposition according to the present invention, and are sectional views showing respective steps. Figs. 4 (f) to (i) are also cross-sectional views showing respective steps. 5 (a) to (c) are explanatory diagrams related to the work of joining a thin plate to a support frame, and are perspective views showing respective steps. Figs. 6 (a) to (e) are explanatory diagrams illustrating another example of the method for manufacturing the photomask for vapor deposition of the present invention, and are sectional views showing respective steps. 7 (f) to (j) are also cross-sectional views showing respective steps. 8 (k) to (0) are also cross-sectional views showing respective steps. Fig. 9 is a partially enlarged cross-sectional view of a thin plate material of the vapor deposition mask manufactured by the manufacturing method shown in Figs. 6 to 8, and is an enlarged cross-sectional view of part B of Fig. 8 (0). Figs. 10 (f) to (j) are explanatory diagrams illustrating still another example of a method for manufacturing a photomask for vapor deposition according to the present invention, and are sectional views showing respective steps. 11 (k) to (1) are also cross-sectional views showing respective steps. (Description of Element Symbols) 10 Mask for vapor deposition 23
312/發明說明書(補件)/93-07/93111230 1242048 12 薄板材 14 光罩區域 16 蒸鍍用金屬層 18 支持用金屬層 2 0 中間層 2 2 微細開孔部 2 4 支持用金屬層的框部 2 6 支持用金屬層的開孔部 3 0 薄板素材 3 2 第1金屬層 34 第2金屬層 36 中間層 38、 40、 58 光阻膜 42、44 曝光用光罩 3 8a 光阻膜 40a 光阻膜 3 8 b、4 0 b 耐腐蝕性抗蝕劑膜 46 微細開孔部 48 第2金屬層的開孔部 5 0 薄板材 5 2 支持框架 54 蒸鍍用光罩 3 8 c、5 8 b 而ί腐蚀性抗姓劑膜 24312 / Instruction of the Invention (Supplement) / 93-07 / 93111230 1242048 12 Sheet material 14 Photomask area 16 Metal layer for vapor deposition 18 Metal layer for support 2 0 Intermediate layer 2 2 Micro-holes 2 4 Metal layer for support Frame part 2 6 Opening part for supporting metal layer 3 0 Sheet material 3 2 First metal layer 34 Second metal layer 36 Intermediate layer 38, 40, 58 Photoresist film 42, 44 Exposure mask 3 8a Photoresist film 40a Photoresist film 3 8 b, 4 0 b Corrosion-resistant resist film 46 Fine openings 48 Openings of the second metal layer 5 0 Thin plate 5 2 Support frame 54 Photomask for vapor deposition 3 8 c, 5 8 b And erosive anti-surname agent film 24
312/發明說明書(補件)/93-07/93111230312 / Invention Specification (Supplement) / 93-07 / 93111230