CN107855641A

CN107855641A - Deposition mask, deposition mask prepare body, the manufacture method of deposition mask and the manufacture method of organic semiconductor device

Info

Publication number: CN107855641A
Application number: CN201710872255.0A
Authority: CN
Inventors: 武田利彦; 小幡胜也; 落合洋光
Original assignee: Dai Nippon Printing Co Ltd
Current assignee: Dai Nippon Printing Co Ltd
Priority date: 2013-04-12
Filing date: 2014-03-24
Publication date: 2018-03-30
Also published as: CN107858642B; JP2018119218A; JP6327048B2; CN107858642A; JP2019196549A; JP2015165051A; JP6569880B2; JP6327196B2; JP2014218750A; JP6940828B2

Abstract

The present invention provides one kind in the case of maximization, both High precision and lighting can also be met, and the deposition mask of the evaporation pattern of fine while intensity is kept, can be formed and can easily manufacture the manufacture method of the deposition mask of the deposition mask；Deposition mask prepares body；And the manufacture method of the organic semiconductor device of the organic semiconductor device of fine can be manufactured.Lamination is provided with the metal mask (10) and resin mask (20) of multiple gaps (15), opening portion (25) necessary to being used to form multiple pictures is provided with resin mask (20), opening portion (25) is corresponding with the pattern of making to be deposited, and each gap (15) is located at and the overall equitant position of at least one picture.

Description

Deposition mask, deposition mask prepare body, the manufacture method of deposition mask and organic half The manufacture method of conductor element

The application is " to be steamed for the Chinese invention application of on March 24th, 2014, Application No. 201480020615.9 applying date The division Shen of plating mask, deposition mask preparation body, the manufacture method of deposition mask and the manufacture method of organic semiconductor device " Please.

Technical field

The present invention relates to the manufacture method and organic semiconductor device that deposition mask, deposition mask prepare body, deposition mask Manufacture method.

Background technology

At present, in the manufacture of organic EL element, when forming the organic layer or cathode electrode of organic EL element, using for example In the metal deposition mask that the region that should be deposited is formed with slight gap multiple fine gaps arranged in parallel.Using the evaporation In the case of mask, deposition mask is loaded in the substrate surface that should be deposited, is kept from the back side using magnet, still, due to seam The rigidity of gap is minimum, so when deposition mask is maintained at into substrate surface, is easily deformed at gap, hinders fine Change or gap length it is big product maximization.

For the deposition mask for preventing gap from deforming, various self-criticism have been carried out, such as Patent Document 1 discloses A kind of deposition mask, it possesses：With multiple opening portions as the first metal mask bottom plate, covering above-mentioned opening portion Region possesses second metal mask in multiple fine gaps, covers the second metal in the state of the length direction stretching to gap Mould is located at the mask stretching holding meanss on bottom plate.That is, a kind of deposition mask for combining and there are 2 kinds of metal masks is disclosed.According to It the deposition mask, will not be deformed at gap, and can ensure that gap precision.

But recently as the maximization of product or the maximization of substrate size using organic EL element, for steaming Mask is plated, the requirement of maximization is constantly increased, and used metallic plate also gradually maximizes when manufacturing metal deposition mask.But It is, in present metalworking technology, it is difficult to gap is accurately formed in band large-scale metal plate, even if passing through above-mentioned patent Method disclosed in document 1 etc. can prevent gap portion from deforming, and can not also correspond to the High precision in gap.In addition, be formed as only In the case of the deposition mask be made up of metal, with maximization, its quality also increases, and the gross mass comprising framework also increases, Therefore obstacle can be caused in processing.

In above-mentioned disclosed deposition mask, to realize the lighting of deposition mask, it is necessary to make the steaming being made up of metal The thickness for plating mask is thinning.But in the case where the thickness for the deposition mask for making to be made up of metal is thinning, deposition mask be present Intensity decreases and deposition mask situation about deforming, or exist and the new the problem of such as be difficult to handle.

Prior art literature

Patent document

Patent document 1：2003~No. 332057 publications of Japanese Unexamined Patent Publication

The content of the invention

Invent problem to be solved

The present invention be in view of situation as above and carry out, its major subjects is, there is provided a kind of situation in maximization Under, both High precision and lighting are also disclosure satisfy that, and the evaporation pattern of fine while intensity is kept, can be formed Deposition mask；The manufacture method and deposition mask for providing the deposition mask that can easily manufacture the deposition mask prepare body；With And provide the manufacture method for the organic semiconductor device that can accurately manufacture organic semiconductor device.

For solving the technical scheme of problem

A kind of evaporation for the evaporation pattern for being used for while forming multiple pictures is provided for solving the present invention of above-mentioned problem Mask, it is characterised in that lamination has resin mask and the metal mask provided with multiple gaps, is provided with and uses on the resin mask The opening portion necessary to multiple pictures are formed, the opening portion is corresponding with the pattern of making to be deposited, and each gap is set In with the overall equitant position of at least one picture.

In addition, provide a kind of deposition mask for solving the present invention of above-mentioned problem, it is characterised in that will be passed through provided with 1 The metal mask of through hole and the resin mask stack provided with multiple opening portions corresponding with the pattern of making to be deposited are described more Individual opening portion is all located at the position overlapping with 1 through hole.

In addition, provide a kind of deposition mask preparation for being used to obtain deposition mask for solving the present invention of above-mentioned problem Body, it is characterised in that set apertured metal mask in a face lamination of resin plate and form, each gap is located at forming most Integrally equitant position, the deposition mask lamination have resin mask for the opening portion of whole 1 picture located at the resin plate With the metal mask provided with multiple gaps, opening portion necessary to being used to form multiple pictures is provided with the resin mask, And the opening portion is corresponding with the pattern of making to be deposited, each gap is located at integrally equitant with least one picture Position.

In addition, provide a kind of deposition mask preparation for being used to obtain deposition mask for solving the present invention of above-mentioned problem Body, it is characterised in that set apertured metal mask in a face lamination of resin plate and form, each 1 through hole be located at Finally located at the overall equitant position in opening portion of the resin plate, the deposition mask lamination has provided with 1 through hole Metal mask and the resin mask provided with multiple opening portions corresponding with the pattern of making to be deposited, the multiple opening portion are complete Portion is located at the position overlapping with 1 through hole.

In addition, provide a kind of manufacture method of deposition mask for solving the present invention of above-mentioned problem, it is characterised in that tool It is standby：The process that preparation lamination has the metal mask of the resin plate of resin plate and the metal mask provided with multiple gaps；From described Laser is irradiated in metal mask side, so as to form the resin for opening portion necessary to forming multiple pictures on the resin plate Mask formation process；As the metal mask, using integrally equitant with least one picture in the multiple picture Position sets apertured metal mask.

In addition, provide a kind of manufacture method of deposition mask for solving the present invention of above-mentioned problem, it is characterised in that tool It is standby：The process that preparation lamination has the metal mask of the resin plate of resin plate and the metal mask provided with 1 through hole；From described Laser is irradiated in metal mask side, so as to form multiple opening portions with the overlapping position of 1 through hole in the resin plate Resin mask formation process.

In addition, in above-mentioned manufacture method, after the metal mask that the resin plate can also be secured on framework, enter The row resin mask formation process.

In addition, provide a kind of manufacture method of organic semiconductor device, its feature for solving the present invention of above-mentioned problem It is, comprising：Using the deposition mask for the tape frame that deposition mask is fixed with framework, evaporation figure is formed on evaporation object The process of case；In the process for forming evaporation pattern, the deposition mask lamination for being fixed on the framework has resin to cover Mould and the metal mask provided with multiple gaps, opening necessary to being used to form multiple pictures is provided with the resin mask Portion, each gap are located at and the overall equitant position of at least one picture.

In addition, provide a kind of manufacture method of organic semiconductor device, its feature for solving the present invention of above-mentioned problem It is, comprising：Using the deposition mask for the tape frame that deposition mask is fixed with framework, evaporation figure is formed on evaporation object The process of case, in the process for forming evaporation pattern, the above-mentioned deposition mask lamination for being fixed on the framework has provided with 1 The metal mask of through hole and the resin mask provided with multiple opening portions corresponding with the pattern of making to be deposited, it is the multiple Opening portion is all located at the position overlapping with 1 through hole.

The effect of invention

According to the deposition mask of the present invention, in the case of maximization, both High precision and lighting can also be met, And the evaporation pattern of fine while the intensity of deposition mask entirety is kept, can be formed.In addition, the evaporation according to the present invention Mask prepares the manufacture method of body or deposition mask, can easily manufacture the deposition mask of features described above.In addition, according to this hair The manufacture method of bright organic semiconductor device, it can accurately manufacture organic semiconductor device.

Brief description of the drawings

Fig. 1 is the front elevation of the deposition mask of embodiment (A) from metal mask side；

Fig. 2 is the enlarged fragmentary cross section of the deposition mask shown in Fig. 1；

Fig. 3 is the front elevation of the deposition mask of embodiment (A) from metal mask side；

Fig. 4 is the front elevation of the deposition mask of embodiment (A) from metal mask side；

Fig. 5 is the front elevation of the deposition mask of embodiment (A) from metal mask side；

Fig. 6 is the enlarged fragmentary cross section of the deposition mask of embodiment (A)；

Fig. 7 is the front elevation of the deposition mask of embodiment (A) from resin mask side；

Fig. 8 is the summary section of the relation for the thickness for representing shade and metal mask；

Fig. 9 is the front elevation of the deposition mask of embodiment (A) from metal mask side；

Figure 10 is the process chart for being used to illustrate the example of the manufacture method of the deposition mask of embodiment (A), it is necessary to illustrate , (a)~(c) be all profile；

Figure 11 is the front elevation of the deposition mask of embodiment (B) from metal mask side；

Figure 12 is the enlarged fragmentary cross section of the deposition mask shown in Figure 11；

Figure 13 is the front elevation of the deposition mask of embodiment (B) from metal mask side；

Figure 14 is the enlarged fragmentary cross section of the deposition mask shown in Figure 13；

Figure 15 is the front elevation of the deposition mask of embodiment (B) from metal mask side；

Figure 16 is the enlarged fragmentary cross section of the deposition mask of embodiment (B)；

Figure 17 is the summary section of the relation for the thickness for representing shade and metal mask；

Figure 18 is the front elevation of the deposition mask of embodiment (B) from metal mask side；

Figure 19 is the process chart for being used to illustrate the example of the manufacture method of the deposition mask of embodiment (B), it is necessary to illustrate , (a)~(c) is profile；

Figure 20 is the front elevation of the deposition mask of the tape frame of an embodiment from resin mask side；

Figure 21 is the front elevation of the deposition mask of the tape frame of an embodiment from resin mask side.

Description of symbols

100 deposition masks

10 metal masks

15 gaps, through hole

20 resin masks

25 opening portions

28 grooves

60 metal frameworks

The deposition mask of 200 tape frames

Embodiment

Hereinafter, the deposition mask 100 of an embodiment of the present invention is divided for embodiment (A), embodiment (B) and used Accompanying drawing is specifically described.

The deposition mask ＞ of ＜ embodiments (A)

As shown in Fig. 1~Fig. 7, Fig. 9, the deposition mask 100 of embodiment (A) be for and meanwhile form the steaming of multiple pictures Plate the deposition mask of pattern, it is characterised in that：Formed by the metal mask 10 provided with multiple gaps 15 and the lamination of resin mask 20, Opening portion 25 necessary to being used to form multiple pictures is provided with resin mask 20, each gap 15 is arranged on draws with least one The overall equitant position in face.In addition, the evaporation that Fig. 1, Fig. 3~Fig. 5, Fig. 9 are the embodiments (A) from metal mask side is covered The front elevation of mould, Fig. 2, Fig. 6 are the partial enlargement summary sections of the deposition mask shown in Fig. 1.

The deposition mask 100 of embodiment (A) be for and meanwhile the evaporation that forms the evaporation pattern of multiple pictures and use Mask, the evaporation pattern corresponding with multiple products is formed simultaneously using 1 deposition mask 100.It is described in this case specification " opening portion " refer to the pattern that the deposition mask of embodiment to be used (A) and embodiment (B) makes, such as should In the case that deposition mask is used for the organic layer that is formed in organic el display, the shape for being shaped as the organic layer of opening portion 25 Shape.In the deposition mask 100 of embodiment (A) and embodiment (B), the deposition material released by vapor deposition source passes through opening Portion 25, thus, the evaporation pattern corresponding with opening portion 25 is formed in evaporation object.In addition, " 1 picture " refers to by with 1 The aggregate of the corresponding opening portion 25 of individual product is formed, and in the case where 1 product is organic el display, forms 1 The aggregate of organic layer necessary to organic el display, the aggregate for becoming the opening portion 25 of organic layer are " 1 picture ". Moreover, the deposition mask 100 of embodiment (A) be in order to and meanwhile form the evaporation pattern of multiple pictures and on resin mask 20 Predetermined distance is separated to be configured with multiple above-mentioned " 1 picture ".That is, being provided with resin mask 20 must for forming multiple pictures The opening portion 25 wanted.

The deposition mask of embodiment (A) is characterised by, multiple gaps 15 are provided with a face superimposed layer of resin mask Metal mask 10, each gap of metal mask 10 is respectively provided in and the overall equitant position of at least one picture.Change speech It, it is characterised in that between opening portion 25 necessary to 1 picture is formed, between the opening portion 25 to be laterally abutted not In the presence of being equal length and with metal line portions with the same thickness of metal mask 10 with the longitudinal length in gap 15, or with 25 are not present with the lateral length in gap 15 for equal length and with identical with metal mask 10 between longitudinally adjacent opening portion The metal part of thickness.Hereinafter, sometimes will be with the longitudinal length in gap 15 for equal length and with identical with metal mask 10 The metal line portions of thickness for equal length and have the gold with the same thickness of metal mask 10 with the lateral length in gap 15 Belong to the total referred to as metal part in line part.

According to the deposition mask 100 of embodiment (A), necessary to 1 picture of composition is made the size of opening portion 25 or In the case that spacing between the opening portion 25 of 1 picture of composition narrows, such as in order to be performed for more than the shape of 400ppi picture Into in the case that the spacing between the size or opening portion 25 for making opening portion 25 is extremely small, can also preventing because upper The interference caused by metal part is stated, the image of fine can be formed.In addition, it is divided in 1 picture by multiple gaps In the case of, it is in other words, adjoint to form 1 in the case where metal line portions be present between forming the opening portion 25 of 1 picture The situation that spacing between the opening portion 25 of picture narrows is, it is necessary to make the metal part graph thinning being present between opening portion 25. But in the case of the metal part graph thinning for making to be present between the opening portion 25 for forming 1 picture, the metal portion disjunction The frequency split uprises, and the metal part being broken sometimes has undesirable effect in evaporation.

In addition, in the case where there are metal part between forming the opening portion 25 of 1 picture, the metal part causes The generation of shade and be difficult to the picture to form fine.It should be noted that shade refers to the deposition material released by vapor deposition source A part collide metal mask 10 gap 15 internal face and do not reach evaporation object, so as to produce as Film Thickness Ratio mesh The thinner non-evaporated segment of evaporation thickness phenomenon.Especially, with the shape miniaturization of opening portion 25, it is present in 1 picture The influence of shade can become big caused by the metal part between opening portion 25 in face.That is, in embodiment (A) deposition mask In, integrally equitant position sets gap with least one picture, i.e. do not deposited between the opening portion 25 of 1 picture is formed In metal part, thus improve the durability of deposition mask or prevent the influence of shade.

In addition, according to the deposition mask 100 of embodiment (A), compared with existing deposition mask, lightweight can be achieved Change.Specifically, if by the quality of the deposition mask 100 of embodiment (A) and the currently known steaming being only made up of metal The quality of plating mask is compared (it is assumed that the thickness of deposition mask entirety is identical), only by the metal of currently known deposition mask A part for material is replaced as resin material, then the light weight of the deposition mask 100 of embodiment (A).In addition, in order that with only The deposition mask that is made up of metal realizes lighting, it is necessary to makes the thickness of the deposition mask thinning etc., but makes evaporation In the case that the thickness of mask is thinning, when deposition mask is maximized, it may occur that the situation or resistance to that deposition mask deforms The situation that long property reduces.On the other hand, according to embodiment (A) deposition mask, even in order to prevent change during maximization Shape or meet durability and in the case of thickening the overall thickness of deposition mask, due to resin mask 20 be present, so as to also can Realize the deposition mask more lighting than only being formed by metal.Hereinafter, it is specifically described respectively.This is for implementation described later The deposition mask of mode (B) is also identical.

(the resin mask for forming the deposition mask of embodiment (A))

Forming the resin mask 20 of the deposition mask of embodiment (A) can suitably select to use currently known resinous wood Material, its material is not particularly limited, but preferably using can form the opening portion 25 of fine by laser machining etc., and heat or Through when size changing rate or hydroscopicity is small and the material of lightweight.As such material, polyimide resin can be enumerated, gathered Amide resin, polyamide-imide resin, polyester resin, polyvinyl resin, polyvinyl alcohol resin, acrylic resin, poly- carbonic acid Ester resin, polystyrene resin, polyacrylonitrile resin, ethylene-vinyl acetate copolymer resin, ethylene-vinyl alcohol copolymer Resin, ethylene methacrylic acid copolymer resin, Corvic, polyvinylidene chloride resin, cellophane, ionomer tree Fat etc..In above-mentioned illustrated material, preferably its thermal coefficient of expansion is 16ppm/ DEG C of below C resin material, is preferably inhaled Wet rate is less than 1.0% resin material, particularly preferably possesses the resin material of two conditions.By being set to use the tree The resin mask of fat material, can improve the dimensional accuracy of opening portion 25, and can reduce heat or through when size changing rate or Hydroscopicity.In embodiment (A) deposition mask, resin mask 20 is as described above compared with metal material, by can shape Resin material into the opening portion 25 of fine is formed.Therefore, it may be formed to have the deposition mask of the opening portion 25 of fine 100.It is also identical for the deposition mask of embodiment (B).

The thickness of resin mask 20 is also not particularly limited, and is deposited in the deposition mask 100 using embodiment (A) When, in order to prevent the thinner evaporated segment of Film Thickness Ratio purpose evaporation thickness, i.e., so-called shade, resin mask 20 is preferably It is as thin as possible.But in the case where the thickness of resin mask 20 is less than 3 μm, easily the defects of generation pin hole, and deform etc. Risk increases.On the other hand, if beyond 25 μm, there may be shade.In consideration of it, the thickness of resin mask 20 is preferred For more than 3 μm and less than 25 μm.By the way that the thickness of resin mask 20 is set in the range of this, the defects of pin hole can be reduced or deformation Equivalent risk, and can effectively prevent the generation of shade.Especially, by make the thickness of resin mask 20 for more than 3 μm and 10 μm with Under, more preferably more than 4 μm and less than 8 μm, it can more efficiently prevent from forming shade during beyond 400ppi fine pattern Influence.In addition, in embodiment (A) deposition mask, even in making the thickness of thin of resin mask 20 to above-mentioned preferred model In the case of enclosing, due to the metal mask 10 on resin mask 20 be present, so as to which the entirety of deposition mask 100 can also be made Durability or treatability are met.It is also identical for the deposition mask of embodiment (B).

In addition, in the deposition mask 100 of embodiment (A), metal mask 10 and resin mask 20 can be engaged directly, It can be engaged by bond layer, but in the case of by bond layer jointing metal mask 10 and resin mask 20, considered Above-mentioned shade this point, preferably using the aggregate thickness of resin mask 20 and bond layer as more than 3 μm and less than 25 μm, more preferably Set for the mode in more than 3 μm and less than 10 μm, particularly preferably more than 4 μm and less than 8 μm of scope.For implementing The deposition mask of mode (B) is also identical.

Formed in addition, the deposition mask 100 of embodiment (A) uses by above-mentioned resin mask 20 and the lamination of metal mask 10 Composition, therefore, because the presence of metal mask 10 and realize the raising of the overall durability of deposition mask, hereby it is achieved that place Rationality energy is prevented from being broken, deformed.It is also identical for the deposition mask of embodiment (B).

Then, reference picture 1, Fig. 3~Fig. 6 illustrate form the opening portion 25 of 1 picture one.It should be noted that In the mode of diagram, the region closed by dotted line is 1 picture.In the mode of diagram, for purposes of illustration only, by a small number of opening portions 25 aggregate is set to 1 picture, but is not limited to which, can also be for example, when 1 opening portion 25 is set into 1 pixel The opening portion 25 of millions of pixels be present in 1 picture.

In the mode shown in Fig. 1, by with the set of the opening portion 25 longitudinally, laterally formed provided with multiple opening portions 25 Body, form 1 picture.In the mode shown in Fig. 3, the set of the opening portion 25 formed by being transversely provided with multiple opening portions 25 Body, form 1 picture.In addition, in the mode shown in Fig. 4, pass through longitudinal opening portion 25 for being provided with multiple opening portions 25 and forming Aggregate form 1 picture.Then, in Fig. 1, Fig. 3, Fig. 4, integrally equitant position is provided with gap with 1 picture 15。

As described above, the gap 15 of metal mask 10 can be located at position only overlapping with 1 picture, can also be such as figure Shown in 5 (a), Fig. 5 (b), gap 15 is located at and the overall equitant position of the picture of more than 2.In Fig. 5 (a), in Fig. 1 institutes In the resin mask shown, with laterally continuous 2 pictures, integrally equitant position is provided with gap 15.In Fig. 5 (b), With to be longitudinally continuous 3 pictures, integrally equitant position is provided with gap 15.In addition, by multiple pictures it is overall with 1 In the case that gap is overlapping, relative to the whole surface of metal mask 10, the ratio in region is more shared by gap 15, located at resin Metal part proportion on mask is lower, and the overall durability of deposition mask 100 is lower.Therefore, multiple pictures are whole , it is necessary to consider the overall durability of deposition mask 100 suitably to set in the case that body is overlapping with 1 gap.

Then, exemplified by the manner shown in fig. 1, between the spacing between the opening portion 25 of 1 picture of composition, picture Away from illustrating.On the spacing or the size of opening portion 25 between the opening portion 25 of 1 picture of composition, it is not particularly limited, It can be appropriately configured according to the pattern for be deposited making.For example, in the situation for the fine evaporation pattern for forming 400ppi Under, for forming the opening portion 25 of 1 picture, the horizontal spacing (P1) of adjacent opening portion 25, longitudinal pitch (P2) are 60 μm or so.In addition, the size of opening portion is 500 μm²~1000 μm²Left and right.In addition, 1 opening portion 25 is not limited to and 1 pixel It is corresponding, such as multiple pixels can also be aggregated to form as 1 opening portion 25 by pixel arrangement.

Also it is not particularly limited for the horizontal spacing (P3) between picture, longitudinal pitch (P4), as shown in figure 1, in 1 seam In the case that gap 15 is located at 1 picture integrally equitant position, metal part be present between each picture.Therefore, in each picture Horizontal spacing (P3), longitudinal pitch (P4) ratio between face are located between the horizontal spacing (P1) of the opening portion 25 in 1 picture, longitudinal direction Away from (P2) small situation or it is roughly equal in the case of, the metal part being present between each picture becomes easily to break.Therefore, If in consideration of it, if between opening portion 25 of the spacing (P3, P4) preferably than forming 1 picture between picture spacing (P1, P2 it is) wider.It is 1mm~100mm or so as one of the spacing (P3, P4) between picture.It should be noted that between picture Spacing refers in 1 picture and the other pictures adjacent with 1 picture, the spacing between adjacent opening portion.

In addition, as shown in figure 5, the situation with the overall equitant position of the picture of more than 2 is located in 1 gap 15 Under, metal part is not present between multiple pictures in 1 gap 15.Therefore, in this case, being located at and 1 gap 15 Spacing between the picture of more than 2 of overlapping position can also be forming 1 picture opening portion 25 between spacing substantially It is equal.

Also it is not particularly limited for the section shape of opening portion 25, or form the resin mask of opening portion 25 It is substantially parallel to one another between opposite end face, but more preferably as shown in Fig. 2, Fig. 6, its section shape of opening portion 25 is towards vapor deposition source The shape to broaden.In other words, preferably there is the conical surface to be broadened towards the side of metal mask 10.By by the section shape of opening portion 25 Be formed as this composition, when the deposition mask using embodiment (A) is deposited, can prevent from carrying out that the pattern being made is deposited Upper generation shade.On taper angle theta, it is contemplated that thickness of resin mask 20 etc. is suitably set, but by the opening portion of resin mask Bottom front end and identical resin mask opening portion in the straight line that is connected of upper bottom front end and resin mask 20 bottom surface The angle of composition, in other words, resin mask 20 composition opening portion 25 internal face thickness direction section, opening portion 25 The face of the side not connected with metal mask 10 of internal face and resin mask 20 (is under resin mask in the mode of diagram Face) form angle (θ) preferably in the range of 5 °~85 °, more preferably in the range of 15 °~80 °, further preferably exist In the range of 25 °~65 °.Especially, within the range, also preferably it is less than the angle of the deposition angles of used evaporator Degree.In addition, in Fig. 2, Fig. 6, the linear shape in end face of opening portion 25, but not limited to this are formed, can also be formed as being convex to Outer curved shape, the i.e. global shape of opening portion 25 are formed as bassie shape.Opening portion with this section shape 25 Such as by the irradiation position of laser when suitably adjustment forms opening portion 25 or the irradiation energy of laser or enter to exercise irradiation The multistage laser that the position stage sexually revises is irradiated to be formed.Covered in addition, Fig. 2, Fig. 6 are the evaporations for representing the mode shown in Fig. 1 The enlarged fragmentary cross section of one of mould 100.It is also identical for the deposition mask of embodiment (B), as long as Fig. 2, Fig. 6 are distinguished It is changed to Figure 12, Figure 16.

Resin mask 20 uses resin material, therefore, does not use used processing method during conventional intermetallic composite coating, for example loses Carve the processing method such as processing method or cutting, you can form opening portion 25.That is, for the forming method of opening portion 25, without special Limit, various processing methods can be used, such as the laser processing method of the opening portion 25 of fine can be formed or precision stamping adds Work, lithography process etc. form opening portion 25.It is as described later on forming the method for opening portion 25 by laser processing method etc.. It is also identical for the deposition mask of embodiment (B).

As etching and processing method, it can be used and for example etching material is sprayed from injection nozzle with defined atomisation pressure Injection etching method, be immersed in filled with etching material etching solution in dip etch method, be added dropwise etching material rotation erosion The wet etchings such as lithography utilize the dry etching methods such as gas, plasma.For the deposition mask also phase of embodiment (B) Together.

In addition, in embodiment (A) deposition mask, the composition using resin mask 20 as deposition mask 100, because This, when being deposited using the deposition mask 100, applies very high heat, from resin in the opening portion 25 of resin mask 20 The end face 25a (reference picture 6) of the formation opening portion 25 of mask 20 produces gas, may reduce the vacuum in evaporation coating device Deng.Therefore, if considering this point, as shown in fig. 6, it is preferred that the end face 25a in the formation opening portion 25 of resin mask 20 sets resistance Barrier 26.By forming barrier layer 26, can prevent from producing gas by the end face 25a for forming opening portion 25 of resin mask 20. It is also identical for the deposition mask of embodiment (B), as long as Fig. 6 is changed into Figure 16.

Barrier layer 26 can use inorganic oxide or inorganic nitride, the film layer of metal or evaporation layer.As inorganic Oxide, aluminium or silicon, indium, tin, the oxide of magnesium can be used, as metal, aluminium etc. can be used.The thickness on barrier layer 26 is more preferably For 0.05 μm~1 μm or so.It is also identical for the deposition mask of embodiment (B).

In addition, the vapor deposition source side surface (not shown) of the preferred covering resin mask 20 in barrier layer 26.By using barrier layer 26 The vapor deposition source side surface of covering resin mask 20, block further improve.Barrier layer is for inorganic oxide and inorganic nitridation In the case of thing, preferably pass through various PVD (physical vapor deposition) method, CVD (chemical vapor Deposition) method is formed.In case of a metal, it is preferably various by sputtering method, ion plating method, vacuum vapour deposition etc. PVD method, especially vacuum vapour deposition are formed.In addition, the vapor deposition source side surface of resin mask 20 said here can be tree The surface of the evaporation source of fat mask 20 is overall, may also be only on the surface of the evaporation source of resin mask 20 from metal mask The part exposed.It is also identical for the deposition mask of embodiment (B).

In addition, when evaporation object is deposited the deposition mask using embodiment (A), after object is deposited Square distributed magnet etc., by magnetic force attract that the deposition mask 100 in front of object is deposited, thus make embodiment (A) steaming In the case that plating mask and evaporation object are closely sealed, preferably set in the face of the side not connected with metal mask 10 of resin mask 20 Put the magnetosphere (end diagram) being made up of magnetic material.By setting magnetosphere, the magnetosphere and evaporation are attracted by magnetic force Object, the deposition mask of embodiment (A) and evaporation object can be made seamlessly fully closely sealed, can be prevented because of embodiment (A) the caused evaporation pattern increase of deposition mask and the gap of evaporation object.Specifically, in embodiment (A) In deposition mask, due to metal part is not present between the opening portion 25 of 1 picture is formed, so relative with 1 picture The region answered, it is impossible to make the deposition mask 100 of embodiment (A) and evaporation object closely sealed.On the other hand, magnetosphere is being set In the case of, provided with the magnetospheric region, the deposition mask 100 of embodiment (A) and evaporation object can also be made close Close, therefore, magnetosphere is set by the region corresponding with 1 picture in resin mask 20, embodiment (A) can be made The adaptation of deposition mask 100 and evaporation object is more good.Evaporation pattern increase refers to be formed the evaporation for the purpose of being compared to The phenomenon of the evaporation pattern of the bigger shape of pattern.It should be noted that attracting embodiment (A) using by magnetic force In the case that method beyond deposition mask 100 and evaporation object makes its closely sealed, do not need especially to set magnetosphere.For The deposition mask of embodiment (B) is also identical.

As magnetospheric material, can enumerate such as iron, nickel or cobalt or comprising the alloy of these metals.Magnetosphere Thickness be not particularly limited, but preferably more than 0.05 μm and less than 1 μm.For the deposition mask also phase of embodiment (B) Together.

Fig. 7 is the front elevation of the other manner of resin mask.As shown in fig. 7, it is preferred that formed on resin mask 20 to tree The longitudinal direction of fat mask 20 or the laterally groove 28 of (being longitudinal direction in the case of Fig. 7) extension.In evaporation in the case of heating, resin The thermal expansion of mask 20, thus, the size of opening portion 25 or position may change, and still, by forming the groove 28, can absorb The expansion of resin mask, can prevent because resin mask everywhere caused by make resin mask 20 overall towards rule thermal expansion accumulation The size of opening portion 25 or position change caused by determining direction expansion.The forming position of groove 28 does not limit, and may be provided in composition 1 Between the opening portion 25 of the picture or position overlapping with opening portion 25, but be preferably located between each picture.In addition, groove can be only defined The one side of resin mask, such as the face of the side to connect with metal mask, can also be only defined the side not connected with metal mask Face.Or the two sides of resin mask 20 can also be located at.

In Fig. 7, formed with the groove 28 towards Longitudinal extending between adjacent picture, but this is not limited to, can also be in adjoining Picture between formed to the groove extended laterally.In addition it is also possible to form groove in a manner of they to be combined.

The depth of groove 28 or its width are not particularly limited, in the feelings that the too deep situation of the depth of groove 28 or width are wide Under condition, there is rigidly reducing for resin mask 20, therefore, it is necessary to set in view of this point.In addition, on groove Section shape, be also not particularly limited, as long as considering that processing method etc. carrys out any selection for U-shaped or V-shape etc. .It is also identical for the deposition mask of embodiment (B).

(metal mask for forming the deposition mask of embodiment (A))

The metal mask 10 for forming the deposition mask of embodiment (A) is made up of metal, provided with multiple gaps 15.Implementing In the deposition mask of mode (A), as described above, each gap 15 is located at and the overall equitant position of at least one picture.Change The position overlapping with 1 gap 15 is located in Yan Zhi, the opening portion 25 for forming 1 picture.

Then, using Fig. 8 (a)~Fig. 8 (c), generation to shade and because the thickness of metal mask 10 and may caused by The generation of shade or integrally equitant position sets apertured embodiment (A) deposition mask with least one picture L00 advantage illustrates.It should be noted that Fig. 8 (a) be form 1 picture in opening portion 25a by multiple gap 15a The enlarged fragmentary cross section of the deposition mask of segmentation, Fig. 8 (b) are in the deposition mask shown in Fig. 8 (a), represent to thicken metal The enlarged fragmentary cross section of the state of the thickness of mask.Fig. 8 (c) is to represent that l gap 15 is located at integrally to overlap with 1 picture Position embodiment (A) deposition mask 100 the enlarged fragmentary cross section of one, Fig. 8 (d) is represented in Fig. 8 (c) Deposition mask 100 in thicken metal mask 10 thickness state enlarged fragmentary cross section.In addition, in the mode of diagram In, the aggregate for the opening portion 25 for being transversely provided with 5 opening portions (longitudinal direction is any) is set to 1 picture.

As shown in Fig. 8 (a), in the case where the opening portion 25a for forming 1 picture is split with multiple gap 15a, adjacent The metal part for the wall for forming gap 15a be present in the opening portion 25a connect a part.In order to carry out the evaporation figure of fine The formation of case, and by opening portion 25a spacing or opening portion 25a shape miniaturization in the case of, forming 1 picture When metal part be present between the 25a of opening portion, the metal part hinders to be passed through to opening portion 25a by the deposition material that vapor deposition source is released It is interior, it is difficult to carry out the making of the evaporation pattern of fine.In addition, make metal mask 10a thickness it is thinning in the case of, evaporation The overall durability of mask can also reduce.In order that the durability raising that deposition mask is overall, and gold is thickeied as shown in Fig. 8 (b) In the case of the thickness for belonging to mask 10a, the deposition material released by vapor deposition source is easier to collide the internal face of the metal part.Punching The amount for hitting the deposition material of internal face is more, it is impossible to which the amount to the deposition material for reaching evaporation object is more, the generation of shade It is more notable.In addition, in the case where the spacing between making opening portion 25a narrows, it is necessary to make the gold being present between the 25a of the opening portion Belong to part graph thinning, the broken string risk of metal part uprises.In addition, in the case where metal part breaks, deposition mask is overall Durability can reduce.

On the other hand, in embodiment (A) deposition mask, as shown in Fig. 8 (c), 1 picture is overall, is located at 1 It is located at the position overlapping with 1 gap 15 in whole opening portions 25 in picture.Therefore, as shown in Fig. 8 (c), can not waste Ground makes deposition material by that in opening portion 25, can prevent shade.In addition, as shown in Fig. 8 (d), even in to a certain degree In the case of the thickness for thickening metal mask 10, small and fine the evaporation pattern of influence of shade can also be formed.Especially, In embodiment (A) deposition mask, in the case that the thickness for making metal mask 10 is formed as 100 μm or so, Shade can be prevented.By thickening the thickness of metal mask 10, the overall durability of deposition mask 100 improves, therefore, , can be while the evaporation pattern of fine be formed, while making by suitably setting the thickness in the deposition mask of embodiment (A) Durability improves.

The thickness of metal mask 10 is not particularly limited, but in order to more efficiently prevent near the internal face in gap 15 Opening portion 25 in shade occur, preferably less than 100 μm, more preferably less than 50 μm, particularly preferably less than 35 μm.It is right It is also identical in the deposition mask of embodiment (B), as long as gap 15 is changed into through hole.

In addition, in the deposition mask 100 of embodiment (A), in addition, in order to be substantially prevented from shade, such as Fig. 2, Fig. 6 It is shown, preferably the section shape in gap 15 is formed with the shape to be broadened towards vapor deposition source.By being formed as such section Shape, even if thickening deposition mask for the purpose of issuable deformation or raising durability on deposition mask 100 is prevented In the case of integral thickness, from vapor deposition source release deposition material also will not collide gap 15 the surface or gap 15 in Wall etc., and deposition material can be made to reach evaporation object.Specifically, the bottom in the gap 15 by metal mask 10 Formed by the straight line of upper bottom front end link and the bottom surface of metal mask 10 in front end and the gap of identical metal mask 10 15 Angle, in other words, in the thickness direction section of the internal face in the composition gap 15 of metal mask 10, gap l5 internal face and gold Belong to angle formed by the face (for below metal mask in the mode of diagram) of the side to connect with resin mask 20 of mask 10 Degree is preferably in the range of 5 °~85 °, more preferably in the range of 15 °~80 °, more preferably in 25 °~65 ° of model In enclosing.When especially, within the range, preferably also it is less than the angle of the deposition angles of used evaporator.Pass through to be formed Such section shape, even if making gold for the purpose for preventing the issuable deformation of deposition mask 100 or raising durability Belong to mask 10 thickness it is thicker in the case of, the deposition material released by vapor deposition source will not also collide the internal face etc. in gap 15, And deposition material can be made to reach evaporation object.Thereby, it is possible to more efficiently prevent from shade.In addition, resin mask 20 The opposite end face of opening portion 25 can also be almost parallel, but as described above, the gap 15 of metal mask 10 and resin are covered The opening portion 25 of mould 20 preferably forms the shape to be broadened towards evaporation source with its section shape.

The material of metal mask 10 is not particularly limited, and can suitably be selected in the field of deposition mask using existing known Material, such as the metal materials such as stainless steel, iron-nickel alloy, aluminium alloy can be enumerated.Wherein, due to the invar conjunction as iron-nickel alloy Deformation of the golden material caused by heat is less, so can also suitably use.For the deposition mask also phase of embodiment (B) Together.

In addition, when the deposition mask 100 using embodiment (A) on substrate to being deposited, needing after substrate Square distributed magnet etc. and in the case of attracting the deposition mask 100 in front of substrate by magnetic force, gold is preferably formed by magnetic Belong to mask 10.As the metal mask 10 of magnetic, iron-nickel alloy, pure iron, carbon steel, tungsten (W) steel, chromium (Cr) steel, cobalt can be enumerated (Co) steel, the alloy of iron comprising cobalt tungsten chromium carbon be KS steel, using iron nickel aluminium as the MK steel of principal component, in MK steel It with the addition of NKS steel, Cu-Ni-Co steel, aluminium (Al)-iron (Fe) alloy of cobalt titanium etc..In addition, forming the material of metal mask 10 In the case that material is not magnetic in itself, the powder of above-mentioned magnetic can also be made scattered within this material and to metal mask 10 Assign magnetic.It is also identical for the deposition mask of embodiment (B).

Fig. 9 is the front elevation of the other manner for the deposition mask 100 for representing embodiment (A).As shown in figure 9, by steaming In the front elevation that the side of metal mask 10 of plating mask 100 is observed, the opening of 1 picture can also be formed in laterally staggered configuration Portion 25.That is, laterally adjacent opening portion 25 longitudinally can also be in staggered configuration.By so being configured, covered even in resin In the case of the thermal expansion of mould 20, throughout caused expansion can also be absorbed by opening portion 25, can prevent expansion accumulate and Produce larger deformation.

The deposition mask ＞ of ＜ embodiments (B)

As shown in Figure 11, Figure 12, for embodiment (B) deposition mask, the metal provided with 1 through hole 15 is covered Mould 10 and the lamination of resin mask 20 provided with multiple opening portions corresponding with the pattern of making to be deposited, the plurality of opening portion 25 are all located at the position overlapping with 1 through hole located at metal mask 10.In addition, Figure 11 is from metal mask side The front elevation of the deposition mask of embodiment (B), Figure 12 are the partial enlargement summary sections of the deposition mask shown in Figure 11.

According to the deposition mask 100 of embodiment (B), metal mask 10 is provided with resin mask 20, therefore, can be improved The durability or treatability of deposition mask 100.In addition, metal mask 10 need not set on resin mask 20, and be formed as In the case of the deposition mask being only made up of resin mask, the durability or treatability of deposition mask reduce.Especially, in order to The evaporation pattern of fine is formed, the thickness of resin mask is more preferably relatively thin, makes the thinning situation of the thickness of resin mask Under, the durability or process performance of the deposition mask being only made up of resin mask further reduce.

According to embodiment (B) deposition mask, as described above, even in making the thinning situation of the thickness of resin mask 20 Under, due to the presence of metal mask 10, so as to which sufficient durability and treatability can also be assigned to deposition mask 100.

In addition, in embodiment (B) deposition mask, tool is provided with the resin mask 20 with multiple opening portions 25 There is the metal mask 10 of 1 through hole 15, and the position overlapping with 1 through hole 15 is all located in multiple opening portions 25. In the deposition mask 100 of the embodiment (B) with the structure, due to metal part being not present between opening portion 25, because This will not be disturbed by metal part, and can form fine according to the size located at the opening portion 25 of resin mask 20 Pattern is deposited.

Hereinafter, the advantage of the deposition mask of embodiment (B) is illustrated using Figure 17.In addition, Figure 17 (a) is by more Opening portion 25a possessed by individual through hole 15a segmentation resin masks 20a, exists between the 25a of opening portion and forms through hole 15a's The enlarged fragmentary cross section of the deposition mask of the metal part of wall.In addition, Figure 17 (b) is in Figure 17 (a), thickeies metal and cover The enlarged fragmentary cross section of the deposition mask of mould 10a thickness.

As shown in Figure 17 (a), (b), the feelings of the metal part for the wall for forming through hole 15a between the 25a of opening portion be present Under condition, when forming the evaporation pattern using the deposition mask shown in Figure 17 (a), (b), the deposition material released from vapor deposition source rushes The metal part is hit, because of the influence of shade, the precision of the evaporation pattern formed reduces.In addition, shade refers to due to from evaporation A part for the deposition material that source releases collides the wall of the through hole of metal mask and does not reach evaporation object, so as to steam Plate the phenomenon for being produced on pattern and turning into the Film Thickness Ratio non-evaporated segment thinner as the evaporation thickness of purpose.With regard to deposition material to gold For the collision for belonging to part, the thickness of metal part is thicker, in other words, more thickeies metal mask 10a thickness, more obvious production It is raw.

In order to prevent the generation of shade, the countermeasure for making metal mask 10a thickness thinning as shown in Figure 17 (a) is effective , but in order to form the evaporation pattern of fine, and make opening portion 25a size or opening portion 25a between spacing miniaturization In the case of, even if make metal mask 10a thickness thinning, and the thickness for the metal part for making to be present between the 25a of opening portion becomes It is thin, also can be by shadow effect, it is difficult to form the evaporation pattern of fine.In addition, by becoming metal mask 10a thickness Thin, the overall durability of deposition mask can also reduce.Moreover, in the case where the spacing between making opening portion 25a narrows, it is necessary to make The metal part graph thinning being present between the 25a of the opening portion, the broken string risk of metal part uprise.

On the other hand, in the deposition mask 100 of embodiment (B), as shown in Figure 17 (c), (d), due in opening portion The metal part for the wall for forming through hole 15 is not present between 25, so will not be by shadow effect, and can be formed high-precision Thin evaporation pattern.In other words, the end that deposition mask 100 is located at due to the metal part for the wall for forming through hole 15 is attached Closely, therefore the formation that pattern is deposited will not be impacted, and the formation of the evaporation pattern of fine can be carried out.In addition, such as ,, therefore, can also hardly by shadow effect in the case of the thickness of metal mask 10 is thickeied shown in Figure 17 (d) The thickness of metal mask 10 is thickeied untill it can fully meet durability or treatability, can form the evaporation pattern of fine, It and can improve durability or treatability.

(the resin mask for forming the deposition mask of embodiment (B))

The resin mask 20 for forming the deposition mask of embodiment (B) is made up of resin, as shown in figure 12, is passed through with 1 The overlapping position of through hole 15 is provided with multiple opening portions 25 corresponding with the pattern of making to be deposited.Opening portion 25 is with that will be deposited system The pattern of work is corresponding, the deposition material by making to release from vapor deposition source by opening portion 25, formed on evaporation object with The corresponding evaporation pattern in opening portion 25.In the mode of diagram, illustrated with configuring the example of multiple row opening portion in length and breadth, but Only it can also be configured with vertical or horizontal.The deposition mask 100 of embodiment (A) with least by located at resin mask The overlapping position of 1 picture that the aggregate of opening portion is formed is provided with the gap 15 of metal mask 10, in contrast, embodiment (B) deposition mask 100 is located at the position overlapping with whole opening portions located at resin mask in the through hole 15 of metal mask 10 On this point of putting is different from the deposition mask of embodiment (A).In addition to the difference, can suitably it select in above-mentioned embodiment party Illustrated mode in the deposition mask of formula (A).Illustrated below centered on difference.

Shape, size for opening portion 25 are not particularly limited, as long as to be corresponding with the pattern of making to be deposited Shape, size.In addition, as shown in figure 11, for the longitudinal pitch P1 or horizontal spacing P2 of adjacent opening portion 25, It can be appropriately configured according to the pattern for be deposited making.For example, carrying out the evaporation pattern of 400ppi fine In the case of formation, the longitudinal pitch (P1) of adjacent opening portion 25, horizontal spacing in the opening portion 25 for forming 1 picture (P2) it is 60 μm or so.In addition, the size of opening portion is 500 μm²~1000 μm²Left and right.In addition, 1 opening portion 25 be not limited to 1 pixel is corresponding, such as multiple pixels can also be aggregated to form as 1 opening portion 25 by pixel arrangement.

The deposition mask 100 of embodiment (B) can be used for forming the evaporation pattern corresponding with 1 picture, can also For forming the evaporation pattern corresponding with the picture of more than 2 simultaneously.In this case, as shown in figure 15, preferably drawn by each Face unit separates predetermined distance and sets opening portion 25.In addition, in Figure 15, the region closed by dotted line is set to " 1 picture ".Figure In 15,1 picture is formed by 12 opening portions 25, but is not limited to which, for example, 1 opening portion 25 is being set into 1 pixel When, 1 picture can also be formed by millions of individual opening portions 25.As one of the spacing between picture, between longitudinal pitch, transverse direction Away from being 1mm~100mm or so.In addition, the spacing between picture refers to other pictures in 1 picture and with 1 picture adjoining In face, the spacing between adjacent opening portion.

Figure 18 is the front elevation of the other manner for the deposition mask 100 for representing embodiment (B).As shown in figure 18, from , can also be in laterally staggered configuration opening portion 25 in the front elevation of the side of metal mask 10 observation of deposition mask 100.That is, also may be used To be in staggered configuration longitudinally with laterally adjacent opening portion 25.It is swollen even in the heat of resin mask 20 by being configured as described above In the case of swollen, throughout caused expansion can also be absorbed by opening portion 25, can prevent expansion from accumulating and producing larger Deformation.

(metal mask for forming the deposition mask of embodiment (B))

The metal mask 10 for forming the deposition mask of embodiment (B) is made up of metal, has 1 through hole 15.And And in embodiment (B) deposition mask, when 1 through hole 15 is from the front from metal mask 10, it is configured in The position overlapping with whole opening portions 25, in other words as the position that can see the whole opening portions 25 for being configured in resin mask 20 Put.

The metal part of composition metal mask 10, the part i.e. beyond through hole 15 can be covered along evaporation as shown in figure 11 The outer rim of mould 100 is set, and can also be made the size of metal mask 10 smaller than resin mask 20 as shown in figure 13, be made resin mask 20 Outer peripheral portion expose.In addition, Figure 14 is the partial enlargement summary section of the deposition mask shown in Figure 13.Alternatively, it is also possible to The size of metal mask 10 is more than resin mask 20, make a part for metal part to the lateral outer side or vertical of resin mask Protrude laterally.In addition, under any circumstance, the size of through hole 15 is configured to the size less than resin mask 20.

Form transverse width (W1) or the longitudinal direction of the metal part of the wall of the through hole of the metal mask 10 shown in Figure 11 Width (W2) is not particularly limited, but as W1, W2 narrowed width, durability or treatability have the tendency of reduction.Therefore, W1, W2 are preferably formed can fully to meet the width of durability or treatability.Can suitably it be set according to the thickness of metal mask 10 Fixed width degree, but as one of preferable width, W1, W2 are 1mm~100mm or so.

In addition, in order to which the shade being substantially prevented from the opening portion 25 near the internal face of through hole 15 occurs, preferably The section shape of through hole 15 is formed towards the shape that vapor deposition source broadens.By being formed as such section shape, in place Opening portion 25 near the internal face of through hole 15, it can not also lavishly make to pass through from the deposition material that vapor deposition source is released. Specifically, by before the bottom front end of the through hole 15 of metal mask 10 and the upper bottom of the through hole 15 of identical metal mask 10 It is preferably in the range of 25 °~65 ° to hold the straight line being connected, the angle formed with the bottom surface of metal mask 10.Especially, at this In the range of when, be preferably also less than the angles of the deposition angles of used evaporator.

More than, to the deposition mask 100 of embodiments of the present invention (B), to be provided only with 1 insertion on metal mask 10 Illustrated centered on the example in hole 15, but multiple through holes 15 can also be provided with metal mask 10.In addition, in this case, Using 1 through hole 15 in multiple through holes 15 located at the position overlapping with being located at whole opening portions 25 of resin mask 20 as must Yarn part.

(manufacture method of the deposition mask of embodiment (A))

Then, the manufacture method of the deposition mask of embodiment of the present invention (A) is illustrated.The deposition mask of embodiment (A) Shown in 100 manufacture method such as Figure 10 (a), it is characterised in that have：Prepare by the He of metal mask 10 provided with multiple gaps 15 The process of the metal mask for the resin plate that the lamination of resin plate 30 forms；As shown in Figure 10 (b) laser is irradiated from metal mask side And the resin mask formation process for opening portion 25 necessary to forming multiple pictures is formed on resin plate 30, as composition The metal mask 10 of the metal mask of resin plate, using provided with integrally being overlapped with least one picture in multiple pictures Gap 15 metal mask.Hereinafter, the manufacture method of the deposition mask of embodiment (A) is illustrated.

(process for preparing the metal mask of resin plate)

Preparing the resin plate formed by setting apertured metal mask 10 and resin plate 30 lamination shown in Figure 10 (a) Metal mask when, first, prepare provided with multiple gaps 15 metal mask.In the manufacture of the deposition mask of embodiment (A) In method, it is provided with this metal mask prepared 10 using illustrated in the deposition mask 100 of above-mentioned embodiment (A) The metal mask 10 in gap 15, the gap 15 opening portion 25 overall with being located at least one picture is overall to overlap.

For the metal mask of metal mask and the applying method of resin plate or forming method for being formed as resin plate It is not particularly limited, such as can also prepares in advance by folded and what is formed as the metallic plate application of resin layer of metal mask Layer body, in the state of laminated body, gap 15 is formed on a metal plate, is derived from the metal mask of resin plate.Implementing In the manufacture method of the deposition mask of mode (A), also include as above on the resin plate of metal mask for forming resin plate It is described by coating and the resin bed that is formed.That is, resin plate can be pre-prepd resin plate, or pass through existing public affairs The resin plate of the formation such as the coating process known.In addition, various bonding agents can be used to be bonded for metal mask 10 and resin plate, can also make With the resin plate with self-adhesiveness.It should be noted that the size of metal mask 10 and resin plate 30 can also be identical.If examine The fixation to framework arbitrarily carried out after considering, makes the size of resin plate 30 be less than metallic plate 10, is formed as metal mask 10 The state that outer peripheral portion exposes, the then welding of metal mask 10 and framework become to be relatively easy to, so more preferably.For embodiment party The manufacture method of the deposition mask of formula (B) is also identical, as long as gap is changed into 1 through hole.

As the forming method of the metal mask 10 provided with gap 15, surface mask applied part in metallic plate, such as Anticorrosive additive material, predetermined portion is exposed, developed, and thus ultimately forms the resist figure for remaining the position for forming gap 15 Case.As the anticorrosive additive material as mask parts, preferred process is good and has the material of desired resolution.Then, Using the Resist patterns as etch resistant mask, processing is etched by etching method.After etching terminates, by resist figure Case, which is cleaned, to be removed.Thus, the metal mask 10 provided with multiple gaps 15 is obtained.Etching for forming gap 15 can be from metal The single-face side of plate is carried out, and can also be carried out from two sides.In addition, using the laminated body provided with resin plate on a metal plate in metallic plate In the case of upper formation gap 15, after the surface mask applied part of the side not connected with resin plate of metallic plate, shape Into Resist patterns, then, by the etching from single-face side, gap 15 is formed.In addition, in resin plate relative to metallic plate In the case that etching material has elching resistant, although need not by the surface shaded of resin plate, resin plate without pair Metallic plate etching material patience in the case of, it is necessary to resin plate surface mask applied part.In addition, in above-mentioned, with Anticorrosive additive material as being illustrated centered on mask parts, but can also laminated dry film resist, carry out same composition To substitute coating anticorrosive additive material.It is also identical for the manufacture method of the deposition mask of embodiment (B), as long as gap is changed to 1 through hole.

(process of the metal mask of fixing band resin plate on framework)

The process is any process in the manufacture method of the deposition mask of embodiment (A), but not will be completed Deposition mask is fixed on framework, but the metal mask of the resin plate of the state to being fixed in framework sets opening from rear Portion, therefore, positional precision can be made particularly high.It should be noted that completed deposition mask 100 is being fixed on framework In the case of upper, due to by it is determined that the metal mask of opening on one side to frame drawing while fixation, so with this work The situation of sequence is compared, and aperture position coordinate precision can reduce.

The method of the metal mask of fixing band resin plate is not particularly limited on framework, as long as suitably using such as spot welding Etc. currently known process method.

(laser is irradiated from metal mask side, is formed on the resin plate of the metal mask of resin plate and making is deposited The corresponding opening portion of pattern process)

Then, as shown in Figure 10 (b), irradiated and swashed by gap 15 from the side of metal mask 10 of the metal mask of resin plate Light, the opening portion 25 corresponding with the pattern of making to be deposited is formed on above-mentioned resin plate 30, resin mask 20 is made.Herein Used laser aid is not particularly limited, as long as using existing known laser aid.Thus, Figure 10 (c) is obtained The deposition mask 100 of shown embodiment (A).

In addition, in embodiment (A) manufacture method, using in advance with 1 picture is overall or the picture of more than 2 Integrally equitant position is provided with the metal mask 10 in gap 15 in face, therefore, in this process, in 1 gap 15 formed with Opening portion 25 necessary to forming 1 picture forms opening portion 25 necessary to the picture of more than 2.That is, 1 gap 15 By the opening portion overall with being formed 1 picture or is formed more than 2 picture entirety opening portion 25 it is overlapping in a manner of set.

It is accurate during alternatively, it is also possible to set opening portion 25 in the resin plate for being fixed on the metal mask of resin plate of framework Standby pattern, the datum plate of pattern i.e. corresponding with the opening portion 25 that should be formed for being previously provided be deposited making (is not schemed Show), by the datum plate in the state of fitting on the face for the side for being not provided with metal mask 10 of resin plate, from metal mask 10 sides carry out the laser irradiation corresponding with the pattern of datum plate.According to this method, it can be observed on one side and fit in resin plate Metal mask datum plate pattern while carry out laser irradiation it is so-called it is opposite in the state of, form opening portion 25, can Form the opening portion 25 of the high fine of the dimensional accuracy being open.In addition, this method is entered in the state of framework is fixed on The formation of row opening portion 25, therefore, not only dimensional accuracy can be formed, and positional precision also excellent deposition mask.

In addition, using in the case of the above method, it is necessary to can be from the side of metal mask 10 across resin plate 30, using swashing Light irradiation device etc. recognizes the pattern of datum plate.As resin plate, in the case of with a certain degree of thickness, it is necessary to make With the resin plate with the transparency, but as described above, in the preferred thickness for being formed as the influence in view of shade, such as 3 μm In the case of~25 μm or so of thickness, even if being the resin plate through coloring, the pattern of datum plate can also be recognized.For implementing The manufacture method of the deposition mask of mode (B), same method can also be used.

The applying method of metal mask and datum plate for resin plate is also not particularly limited, such as in metal mask In the case that 10 are magnetic, the resin plate of the metal mask of resin plate in rear distributed magnet of datum plate etc., can be attracted 30 and datum plate be bonded.In addition, can also be bonded using Electrostatic Absorption method etc..As datum plate, example TFT substrate or photomask with defined patterns of openings can such as be enumerated.For the system of the deposition mask of embodiment (B) Method is made, same method can also be used.

Alternatively, it is also possible to carry out thickness reducing step after the inter process of described above or process.For example, as finally into For the resin plate 30 or metal mask 10 of resin mask 20, the situation of the thicker material of the preferred thickness than described above is used Under, in manufacturing process, when individually conveying metal mask 10 or during resin plate 30, can assign excellent durability or Transporting.On the other hand, in order to prevent that shade from occurring, the deposition mask obtained in the manufacture method of preferred embodiment (A) 100 thickness is most suitable thickness.Thickness reducing step be meeting durability or transporting manufacturing process or after process, and And by the useful process of the situation of the thickness optimization of deposition mask 100.

The slimming of metal mask 10 can by after the inter process of described above or process, by metal mask 10 with The face for the side that resin plate 30 does not connect or the side not connected with resin plate 30 or resin mask 20 of metal mask 10 Face, it is etched using the etching material of etchable metal mask 10 to realize.

For the resin plate 30 as resin mask 20 or the slimming of resin mask 20, i.e. resin plate 30, resin mask The optimization of 20 thickness is also identical, can be by after any inter process or process of described above, by resin plate 30 and gold The face for the side that category mask 10 does not connect or the face of the side not connected with metal mask 10 of resin mask 20, use can lose The etching material for carving the material of resin plate 30 or resin mask 20 is etched to realize.In addition, forming deposition mask 100 Afterwards, both metal mask 10, resin mask 30 are etched processing, thus, can also be by the thickness optimization of the two.On Thickness reducing step is stated can also directly to apply in the manufacture method of the deposition mask of embodiment (B).

(manufacture method of the deposition mask of embodiment (B))

Then, the manufacture method of the deposition mask of embodiment of the present invention (B) is illustrated.The deposition mask of embodiment (B) 100 manufacture method is as shown in figure 19, it is characterised in that possesses：Prepare by metal mask 10 and resin provided with 1 through hole The process (reference picture 19 (a)) of the metal mask for the resin plate that the lamination of plate 30 forms and from the side of metal mask 10 irradiate laser And in the resin mask formation process (reference that multiple opening portions 25 are formed with 1 overlapping position of through hole 15 of resin plate 30 Figure 19 (b)).Hereinafter, the manufacture method of the deposition mask of embodiment (B) is illustrated.

(process for preparing the metal mask of resin plate)

This process is that the metal mask 10 provided with 1 through hole 15 fits with resin plate 30, is thereby preparing for lamination gold The process of the metal mask for the resin plate that category mask 10 and resin plate 30 form.

(process of the metal mask of fixing band resin plate on framework)

The process is the optional process steps in the manufacture method of the deposition mask of embodiment (B), can be same as before using above-mentioned Illustrated method in the manufacture method of the deposition mask of embodiment (A), omits detailed description herein.

(laser is irradiated from metal mask side, is formed on the metal mask of resin plate overlapping with 1 through hole multiple The process of opening portion)

Then, as shown in Figure 19 (b), laser is irradiated from the side of metal mask 10 by 1 through hole 15, in above-mentioned resin plate The opening portion 25 corresponding with the pattern of making to be deposited is formed on 30, resin mask 20 is made.In the process, pass through 1 Through hole 15 carries out laser irradiation, therefore, is finally forming multiple opening portions 25 with 1 overlapping position of through hole 15.For Laser aid as used herein is not particularly limited, as long as using currently known laser aid.Thus, Figure 19 is obtained (c) deposition mask 100 of the embodiment (B) shown in.

(deposition mask preparation body)

Then, illustrate that the deposition mask of an embodiment of the present invention prepares body.The deposition mask of an embodiment of the present invention It is to be used to obtain deposition mask to prepare body, it is characterised in that set apertured metal mask in a face superimposed layer of resin plate and Into, each gap be located at finally located at the overall equitant position in opening portion of 1 picture of composition of resin plate, the evaporation Mask stack has resin mask and the metal mask provided with multiple gaps, is provided with resin mask and is used to form multiple picture institutes Necessary opening portion, opening portion is corresponding with the pattern of making to be deposited, and each gap is located at and integrally overlapped with least one picture Position.

The deposition mask of an embodiment of the present invention prepares body in addition to opening portion 25 is not provided with resin plate, with above stating The deposition mask 100 of bright embodiment (A) is common, omits specific description.Deposition mask as an embodiment prepares The specific composition of body, it can enumerate what is prepared in the preparatory process in the manufacture method of the deposition mask of above-mentioned embodiment (A) The metal mask (reference picture 10 (a)) of resin plate.

Body is prepared according to the deposition mask of an above-mentioned embodiment, there is provided prepare shape on the resin plate of body in the deposition mask Into opening portion, in the case of maximization, High precision and this both sides of lighting can also be met, it is available to form height The deposition mask of fine evaporation pattern.

The deposition mask of other embodiment prepares body and is used to obtain deposition mask, it is characterised in that the one of resin plate Face superimposed layer is provided with the metal mask of 1 through hole, and 1 through hole is located at whole opening portions weight with being finally located at resin plate Folded position, the deposition mask lamination have metal mask provided with 1 through hole and provided with multiple figures with making is deposited The position overlapping with 1 through hole is all located in the resin mask of the corresponding opening portion of case, multiple opening portions.

The deposition mask of other embodiment prepares body in addition to opening portion 25 is not provided with resin plate, with described above The deposition mask 100 of embodiment (B) is common, and omission illustrates.Deposition mask as other embodiment prepares body It is specific to form, the tape tree prepared in the preparatory process in the manufacture method of the deposition mask of above-mentioned embodiment (B) can be enumerated The metal mask (reference picture 19 (a)) of fat plate.

Body is prepared according to the deposition mask of above-mentioned other embodiment, there is provided on the resin plate that the deposition mask prepares body Opening portion is formed, thus in the case of maximization, High precision and this both sides of lighting can also be met, can obtain can Form the deposition mask of the evaporation pattern of fine.

(manufacture method of organic semiconductor device)

Then, the manufacture method of the organic semiconductor device of an embodiment of the present invention is illustrated.An embodiment of the present invention The manufacture method of organic semiconductor device be characterised by having：By using the vapour deposition method shape of the deposition mask of tape frame Into the process of evaporation pattern, in the process for forming the organic semiconductor device, the deposition mask of following tape frame is used.

Vapour deposition method with the deposition mask by using tape frame come formed evaporation pattern process an embodiment The manufacture method of organic semiconductor device have：Formed on substrate the electrode forming process of electrode, organic layer formation process, Counter electrode formation process, sealant formation process etc., in each any process, by using the steaming of the deposition mask of tape frame Plating method, evaporation pattern is formed on substrate.For example, in the assorted luminescent layer formation process of R, G, B of organic EL element respectively In the case of vapour deposition method using the deposition mask of tape frame, the evaporation pattern of assorted luminescent layer is formed on substrate.This Outside, the manufacture method of the organic semiconductor device of an embodiment of the present invention is not limited to these processes, is applicable to manufacture and uses Any process during the currently known organic semiconductor device of vapour deposition method.

The manufacture method of the organic semiconductor device of an embodiment of the present invention is characterised by, is forming above-mentioned evaporation figure In the process of case, deposition mask or embodiment party of the above-mentioned deposition mask of framework for the embodiment (A) of described above are fixed on The deposition mask of formula (B).

For the deposition mask for the deposition mask for forming tape frame, the embodiment (A) or real of described above still can be used The deposition mask 100 of mode (B) is applied, in this detailed description will be omitted.According to of the invention embodiment party of the use comprising described above The system of the organic semiconductor device of the deposition mask of the tape frame of the deposition mask of formula (A) or the deposition mask of embodiment (B) Method is made, the organic semiconductor device with fine pattern can be formed.Organic semiconductor as an embodiment of the present invention Organic semiconductor device manufactured by the manufacture method of element, such as the organic layer, luminescent layer or the moon of organic EL element can be enumerated Pole electrode etc..Especially, the manufacture method of the organic semiconductor device of an embodiment of the present invention is applicable to manufacture and requires high R, G, B luminescent layer of the organic EL element of fine pattern accuracy.

As long as the deposition mask of the tape frame for manufacturing organic semiconductor device meets to be fixed with framework to state Bright embodiment (A) or the condition of the deposition mask of embodiment (B), are not particularly limited for other conditions.It is right It is not particularly limited in framework, as long as the part of deposition mask can be supported, such as metal framework or ceramic frame can be used Frame etc..Wherein, on this point metal framework is welded in the metal mask easily with deposition mask, and the influence deformed etc. is smaller It is preferred that.Hereinafter, to be illustrated using metal framework as centered on the example of framework.For example, can be used as shown in figure 20, The deposition mask 200 with metal framework that 1 deposition mask 100 forms is fixed on metal framework 60, can also be used as schemed Shown in 21, by fixed (being transversely arranged fixation in a manner of in diagram) the multiple steamings of vertical or horizontal arrangement on metal framework 60 Plate the deposition mask 200 with metal framework of mask (being 4 deposition masks in the mode of diagram).In addition, Figure 20, Tu21Shi The front elevation of the deposition mask 200 with metal framework of an embodiment from the side of resin mask 20.

Metal framework 60 is the frame part of rectangular shape, has and is used to make to be located at finally by fixed deposition mask The opening that the opening portion 25 of 100 resin mask 20 is exposed in evaporation source.It is not particularly limited for the material of metal framework, But the big metal material of rigidity, such as SUS or invar alloy material etc. are more adapted to.

Also it is not particularly limited for the thickness of metal framework, but from the point of view of rigidity etc., preferably 10mm~30mm Left and right.As long as the width between the inner circumferential end face of the opening of metal framework and the peripheral end face of metal framework is that can fix the metal frame The width of the metal mask of frame and deposition mask, is just not particularly limited, and can illustrate such as 10mm~50mm or so width.

Alternatively, it is also possible in the scope exposed of the opening portion 25 without prejudice to the resin mask 20 for forming deposition mask 100 It is interior, reinforcement framework 65 etc. be present in the opening of metal framework.In other words, it is possible to have opening is logical possessed by metal framework 60 Cross the composition that reinforcement framework decile is cut.In the mode shown in Figure 20, multiple reinforcement frameworks to extend laterally are configured along longitudinal direction 65, but the reinforcement framework 65 can also be substituted, or the reinforcement framework that multiple row extends longitudinally transversely is configured together with it.Separately Outside, in the mode shown in Figure 21, multiple reinforcement frameworks 65 extended longitudinally are transversely configured with, but the benefit can also be substituted Strong frame 65, or configure multiple reinforcement frameworks extended transversely along longitudinal direction together with it.By using being configured with reinforcement frame The metal framework 60 of frame 65, along longitudinal direction and the embodiment of the transversely arranged multiple described above of fixation on metal framework 60 (A) or during the deposition mask 100 of embodiment (B), even in the overlapping position of the reinforcement framework and deposition mask, also may be used To fix deposition mask on metal framework 60.

Fixation for the embodiment of metal framework 60 and described above (A) or the deposition mask 100 of embodiment (B) Method, also it is not particularly limited, can be used and be fixed by laser etc. come the spot welding that is fixed, bonding agent, screw etc..

Claims

1. a kind of manufacture method of deposition mask, this method possess：

The process that preparation lamination has the metal mask of the resin plate of resin plate and the metal mask provided with multiple gaps；With

Laser is irradiated from the metal mask side, is opened so as to be formed on the resin plate for forming necessary to multiple pictures The resin mask formation process of oral area,

Wherein, as the metal mask, using with the overall equitant position of at least one picture in the multiple picture If apertured metal mask.