JP2009052072A - Vapor deposition mask, vapor deposition mask device, method for manufacturing vapor deposition mask, method for manufacturing vapor deposition mask device and method for manufacturing sheet-shaped member for vapor deposition mask - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a vapor deposition mask which enables a pattern with extremely high definition to be formed. <P>SOLUTION: The method for manufacturing the vapor deposition mask includes forming a hole 25 in a sheet made from a metal 34 through an etching process. The sheet made from the metal to be etched is provided in a form of a laminate 30 which supports the sheet made from the metal on a sheet made from a resin 32. The sheet made from the resin of the laminate is removed after the sheet made from the metal has been etched. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a vapor deposition mask used for performing vapor deposition with a desired pattern, and more particularly to a vapor deposition mask capable of performing vapor deposition with an extremely high-definition pattern with high accuracy.

  The present invention also relates to a vapor deposition mask apparatus provided with a vapor deposition mask used for vapor deposition in a desired pattern, and in particular, includes a vapor deposition mask that can perform vapor deposition in an extremely high-definition pattern with high accuracy. The present invention relates to a vapor deposition mask device.

  Furthermore, the present invention relates to a method of manufacturing a vapor deposition mask used for performing vapor deposition with a desired pattern, and more particularly, to a method of manufacturing a vapor deposition mask capable of performing vapor deposition with an extremely high-definition pattern with high accuracy.

  Furthermore, the present invention relates to a method of manufacturing a vapor deposition mask apparatus having a vapor deposition mask used for vapor deposition in a desired pattern, and in particular, vapor deposition that can perform vapor deposition in an extremely high-definition pattern with high accuracy. The present invention relates to a method for manufacturing a vapor deposition mask apparatus including a mask.

  Furthermore, the present invention relates to a method of manufacturing a sheet-like member used for a vapor deposition mask used for vapor deposition in a desired pattern, and in particular, vapor deposition that can perform vapor deposition in an extremely high-definition pattern with high accuracy. The present invention relates to a method for manufacturing a sheet-like member for a mask.

  Conventionally, a method of forming a thin film with a desired pattern using a vapor deposition mask including holes arranged in a desired pattern is known. In recent years, for example, when an organic material is vapor-deposited on a substrate at the time of manufacturing an organic EL display device, it is strongly desired to perform extremely high-definition patterning by vapor deposition.

In general, such a deposition mask can be manufactured by forming holes in a metal plate by etching using a photolithography technique (for example, Patent Document 1). Moreover, when forming a hole in a metal plate by etching, there are a method of etching from both sides of the metal plate and a method of etching only from one side of the metal plate.
JP 2004-39319 A

  However, when a vapor deposition mask produced by etching is used, there is a problem that vapor deposition with an extremely fine pattern cannot be performed with high accuracy. An investigation of the cause of this failure confirmed the following.

  In etching using a photolithography technique, erosion starts from a region of the metal plate that is not covered with a resist film. Thereafter, the erosion does not proceed only in the thickness direction of the metal plate, but also proceeds in the direction along the plate surface of the metal plate. Accordingly, tapered holes are formed by etching. For this reason, when etching is performed from both surfaces of the metal plate 2, as shown in FIG. 11, the cross-sectional area (opening area) is the largest in the hole 2a except at the end in the thickness direction of the metal plate 2. The overhanging portion 3 is formed to reduce the. When vapor deposition is performed using such a vapor deposition mask 1, the film thickness of the vapor deposition film 5 formed in a region corresponding to the back side of the protruding portion 3 of the substrate 4 is not stable. As a result, the edge of the vapor deposition pattern is blurred (the outline of the vapor deposition pattern is not clear). In the first place, it is difficult to control the position and cross-sectional shape of the overhang portion formed in the hole. From the above, when the metal plate is etched from both sides, it is not possible to perform deposition with an extremely fine pattern with high accuracy.

  On the other hand, when the metal plate is etched only from the upper surface, an etchant that has already been used for erosion and has a low erosion ability remains in the tapered hole formed by erosion. After that, when the hole of the metal plate reaches the lower surface, the etching solution remaining in the hole until then flows out from the lower surface, and into the hole in which a fresh etching solution having a high erosion ability is formed. Flows in. At this time, the liquid pressure increases in the lower region in the hole where the cross-sectional area (opening area) is small, and the lower region in the hole is eroded violently by the fresh etching solution. As a result, as in the case where etching is performed from both sides of the metal plate, a protruding portion is formed in the hole.

  Further, when the metal plate 6 is etched from only the lower surface through the resist film 7, when the tapered hole 6a formed by erosion penetrates the metal plate 6 as shown in FIG. In addition, the etching solution 8 may remain. As a result, the metal plate is eroded from the upper surface by the remaining etching solution, and an overhang portion is formed in the hole as in the case of etching from both sides of the metal plate.

  Therefore, even when the metal plate is etched from only one side, the edge of the vapor deposition pattern is blurred (the outline of the vapor deposition pattern is not clear). In the first place, when the metal plate is etched from one surface side, the cross-sectional shape of the hole may be bent due to the pressure generated when the hole is penetrated and the etching solution starts to flow. In this case, it is difficult to accurately form the hole with a desired shape. This phenomenon becomes more prominent in the above-described deposition mask for performing high-definition patterning. From the above, even when the metal plate is etched only from one surface, it is not possible to perform deposition with an extremely high-definition pattern with high accuracy.

  And this invention is based on these knowledge, Comprising: It aims at providing the vapor deposition mask which can perform very high-definition patterning.

  Another object of the present invention is to provide a vapor deposition mask apparatus provided with a vapor deposition mask that enables extremely high-definition patterning.

  Furthermore, an object of this invention is to provide the manufacturing method of the vapor deposition mask which manufactures the vapor deposition mask which makes it possible to perform very high-definition patterning.

  Furthermore, an object of the present invention is to provide a method for manufacturing a vapor deposition mask device for manufacturing a vapor deposition mask device having a vapor deposition mask that enables highly precise patterning.

  Furthermore, this invention aims at providing the manufacturing method of the sheet-like member for vapor deposition masks which manufactures the sheet-like member used for the vapor deposition mask which makes it possible to perform very high-definition patterning.

  The method of manufacturing a vapor deposition mask according to the present invention includes a step of supplying a laminate having a resin sheet and a metal sheet laminated on the resin sheet, etching the supplied laminate, It is characterized by comprising a step of forming a large number of holes in a sheet made and a step of removing the resin sheet from the laminate after the etching step.

  In the method of manufacturing a vapor deposition mask according to the present invention, in the step of etching the stacked body, a plurality of holes arranged side by side along one direction, each extending along another direction orthogonal to the one direction. These holes may be formed. In the step of removing the resin sheet in such a method for manufacturing a vapor deposition mask, the metal sheet and the resin sheet may be separated along the other direction. Moreover, in the manufacturing method of such a vapor deposition mask, you may make it the said laminated body supply along the said other direction.

  Further, in the step of etching the laminated body of the method for manufacturing a vapor deposition mask according to the present invention, a plurality of perforated regions in which a plurality of holes are arranged in a predetermined pattern are formed on the metal sheet, thereby enabling multifaceted application. A vapor deposition mask may be manufactured.

  Furthermore, in the step of supplying the laminate in the method for manufacturing a vapor deposition mask according to the present invention, a laminate including a resin sheet that is adapted to reduce the bonding force to the metal sheet when irradiated with UV light is supplied. In the step of removing the resin sheet, the resin sheet may be irradiated with UV light to separate the metal sheet and the resin sheet.

  Furthermore, in the step of supplying the laminated body in the method for manufacturing a vapor deposition mask according to the present invention, the wound body around which the laminated body is wound may be rewound to supply a laminated body extending in a band shape.

  The vapor deposition mask according to the present invention is a vapor deposition mask manufactured by any one of the above-described manufacturing methods, and has a cross-sectional area of holes formed in the vapor deposition mask from one surface of the vapor deposition mask to the other surface. It is characterized by gradually becoming smaller.

  In the vapor deposition mask according to the present invention, in a cross section orthogonal to the sheet surface of the vapor deposition mask, a straight line connecting the end on the one surface side and the end on the other surface side of the hole, and the other surface, The angle made may be 60 ° or less.

  An evaporation mask apparatus according to the present invention includes an evaporation mask manufactured by any one of the manufacturing methods described above, and a frame fixed to the evaporation mask, from one surface of the evaporation mask toward the other surface, The cross-sectional area of the hole formed in the vapor deposition mask is gradually reduced.

  In the vapor deposition mask device according to the present invention, in a cross section perpendicular to the sheet surface of the vapor deposition mask, a straight line connecting the end on the one surface side and the end on the other surface side of the hole, and the other surface, The angle formed by may be 60 ° or less.

  A first vapor deposition mask device manufacturing method according to the present invention is a vapor deposition mask device manufacturing method including a vapor deposition mask and a frame fixed to the vapor deposition mask, and is laminated on the resin sheet. And a step of supplying a laminate having a metal sheet, a step of etching the supplied laminate to form a large number of holes in the metal sheet, and an etching step. A step of attaching the frame to a metal sheet, and a step of removing the resin sheet from the laminate to which the frame is attached are provided.

  A second vapor deposition mask device manufacturing method according to the present invention is a vapor deposition mask device manufacturing method including a vapor deposition mask and a frame fixed to the vapor deposition mask, and is laminated on the resin sheet. A step of supplying a laminate having a metal sheet, a step of etching the supplied laminate to form a large number of holes in the metal sheet, and an etching step. A step of removing the resin sheet and a step of attaching the frame to the metal sheet after the resin sheet is removed are provided.

  In the step of etching the laminate of the first or second vapor deposition mask device manufacturing method according to the present invention, a plurality of holes arranged side by side along one direction, each of which is orthogonal to the one direction A large number of holes extending in the direction may be formed. In the step of removing the resin sheet in the method of manufacturing the vapor deposition mask device, the metal sheet and the resin sheet may be separated along the other direction. Moreover, in the manufacturing method of such a vapor deposition mask apparatus, you may make it the said laminated body supply along the said other direction.

  Further, in the step of etching the laminate of the first or second vapor deposition mask device manufacturing method according to the present invention, a plurality of perforated regions in which a plurality of holes are arranged in a predetermined pattern are formed on the metal sheet, Thereby, the vapor deposition mask arrangement | positioning which can be multi-faceted may be manufactured.

  Further, in the step of supplying the laminated body of the first or second vapor deposition mask device manufacturing method according to the present invention, when the resin is irradiated with UV light, the bonding force to the metal sheet is reduced. In the step of supplying a laminate including a sheet and removing the resin sheet, the adhesive layer may be irradiated with UV light to separate the metal sheet and the resin sheet.

  Furthermore, in the step of supplying the laminated body of the first or second vapor deposition mask device manufacturing method according to the present invention, the winding body around which the laminated body is wound is rewound to supply a laminated body extending in a band shape. It may be.

  A method for producing a sheet-like member for a vapor deposition mask according to the present invention is a method for producing a sheet-like member for a vapor deposition mask for producing a sheet-like member used for a vapor deposition mask in which a large number of holes are formed. A step of supplying a laminate having a metal sheet laminated on the resin sheet, a step of etching the supplied laminate to form a large number of holes in the metal sheet, and an etching step And a step of removing the resin sheet from the laminate.

  In the step of etching the laminate of the method for producing a sheet-like member for vapor deposition mask according to the present invention, a plurality of holes arranged side by side along one direction, each along another direction orthogonal to the one direction A plurality of holes extending in the direction may be formed. In the step of removing the resin sheet of the method for manufacturing the vapor deposition mask sheet member, the metal sheet and the resin sheet may be separated along the other direction. Moreover, in the manufacturing method of such a sheet-like member for vapor deposition masks, the laminate may be supplied along the other direction.

  Further, in the step of etching the laminate of the method for producing a sheet-like member for vapor deposition mask according to the present invention, a plurality of perforated regions in which a plurality of holes are arranged in a predetermined pattern are formed in the metal sheet, You may make it manufacture the sheet-like member used for the vapor deposition mask which can be attached to many surfaces.

  Furthermore, in the step of supplying the laminate of the method for producing a sheet-like member for a vapor deposition mask according to the present invention, including a resin sheet adapted to reduce the bonding force to the metal sheet when irradiated with UV light In the step of supplying the laminate and removing the resin sheet, the adhesive layer may be irradiated with UV light to separate the metal sheet and the resin sheet.

  Furthermore, in the step of supplying the laminate in the method for manufacturing a sheet-like member for a vapor deposition mask according to the present invention, the laminate around which the laminate is wound is rewound to supply a laminate extending in a band shape. Good.

  According to the present invention, it is possible to obtain a vapor deposition mask in which the cross-sectional area gradually decreases from one surface to the other surface and the shape on the other surface is formed with high accuracy. Therefore, according to this vapor deposition mask, vapor deposition with an extremely high-definition pattern can be performed with high accuracy.

  Hereinafter, an embodiment of a deposition mask, a deposition mask device, a method for manufacturing a deposition mask, a method for manufacturing a deposition mask device, and a method for manufacturing a sheet-like member for a deposition mask according to the present invention will be described with reference to FIGS. Will be described. Here, FIG. 1 to FIG. 10 are diagrams for explaining an embodiment of the present invention. In the following embodiments, a vapor deposition mask (a metal mask for vapor deposition), a vapor deposition mask device used for patterning an organic light emitting material on a glass substrate in a desired pattern when manufacturing an organic EL display device, The vapor deposition mask manufacturing method, the vapor deposition mask device manufacturing method, and the vapor deposition mask sheet-like member will be described as examples. However, the present invention is not limited to such an application, and a vapor deposition mask (metal mask for vapor deposition), a vapor deposition mask device, a vapor deposition mask manufacturing method, a vapor deposition mask device manufacturing method, and a vapor deposition mask used for various purposes. The present invention can be applied to a sheet-like member.

  First, an example of a vapor deposition mask and a vapor deposition mask device that can be produced by the vapor deposition mask production method and the vapor deposition mask device production method according to the present invention will be described mainly with reference to FIGS. Here, FIG. 1 is a perspective view showing an example of a vapor deposition mask and a vapor deposition mask device, and FIG. 2 is a view for explaining a method of using the vapor deposition mask and the vapor deposition mask device.

  As shown in FIGS. 1 to 4, the vapor deposition mask apparatus 10 in the present embodiment includes a vapor deposition mask 20 made of a rectangular metal sheet, and a frame 15 to which the peripheral edge of the vapor deposition mask 20 is attached. ing. The vapor deposition mask 20 is made of a metal sheet-like member having a large number of holes 25 (see FIG. 4). As shown in FIG. 2, the vapor deposition mask device 10 is supported in the vapor deposition device 40 so that the vapor deposition mask 20 faces the glass substrate 42. In the vapor deposition apparatus 40, a crucible 44 for accommodating a vapor deposition material (for example, an organic light emitting material) 48 and a heater 46 for heating the crucible 44 are disposed below the glass substrate 42 with the vapor deposition mask apparatus 10 interposed therebetween. Has been. The vapor deposition material 48 in the crucible 44 is vaporized or sublimated by heating from the heater 46 and adheres to the surface of the glass substrate 42. As described above, a large number of holes 25 are formed in the vapor deposition mask 20, and the vapor deposition material 48 adheres to the glass substrate 42 through the holes 25. As a result, the vapor deposition material 48 is formed on the surface of the glass substrate 42 in a desired pattern corresponding to the position of the hole 25 of the vapor deposition mask 20.

  As shown in FIG. 1, in the present embodiment, the vapor deposition mask 20 has a substantially rectangular shape in a plan view, more precisely, a substantially rectangular shape in a plan view. The vapor deposition mask 20 includes a perforated region 22 in which the holes 25 are formed and a non-perforated region 23 that does not have the holes 25 and occupies a region surrounding the perforated region 22. As shown in FIG. 1, each of the perforated regions 22 has a substantially rectangular shape in a plan view, more precisely, a substantially rectangular shape in a plan view.

  In the present embodiment, the plurality of perforated regions 22 are arranged at a predetermined interval along one direction parallel to one side of the vapor deposition mask 20 and predetermined along another direction orthogonal to the one direction. Are arranged with an interval of. In the present embodiment, one perforated region 22 corresponds to one organic EL display device. That is, according to the vapor deposition mask apparatus 10 (deposition mask 20) shown in FIG. 1, vapor deposition with multiple surfaces is possible.

  As shown in FIGS. 1 and 3, the plurality of holes 25 provided in each perforated region 22 are arranged side by side at equal intervals along one direction in the perforated region 22. In addition, each hole 25 extends elongated from one end to the other end of the perforated region 22 in parallel with the other direction orthogonal to the one direction. Further, as shown in FIG. 4, the cross-sectional area of each hole 25 in the cross section along the sheet surface of the metal sheet 34 is gradually reduced from one surface 20a of the vapor deposition mask 20 having a sheet shape to the other surface 20b. It will become. Here, FIG. 3 is a partial plan view showing the vapor deposition mask 20 from the one surface 20a side, and FIG. 4 is a cross-sectional view taken along line IV-IV in FIG.

  Incidentally, as shown in FIG. 5, when the vapor deposition mask device 10 is accommodated in the vapor deposition device 40, one surface 20 a of the vapor deposition mask 20 faces the crucible 44 holding the vapor deposition material 48, and the other of the vapor deposition mask 20. The surface 20b faces the glass substrate 42. That is, as shown in FIG. 5, the vapor deposition material 48 passes through the holes 25 having a gradually decreasing cross-sectional area and adheres to the glass substrate 42. As shown in FIG. 5, the vapor deposition material 48 may not move linearly from the crucible 44 toward the glass substrate 42, but may move obliquely with respect to the plate surface of the glass substrate 42. At this time, if the cross-sectional shape of the hole 25 has an outline indicated by a dotted line in FIG. 5, the vapor deposition material 48 that moves obliquely does not adhere to the vapor deposition mask 20 and reach the glass substrate 42.

  That is, in order to increase the utilization efficiency (deposition efficiency: rate of adhesion to the glass substrate 42) of the vapor deposition material and save an expensive vapor deposition material, a cross section perpendicular to the sheet surface of the vapor deposition mask 20 (cross section of FIG. 5). The angle θ formed by the straight line L connecting the end of the hole 25 on the one surface 20a side and the end of the hole 25 on the other surface 20b side and the other surface 20b is preferably small. However, the ratio of the vapor deposition material that moves toward the glass substrate 42 so as to form a large angle with respect to the perpendicular to the glass substrate 42 is small. And if the angle (theta) which the above-mentioned straight line L makes with respect to the other surface 20b is 60 degrees or less, the utilization efficiency of vapor deposition material will become a sufficient value.

  As the angle θ is decreased, the wall surfaces of the adjacent holes 25 are connected as shown by a two-dot chain line in FIG. However, considering the strength of the vapor deposition mask 20, the wall surfaces of the adjacent holes 25 are preferably not connected to each other, and a flat surface of 5 μm or more is formed between the adjacent holes 25 on one surface 20a. More preferably.

  That is, the angle θ formed by the straight line L with respect to the other surface 20b is not less than an angle at which a flat surface of 5 μm or more is formed between the holes 25 on the one surface 20a, and is not more than 60 ° C. Preferably there is.

  As described above, in the present embodiment, the holes 25 are arranged at equal intervals in each perforated region 22. As an example, when the vapor deposition mask 20 (vapor deposition mask device 10) is used to produce a display (about 2 to 3 inches) such as a mobile phone or a digital camera, the arrangement pitch P of the holes 25 (see FIG. 4) is: It can be about 84 μm (300 ppi) or more and 254 μm (100 ppi) or less. When color display is desired, the vapor deposition mask 20 (vapor deposition mask device 10) and the glass substrate 42 are relatively moved along the arrangement direction of the holes 25 (one direction described above), and the red organic The light emitting material, the green organic light emitting material, and the blue organic light emitting material may be deposited in this order. Further, when the vapor deposition mask 20 (vapor deposition mask device 10) is used for manufacturing a display of a mobile phone, the width (slit width) W along the arrangement direction (one direction described above) of each hole 25 is 28 μm or more. It can be about 84 μm or less.

  On the other hand, the frame 15 of the vapor deposition mask device 10 is attached to the peripheral edge of the rectangular vapor deposition mask 20. The frame 15 holds the deposition mask in a stretched state so that the deposition mask 20 is not bent. The vapor deposition mask 20 and the frame 15 are fixed to each other, for example, by spot welding.

  The vapor deposition mask device 10 is held inside the vapor deposition device 40 that is in a high temperature atmosphere. Therefore, the vapor deposition mask 20 and the frame 15 are preferably made of the same material having a low coefficient of thermal expansion in order to prevent the vapor deposition frame from being bent or generating thermal stress. As such a material, for example, a 36% Ni invar material can be used.

  Next, the manufacturing method of such a vapor deposition mask 20 and the vapor deposition mask apparatus 10 is demonstrated mainly using FIG. 6 thru | or FIG. Among these, FIG. 6 is a figure for demonstrating the manufacturing method of a vapor deposition mask.

  As shown in FIG. 6, the manufacturing method of the vapor deposition mask in this Embodiment is the process of supplying the laminated body 30 which has the resin sheet 32 and the metal sheet 34 laminated | stacked on the resin sheet 32, Photo Etching using a lithography technique is performed on the metal sheet 34 of the laminate 30 to form a large number of holes 25 in the metal sheet 34, and the resin sheet 32 is removed from the laminate 30 after the etching process. And a process.

  As shown in FIG. 6, in the present embodiment, a laminated body 29 in which the laminated body 30 is wound around a supply core 31 is prepared. Then, when the supply core 31 rotates and the wound body 29 is rewound, the laminated body 30 extending in a strip shape is supplied as shown in FIG. Here, the laminated body 30 is supplied so that the metal sheet 34 is located below and the resin sheet 32 is located above.

  In addition, the metal sheet 34 of the laminate 30 is formed with a hole 25 as described below to form the vapor deposition mask 20. Therefore, as described above, the metal sheet 34 is made of, for example, 36% Ni invar material. However, the sheet is not limited thereto, and a sheet made of stainless steel, copper, iron, or aluminum can be used as the metal sheet 34.

  On the other hand, as the resin sheet 32, for example, a sheet made of polyethylene terephthalate or polypropylene having a thickness of about 50 μm to 150 μm can be used. In the present embodiment, a resin sheet 32 is used in which the bonding force to the metal sheet 34 is reduced when irradiated with UV light. Specifically, the resin sheet 32 has a base sheet 32a made of polyethylene terephthalate, and a UV release layer 32b that is laminated on the base sheet 32a and faces the metal sheet 34. (See FIGS. 7 and 8).

  Here, the UV release layer 32b has an adhesive force at first, and adheres the base sheet 32a and the metal sheet 34, but when irradiated with UV light, the adhesive strength of the irradiated portion is reduced. It is a layer that is. For example, when irradiated with UV light, the irradiated portion is cured and the bonding force to the metal sheet 34 is reduced. Such a UV peeling layer 32b can be formed from, for example, an acrylic UV re-peeling adhesive.

  The supplied laminate 30 is subjected to an etching process by an etching apparatus (etching means) 50. Specifically, first, a photosensitive resist material is applied on the surface of the metal sheet 34 of the laminate 30 (on the lower surface of the paper surface of FIG. 7), and a resist film 36 is formed on the metal sheet 34. To do. Next, a glass dry plate 37 is prepared in which light is not transmitted to a region to be removed of the resist film 36, and the glass dry plate 37 is disposed on the resist film 36.

  Thereafter, as shown in FIG. 7, the resist film 36 is exposed through a glass dry plate 37, and the resist film 36 is further developed. As described above, the resist pattern 36 a is formed on the metal sheet 34 of the stacked body 30.

  Note that a region of the glass dry plate 37 facing the resist film 36 to be removed may be black, and visible light may be used as exposure light. In this case, the visible light is absorbed by the black portion, so that light does not enter the region to be removed of the resist film 36 and the resist film 36 is not fixed on the metal sheet 34. On the other hand, light is incident on an area where the resist film 36 should not be removed, and the resist film 36 in the area is fixed on the metal sheet 34. The unfixed resist film 36 is removed by, for example, hot water washing.

  Next, as shown in FIG. 8, the laminated body 30 is etched with an etching solution (for example, ferric chloride solution) 38 using the resist pattern 36a formed on the metal sheet 34 as a mask. In the present embodiment, the etching solution 38 is sprayed from the nozzle 51 of the etching apparatus 50 disposed below the transported laminate 30 toward the one surface 34a of the metal sheet 34 through the resist pattern 36a. The At this time, as shown by a dotted line in FIG. 8, erosion by the etching solution starts in a region of the metal sheet 34 that is not covered with the resist pattern 36a. Thereafter, erosion proceeds not only in the thickness direction of the metal sheet 34 but also in the direction along the sheet surface of the metal sheet 34. As described above, erosion by the etching solution proceeds from one surface 34a of the metal sheet 34 to the other surface 34b, and the hole 25 penetrating the metal sheet 34 is formed.

  Thereafter, the resist pattern 36a on the stacked body 30 is removed, and the stacked body 30 is further washed with water. In this manner, the vapor deposition mask sheet-like member 18 formed of the metal sheet 34 having a large number of holes 25 formed on the resin sheet 32 is obtained.

  By the way, if the resin sheet 32 is not provided, as described above, the etching liquid stays on the other surface 34b side of the metal sheet 34 after the metal sheet 34 is penetrated and the hole 25 is formed. This may cause a problem that the shape and size of the hole 25 are not stable. However, according to the present embodiment, even if the hole 25 penetrating the metal sheet 34 is formed, the upper side of the hole 25 is covered with the resin sheet 32. Therefore, it is possible to reliably avoid the problems that have occurred in the conventional method. As a result, the metal sheet 34 is eroded only from the one surface 34a side, and the cross-sectional area of the hole 25 formed in the metal sheet 34 is directed from the one surface 34a, 20a to the other surface 34b, 20b. It gradually gets smaller. Further, the hole 25 having a desired opening area (area of the hole 25 in plan view) can be formed with high accuracy.

  Thereafter, the stacked body 30 thus etched is transported into a removing device (removing means) 54 by a pair of transport rollers 57 and 57 that rotate while sandwiching the stacked body 30. Note that the supply core 31 described above is rotated through the tension (pulling force) acting on the laminated body 30 by the rotation of the transport rollers 57 and 57, and the laminated body 30 is supplied from the wound body 29. Yes.

  In the present embodiment, the metal sheet 34 is supported and reinforced by the resin sheet 32. Therefore, when the laminated body 30 is transported, the stress between the holes 25 and the holes 25 may cause a cut between the holes 25 and 25 of the metal sheet 34, It is possible to remarkably suppress the problem that the portion extending linearly becomes tangled. As a result, it is possible to avoid the problem that the shape of the fine holes 25 formed in the metal sheet 34 in the etching process is subsequently lost.

  In addition, as described above, when the holes 25 that are elongated along the direction orthogonal to the arrangement direction are formed, the direction in which the holes 25 extend (the other direction described above) and the direction in which the stacked body 30 is supplied (the stacked body is transported). Direction) is preferably substantially parallel. In this case, it is possible to effectively prevent the gap between the hole 25 and the hole 25 of the metal sheet 34 from being cut or a portion extending linearly between the hole 25 and the hole 25 from being tangled. it can.

  As shown in FIG. 9, the removal device 54 in the present embodiment has UV light irradiation means 55 provided on the downstream side of the transport roller 57. The UV light irradiation means 55 is provided along the movement path of the laminate 30, and includes a shade 55a that covers the laminate 30 from the resin sheet 32 side, and a UV light source 55b that is disposed in the shade 55a. Yes. And the laminated body 30 conveyed is irradiated with UV light from the resin sheet 32 side, and the substrate sheet 32a and the vapor deposition mask 20 (metal sheet 34) are transmitted by the UV light transmitted through the substrate sheet 32a of the resin sheet 32. ) Is strongly weakened. As a result, the resin sheet 32 and the metal sheet 34 (deposition mask 20) forming the laminate 30 can be separated, and the resin sheet 32 is peeled off from the metal sheet 34 and wound as shown in FIG. It is wound around the take-up core 58.

  The direction in which the resin sheet 32 is peeled from the metal sheet 34 is preferably parallel to the direction in which the holes 25 formed in the metal sheet 34 extend (the other direction described above). When the resin sheet 32 is separated from the metal sheet 34 along such a direction, the gap between the hole 25 and the hole 25 of the metal sheet 34 is cut, or the gap between the hole 25 and the hole 25 is cut. It is possible to effectively prevent the portion extending linearly from becoming tangled.

  In this way, a metal sheet 34 having a large number of holes 25 is obtained, and is cut into a predetermined length by a cutting device (cutting means) 59, whereby a sheet-like vapor deposition mask 20 is obtained. . And the vapor deposition mask apparatus 10 is obtained by attaching the flame | frame 15 with respect to each vapor deposition mask 20. As shown in FIG. The frame 15 may be attached to one surface 20a of the vapor deposition mask 20 or may be attached to the other surface 20b of the vapor deposition mask 20.

  As described above, according to the present embodiment, processing is performed on the metal sheet 34 laminated on the resin sheet 32. Therefore, the metal sheet 34 can be etched only from the one surface 34 a side to form the hole 25 penetrating the metal sheet 34. In this case, although the hole 25 penetrates the metal sheet 34, the end of the hole 25 located on the other surface 34 b side of the metal sheet 34 is covered with the resin sheet 32. That is, since the hole 25 does not penetrate the laminated body 30, the conventional problems described above can be avoided, and as a result, the cross-sectional area gradually decreases from one surface 20a to the other surface 20b. The vapor deposition mask 20 in which the going holes 25 are formed can be obtained. Moreover, the vapor deposition mask 20 opened with a high-definition pattern can be produced with high accuracy. According to such a vapor deposition mask 20, vapor deposition with a high-definition pattern can be performed with high accuracy.

  Therefore, the vapor deposition mask 20 obtained in this manner is a vapor deposition mask (metal for vapor deposition) used for patterning, for example, an organic light emitting material on the glass substrate 42 in a desired pattern when manufacturing an organic EL display device. Very suitable for mask).

  Further, according to the present embodiment, the tension (pulling force) acting on the metal sheet 34 in the laminated body 30 during the conveyance after forming the holes 25 is remarkably reduced, and the holes 25 of the metal sheet 34 are thereby reduced. Generation of stress acting to cut the gap between the hole 25 and the metal sheet 34, and stress acting to entangle the portion extending linearly between the hole 25 and the hole 25 of the metal sheet 34. Can be reduced. Therefore, it is possible to prevent the holes formed in the deposition mask 20 with high accuracy from being damaged in the subsequent process.

  Further, according to the present embodiment, in the step of supplying the laminated body 30, the wound body 29 around which the laminated body 30 is wound is rewound to supply the laminated body 30 extending in a strip shape. Such a wound body 29 is available at a low cost and is very convenient for handling.

  Various modifications can be made to the above-described embodiment within the scope of the present invention. Hereinafter, an example of a modification will be described.

  In the above-described embodiment, an example in which the resin sheet 32 is irradiated with UV light and the resin sheet 32 is removed from the laminate 30 has been described, but the method of removing the resin sheet 32 is not limited thereto. . For example, the laminate 30 may be sent to a heating furnace (removing means), and the resin sheet 32 of the laminate 30 may be burned to remove the resin sheet 32 from the laminate 30. When the resin sheet 32 is removed by burning, the metal sheet 34 is removed from the metal sheet 34 (deposition mask 20) without affecting the holes 25 by a simple method using a simple apparatus. The resin sheet 32 can be separated. In addition, when removing the resin sheet 32 by burning, it is not necessary to use the resin sheet 32 in which the bonding force to the metal sheet 34 is reduced by being irradiated with UV light.

  Moreover, in embodiment mentioned above, although the example which prepares and supplies the laminated body 30 by which the resin-made sheets 32 and the metal sheets 34 were laminated | stacked previously was shown, it is not restricted to this. For example, the metal sheet 34 extending in a strip shape and the resin sheet 32 extending in a strip shape are supplied, and the supplied metal sheet 34 and the resin sheet 32 are joined to produce the laminated body 30, which are sequentially manufactured. You may make it perform the process mentioned above with respect to the laminated body 30 done. Alternatively, the metal sheet 34 extending in a strip shape is supplied and the sheet-like resin sheet 32 is laminated on the supplied metal sheet 34, and the sheet-like resin sheet 32 of the metal sheets 34 is attached. You may make it perform the process mentioned above sequentially about the laminated | stacked part (laminated body 30). Alternatively, a sheet-like metal sheet 34 is laminated on the resin sheet 34 by supplying the resin sheet 32 extending in a belt shape and laminating the sheet-like metal sheet 34 on the supplied resin sheet 32. You may make it perform the process mentioned above sequentially on the part (laminated body 30) in which 34 was laminated | stacked.

  Further, in the above-described embodiment, after the holes 25 are formed in the metal sheet 34 and the resin sheet 32 is separated from the metal sheet 34, the metal sheet 34 is cut to a predetermined length by the cutting device 59. Although the example which cut | disconnects was shown in (1), it is not restricted to this. For example, the step of cutting the metal sheet 34 may be performed before the holes 25 are formed in the metal sheet 34, and further, after the holes 25 are formed in the metal sheet 34, the resin sheet. It may be performed before separating 32 from the metal sheet 34. When the metal sheet 34 is cut to a predetermined length before the resin sheet 32 is separated from the metal sheet 34, the laminate 30 is half-cut so that the resin sheet 32 cannot be cut completely. Only the sheet 34 may be cut, or the entire laminate 30 including the metal sheet 34 may be cut to a predetermined length. Further, during the step of forming the holes 25 by etching, the metal sheet 34 may be etched so as to be cut to a predetermined length. That is, when the hole 25 is formed by etching, the metal sheet 34 may be separated into a predetermined length by etching. In this case, the trouble of separately cutting the metal sheet 34 into a predetermined length can be saved, and the vapor deposition mask 20 can be manufactured at high cost with high production efficiency.

  Furthermore, although the example which cut | disconnects the vapor deposition mask 20 in predetermined length was shown in embodiment mentioned above, it is not restricted to this. You may make it handle the metal sheet 34 in which many holes 25 were formed as the sheet-like member 18 for vapor deposition masks, without cut | disconnecting. For example, as shown in FIG. 10, a vapor deposition mask sheet-like member 18 made of a metal sheet 34 having a large number of holes 25 is wound around a take-up core 19 without cutting, and the vapor deposition mask sheet-like shape is obtained. You may make it handle (shipment etc.) as the wound body 18a of the member 18. FIG. In addition, the sheet-like member 18 for vapor deposition masks is also a protection object of this case.

  Furthermore, although the example which attaches the flame | frame 15 with respect to the vapor deposition mask 20 cut | disconnected by predetermined length was shown in embodiment mentioned above, it is not restricted to this. For example, the frame 15 may be attached to the metal sheet 34 after the resin sheet 34 is removed and before being cut into a predetermined length. Alternatively, the frame 15 may be attached to the metal sheet 34 after the holes 25 are formed and before the resin sheet 34 is removed.

FIG. 1 is a diagram showing an embodiment of a vapor deposition mask and a vapor deposition mask apparatus according to the present invention. FIG. 2 is a view for explaining a method of vapor deposition using the vapor deposition mask and vapor deposition mask apparatus shown in FIG. FIG. 3 is a partial plan view showing the vapor deposition mask shown in FIG. FIG. 4 is a cross-sectional view taken along a line IV-IV in FIG. FIG. 5 is a diagram for explaining the operation of the vapor deposition mask. FIG. 6 is a diagram for explaining an embodiment of a method for manufacturing a vapor deposition mask and a method for manufacturing a vapor deposition mask device according to the present invention. FIG. 7 is a diagram for explaining a method of forming a resist pattern on a laminate (metal sheet). FIG. 8 is a diagram for explaining a method of etching a laminate (metal sheet). FIG. 9 is a view for explaining a method of removing a resin sheet from a laminate. FIG. 10 is a view corresponding to FIG. 6 and is a view for explaining a method of manufacturing a vapor deposition mask sheet-like member. FIG. 11 is a view corresponding to FIG. 5 for explaining a method of vapor deposition using a vapor deposition mask made of a metal plate etched from both sides. FIG. 12 is a view corresponding to FIG. 8 and is a view for explaining a method of manufacturing a deposition mask by etching a metal plate from the lower surface.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Deposition mask apparatus 15 Frame 18 Deposition mask sheet-like member 20 Deposition mask 20a One surface 20b The other surface 22 Perforated region 23 Non-perforated region 25 Hole 29 Roll body 30 Laminated body 32 Resin sheet 34 Metal sheet L Straight line θ angle

Claims (25)

Supplying a laminate having a resin sheet and a metal sheet laminated on the resin sheet;
Etching the supplied laminate to form a number of holes in the metal sheet; and
And a step of removing the resin sheet from the laminated body after the etching step. In the step of etching the stacked body, a plurality of holes arranged side by side along one direction, each of which extends along another direction orthogonal to the one direction, are formed. The manufacturing method of the vapor deposition mask of Claim 1 to do. The method for producing a vapor deposition mask according to claim 2, wherein, in the step of removing the resin sheet, the metal sheet and the resin sheet are separated along the other direction. The said laminated body is supplied along the said other direction, The manufacturing method of the vapor deposition mask of Claim 2 or 3 characterized by the above-mentioned. In the step of etching the laminated body, a plurality of perforated regions in which a plurality of holes are arranged in a predetermined pattern are formed on a metal sheet, and thereby a multi-sided deposition mask is manufactured. The manufacturing method of the vapor deposition mask as described in any one of Claims 1 thru | or 4. In the step of supplying the laminate, a laminate including a resin sheet that is adapted to reduce the bonding force to the metal sheet when irradiated with UV light is supplied.
6. The step of removing the resin sheet, wherein the resin sheet is irradiated with UV light to separate the metal sheet and the resin sheet. The manufacturing method of the vapor deposition mask of description. The vapor deposition according to any one of claims 1 to 6, wherein, in the step of supplying the laminated body, the wound body around which the laminated body is wound is rewound to supply a laminated body extending in a band shape. Mask manufacturing method. A vapor deposition mask manufactured by the manufacturing method according to any one of claims 1 to 7,
A vapor deposition mask, wherein a cross-sectional area of holes formed in the vapor deposition mask gradually decreases from one surface of the vapor deposition mask to the other surface. A vapor deposition mask manufactured by the manufacturing method according to any one of claims 1 to 7,
The vapor deposition mask and a fixed frame,
A vapor deposition mask apparatus, wherein a cross-sectional area of holes formed in the vapor deposition mask gradually decreases from one surface of the vapor deposition mask to the other surface. In a cross section perpendicular to the sheet surface of the vapor deposition mask, an angle formed by a straight line connecting the end on the one surface side and the end on the other surface side of the hole and the other surface is 60 °. The vapor deposition mask device according to claim 9, wherein: In a method of manufacturing a vapor deposition mask device comprising a vapor deposition mask and a frame fixed to the vapor deposition mask,
Supplying a laminate having a resin sheet and a metal sheet laminated on the resin sheet;
Etching the supplied laminate to form a number of holes in the metal sheet; and
After the etching step, attaching the frame to the metal sheet of the laminate,
And a step of removing the resin sheet from the laminate to which the frame is attached. In a method of manufacturing a vapor deposition mask device comprising a vapor deposition mask and a frame fixed to the vapor deposition mask,
Supplying a laminate having a resin sheet and a metal sheet laminated on the resin sheet;
Etching the supplied laminate to form a number of holes in the metal sheet; and
After the etching step, removing the resin sheet from the laminate,
And a step of attaching the frame to the metal sheet after removing the resin sheet. In the step of etching the laminated body, a plurality of holes arranged side by side along one direction, each of which extends along another direction orthogonal to the one direction, are formed. The manufacturing method of the vapor deposition mask apparatus of Claim 11 or 12. The method of manufacturing a vapor deposition mask device according to claim 13, wherein in the step of removing the resin sheet, the metal sheet and the resin sheet are separated along the other direction. The method of manufacturing a vapor deposition mask device according to claim 13, wherein the stacked body is supplied along the other direction. In the step of etching the laminate, a plurality of perforated regions in which a plurality of holes are arranged in a predetermined pattern are formed in a metal sheet, thereby producing a multi-sided deposition mask arrangement. The manufacturing method of the vapor deposition mask apparatus as described in any one of Claim 11 thru | or 15. In the step of supplying the laminate, a laminate including a resin sheet that is adapted to reduce the bonding force to the metal sheet when irradiated with UV light is supplied.
The vapor deposition according to any one of claims 11 to 16, wherein in the step of removing the resin sheet, the adhesive layer is irradiated with UV light to separate the metal sheet and the resin sheet. Manufacturing method of mask device. 18. The vapor deposition according to claim 11, wherein, in the step of supplying the laminated body, the wound body around which the laminated body is wound is rewound to supply a laminated body extending in a band shape. Manufacturing method of mask device. In the method for producing a sheet-like member for a vapor deposition mask for producing a sheet-like member used for a vapor deposition mask in which a large number of holes are formed,
Supplying a laminate having a resin sheet and a metal sheet laminated on the resin sheet;
Etching the supplied laminate to form a number of holes in the metal sheet; and
And a step of removing the resin sheet from the laminated body after the etching step. In the step of etching the laminated body, a plurality of holes arranged side by side along one direction, each of which extends along another direction orthogonal to the one direction, are formed. The manufacturing method of the sheet-like member for vapor deposition masks of Claim 19. The method for producing a sheet-like member for a vapor deposition mask according to claim 20, wherein, in the step of removing the resin sheet, the metal sheet and the resin sheet are separated along the other direction. . The said laminated body is supplied along the said other direction, The manufacturing method of the sheet-like member for vapor deposition masks of Claim 20 or 21 characterized by the above-mentioned. In the step of etching the laminated body, a plurality of perforated regions in which a plurality of holes are arranged in a predetermined pattern are formed in a metal sheet, thereby producing a sheet-like member used for a vapor deposition mask that can be attached to multiple surfaces. The method for producing a sheet-like member for a vapor deposition mask according to any one of claims 19 to 22. In the step of supplying the laminate, a laminate including a resin sheet that is adapted to reduce the bonding force to the metal sheet when irradiated with UV light is supplied.
24. The vapor deposition according to any one of claims 19 to 23, wherein, in the step of removing the resin sheet, the adhesive layer is irradiated with UV light to separate the metal sheet and the resin sheet. A method for producing a sheet-like member for a mask. 25. The vapor deposition according to any one of claims 19 to 24, wherein, in the step of supplying the laminate, the roll wound around the laminate is rewound to supply a laminate extending in a band shape. A method for producing a mask-like member.

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