JPS6379958A - Mask for vapor deposition and its production - Google Patents
Mask for vapor deposition and its productionInfo
- Publication number
- JPS6379958A JPS6379958A JP22441586A JP22441586A JPS6379958A JP S6379958 A JPS6379958 A JP S6379958A JP 22441586 A JP22441586 A JP 22441586A JP 22441586 A JP22441586 A JP 22441586A JP S6379958 A JPS6379958 A JP S6379958A
- Authority
- JP
- Japan
- Prior art keywords
- vapor deposition
- resist
- mask
- sheet
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007740 vapor deposition Methods 0.000 title claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 239000002184 metal Substances 0.000 claims abstract description 36
- 229910052751 metal Inorganic materials 0.000 claims abstract description 36
- 238000013007 heat curing Methods 0.000 claims abstract description 4
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 4
- 229910052802 copper Inorganic materials 0.000 claims abstract description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 3
- 239000010935 stainless steel Substances 0.000 claims abstract description 3
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 238000003825 pressing Methods 0.000 abstract description 2
- 238000003754 machining Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 10
- 238000005530 etching Methods 0.000 description 8
- 230000008020 evaporation Effects 0.000 description 7
- 238000001704 evaporation Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- QZPSXPBJTPJTSZ-UHFFFAOYSA-N aqua regia Chemical compound Cl.O[N+]([O-])=O QZPSXPBJTPJTSZ-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は開口部にテーバを有し、がっ、大面積化が容易
である蒸着用マスクとその製造法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an evaporation mask having a tapered opening and which can easily be made to have a large area, and a method for manufacturing the same.
従来の技術
ここで言う蒸着用マスクとは、基板上の所定の部分のみ
に金属などからなる蒸着膜を形成するために用いる、基
板と蒸発源との間に置く平板状のマスクのことである。2. Description of the Related Art The evaporation mask referred to here refers to a flat mask placed between the substrate and the evaporation source, which is used to form a evaporation film made of metal or the like only on a predetermined portion of the substrate. .
この蒸着用マスクの製造法として、従来より行われてい
るのは、主にエツチング法である。The etching method has traditionally been used as a manufacturing method for this vapor deposition mask.
エツチング法は、金属板上に耐食性皮膜をフォトグラフ
ィー的な手法で所定のパターンにて形成し、金属板を腐
食させる化学薬品に接触させることにより、耐食性皮膜
のない部分に穴を開ける方法である。片方の面から腐食
させる方法と両面から腐食させる方法とがある。The etching method is a method in which a corrosion-resistant film is formed in a predetermined pattern on a metal plate using a photographic method, and then holes are made in areas where there is no corrosion-resistant film by contacting the metal plate with chemicals that corrode it. . There are two methods: corroding from one side and corroding from both sides.
発明が解決しようとする問題点
基板上に蒸着膜をｌ０ＸＩＯμ耐程度の矩形パターンで
形成したい場合がある。このとき蒸着用マスクとしては
勿論同じ大きさの微細な開口の穴を持ったものが必要と
なる。しかしながら、エツチング法では、１０μｍのパ
ターンを得るには、基板の厚さを少なくとも１０μｍ以
下にしなければならず、製造工程上および使用する上に
おいて取り扱いが繁雑になる。Problems to be Solved by the Invention There are cases where it is desired to form a vapor deposited film on a substrate in a rectangular pattern with a resistance of about 10×IOμ. At this time, a mask for vapor deposition that has fine openings of the same size is of course required. However, in the etching method, in order to obtain a pattern of 10 .mu.m, the thickness of the substrate must be at least 10 .mu.m or less, which makes handling difficult in the manufacturing process and in use.
また、基板上にある材料を島状に蒸着し、さらに他の材
料を島状領域内に積層したい場合があるが、このときに
は、第４図（ａｌに示すように蒸着マスク９の開口部が
テーパになっているものの方が（ｂｌのようにテーパに
なっていないものの方より蒸発源１０の位置によって蒸
着角の差をつけ易いので有用である。しかしながら、エ
ツチング法によっては満足のゆくテーパを得ることはで
きない。In addition, there are cases where it is desired to deposit a material on the substrate in an island shape and further laminate another material within the island region, but in this case, as shown in FIG. A tapered one is more useful than a non-tapered one (like BL) because it is easier to vary the evaporation angle depending on the position of the evaporation source 10. However, depending on the etching method, it is not possible to obtain a satisfactory taper. You can't get it.
問題点を解決するための手段
前記問題点を解決するために本発明の蒸着用マスクとそ
の製造法は、所定の開口部を有する金属板の一方の面に
ポジタイプのフィルムレジストを貼り付け、その反対面
側から露光し、その後、現像、加熱硬化の工程を経るも
のである。Means for Solving the Problems In order to solve the above-mentioned problems, the vapor deposition mask of the present invention and its manufacturing method are such that a positive type film resist is pasted on one side of a metal plate having a predetermined opening, and It is exposed to light from the opposite side, and then undergoes the steps of development and heat curing.
作用
本発明は前記した構成をなすが、まず金属板をエツチン
グ法やレーザーによって加工し、所定のパターンに穴開
けする。その後、ポジタイプのフィルムレジストを金属
板の一方の面に貼り付け、金属板側から露光し、その後
、現像、加熱硬化する。この製法により開口部にテーパ
を有するマスクを得ることができる。さらに、レジスト
側に金属蒸着することにより強度を持たせることも可能
である。Function The present invention has the above-described structure, but first, a metal plate is processed by etching or laser, and holes are made in a predetermined pattern. Thereafter, a positive type film resist is attached to one side of the metal plate, exposed to light from the metal plate side, and then developed and heated to harden. By this manufacturing method, a mask having a tapered opening can be obtained. Furthermore, it is also possible to provide strength by depositing metal on the resist side.
実施例
以下、本発明の代表的な一実施例について、図面を参照
しながら説明する。EXAMPLE Hereinafter, a typical example of the present invention will be described with reference to the drawings.
実施例１
第１図（ａｌは本発明の実施例の蒸着用マスクの構成断
面図、第１図（ト））は平面図を示す図である。第１図
（ａｌにおいて１は金属板、２はポジタイプのフィルム
レジスト、３は金属膜であり、第１図（ａｌおよび（ｂ
ｌにおいて、４は開口部を示す。マスクの製造工程を第
２図に示す。ｔａ＞金属板１にレーザー加工により所望
のパターンの穴を開ける。（ｂｌ金属板１にポジタイプ
のフィルムレジスト２を加熱圧着する。（Ｃｌフィルム
レジスト２の下に、反射板５を置き、金属板側から露光
する。この際、露光時間は十分に長（する。（ｄｌ現像
し、加熱硬化させる。Embodiment 1 FIG. 1 (Al is a cross-sectional view of the configuration of a vapor deposition mask according to an embodiment of the present invention, and FIG. 1 (G)) is a diagram showing a plan view. In Figure 1 (al), 1 is a metal plate, 2 is a positive film resist, and 3 is a metal film.
In 1, 4 indicates an opening. The manufacturing process of the mask is shown in FIG. ta> Holes with a desired pattern are made in the metal plate 1 by laser processing. (The positive type film resist 2 is heat-pressed onto the BL metal plate 1. (The reflective plate 5 is placed under the Cl film resist 2 and exposed from the metal plate side. At this time, the exposure time is sufficiently long.) (DL developed and heat cured.
（Ｃｌフィルムレジスト２の上に金属膜３を蒸着形成す
る。金属板１はニッケル（Ｎｉ）、チタン（Ｔｉ）。(A metal film 3 is formed by vapor deposition on the Cl film resist 2. The metal plate 1 is made of nickel (Ni) and titanium (Ti).
銅（Ｃｕ）、ステンレス、アルミニウム（Ａｊり等、金
属膜３はニッケル（Ｎｉ）、クロム（ＣｒＬアルミニウ
ム（Ａβ）等からそれぞれ形成されている。以上のよう
な製造法により開口部に段差状のテーパを有する蒸着用
マスクを得ることが可能である。The metal film 3 is made of nickel (Ni), chromium (CrL), aluminum (Aβ), etc. by copper (Cu), stainless steel, aluminum (Aj), etc. By the above manufacturing method, a step-like shape is formed in the opening. It is possible to obtain a vapor deposition mask with a taper.
実施例２
本発明の実施例はエツチング法を用いて金属板を加工す
る製造法である。マスクの構成は、第１図に示した実施
例１の構成と同様である。第３図は製造工程を示す。第
３図（ａｌ金属板１に感光剤６を塗布する。第３図中）
感光剤６の上に、所望のパターンが形成されたガラス乾
板７を置き、露光する。第３図（Ｃ１現像し、加熱硬化
させる。第３図（ｄｌ金属板１をエツチング液（主に王
水）に接触させて感光剤６のない部分に穴を開ける。第
３図（８）感光剤６を剥離させる。以下、第２図の（ｂ
ｌから（ｅ）の工程を経てマスクを製作する。金属板１
および金属膜３の材質は実施例１と同様のものが可能で
ある。Example 2 An example of the present invention is a manufacturing method in which a metal plate is processed using an etching method. The structure of the mask is similar to that of Example 1 shown in FIG. FIG. 3 shows the manufacturing process. Figure 3 (Applying photosensitive agent 6 to Al metal plate 1. In Figure 3)
A glass dry plate 7 on which a desired pattern has been formed is placed on the photosensitive agent 6 and exposed. Figure 3 (C1 is developed and cured by heating. Figure 3 (dl) The metal plate 1 is brought into contact with an etching solution (mainly aqua regia) and holes are made in the areas where the photosensitive agent 6 is not present. Figure 3 (8) The photosensitive agent 6 is peeled off.Hereafter, (b) in FIG.
A mask is manufactured through steps 1 to (e). metal plate 1
The material of the metal film 3 can be the same as in the first embodiment.
実施例１および２においては金属膜３を蒸着したが、こ
の工程を省略してもマスクとして使用できる。また、金
属板１および金属膜３の少なくとも一方が磁性金属であ
れば、このマスクを蒸着の際使用するとき、磁石によっ
て固定することができる。In Examples 1 and 2, the metal film 3 was deposited, but it can be used as a mask even if this step is omitted. Further, if at least one of the metal plate 1 and the metal film 3 is a magnetic metal, the mask can be fixed with a magnet when used for vapor deposition.
発明の効果
以上のように本発明の蒸着用マスクは、あらかじめエツ
チング法またはレーザー加工により穴開けした金属板に
ポジタイプのフィルムレジストを加熱圧着し、金属板側
から露光し、その後、現像。Effects of the Invention As described above, the vapor deposition mask of the present invention is produced by heat-pressing a positive type film resist onto a metal plate that has been previously drilled by etching or laser processing, exposing it to light from the metal plate side, and then developing it.
加熱硬化過程を経て、先に加工した穴に重なる位置のフ
ィルムレジストに加工精度の良い開口部を得ることがで
きる。この製法により、たとえば、面積がｌ０ＸＩＯμ
ｄの開口部に段差状のテーバを設けた蒸着マスクを得る
ことが可能である。Through the heat curing process, openings with high processing accuracy can be obtained in the film resist at positions overlapping the holes previously processed. With this manufacturing method, for example, the area is 10XIOμ
It is possible to obtain a vapor deposition mask in which a step-like taper is provided at the opening d.
第１図＋ａｌは本発明の一実施例１および一実施例用マ
スクの製造工程図、第３図（ａｌ 、 （ｂｌ 、 （
ｃ） 、 （ｄｌ 。
（ｅｌは本発明による一実施例１の蒸着用マスクの製造
工程図、第４図（ａ）は本発明の蒸着用マスクの使用状
態の説明図、第４図山）は従来例の蒸着用マスクの使用
状態の説明図である。
１・・・・・・金属板、２・・・・・・フィルムレジス
ト、３・・・・・・金属膜、４・・・・・・開口部、５
・・・・・・反射板、６・・・・・・感光剤、７・・・
・・・ガラス乾板、８・・・・・・基板、９・・・・・
・蒸着マスク、１０・・・・・・蒸発源。
代理人の氏名 弁理士 中尾敏男 はか１名／ −一一
盆Ａ版
２−フィルムレジスト
３− 金属膜
第１図 ４−間Ｔ３部
第２図
５−反射板
（ｄ−） ［面コ５ジ５
第３図 ６−お光音Ｉ
７−六゛ラス契ｌ又
乙
（ｅ）［…ｍ
第４図Figure 1+al is a manufacturing process diagram of Example 1 of the present invention and a mask for the example, and Figure 3 (al, (bl, (
c) , (dl. (el is a manufacturing process diagram of the vapor deposition mask of Example 1 according to the present invention, FIG. 4 (a) is an explanatory diagram of the usage state of the vapor deposition mask of the present invention, and the figure 4 is the top) 1 is an explanatory diagram of the usage state of a conventional vapor deposition mask. 1...Metal plate, 2...Film resist, 3...Metal film, 4... ...opening, 5
...Reflector, 6...Photosensitizer, 7...
...Glass dry plate, 8...Substrate, 9...
- Vapor deposition mask, 10... Evaporation source. Name of agent Patent attorney Toshio Nakao 1 person / -11 Bon A version 2-Film resist 3-Metal film Figure 1 4-T3 section Figure 2 5-Reflector plate (d-) [Surface 5 5 Figure 3 6-Omitsune I 7-Roku rasu lmata Otsu (e) […m Figure 4
Claims (4)
イプのフィルムレジストを密着させた構造を有すること
を特徴とする蒸着用マスク。(1) A vapor deposition mask characterized by having a structure in which a positive type film resist is adhered to one side of a metal plate having a predetermined opening.
方に金属層が蒸着形成されていることを特徴とする特許
請求の範囲第（１）項記載の蒸着用マスク。(2) The vapor deposition mask according to claim (1), wherein a metal layer is formed by vapor deposition on at least one of a metal plate and a film resist.
（Ｃｕ）、ステンレス、アルミニウム（Ａｌ）の何れか
からなることを特徴とする特許請求の範囲第（１）項ま
たは第（２）項の何れかに記載の蒸着用マスク。(3) Claim (1) or (2) characterized in that the metal plate is made of nickel (Ni), titanium (Ti), copper (Cu), stainless steel, or aluminum (Al). ) The vapor deposition mask described in any of the above items.
イプのフィルムレジストを貼り付け、その反対面側から
露光し、その後、現像、加熱硬化の工程を経ることを特
徴とする蒸着用マスクの製造法。(4) A vapor deposition mask characterized by pasting a positive type film resist on one side of a metal plate having a predetermined opening, exposing it to light from the opposite side, and then going through the steps of development and heat curing. manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22441586A JPS6379958A (en) | 1986-09-22 | 1986-09-22 | Mask for vapor deposition and its production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22441586A JPS6379958A (en) | 1986-09-22 | 1986-09-22 | Mask for vapor deposition and its production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6379958A true JPS6379958A (en) | 1988-04-09 |
Family
ID=16813415
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22441586A Pending JPS6379958A (en) | 1986-09-22 | 1986-09-22 | Mask for vapor deposition and its production |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6379958A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6430354U (en) * | 1987-08-18 | 1989-02-23 | ||
| JP2014201819A (en) * | 2013-04-09 | 2014-10-27 | 株式会社ブイ・テクノロジー | Vapor deposition mask and production method of vapor deposition mask |
| US20170107605A1 (en) * | 2015-10-16 | 2017-04-20 | Samsung Display Co., Ltd. | Mask and method of manufacturing the mask |
-
1986
- 1986-09-22 JP JP22441586A patent/JPS6379958A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6430354U (en) * | 1987-08-18 | 1989-02-23 | ||
| JP2014201819A (en) * | 2013-04-09 | 2014-10-27 | 株式会社ブイ・テクノロジー | Vapor deposition mask and production method of vapor deposition mask |
| US20170107605A1 (en) * | 2015-10-16 | 2017-04-20 | Samsung Display Co., Ltd. | Mask and method of manufacturing the mask |
| KR20170045439A (en) * | 2015-10-16 | 2017-04-27 | 삼성디스플레이 주식회사 | Method for manufacturing mask |
| US10287669B2 (en) * | 2015-10-16 | 2019-05-14 | Samsung Display Co., Ltd. | Mask and method of manufacturing the mask |
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