JPH0313304B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a thin film forming mask used when attaching a predetermined thin film pattern to a substrate by thin film forming techniques such as vapor deposition or sputtering.

When a thin film pattern having a predetermined shape is attached to a substrate surface by a thin film forming technique such as vapor deposition or sputtering, a plate-shaped mask having a predetermined hole shape is used.

Conventionally, masks having holes of a predetermined shape have generally been made by pressing a metal plate or etching the metal plate using a photo-etching technique. However, in press working, it is almost impossible to process minute and complicated hole shapes, while in corrosion removal processing of metal plates, it is easier to process complicated hole shapes compared to press working, but the hole shape The dimensional accuracy is generally about ±10% of the thickness of the metal plate, for example, when using a metal plate with a thickness of 0.1 mm, the dimensional accuracy is ±10 μm.
Therefore, it was not possible to sufficiently meet the demand for fine and high pattern alignment accuracy.
Furthermore, when such a metal plate is subjected to corrosion removal processing, the minimum dimension of the hole shape is generally approximately the same as the thickness of the metal plate, and it is almost impossible to form pattern holes with dimensions smaller than the thickness of the metal plate. Therefore, in order to form fine patterns, the mask must be made thinner. However, simply making the mask thinner is difficult in terms of strength, and the thinner the mask becomes, the more the mask becomes warped and its shape and dimensions become distorted.

As a mask to solve these drawbacks mentioned above, a pattern of holes 2 is formed in a thin plate 1 as shown in FIG.
A mask having a two-layer structure has already been considered, in which a reinforcing material 4 is provided integrally with the thin plate 1 in a portion of the thin plate 1 excluding the hole 2 and the opening 3 around it. According to the conventional mask shown in Figure 1, the thickness of the thin plate on which the patterned holes are formed can be made much thinner than the thickness of the conventional single-layer metal plate, and it is also equipped with a reinforcing material. Therefore, the above-mentioned conventional drawbacks of the one-piece metal plate can be solved.

However, when trying to form a predetermined pattern shape through a mask by vapor deposition or sputtering,
The mask temperature naturally increases due to the collision of heated particles. Furthermore, if the thin film is formed by heating the substrate to 300° C. to 400° C. in order to increase the adhesion strength of the thin film to the substrate, the mask may also be heated to several hundred degrees Celsius under the influence of the heating. In such a case, in a mask with a two-layer structure as shown in Fig. 1, the thin plate 1 and the reinforcing material 4
Since the materials are different from each other, new practical problems arise such as the size and shape of the holes 2 in the pattern formed in the thin plate 1 changing or warping occurring in the mask itself due to the difference in their thermal expansion coefficients.

The purpose of the present invention is to solve the conventional problems.
A thin plate for forming pattern holes that determine the shape of a pattern to be formed on a thin film on a substrate is made as thin as possible to form a pattern film with high precision and minute dimensions on the substrate, and at the same time realizing fine and highly accurate pattern hole processing in the thin plate, Moreover, it is an object of the present invention to provide a method for manufacturing a thin film forming mask that is strong in strength, has relatively little thermal deformation, and can withstand practical use.

That is, in order to achieve the above object, the present invention has the following features:
A thin plate with patterned holes is deposited, sputtered, vapor-phase grown,
The reinforcing material is formed by either liquid phase growth or plating, and the pattern hole and its surrounding area are removed by etching, and the pattern hole is formed in the thin plate approximately at the center of the removed portion by energy beam processing. 1 is a method of manufacturing a mask for forming a thin film, characterized in that the mask is formed by a method of manufacturing a mask for forming a thin film;

The present invention will be specifically described below with reference to the embodiments shown in FIGS. 2 and 3.

FIG. 2 shows a cross-sectional view of a mask for forming a thin film according to the present invention, and shows an example in which the reinforcing material portion has a two-layer structure. In the figure, a thin plate 1 is provided with a pattern of holes 2, a reinforcing member 4 is provided integrally with the thin plate 1, and the patterned hole portion 2 of the thin plate 1 of the reinforcing material and its surroundings are removed. This forms an opening 3. The reinforcing material 4 is a reinforcing thin plate 5, 6
It is integrally constructed of plywood.
The reinforcing thin plate 5 is made of a different material from the thin plate 1 so that selective etching is possible. The reinforcing thin plate 6 is
Although the material is different from the reinforcing thin plate 5, the thin plate 1
It doesn't matter if the material is the same or different. Further, the number of laminated reinforcing thin plates 5 and 6 constituting the reinforcing material 4 is not limited to two layers. The thickness of the thin plate 1 and the reinforcing material 4 is determined by various factors such as the size and precision of the pattern holes 2, the size of the mask, and the handling conditions of the mask.

Next, a method of manufacturing such a mask for forming a thin film will be explained.

A thin plate 1 is placed on one side of a reinforcing material 4 having a plywood structure in which reinforcing thin plates 5 and 6 are laminated and integrated by a thin film forming technique such as vapor deposition, sputtering, or plating, a thin plate pressure welding technique, or a combination of the two. form. The thin plate 1 is formed by vapor deposition, sputtering,
Any of vapor phase growth, liquid phase growth, plating, etc. is possible. A method of forming pattern holes by etching will be explained.

When the reinforcing material 4 has a two-layer structure as shown in FIG. 2, and the thin plate 1 and the reinforcing thin plate 6 are made of the same material,
First, photoresist is applied to both sides of the mask, and by exposure and development, a predetermined pattern shape is formed on the thin plate 1 side, and the pattern shape is centered on the reinforcing thin plate 6 side, and is slightly larger than the pattern. form the opening shape. Next, the holes 2 and openings in the pattern are etched using a certain etching solution that has the highest etching speed for the thin plate 1, the reinforcing thin plate 6, the reinforcing thin plate 5, and the photoresist. Open part of 3. Next, the opening 3 in the portion of the reinforcing thin plate 6 is etched using an etching liquid that has the highest etching speed for the thin reinforcing plate 5 and has a slow etching speed for the thin plate 1, the thin reinforcing plate 6, and the photoresist. Remove by etching.

In addition, as another mask manufacturing method different from the method described above, the surface of the thin plate 1 is entirely masked with a photoresist, the reinforcing thin plates are sequentially removed from the reinforcing material side, and the opening 3 is opened, and finally, It is also possible to provide a pattern of holes in the center of the thin plate 1 in the opening 3 by techniques such as etching, laser processing, electron beam processing, etc.

Alternatively, the pattern holes 2 can be formed in the thin plate 1 first, and the openings 3 can be formed in the reinforcing material 4 later. In this case as well, if necessary, after forming the pattern holes 2, the entire surface of the thin plate 1 may be coated with photoresist for masking, and then the openings 3 may be formed.

Another method for providing the openings 3 in the reinforcing material 4 is to form an oxide film pattern on the surface of the reinforcing material instead of the above-mentioned resist pattern and then etching it.

So far, we have only talked about one pattern hole, but when actually forming a thin film pattern,
In consideration of production efficiency, many patterns are often provided on one mask. FIG. 3 shows an example of such a case. The repetition period l is determined by the accuracy of the resist film or the accuracy of laser processing or electron beam processing. Further, all the pattern holes in one mask may have the same shape, and depending on the purpose, it is also possible to include shapes of numerical values.

As described above, according to the present invention, the thin plate that forms the pattern holes that determine the shape of the pattern to be formed on the thin film on the substrate is made as thin as possible to form a pattern film with high precision and fine dimensions on the substrate, and at the same time, it is possible to form the thin plate with fine dimensions on the thin plate. In addition, it is possible to obtain a mask for forming a thin film that can realize highly accurate pattern hole machining, is strong in strength, has relatively little thermal deformation, and can withstand practical use.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing a conventional embodiment, FIG. 2 is a sectional view showing an embodiment of the present invention, and FIG. 3 is a sectional view showing another embodiment of a mask processed at a repetition period l. . 1... Thin plate, 2... Pattern hole, 3... Opening, 4... Reinforcement material, 5, 6... Thin plate for reinforcement.

Claims (1)

[Claims] 1. A thin plate with patterned holes is formed on one side of a reinforcing material with a plywood structure made by laminating and integrating multiple reinforcing thin plates of different materials by vapor deposition, sputtering, vapor phase growth, liquid phase growth, or plating. death,
Thin film formation characterized in that the pattern hole and its surrounding area are removed from the reinforcing material by etching, and the pattern hole is formed in the thin plate approximately at the center of the removed portion by energy beam processing. Method of manufacturing masks for use.