CN112038503A - Display panel mother board and manufacturing method thereof, display panel and display device - Google Patents
Display panel mother board and manufacturing method thereof, display panel and display device Download PDFInfo
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- CN112038503A CN112038503A CN202010996760.8A CN202010996760A CN112038503A CN 112038503 A CN112038503 A CN 112038503A CN 202010996760 A CN202010996760 A CN 202010996760A CN 112038503 A CN112038503 A CN 112038503A
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10K50/00—Organic light-emitting devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
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- H10K50/844—Encapsulations
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Abstract
The application provides a display panel mother board, a manufacturing method of the display panel mother board, a display panel and a display device. The display panel master comprises a plurality of display sub-substrates, wherein each display sub-substrate comprises a back plate and a touch layer positioned on one side of the back plate. The back plate comprises a substrate base plate and an organic layer, wherein the organic layer is positioned between the substrate base plate and the touch layer. The touch layer comprises an inorganic layer, and the inorganic layer is positioned on one side of the organic layer, which is far away from the substrate. Each display sub-substrate comprises a display area and a binding area positioned on at least one side of the display area, and in the binding area, the orthographic projection of the organic layer on the substrate and the orthographic projection of the inorganic layer on the substrate have no overlapping area. A cutting area is arranged between the adjacent display sub-substrates, and in the cutting area, the orthographic projection of the organic layer on the substrate and the orthographic projection of the inorganic layer on the substrate do not have an overlapping area; alternatively, the organic layer is coated with an inorganic layer. The structure avoids the pollution of inorganic layer peeling to the equipment cavity, can stop the possibility of binding failure, and improves the product performance.
Description
Technical Field
The application relates to the technical field of display, in particular to a display panel mother board, a manufacturing method thereof, a display panel and a display device.
Background
Organic Light Emitting Diode (OLED) is a third generation display technology following Liquid Crystal Display (LCD). The OLED display technology has the advantages of self-luminescence, wide viewing angle, almost infinite contrast, low power consumption, extremely high reaction speed and the like, and has very good market application prospect.
The Flexible multi-layer structure (FMLOC) technology has become a mainstream technology in the OLED display field due to its advantages of being light and thin, and at present, a touch structure can be designed by adopting a Flexible multi-layer structure (FMLOC) process for a display panel master mask, and the touch structure manufactured by the FMLOC process is located on an encapsulation layer of the OLED display panel and includes multiple inorganic layers.
However, the inventors found that after the FMLOC process is performed for multiple times of water washing, the cutting region (Dummy) between the panels has a problem of peeling off the inorganic layer above the organic layer, which causes contamination of the device chamber and yield loss; and the binding area (binding) has the problem that the organic layer absorbs water and swells, so that the binding is failed, and the display is abnormal.
Disclosure of Invention
In view of this, the present application provides a display panel master, a manufacturing method thereof, a display panel, and a display device, which are used to solve the technical problems in the prior art that an inorganic layer above an organic layer is peeled off in a cutting area, so that a device cavity is polluted, yield loss is caused, and a binding failure and abnormal display are caused in a binding area.
In order to solve the above problem, the embodiments of the present application mainly provide the following technical solutions:
in a first aspect, an embodiment of the present application discloses a display panel master, including a plurality of display sub-substrates, where the display sub-substrates include a backplane and a touch layer located on one side of the backplane;
the back plate comprises a substrate base plate and an organic layer, wherein the organic layer is positioned between the substrate base plate and the touch layer,
the touch layer comprises an inorganic layer, and the inorganic layer is positioned on one side of the organic layer, which is far away from the substrate;
each display sub-substrate comprises a display area and a binding area positioned on at least one side of the display area, and in the binding area, the orthographic projection of the organic layer on the substrate and the orthographic projection of the inorganic layer on the substrate have no overlapping area;
a cutting area is arranged between the adjacent display sub-substrates, and in the cutting area, the orthographic projection of the organic layer on the substrate and the orthographic projection of the inorganic layer on the substrate have no overlapping area; alternatively, the organic layer is coated with the inorganic layer.
Optionally, the touch layer includes a conductive layer on a side of the inorganic layer away from the substrate;
in the binding region, the orthographic projection of the organic layer on the substrate base plate and the orthographic projection of the conductive layer on the substrate base plate have no overlapping region.
Optionally, the touch layer comprises a conductive layer;
in the cutting area, when the organic layer is coated by the inorganic layer, the conductive layer is positioned on the side of the inorganic layer far away from the substrate base plate, and the orthographic projection of the conductive layer on the substrate base plate is overlapped with the orthographic projection of the inorganic layer on the substrate base plate.
Optionally, the touch layer comprises an organic protective layer;
the organic protective layer is positioned on one side of the conducting layer, which is far away from the substrate base plate, coats the inorganic layer and the conducting layer, and is arranged at a cutting position in a breaking mode.
Optionally, the touch layer comprises an organic protective layer;
in the cutting area, when the orthographic projection of the organic layer on the substrate base plate and the orthographic projection of the inorganic layer on the substrate base plate have no overlapping area, the organic protection layer is positioned on one side of the organic layer, which is far away from the substrate base plate, and is arranged in a breaking mode at the cutting position.
Optionally, the touch layer includes a bridge layer, a conductive layer, and an organic protective layer; the inorganic layer includes a first insulating layer and a second insulating layer;
in the display area, the backboard comprises a light-emitting layer positioned on one side of the substrate base plate and an encapsulation layer positioned on one side of the light-emitting layer far away from the substrate base plate;
the first insulating layer is positioned on one side, far away from the substrate, of the packaging layer;
the bridging layer is positioned on one side, far away from the packaging layer, of the first insulating layer;
the second insulating layer is positioned on one side, far away from the first insulating layer, of the bridging layer;
the conducting layer is positioned on one side, far away from the bridging layer, of the second insulating layer;
the organic protective layer is positioned on one side, far away from the second insulating layer, of the conducting layer and coats the conducting layer, the second insulating layer, the bridging layer and the first insulating layer.
In a second aspect, an embodiment of the present application discloses a display panel obtained by cutting the display panel master described in the first aspect.
In a third aspect, the present application discloses a display device, including the display panel of the second aspect.
In a fourth aspect, an embodiment of the present application discloses a method for manufacturing a display panel master in the first aspect, including:
providing a backboard, wherein the backboard comprises a substrate, and an organic layer is manufactured above the substrate;
manufacturing a touch layer on one side of the organic layer far away from the substrate base plate, wherein the touch layer comprises an inorganic layer; wherein: in the binding region, the orthographic projection of the organic layer on the substrate base plate and the orthographic projection of the inorganic layer on the substrate base plate have no overlapping region; and in the cutting area, the orthographic projection of the organic layer on the substrate has no overlapping area with the orthographic projection of the inorganic layer on the substrate; alternatively, the organic layer is coated with the inorganic layer.
Optionally, the manufacturing of the touch layer on the side of the organic layer away from the substrate includes:
sequentially manufacturing a first insulating layer, a bridging layer and a second insulating layer on one side of the organic layer far away from the substrate base plate through a composition process;
manufacturing a conducting layer on the second insulating layer through a composition process, wherein the conducting layer is located in the display area and the binding area, and in the binding area, the orthographic projection of the organic layer on the substrate base plate and the orthographic projection of the conducting layer on the substrate base plate are not overlapped;
etching the first insulating layer and the second insulating layer by a dry etching process so that the organic layer has no overlapping region with the first insulating layer and the second insulating layer in the binding region in the orthographic projection direction on the substrate; and in the cutting region, in an orthographic projection direction on the substrate, the organic layer has no overlapping region with the first insulating layer and the second insulating layer;
manufacturing an organic protective layer on the conductive layer through a composition process;
or the like, or, alternatively,
manufacturing a touch layer on one side of the organic layer far away from the substrate base plate, wherein the touch layer comprises:
sequentially manufacturing a first insulating layer, a bridging layer and a second insulating layer on one side of the organic layer far away from the substrate base plate through a composition process;
manufacturing a conducting layer on the second insulating layer through a composition process, wherein the conducting layer is located in the display area and the binding area, and in the binding area, the orthographic projection of the organic layer on the substrate base plate and the orthographic projection of the conducting layer on the substrate base plate are not overlapped; and in the cutting area, the conductive layer covers the organic layer;
etching the first insulating layer and the second insulating layer by a dry etching process so that the organic layer has no overlapping region with the first insulating layer and the second insulating layer in the binding region in the orthographic projection direction on the substrate; and in the cutting area, the organic layer is coated by the inorganic layer;
and manufacturing an organic protective layer on the conductive layer through a composition process.
By means of the technical scheme, the technical scheme provided by the embodiment of the application at least has the following advantages:
in the binding region of the display panel master mask, the orthographic projection of the organic layer on the substrate and the orthographic projection of the inorganic layer on the substrate do not have an overlapping region, so that the problem that the inorganic layer above the organic layer is peeled off to form binding failure due to water absorption and expansion of the organic layer after the inorganic layer is broken in the binding process is solved. In addition, in the cutting area, the orthographic projection of the organic layer on the substrate base plate and the orthographic projection of the inorganic layer on the substrate base plate have no overlapping area, so that the problem of peeling of the inorganic layer above the organic layer is avoided, the pollution to the equipment cavity is further avoided, and the product yield is improved; or, in the cutting area, the organic layer is coated by the inorganic layer, and at the moment, water vapor is difficult to enter the organic layer, so that the problem of peeling off of the inorganic layer above the organic layer is avoided, the pollution to the equipment cavity is further avoided, and the product yield is improved.
The foregoing description is only an overview of the technical solutions of the embodiments of the present application, and the embodiments of the present application can be implemented according to the content of the description in order to make the technical means of the embodiments of the present application more clearly understood, and the detailed description of the embodiments of the present application will be given below in order to make the foregoing and other objects, features, and advantages of the embodiments of the present application more clearly understandable.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the alternative embodiments. The drawings are only for purposes of illustrating alternative embodiments and are not to be construed as limiting the embodiments of the present application. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:
fig. 1 is a schematic structural diagram of a display panel master in an embodiment of the present application;
fig. 2 is a schematic structural diagram of a bonding area of a display panel master in an embodiment of the present application;
FIG. 3 is a schematic diagram of a first structure of an embodiment of a cutting area of a display panel master in an embodiment of the present application;
FIG. 4 is a second structural diagram of an embodiment of a cutting area of a display panel master in an embodiment of the present application;
FIG. 5 is a schematic diagram of a first structure of another embodiment of a cutting area of a display panel master in an embodiment of the present application;
FIG. 6 is a second structural diagram of another embodiment of a cutting area of a display panel master in an embodiment of the present application;
FIG. 7 is a schematic structural diagram of a display area of a display panel master in an embodiment of the present application;
FIG. 8 is a schematic structural diagram of an encapsulation layer according to an embodiment of the present application;
FIG. 9 is a flowchart of a method for making a display panel master in an embodiment of the present application;
fig. 10 is a schematic structural view of a display region after a first insulating layer, a bridge layer, and a second insulating layer are completed in the first embodiment;
fig. 11 is a schematic structural view of a cutting region after the first insulating layer, the bridge layer and the second insulating layer are completed in the first embodiment;
fig. 12 is a schematic structural view of a bonding region after the first insulating layer, the bridge layer, and the second insulating layer are completed in the first embodiment;
FIG. 13 is a schematic structural diagram of FIG. 10 after an etching process;
FIG. 14 is a schematic structural diagram of FIG. 11 after an etching process;
FIG. 15 is a schematic structural diagram of FIG. 12 after an etching process;
FIG. 16 is a schematic view of the structure of FIG. 13 after a conductive film is deposited, exposed and developed;
FIG. 17 is a schematic view of the structure of FIG. 14 after deposition of a conductive film, exposure of a photoresist, and development;
FIG. 18 is a schematic view of the structure of FIG. 15 after a conductive film is deposited, exposed and developed;
fig. 19 is a schematic view of the structure after etching the conductive film layer of fig. 16;
fig. 20 is a schematic structural view after etching the conductive film layer of fig. 17;
FIG. 21 is a schematic structural diagram of the conductive film of FIG. 18 after etching;
FIG. 22 is a schematic diagram of the structure of FIG. 19 after etching the inorganic layer;
FIG. 23 is a schematic diagram of the structure of FIG. 20 after etching the inorganic layer;
FIG. 24 is a schematic view of the structure of FIG. 21 after etching of the inorganic layer;
FIG. 25 is a schematic diagram of the structure of FIG. 22 after removal of the photoresist;
FIG. 26 is a schematic structural diagram illustrating a structure of a second embodiment after a conductive film layer is deposited, exposed and developed;
FIG. 27 is a schematic structural diagram illustrating the conductive film of FIG. 26 after etching;
FIG. 28 is a schematic structural view after etching the inorganic layer of the backplate of FIG. 27;
fig. 29 is a schematic diagram of the structure after the photoresist in fig. 28 is removed.
The reference numerals are introduced as follows:
1-display panel mother set; 2-a display submount; 21-a display area; 22-a binding region; 3-a cutting area; 30-a backplane drive layer; 4-a back plate; 41-substrate base plate; a 42-polyimide layer; 43-a backsheet inorganic layer; 5-an organic layer; 6-a touch layer; 7-an inorganic layer; 71-a first insulating layer; 72-a second insulating layer; 8-a conductive layer; 9-an organic protective layer; 10-a bridge layer; 11-a light-emitting layer; 12-an encapsulation layer; 121-organic encapsulation layer; 122-inorganic encapsulation layer; 13-a gate; 14-source drain electrode; 15-photoresist.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
As used herein, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. It is to be understood that the term "and/or" as used herein is intended to include all or any and all combinations of one or more of the associated listed items.
It will be understood by those within the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
The inventor of the application finds that in the prior art, after the multiple water washing process of the FMLOC process, because an organic layer (PLN) exposed leakage part (the position of a cutting channel of the cutting region) exists in the cutting region, after the multiple water washing process of the FMLOC process, water vapor can enter the organic layer, the problem that the inorganic layer is peeled off above the organic layer occurs, and the pollution and yield loss of a device cavity are caused.
In addition, the inventor also finds that in the binding region arranged on each panel, the film layer positioned in the binding region after the FMLOC process has a height difference, so that during binding, the inorganic layer is broken due to a large binding pressure, in the reliability process, water vapor enters the organic layer along the broken crack, the organic layer absorbs water to expand, the inorganic layer above the organic layer is peeled off, binding failure is formed, and display abnormality is caused.
Based on the above problems in the prior art, embodiments of the present application provide a new display panel master.
The touch display panel provided by the embodiment of the present application is described in detail below with reference to the accompanying drawings.
In a first aspect, fig. 1 to 7 respectively show structural schematic diagrams of a display panel master 1 in different areas according to an embodiment of the present application. As shown in fig. 1 to 7, the display panel master 1 includes a plurality of display sub-substrates 2, and the display sub-substrates 2 include a back plate 4 and a touch layer 6 located on one side of the back plate 4. The backplate 4 includes a base substrate 41 and an organic layer 5, the organic layer 5 being located between the base substrate 41 and the touch layer 6. The touch layer 6 includes an inorganic layer 7, and the inorganic layer 7 is located on the side of the organic layer 6 away from the substrate 41. Each display sub-substrate comprises a display area 21 and a binding area 22 located on at least one side of the display area 21, and in the binding area 22, the orthographic projection of the organic layer 5 on the substrate 41 has no overlapping area with the orthographic projection of the inorganic layer 7 on the substrate 41. A cutting area 3 is arranged between the adjacent display sub-substrates 2, and in the cutting area 3, the orthographic projection of the organic layer 5 on the substrate 41 and the orthographic projection of the inorganic layer 7 on the substrate 41 have no overlapping area; alternatively, the organic layer 5 is coated with the inorganic layer 7.
In the binding region 22 of the display panel master 1 according to the embodiment of the present application, there is no overlapping region between the orthographic projection of the organic layer 5 on the substrate and the orthographic projection of the inorganic layer 7 on the substrate, so that the problem of binding failure due to peeling of the inorganic layer above the organic layer and water absorption expansion of the organic layer after the inorganic layer is broken in the binding process is avoided. In addition, in the cutting area 3, the orthographic projection of the organic layer 5 on the substrate base plate and the orthographic projection of the inorganic layer 7 on the substrate base plate have no overlapping area, so that the problem of peeling of the inorganic layer above the organic layer is avoided, further, the pollution to a device cavity is avoided, the product yield is improved, and the bending resistance of the display panel master 1 can be improved due to the fact that the thickness of the inorganic layer is reduced; or, in the cutting area 3, the organic layer 5 is coated by the inorganic layer 7, and at the moment, water vapor is difficult to enter the organic layer, so that the problem of peeling off of the inorganic layer above the organic layer is avoided, the pollution to the equipment cavity is further avoided, and the product yield is improved.
Optionally, in the embodiment of the present application, as shown with continued reference to fig. 1 to 7, the touch layer 6 in the display panel master 1 of the embodiment of the present application includes a conductive layer 8 located on a side of the inorganic layer 7 away from the substrate 41. As shown in fig. 2, in the bonding region 22, there is no overlapping area between the orthographic projection of the organic layer 5 on the base substrate 41 and the orthographic projection of the conductive layer 8 on the base substrate 41.
In the binding region 22, the orthographic projection of the organic layer 5 on the substrate and the orthographic projection of the conductive layer 8 on the substrate do not have an overlapping region, so that the height difference of the film layer in the binding region 22 can be reduced, and the binding process is used.
Note that, as shown in fig. 2 to 6, in the cutting area 3, the backplane 4 of the embodiment of the present application includes a substrate 41, a Polyimide (PI) layer 42, a backplane inorganic layer 43, and an organic layer 5; at the bonding region 22, the backplane 4 of the embodiment of the present application includes a substrate 41, a polyimide layer 42, a backplane inorganic layer 43, a gate 13, a source/drain 14, and an organic layer 5.
Optionally, within the cutting area 3, as shown in fig. 3 and 4, the touch layer 6 includes a conductive layer 8. When the organic layer 5 is coated with the inorganic layer 7, the conductive layer 8 is located on the side of the inorganic layer 7 away from the base substrate, and the orthographic projection of the conductive layer 8 on the base substrate overlaps with the orthographic projection of the inorganic layer 7 on the base substrate. The setting of conducting layer 8 can act as the etching barrier layer when concrete manufacture craft to prevent that inorganic layer 7 from being etched away, and then can be fine guarantee that the periphery of organic layer 5 all is wrapped by inorganic layer 7, can prevent like this that steam from entering into organic layer 5, further mentions the display effect of display panel master 1.
Optionally, with further reference to fig. 3 and 4, when the organic layer 5 is covered by the inorganic layer 7, the touch layer 6 includes an organic protection layer 9 in the cutting region 3 of the embodiment of the present application. The organic protective layer 9 is positioned on one side of the conductive layer 8, which is far away from the substrate base plate, coats the inorganic layer 7 and the conductive layer 8, and is arranged at a cutting position in a breaking way; the organic protective layer 9 can protect the inorganic layer 7 and the conductive layer 8, and the organic protective layer 9 is disconnected at the cutting position to facilitate the cutting.
In addition, fig. 4 is different from fig. 3 in that the organic protective layer 9 in fig. 4 is provided with a through hole provided at the cutting position so that the organic protective layer 9 is broken at the cutting position.
Alternatively, as shown in fig. 5 and 6, in the cutting region 3, when there is no overlapping region between the orthographic projection of the organic layer 5 on the substrate and the orthographic projection of the inorganic layer 7 on the substrate, that is, when the inorganic layer 7 is not disposed above the organic layer 5, the organic protective layer 9 is located on the side of the organic layer 5 away from the substrate, and is disposed off at the cutting position; the organic protective layer 9 is disconnected at the cutting position to facilitate the cutting.
In addition, fig. 6 is different from fig. 5 in that the organic protective layer 9 in fig. 6 is provided with a through hole provided at the cutting position so that the organic protective layer 9 is broken at the cutting position.
Optionally, as shown in fig. 7, in the display area 21, the touch layer 6 includes a bridge layer 10, a conductive layer 8, and an organic protection layer 9; the inorganic layer 7 includes a first insulating layer 71 and a second insulating layer 72. The display sub-substrate 2 includes a backplane driving layer 30, a light emitting layer 11 and an encapsulation layer 12 located on one side of the substrate, and the specific arrangement manner of the backplane driving layer 30, the light emitting layer 11 and the encapsulation layer 12 is similar to that of the prior art and is not described herein again.
Specifically, as shown in fig. 7, the first insulating layer 71 is located on the side of the encapsulation layer 12 away from the substrate. The bridge layer 10 is located on a side of the first insulating layer 71 away from the encapsulation layer 12. The second insulating layer 72 is located on a side of the bridge layer 10 away from the first insulating layer 71. The conductive layer 8 is located on the side of the second insulating layer 72 remote from the bridge layer 10. The organic protection layer 9 is located on the side of the conductive layer 8 away from the second insulating layer 72, and covers the conductive layer 8, the second insulating layer 72, the bridge layer 10 and the first insulating layer 71. In the embodiment of the present application, the organic protection layer 9 wraps the conductive layer 8, the second insulation layer 72, the bridge layer 10 and the first insulation layer 71 at the same time, and the organic protection layer 9 can well protect the conductive layer 8, the second insulation layer 72, the bridge layer 10 and the first insulation layer 71.
In addition, as shown in fig. 8, the encapsulation layer 12 in the embodiment of the present application specifically includes: the inorganic encapsulating layer 122 and the organic encapsulating layer 121 are stacked, only two inorganic encapsulating layers 122 and one organic encapsulating layer 121 are shown in the figure, and in actual design, more inorganic encapsulating layers 122 and more organic encapsulating layers 121 may be set, and the inorganic encapsulating layers 122 and the organic encapsulating layers 121 are alternately stacked.
Based on the same inventive concept, in a second aspect, the embodiment of the present application discloses a display panel obtained by cutting the display panel master 1 of the first aspect. The display panel is the display sub-substrate 2, and because there is no overlapping area between the orthographic projection of the organic layer 5 on the substrate 41 and the orthographic projection of the inorganic layer 7 on the substrate 41 in the binding area 22 of the display sub-substrate 2, the display panel can avoid the problem that the inorganic layer 7 is peeled off above the organic layer 5 to cause binding failure due to water absorption and expansion of the organic layer 5 after the inorganic layer 7 is broken in the binding process.
Based on the same inventive concept, in a third aspect, the present application embodiment discloses a display device comprising the display panel of the second aspect. Since the display device of the third aspect includes the display panel of the second aspect, the display device of the third aspect has the same advantageous effects as the display panel of the second aspect. Therefore, the advantageous effects of the display device of the third aspect are not repeated.
Based on the same inventive concept, in a fourth aspect, fig. 9 illustrates a method for manufacturing a display panel master 1 according to the first aspect of the embodiments of the present application. As shown in fig. 9, the method includes:
s101: a backboard 4 is provided, the backboard 4 comprises a substrate, an organic layer 5 is formed on the substrate, and the organic layer 5 is located in the display area 21, the binding area 22 and the cutting area 3.
S102: manufacturing a touch layer 6 on one side of the organic layer 5 far away from the substrate, wherein the touch layer 6 comprises an inorganic layer 7; wherein: in the binding region 22, the orthographic projection of the organic layer 5 on the substrate has no overlapping region with the orthographic projection of the inorganic layer 7 on the substrate; and in the cutting area 3, the orthographic projection of the organic layer 5 on the substrate has no overlapping area with the orthographic projection of the inorganic layer 7 on the substrate; alternatively, the organic layer 5 is coated with the inorganic layer 7.
In the manufacturing method of the embodiment of the application, the orthographic projection of the organic layer 5 on the substrate and the orthographic projection of the inorganic layer 7 on the substrate have no overlapping area, so that the problems that the inorganic layer is peeled off above the organic layer and binding failure is formed due to water absorption expansion of the organic layer after the inorganic layer is broken in the binding process are solved. In addition, in the cutting area 3, the orthographic projection of the organic layer 5 on the substrate base plate and the orthographic projection of the inorganic layer 7 on the substrate base plate have no overlapping area, so that the problem of peeling of the inorganic layer above the organic layer is avoided, the pollution to a device cavity is further avoided, and the product yield is improved; or, in the cutting area 3, the organic layer 5 is coated by the inorganic layer 7, and at the moment, water vapor is difficult to enter the organic layer, so that the problem of peeling off of the inorganic layer above the organic layer is avoided, the pollution to the equipment cavity is further avoided, and the product yield is improved.
After the display panel master 1 is manufactured, cutting is performed to form individual display sub-substrates 2.
In an alternative embodiment, the touch layer 6 is formed on the side of the organic layer 5 away from the substrate, and includes:
sequentially manufacturing a first insulating layer 71, a bridging layer 10 and a second insulating layer 72 on one side of the organic layer 5 away from the substrate base plate through a patterning process;
manufacturing a conductive layer 8 on the second insulating layer 72 through a patterning process, wherein the conductive layer 8 is located in the display area 21 and the bonding area 22, and in the bonding area 22, an orthographic projection of the organic layer 5 on the substrate base plate 4 and an orthographic projection of the conductive layer 8 on the substrate base plate 4 are not overlapped;
etching the first insulating layer 71 and the second insulating layer 72 by a dry etching process so that the organic layer 5 has no overlapping region with the first insulating layer 71 and the second insulating layer 72 in the binding region 22 in the orthographic projection direction on the substrate base plate 4; and in the dicing area 3, in the orthogonal projection direction on the base substrate 4, the organic layer 5 has no overlapping area with the first insulating layer 71 and the second insulating layer 72;
an organic protective layer 9 is formed on the conductive layer 8 by a patterning process.
In another alternative embodiment, the touch layer 6 is formed on the side of the organic layer 5 away from the substrate, and includes:
sequentially manufacturing a first insulating layer 71, a bridging layer 10 and a second insulating layer 72 on one side of the organic layer 5 away from the substrate base plate through a patterning process;
manufacturing a conductive layer 8 on the second insulating layer 72 through a patterning process, wherein the conductive layer 8 is located in the display area 21 and the bonding area 22, and in the bonding area 22, an orthographic projection of the organic layer 5 on the substrate base plate 4 and an orthographic projection of the conductive layer 8 on the substrate base plate 4 are not overlapped; and in the cutting area 3, the conductive layer 8 covers the organic layer 5;
etching the first insulating layer 71 and the second insulating layer 72 by a dry etching process so that the organic layer 5 has no overlapping region with the first insulating layer 71 and the second insulating layer 72 in the binding region 22 in the orthographic projection direction on the substrate base plate 4; and in the cutting region 3, the organic layer 5 is coated with the inorganic layer 7;
an organic protective layer 9 is formed on the conductive layer 8 by a patterning process.
The display panel master 1 of the embodiment of the application comprises three areas, which are respectively: the display area 21, the cutting area 3 and the binding area 22 are described in detail below with reference to fig. 10 to 29, where the method for manufacturing the display panel master 1 according to the embodiment of the present application is as follows:
firstly, an OLED display substrate is manufactured through a conventional process, the manufactured OLED display substrate comprises a back plate driving layer 30, a light emitting layer 11 and an encapsulation layer 12 in a display area 21, and comprises a substrate 41, a polyimide layer 42, a back plate inorganic layer 43 and an organic layer 5 in a cutting area 3; the binding region 22 includes a substrate 41, a polyimide layer 42, a back-plate inorganic layer 43, a gate electrode 13, source and drain electrodes 14, and an organic layer 5.
And then, manufacturing a touch layer on the manufactured OLED display substrate by adopting an FMLOC process. The following describes a specific manufacturing method of a touch layer in an embodiment of the present application in detail with reference to the accompanying drawings.
The touch layer can be manufactured in the following two ways.
The first implementation mode comprises the following steps:
step 1-the first insulating layer 71, the bridge layer 10 and the second insulating layer 72 are prepared using conventional processes. Specifically, the material of the first insulating layer 71 may be a silicon nitride material, the material of the bridge layer 10 may be a titanium (Ti)/aluminum (Al)/titanium (Ti) material, and the material of the second insulating layer 72 may also be a silicon nitride material. After this step is completed, in the display region 21, as shown in fig. 10, the display panel master 1 includes a first insulating layer 71, a bridge layer 10, and a second insulating layer 72 on the encapsulation layer 12. In the cutting region 3, as shown in fig. 11, the display panel master 1 includes an inorganic layer 7 (including a first insulating layer 71 and a second insulating layer 72) on the organic layer 5. In the binding region 22, as shown in fig. 12, the display panel master 1 includes the inorganic layer 7 on the organic layer 5.
And 2, patterning the inorganic layer 7 by adopting a patterning process, wherein the patterning process in the embodiment of the application comprises the steps of coating, exposing, developing and etching the photoresist and removing part or all of the photoresist, and when the patterning process is specifically implemented, the inorganic layer 7 is removed by adopting dry etching. After this step is completed, in the display area 21, as shown in fig. 13, a part of the bridge layer 10 is exposed. In the dicing area 3, as shown in fig. 14, a part of the inorganic layer 43 of the back sheet is exposed, and the inorganic layer 7 covers the organic layer 5. In the binding region 22, as shown in fig. 15, a part of the source and drain electrodes 14 is exposed, and the inorganic layer 7 covers the organic layer 5.
And 3, depositing a conductive film layer, wherein the conductive film layer can be made of Ti/Al/Ti materials, coating a photoresist 15 on the conductive film layer, and exposing and developing the photoresist 15. After this step is completed, in the display region 21, as shown in fig. 16, the photoresist 15 covers a part of the conductive film (the film before the conductive layer 8 is not patterned), and the covered region of the photoresist 15 is a region where the conductive layer 8 is to be formed later. In the cutting region 3, as shown in fig. 17, the inorganic layer 7 is covered by the entire conductive film layer, and there is no photoresist over the conductive film layer. In the bonding region 22, as shown in fig. 18, the photoresist 15 covers a portion of the conductive film layer, and the covered region of the photoresist 15 is a region where the conductive layer 8 needs to be formed subsequently.
Step 4-use of gaseous Cl2And etching the conductive film layer to form the conductive layer 8. The bridging layer 10 is connected with the conducting layer 8 through the overlapping holes to form a driving electrode or an induction electrode channel, the conducting layer 8 crosses the bridging layer 10 to form an induction electrode or a driving electrode channel, and the mutual capacitance of the driving electrode and the induction electrode node is induced through fingers, so that the touch function is realized; after this step is completed, in the display area 21, as shown in fig. 19, the conductive film layer in the area not covered by the photoresist 15 is etched away. In the cutting region 3, as shown in fig. 20, the conductive film layers are all etched away. In the bonding region 22, as shown in fig. 21, the conductive film layer in the region not covered by the photoresist 15 is etched and removed, and there is no overlapping region between the orthographic projection of the formed conductive layer 8 on the substrate and the orthographic projection of the organic layer on the substrate.
Step 5-on the basis of step 4, add one step of dry etching, pass reaction gas CF4And O2The inorganic layer 7 in step 4 is further etched. After this step is completed, in the display area 21, as shown in FIG. 22, the reaction gas CF is used4And O2The first insulating layer 71 and the second insulating layer 72, which are not covered with the photoresist 15, are etched away. In the cutting area 3, as shown in FIG. 23, a reaction gas CF is used4And O2The inorganic layer 7 and the exposed inorganic layer 43 of the back plate are removed by etching, and at this time, the bending resistance of the display panel master 1 can be increased due to the thinning of the thickness of the inorganic layer. In the bonding region 22, as shown in FIG. 24, a reaction gas CF is used4And O2The inorganic layer 7 not covered by the photoresist 15 is etched away.
Step 6-remove photoresist 15. After this step is completed, the film structure of the display area 21 is as shown in fig. 25.
The second embodiment:
the difference between the second embodiment and the first embodiment is mainly that the manufacturing process of each step of the cutting region 3, the display region 21 and the binding region 22 and the film structure after the manufacturing are the same as those of the first embodiment, and the description of the same parts is omitted here.
In the cutting region 3, the difference between the second embodiment and the first embodiment is mainly from step 3 to step 7, in step 3, after the two pairs of photoresists 15 of the second embodiment are exposed and developed, the photoresists 15 need to cover a part of the conductive film layer, as shown in fig. 26; in step 4, since the photoresist 15 covers part of the conductive film layer, gas Cl is used2After etching the conductive film layer, the conductive film layer in the region covered by the photoresist 15 is not etched, and the specific film layer structure is shown in fig. 27; in step 5, adding a dry etching step by using reaction gas CF4And O2Etching the inorganic layer 43 of the back plate to ensure that the subsequent cutting can be better completed, wherein the specific film structure is shown in fig. 28; in step 6, the structure of the film layer after the photoresist 15 is removed is shown in fig. 29; in step 7, a patterning process is used to fabricate the organic passivation layer 9, and after the step is completed, the specific film structure is shown in fig. 3 and 4.
The beneficial effects obtained by applying the embodiment of the application comprise:
1. in the binding region 22 of the display panel master 1 according to the embodiment of the present application, there is no overlapping region between the orthographic projection of the organic layer 5 on the substrate and the orthographic projection of the inorganic layer 7 on the substrate, so that the problem of binding failure due to peeling of the inorganic layer above the organic layer and water absorption expansion of the organic layer after the inorganic layer is broken in the binding process is avoided. In addition, in the cutting area 3, the orthographic projection of the organic layer 5 on the substrate base plate and the orthographic projection of the inorganic layer 7 on the substrate base plate have no overlapping area, so that the problem of peeling of the inorganic layer above the organic layer is avoided, further, the pollution to a device cavity is avoided, the product yield is improved, and the bending resistance of the display panel master 1 can be improved due to the fact that the thickness of the inorganic layer is reduced; or, in the cutting area 3, the organic layer 5 is coated by the inorganic layer 7, and at the moment, water vapor is difficult to enter the organic layer, so that the problem of peeling off of the inorganic layer above the organic layer is avoided, the pollution to the equipment cavity is further avoided, and the product yield is improved.
2. In the binding region 22, the orthographic projection of the organic layer 5 on the substrate and the orthographic projection of the conductive layer 8 on the substrate do not have an overlapping region, so that the height difference of the film layer in the binding region 22 can be reduced, and the binding process is used.
3. The organic protective layer 9 is located on the side of the conductive layer 8 away from the substrate base plate and covers the inorganic layer 7 and the conductive layer 8, and is provided in an open state at the cutting position. The organic protective layer 9 can protect the inorganic layer 7 and the conductive layer 8, and the organic protective layer 9 is disconnected at the cutting position to facilitate the cutting.
Those of skill in the art will appreciate that the various operations, methods, steps in the processes, acts, or solutions discussed in this application can be interchanged, modified, combined, or eliminated. Further, other steps, measures, or schemes in various operations, methods, or flows that have been discussed in this application can be alternated, altered, rearranged, broken down, combined, or deleted. Further, steps, measures, schemes in the prior art having various operations, methods, procedures disclosed in the present application may also be alternated, modified, rearranged, decomposed, combined, or deleted.
In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be construed as limiting the present application.
The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified.
The foregoing is only a partial embodiment of the present application, and it should be noted that, for those skilled in the art, several modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations should also be regarded as the protection scope of the present application.
Claims (10)
1. The display panel master mask is characterized by comprising a plurality of display sub-substrates, wherein each display sub-substrate comprises a back plate and a touch layer positioned on one side of the back plate;
the back plate comprises a substrate base plate and an organic layer, wherein the organic layer is positioned between the substrate base plate and the touch layer,
the touch layer comprises an inorganic layer, and the inorganic layer is positioned on one side of the organic layer, which is far away from the substrate;
each display sub-substrate comprises a display area and a binding area positioned on at least one side of the display area, and in the binding area, the orthographic projection of the organic layer on the substrate and the orthographic projection of the inorganic layer on the substrate have no overlapping area;
a cutting area is arranged between the adjacent display sub-substrates, and in the cutting area, the orthographic projection of the organic layer on the substrate and the orthographic projection of the inorganic layer on the substrate have no overlapping area; alternatively, the organic layer is coated with the inorganic layer.
2. The display panel master of claim 1, wherein the touch layer comprises a conductive layer on a side of the inorganic layer remote from the substrate base;
in the binding region, the orthographic projection of the organic layer on the substrate base plate and the orthographic projection of the conductive layer on the substrate base plate have no overlapping region.
3. The display panel master of claim 1, wherein the touch layer comprises a conductive layer;
in the cutting area, when the organic layer is coated by the inorganic layer, the conductive layer is positioned on the side of the inorganic layer far away from the substrate base plate, and the orthographic projection of the conductive layer on the substrate base plate is overlapped with the orthographic projection of the inorganic layer on the substrate base plate.
4. The display panel master of claim 3, wherein the touch layer comprises an organic protective layer;
the organic protective layer is positioned on one side of the conducting layer, which is far away from the substrate base plate, coats the inorganic layer and the conducting layer, and is arranged at a cutting position in a breaking mode.
5. The display panel master of claim 1, wherein the touch layer comprises an organic protective layer;
in the cutting area, when the orthographic projection of the organic layer on the substrate base plate and the orthographic projection of the inorganic layer on the substrate base plate have no overlapping area, the organic protection layer is positioned on one side of the organic layer, which is far away from the substrate base plate, and is arranged in a breaking mode at the cutting position.
6. The display panel master of claim 1, wherein the touch layer comprises a bridge layer, a conductive layer, an organic protective layer; the inorganic layer includes a first insulating layer and a second insulating layer;
in the display area, the backboard comprises a light-emitting layer positioned on one side of the substrate base plate and an encapsulation layer positioned on one side of the light-emitting layer far away from the substrate base plate;
the first insulating layer is positioned on one side, far away from the substrate, of the packaging layer;
the bridging layer is positioned on one side, far away from the packaging layer, of the first insulating layer;
the second insulating layer is positioned on one side, far away from the first insulating layer, of the bridging layer;
the conducting layer is positioned on one side, far away from the bridging layer, of the second insulating layer;
the organic protective layer is positioned on one side, far away from the second insulating layer, of the conducting layer and coats the conducting layer, the second insulating layer, the bridging layer and the first insulating layer.
7. A display panel obtained by cutting the display panel master of any one of claims 1 to 6.
8. A display device characterized by comprising the display panel according to claim 7.
9. A method of mastering a display panel according to any one of claims 1-6, comprising:
providing a backboard, wherein the backboard comprises a substrate, and an organic layer is manufactured above the substrate;
manufacturing a touch layer on one side of the organic layer far away from the substrate base plate, wherein the touch layer comprises an inorganic layer; wherein: in the binding region, the orthographic projection of the organic layer on the substrate base plate and the orthographic projection of the inorganic layer on the substrate base plate have no overlapping region; and in the cutting area, the orthographic projection of the organic layer on the substrate has no overlapping area with the orthographic projection of the inorganic layer on the substrate; alternatively, the organic layer is coated with the inorganic layer.
10. The method of claim 9, wherein fabricating a touch layer on a side of the organic layer away from the substrate comprises:
sequentially manufacturing a first insulating layer, a bridging layer and a second insulating layer on one side of the organic layer far away from the substrate base plate through a composition process;
manufacturing a conducting layer on the second insulating layer through a composition process, wherein the conducting layer is located in the display area and the binding area, and in the binding area, the orthographic projection of the organic layer on the substrate base plate and the orthographic projection of the conducting layer on the substrate base plate are not overlapped;
etching the first insulating layer and the second insulating layer by a dry etching process so that the organic layer has no overlapping region with the first insulating layer and the second insulating layer in the binding region in the orthographic projection direction on the substrate; and in the cutting region, in an orthographic projection direction on the substrate, the organic layer has no overlapping region with the first insulating layer and the second insulating layer;
manufacturing an organic protective layer on the conductive layer through a composition process;
or the like, or, alternatively,
manufacturing a touch layer on one side of the organic layer far away from the substrate base plate, wherein the touch layer comprises:
sequentially manufacturing a first insulating layer, a bridging layer and a second insulating layer on one side of the organic layer far away from the substrate base plate through a composition process;
manufacturing a conducting layer on the second insulating layer through a composition process, wherein the conducting layer is located in the display area and the binding area, and in the binding area, the orthographic projection of the organic layer on the substrate base plate and the orthographic projection of the conducting layer on the substrate base plate are not overlapped; and in the cutting area, the conductive layer covers the organic layer;
etching the first insulating layer and the second insulating layer by a dry etching process so that the organic layer has no overlapping region with the first insulating layer and the second insulating layer in the binding region in the orthographic projection direction on the substrate; and in the cutting area, the organic layer is coated by the inorganic layer;
and manufacturing an organic protective layer on the conductive layer through a composition process.
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