CN113888971A - Flexible display panel and manufacturing method thereof - Google Patents
Flexible display panel and manufacturing method thereof Download PDFInfo
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- CN113888971A CN113888971A CN202111157280.3A CN202111157280A CN113888971A CN 113888971 A CN113888971 A CN 113888971A CN 202111157280 A CN202111157280 A CN 202111157280A CN 113888971 A CN113888971 A CN 113888971A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 238000005520 cutting process Methods 0.000 claims abstract description 194
- 229910010272 inorganic material Inorganic materials 0.000 claims abstract description 128
- 239000011147 inorganic material Substances 0.000 claims abstract description 128
- 239000000758 substrate Substances 0.000 claims abstract description 117
- 238000000034 method Methods 0.000 claims abstract description 30
- 239000010410 layer Substances 0.000 claims description 215
- 239000011368 organic material Substances 0.000 claims description 76
- 239000010408 film Substances 0.000 claims description 41
- 239000011241 protective layer Substances 0.000 claims description 19
- 238000005530 etching Methods 0.000 claims description 12
- 239000010409 thin film Substances 0.000 claims description 10
- 230000004888 barrier function Effects 0.000 claims description 8
- 239000011229 interlayer Substances 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 2
- 230000002349 favourable effect Effects 0.000 abstract 1
- 238000002360 preparation method Methods 0.000 abstract 1
- 230000008569 process Effects 0.000 description 14
- 239000007789 gas Substances 0.000 description 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 230000000903 blocking effect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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Abstract
The disclosure provides a flexible display panel and a manufacturing method thereof, and belongs to the field of display devices. The flexible display panel includes a flexible substrate and an inorganic material layer; the surface of the flexible display panel is at least provided with a first cutting channel and a second cutting channel, the first cutting channel is positioned at the junction of the binding area and the non-display area, and the second cutting channel is positioned at the junction of the rough cutting area and the non-display area and is connected with the first cutting channel; the orthographic projection of the first cutting channel and the orthographic projection of the second cutting channel on the surface of the flexible substrate are positioned in the orthographic projection of the inorganic material layer on the surface of the flexible substrate. The inorganic material layer separates first cutting way and flexible substrate, separates second cutting way and flexible substrate, consequently at the in-process of preparation flexible display panel, when peeling off flexible display panel from substrate base plate surface, the inorganic material layer can play the effect of blockking, prevents inside gaseous further entering flexible display panel to avoid forming the bubble, be favorable to improving flexible display panel's yield.
Description
Technical Field
The disclosure relates to the field of display devices, and in particular to a flexible display panel and a manufacturing method thereof.
Background
Flexible display panels have been widely used because they are bendable. When a flexible display panel is manufactured, a flexible substrate is formed on a substrate, then other film layers are formed on the flexible substrate, and then the flexible display panel is peeled off from the substrate.
However, the flexible display panel manufactured in the related art is prone to form bubbles, resulting in a low yield of the flexible display panel.
Disclosure of Invention
The embodiment of the disclosure provides a flexible display panel and a manufacturing method thereof, which can reduce the possibility of generating bubbles and are beneficial to improving the yield of the flexible display panel. The technical scheme is as follows:
in a first aspect, embodiments of the present disclosure provide a flexible display panel, which includes a flexible substrate and an inorganic material layer on one side of the flexible substrate;
the flexible substrate is provided with a display area, a binding area, a rough cutting area and a non-display area, the binding area is connected with the display area, the rough cutting area is positioned on one side of the binding area far away from the display area and is connected with the binding area, and the non-display area surrounds the display area, the binding area and the rough cutting area;
the surface of the flexible display panel is at least provided with a first cutting channel and a second cutting channel, the first cutting channel is positioned at the junction of the binding area and the non-display area, and the second cutting channel is positioned at the junction of the rough cutting area and the non-display area and is connected with the first cutting channel;
the orthographic projection of the first cutting street and the orthographic projection of the second cutting street on the surface of the flexible substrate are positioned in the orthographic projection of the inorganic material layer on the surface of the flexible substrate.
Optionally, the inorganic material layer satisfies at least one of:
the thickness of the inorganic material layer at the first cutting channel is smaller than the thickness of the inorganic material layer at two sides of the first cutting channel;
the thickness of the inorganic material layer at the second cutting channel is smaller than the thickness of the inorganic material layer at two sides of the second cutting channel.
Optionally, the thickness of the inorganic material layer at the first cutting channel is 1500 to 8000 angstroms;
the thickness of the inorganic material layer at the second cutting channel is 1500-8000 angstroms.
Optionally, the surface of the flexible display panel further has a third cutting street, the third cutting street is located at a junction between the binding region and the non-display region, and is located at one end of the first cutting street close to the display region, and is connected to the first cutting street, the third cutting street is arc-shaped, and an orthographic projection of the third cutting street on the surface of the flexible substrate is located outside an orthographic projection of the inorganic material layer on the surface of the flexible substrate.
Optionally, the flexible display panel further includes an organic material layer located on a surface of the inorganic material layer away from the flexible substrate.
Optionally, the thickness of the organic material layer at the first cutting channel is smaller than the thickness of the organic material layer at two sides of the first cutting channel; and/or the presence of a gas in the gas,
the thickness of the organic material layer at the second cutting channel is smaller than the thickness of the organic material layer at two sides of the second cutting channel.
Optionally, the organic material layer includes a first planarization layer, a second planarization layer and a pixel defining layer sequentially stacked on the inorganic material layer, and the bottom of the first scribe line and/or the bottom of the second scribe line are located on the surface of the first planarization layer.
Optionally, the organic material layer is located outside the first cutting channel and/or the second cutting channel.
Optionally, the inorganic material layer includes a barrier layer, a gate insulating layer, and an interlayer dielectric layer, which are sequentially stacked on the surface of the flexible substrate, and the bottom of the first scribe line and/or the second scribe line is located on the surface of the gate insulating layer.
Optionally, the flexible display panel further includes a protection layer, where the protection layer is located on a surface of the organic material layer away from the flexible substrate, and extends to the bottom of the first scribe line along the sidewall of the first scribe line, and extends to the bottom of the second scribe line along the sidewall of the second scribe line.
In a second aspect, an embodiment of the present disclosure further provides a method for manufacturing a flexible display panel, where the method includes:
providing a flexible substrate, wherein the flexible substrate is provided with a display area, a binding area, a rough cutting area and a non-display area, the binding area is connected with the display area, the rough cutting area is positioned on one side of the binding area, which is far away from the display area, and is connected with the binding area, and the non-display area surrounds the display area, the binding area and the rough cutting area;
forming an inorganic material layer on one side of the flexible substrate;
the inorganic material layer is kept away from one side of the flexible substrate to form a first cutting channel and a second cutting channel, the first cutting channel is located at the junction of the binding area and the non-display area, the second cutting channel is located at the junction of the rough cutting area and the non-display area and is connected with the first cutting channel, and the first cutting channel and the second cutting channel are in the orthographic projection of the surface of the flexible substrate and are located in the orthographic projection of the surface of the flexible substrate.
Optionally, the forming of the inorganic material layer on one side of the flexible substrate includes:
forming an inorganic material film on one side of the flexible substrate;
and etching the inorganic material film, and reducing the thickness of the inorganic material film at the positions of the first cutting channel and the second cutting channel to be formed to obtain the inorganic material layer.
Optionally, the forming a first cutting street and a second cutting street on the side of the inorganic material layer far away from the flexible substrate includes:
forming an organic material film on the surface of the inorganic material layer far away from the flexible substrate;
and removing at least partial thickness of the organic material film at the positions where the first cutting channel and the second cutting channel are to be formed, so as to form the first cutting channel and the second cutting channel, and obtain the organic material layer.
Optionally, after forming the thin film of inorganic material on one side of the flexible substrate, the method further comprises:
etching the inorganic material film, and removing the inorganic material film at the position where a third cutting path is to be formed;
the manufacturing method further comprises the following steps:
and removing at least partial thickness of the organic material film at the position of the third cutting channel to be formed to form the third cutting channel, wherein the third cutting channel is positioned at the junction of the binding region and the non-display region and at one end, close to the display region, of the first cutting channel and is connected with the first cutting channel, the third cutting channel is arc-shaped, and the orthographic projection of the third cutting channel on the surface of the flexible substrate is positioned outside the orthographic projection of the inorganic material layer on the surface of the flexible substrate.
Optionally, the method further comprises:
and forming a protective layer on the surface of the organic material layer, wherein the protective layer is positioned on one surface of the organic material layer, which is far away from the flexible substrate, on the side wall of the first cutting channel and on the side wall of the second cutting channel.
The beneficial effects brought by the technical scheme provided by the embodiment of the disclosure at least comprise:
in the embodiment of the disclosure, because the orthographic projections of the first cutting street and the second cutting street on the surface of the flexible substrate are both located in the orthographic projection of the inorganic material layer on the surface of the flexible substrate, that is, the inorganic material layer separates the first cutting street from the flexible substrate and separates the second cutting street from the flexible substrate, in the process of manufacturing the flexible display panel, when the flexible display panel is peeled off from the surface of the substrate, the inorganic material layer can play a role in blocking, gas is prevented from further entering the flexible display panel, and therefore, the formation of bubbles is avoided, and the yield of the flexible display panel is favorably improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.
Fig. 1 is a top view of a flexible display panel provided by an embodiment of the present disclosure;
FIG. 2 is a sectional view A-A of FIG. 1;
FIG. 3 is a cross-sectional view B-B of FIG. 1;
FIG. 4 is a cross-sectional view C-C of FIG. 1;
fig. 5 is a cross-sectional view of another flexible display panel provided by embodiments of the present disclosure;
fig. 6 is a cross-sectional view of another flexible display panel provided by embodiments of the present disclosure;
fig. 7 is a flowchart of a method for manufacturing a flexible display panel according to an embodiment of the present disclosure;
fig. 8 is a flowchart of a method for manufacturing a flexible display panel according to an embodiment of the present disclosure.
Detailed Description
To make the objects, technical solutions and advantages of the present disclosure more apparent, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.
Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," "third," and similar terms in the description and claims of the present disclosure are not intended to indicate any order, quantity, or importance, but rather are used to distinguish one element from another. Also, the use of the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one. The word "comprise" or "comprises", and the like, means that the element or item listed before "comprises" or "comprising" covers the element or item listed after "comprising" or "comprises" and its equivalents, and does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, which may also change accordingly when the absolute position of the object being described changes.
Fig. 1 is a top view of a flexible display panel provided by an embodiment of the present disclosure. As shown in fig. 1, the flexible display panel includes a flexible substrate 10. The flexible substrate 10 has a display area 101, a binding area 102, a rough cut area 103, and a non-display area 104. The binding region 102 is connected with the display region 101, the rough cutting region 103 is located on one side of the binding region 102 far away from the display region 101 and connected with the binding region 102, and the non-display region 104 surrounds the display region 101, the binding region 102 and the rough cutting region 103.
The surface of the flexible display panel has at least a first cutting lane 10a and a second cutting lane 10 b. The first scribe line 10a is located at the boundary between the bonding area 102 and the non-display area 104, the second scribe line 10b is located at the boundary between the rough-cut area 103 and the non-display area 104, and the second scribe line 10b is connected to the first scribe line 10 a.
The cutting streets are used for cutting during manufacturing, and are usually cut along the cutting streets by using a laser to form individual flexible display panels for subsequent processing, and the arrangement of the cutting streets depends on the shape of the flexible display panel to be manufactured. In addition to the first cutting street 10a and the second cutting street 10b, the rough cutting area 103 is removed by cutting along at least the first transverse cutting street 10d and the second transverse cutting street 10 e.
As shown in fig. 1, the first transverse scribe line 10d is located at the boundary between the rough cut region 103 and the non-display region 104, and is located on a side of the rough cut region 103 away from the bonding region 102. The second transverse cut 10e is located at the intersection of the rough cut region 103 and the bonded region 102. When cutting the first transverse cutting street 10d and the second transverse cutting street 10e, the first transverse cutting street 10d is generally cut first, and then the second transverse cutting street 10e is cut. After cutting, the rough cut region 103 is separated from the bonded region 102.
Fig. 2 is a sectional view a-a in fig. 1. As shown in fig. 2, the flexible display panel further includes an inorganic material layer 20, and the inorganic material layer 20 is disposed on one side of the flexible substrate 10.
Also shown in fig. 2 is a substrate base plate 100. In the production of the flexible display panel, the flexible display panel is usually produced on a substrate 100 and then peeled off. For example, the flexible display panel is generally peeled off from the base substrate 100 using a laser lift-off (LLO) process. In the process of peeling the flexible display panel from the substrate 100 using the laser peeling process, the flexible base 10 in the flexible display panel generates gas to form an impact between the flexible base 10 and the substrate 100, thereby facilitating the separation of the flexible base 10 and the substrate 100.
The flexible substrate 10 cannot completely block gas, and a small amount of gas may penetrate through the flexible substrate 10 and enter between the inner film layers of the flexible display panel during the peeling process, thereby forming bubbles and affecting the yield of the flexible display panel. In the related art, since the inorganic material layer 20 is not isolated at the position of the second scribe line 10b, bubbles are easily formed at the position of the second scribe line 10b during the peeling process, so that the subsequent processing process is affected, and the yield of the flexible display panel is low.
As shown in fig. 2, an orthogonal projection of the first cutting street 10a on the surface of the flexible substrate 10 is located within an orthogonal projection of the inorganic material layer 20 on the surface of the flexible substrate 10. Fig. 3 is a sectional view B-B in fig. 1. As shown in fig. 3, an orthographic projection of the second scribe line 10b on the surface of the flexible substrate 10 is also located within an orthographic projection of the inorganic material layer 20 on the surface of the flexible substrate 10. That is, the inorganic material layer 20 is disposed on the bottom of the first cutting street 10a and the bottom of the second cutting street 10b, and the inorganic material layer 20 is made of an inorganic material, has a good capability of isolating gas, and can isolate the gas penetrating through the flexible substrate 10.
In the embodiment of the present disclosure, the inorganic material layer 20 separates the first cutting street 10a from the flexible substrate 10, and separates the second cutting street 10b from the flexible substrate 10, so that when the flexible display panel is peeled off from the surface of the substrate 100 in the process of manufacturing the flexible display panel, the inorganic material layer 20 can play a role of blocking, and prevent gas from further entering the flexible display panel, thereby avoiding forming bubbles, and facilitating to improve the yield of the flexible display panel.
As an example, as shown in fig. 2, the inorganic material layer 20 includes a barrier layer (barrier)21, a Gate Insulator (GI) 22, and an interlayer dielectric (ILD) 23 sequentially stacked on the surface of the flexible substrate 10.
The film layer included in the inorganic material layer 20 is not limited to the film layers listed above, and in other examples, the inorganic material layer 20 may include one or more of the film layers, and may further include other film layers. The illustration in fig. 2 is merely an example.
As shown in fig. 2, the thickness of the inorganic material layer 20 at the first cutting lines 10a is smaller than the thickness of the inorganic material layer 20 at both sides of the first cutting lines 10 a.
For example, in the embodiment of the present disclosure, the inorganic material layer 20 includes only the barrier layer 21 and the gate insulating layer 22 in the portion of the first scribe line 10 a. And portions of the inorganic material layer 20 on both sides of the first cutting street 10a include a barrier layer 21, a gate insulating layer 22, and an interlayer dielectric layer 23. And the thickness of the gate insulating layer 22 at the first scribe line 10a is smaller than the thickness at both sides of the first scribe line 10 a.
After the flexible display panel is peeled from the base substrate 100, the flexible display panel is cut. The cutting path is a groove structure which is formed on the surface of the flexible display panel in advance and is convenient for cutting. The inorganic material layer 20 is brittle, and the inorganic material layer 20 may be cracked during cutting, while the thicker the inorganic material layer 20, the more easily the crack is formed during cutting. In the embodiment of the present disclosure, by providing the inorganic material layer 20 at the first cutting street 10a to be thinner, the possibility of cracks occurring in the inorganic material layer 20 when cutting along the first cutting street 10a is reduced.
Similarly, in the embodiment of the disclosure, the thickness of the inorganic material layer 20 at the second scribe line 10b is smaller than the thickness of the inorganic material layer 20 at both sides of the second scribe line 10 b. Thereby reducing the possibility of cracks occurring in the inorganic material layer 20 when cutting along the second scribe line 10 b.
Alternatively, the thickness of the inorganic material layer 20 at the first scribe line 10a is 1500 to 8000 a.
Reducing the thickness of the inorganic material layer 20 can reduce the possibility of cracks occurring in the inorganic material layer 20 during dicing, but the thinner the thickness of the inorganic material layer 20 is, the weaker the barrier effect of the inorganic material layer 20 against gas is, that is, as the thickness of the inorganic material layer 20 is reduced, the possibility of bubbles being formed during peeling of the base substrate 100 is increased. Through the test, in the range of 1500 to 8000 a, bubbles were not substantially formed during the peeling of the base substrate 100, and cracks were not easily formed during the cutting.
Similarly, the thickness of the inorganic material layer 20 at the second scribe line 10b may also be 1500 to 8000 a.
As shown in fig. 1, the surface of the flexible display panel further has a third cutting street 10c, the third cutting street 10c is located at the boundary between the bonding region 102 and the non-display region 104, and is located at one end of the first cutting street 10a close to the display region 101, and is connected to the first cutting street 10a, and the third cutting street 10c is arc-shaped.
In the subsequent process of the flexible display panel, the bonding region 102 is bent with respect to the display region 101, so as to fold the bonding region 102 to the back of the display region 101. After the folding is completed, the bonding region 102 is in a bent state, and is generally a portion of the bonding region 102 close to the display region 101, that is, a region of the bonding region 102 between the two third scribe lines 10 c. The third scribe line 10c is formed in an arc shape, so that stress at a portion where both sides of the bonding region 102 are connected to the display region 101 when the display region is bent can be reduced.
Fig. 4 is a cross-sectional view of C-C in fig. 1. As shown in fig. 4, in the embodiment of the present disclosure, an orthogonal projection of the third cutting street 10c on the surface of the flexible substrate 10 is located outside an orthogonal projection of the inorganic material layer 20 on the surface of the flexible substrate 10. That is, the inorganic material layer 20 is not distributed at a position corresponding to the bottom of the third street 10 c. Since the inorganic material layer 20 is cut along the arc-shaped cutting street, cracks are very easily formed in the inorganic material layer 20, and the third cutting street 10c is arc-shaped, so that the inorganic material layer 20 is not disposed at the bottom position of the third cutting street 10c in order to prevent the inorganic material layer 20 from forming cracks.
As shown in fig. 2, the flexible display panel further includes an organic material layer 30. The organic material layer 30 is located on the surface of the inorganic material layer 20 away from the flexible substrate 10.
As an example, in the embodiment of the present disclosure, the organic material layer 30 includes a first Planarization Layer (PLN) 31, a second planarization layer 32, and a Pixel Definition Layer (PDL) 33, which are sequentially stacked on the inorganic material layer 20. As shown in fig. 2, the bottom of the first scribe line 10a is located on the surface of the first planarization layer 31. As shown in fig. 3, the bottom of the second scribe line 10b is also located on the surface of the first planarization layer 31.
The film layers included in the organic material layer 30 are not limited to the above-listed film layers, and in other examples, the organic material layer 30 may include one or more of the above-listed film layers, and may further include other film layers. Figures 2-4 are shown as an example only.
As shown in fig. 2, the thickness of the organic material layer 30 at the first scribe line 10a is smaller than the thickness of the organic material layer 30 on both sides of the first scribe line 10 a.
After the substrate 100 is peeled off, the stress inside the organic material layer 30 and the stress inside the inorganic material layer 20 are in different directions in a direction parallel to the surface of the flexible display panel, which may cause the flexible display panel to bow to the side of the flexible substrate 10, thereby affecting the subsequent processes. By reducing the thickness of the organic material layer 30 at the first scribe line 10a, the stress inside the organic material layer 30 can be released to some extent, and the degree of arching of the flexible display panel to the side of the flexible substrate 10 is reduced.
Similarly, the thickness of the organic material layer 30 at the second scribe line 10b is smaller than the thickness of the organic material layer 30 at the two sides of the second scribe line 10b, so that the internal stress of the organic material layer 30 can be released to some extent, and the degree of the flexible display panel arching toward the side where the flexible substrate 10 is located is reduced.
Fig. 5 is a cross-sectional view of another flexible display panel provided by the embodiments of the present disclosure. As shown in fig. 5, in the flexible display panel, the organic material layer 30 is located outside the first scribe line 10 a. That is, the thickness of the organic material layer 30 at the first scribe line 10a is 0. In the embodiment of the present disclosure, the bottom portions of the first scribe line 10a and the second scribe line 10b are located on the surface of the gate insulating layer 22. This can further relieve the stress inside the organic material layer 30, and reduce the degree of doming of the flexible display panel to the side where the flexible substrate 10 is located.
Similarly, fig. 6 is a cross-sectional view of another flexible display panel provided in the embodiment of the present disclosure, as shown in fig. 6, the organic material layer 30 is also located outside the second cutting street 10b, and the thickness of the organic material layer 30 at the first cutting street is also set to be 0, so as to further release the stress inside the organic material layer 30 and reduce the degree of arching of the flexible display panel to the side where the flexible substrate 10 is located.
Referring to fig. 2, the flexible display panel further includes a protective layer 40. The passivation layer 40 is located on a side of the organic material layer 30 away from the flexible substrate 10, and extends along a sidewall of the first scribe line 10a to a bottom of the first scribe line 10a, and extends along a sidewall of the second scribe line 10b to a bottom of the second scribe line 10 b.
Illustratively, the protective layer 40 may be a touch protective layer (TOC). By arranging the protective layer 40, the protective layer 40 covers the surface of the organic material layer 30, so that the organic material layer 30 can be protected and the organic material layer 30 is prevented from being corroded by water and oxygen. And the protective layer 40 extends from the side wall to the bottom of the scribe line, which can prevent water and oxygen from eroding the organic material layer 30 from the side wall of the scribe line. For the flexible display panel shown in fig. 5, the protective layer 40 extends along the side wall of the scribe line to the bottom of the scribe line and extends to the inorganic material layer 20, so that even after the scribe line is cut, the cut section does not expose the organic material layer 30, and the organic material layer 30 can be better protected from water and oxygen.
Fig. 7 is a flowchart of a method for manufacturing a flexible display panel according to an embodiment of the present disclosure. The method is used for manufacturing any one of the flexible display panels shown in fig. 1 to 6. As shown in fig. 7, the manufacturing method includes:
step S11: a flexible substrate is provided.
Step S12: an inorganic material layer is formed on one side of the flexible substrate.
Step S13: and forming a first cutting channel and a second cutting channel on one surface of the inorganic material layer far away from the flexible substrate.
Referring to fig. 1, a first scribe line 10a is located at a boundary between a bonding region 102 and a non-display region 104, a second scribe line 10b is located at a boundary between a rough-cut region 103 and the non-display region 104 and connected to the first scribe line 10a, and an orthographic projection of the first scribe line 10a and the second scribe line 10b on the surface of the flexible substrate 10 is located within an orthographic projection of the inorganic material layer 20 on the surface of the flexible substrate 10.
In the embodiment of the present disclosure, the inorganic material layer 20 separates the first cutting street 10a from the flexible substrate 10, and separates the second cutting street 10b from the flexible substrate 10, so that when the flexible display panel is peeled off from the surface of the substrate 100 in the process of manufacturing the flexible display panel, the inorganic material layer 20 can play a role of blocking, and prevent gas from further entering the flexible display panel, thereby avoiding forming bubbles, and facilitating to improve the yield of the flexible display panel.
Fig. 8 is a flowchart of a method for manufacturing a flexible display panel according to an embodiment of the present disclosure. The method is used for manufacturing any one of the flexible display panels shown in fig. 1 to 7. As shown in fig. 8, the manufacturing method includes:
step S21: a flexible substrate is provided.
The flexible substrate 10 is located on the surface of the substrate 100, and the substrate 100 can keep the flexible substrate 10 flat.
The flexible substrate 10 is provided with a display area 101, a binding area 102, a rough cutting area 103 and a non-display area 104, wherein the binding area 102 is connected with the display area 101, the rough cutting area 103 is positioned on one side of the binding area 102 far away from the display area 101 and is connected with the binding area 102, and the non-display area 104 surrounds the display area 101, the binding area 102 and the rough cutting area 103.
Step S22: a thin film of an inorganic material is formed on one side of a flexible substrate.
The inorganic material film may have a multi-layer structure, and may be specifically configured according to the structure of the inorganic material layer 20 in the flexible display panel to be manufactured. For example, taking the flexible display panel shown in fig. 5 as an example, in this example, the inorganic material layer 20 includes the barrier layer 21, the gate insulating layer 22, and the interlayer dielectric layer 23, and the inorganic material thin film includes 3 layers corresponding to the 3 film layers, respectively.
Step S23: and etching the inorganic material film to reduce the thickness of the inorganic material film at the positions of the first cutting channel and the second cutting channel to be formed.
The position of the first cutting street 10a and the position of the second cutting street 10b have been determined when designing the flexible display panel. In the embodiment of the present disclosure, the thickness of the inorganic material layer 20 at the first scribe line 10a is reduced to 1500 to 8000 a, and the thickness of the inorganic material layer 20 at the second scribe line 10b is also reduced to 1500 to 8000 a by etching.
The etching in step S23 may be performed by one-time etching or by multiple times of etching, where each time an inorganic material film with a certain thickness is etched, so as to reduce the thickness of the inorganic material film at the positions where the first scribe line 10a and the second scribe line 10b are to be formed to within a designed range.
Step S24: and etching the inorganic material film, and removing the inorganic material film at the position where the third cutting path is to be formed.
The third scribe line 10c is located at the boundary between the bonding area 102 and the non-display area 104, and the third scribe line 10c is located at one end of the first scribe line 10a close to the display area 101 and connected to the first scribe line 10 a. The third cutting lane 10c is arc-shaped.
The process of removing the inorganic material thin film at the position where the third street 10c is to be formed may be performed while etching the inorganic material thin film at the position where the first street 10a and the second street 10b are to be formed. By removing the inorganic material film at the position where the third cutting street 10c is to be formed, the orthographic projection of the subsequently formed third cutting street 10c on the surface of the flexible substrate 10 is positioned outside the orthographic projection of the inorganic material layer 20 on the surface of the flexible substrate 10.
And finishing etching the inorganic material film to obtain the inorganic material layer.
Step S25: and forming an organic material film on the surface of the inorganic material layer far away from the flexible substrate.
The organic material film may have a multi-layer structure, and may be specifically configured according to the structure of the organic material layer 30 in the flexible display panel to be manufactured. For example, taking the flexible display panel shown in fig. 5 as an example, in this example, the organic material layer 30 includes a first planarizing layer 31, a second planarizing layer 32, and a pixel defining layer 33, and the organic material thin film includes 3 layers corresponding to the 3 film layers, respectively.
Step S26: and removing at least part of the thickness of the organic material film at the position where the first cutting channel and the second cutting channel are to be formed to form the first cutting channel and the second cutting channel.
In the embodiment of the present disclosure, at least a part of the thickness of the organic material film is removed at the position where the third scribe line 10c is to be formed, and the third scribe line 10c is formed.
By forming the dicing streets, the organic material layer 30 is obtained.
The removal of the organic material film may be performed by a patterning process, and the specific process is the same as that in the related art, which is not described herein again.
The organic material layer 30 is formed to have a thickness at the cutting street smaller than the thickness at both sides of the cutting street by removing at least a part of the thickness of the organic material film at the position where the cutting street is to be formed. The stress in the organic material layer 30 can be released to some extent, and the degree of the flexible display panel arching toward the side of the flexible substrate 10 is reduced.
In some examples, the entire thickness of the organic material thin film is removed at the positions where the first cutting street 10a and the second cutting street 10b are to be formed. That is, the organic material layer 30 is formed to be located outside the first scribe line 10a and the second scribe line 10 b. This can further relieve the stress inside the organic material layer 30, and reduce the degree of doming of the flexible display panel to the side where the flexible substrate 10 is located.
Step S27: a protective layer 40 is formed on the surface of the organic material layer 30.
The protection layer 40 is located on a side of the organic material layer 30 away from the flexible substrate 10, a sidewall of the first scribe line 10a, and a sidewall of the second scribe line 10 b.
Illustratively, the protective layer 40 may be a touch protective layer. By arranging the protective layer 40, the protective layer 40 covers the surface of the organic material layer 30, so that the organic material layer 30 can be protected and the organic material layer 30 is prevented from being corroded by water and oxygen. And the protective layer 40 extends from the side wall to the bottom of the scribe line, which can prevent water and oxygen from eroding the organic material layer 30 from the side wall of the scribe line.
The above description is intended to be exemplary only and not to limit the present disclosure, and any modification, equivalent replacement, or improvement made without departing from the spirit and scope of the present disclosure is to be considered as the same as the present disclosure.
Claims (15)
1. A flexible display panel comprising a flexible substrate (10) and a layer of inorganic material (20), the layer of inorganic material (20) being located on one side of the flexible substrate (10);
the flexible substrate (10) is provided with a display area (101), a binding area (102), a rough cutting area (103) and a non-display area (104), the binding area (102) is connected with the display area (101), the rough cutting area (103) is positioned on one side, away from the display area (101), of the binding area (102) and is connected with the binding area (102), and the non-display area (104) surrounds the display area (101), the binding area (102) and the rough cutting area (103);
the surface of the flexible display panel is provided with at least a first cutting channel (10a) and a second cutting channel (10b), the first cutting channel (10a) is positioned at the junction of the binding area (102) and the non-display area (104), and the second cutting channel (10b) is positioned at the junction of the rough-cut area (103) and the non-display area (104) and is connected with the first cutting channel (10 a);
the orthographic projection of the first cutting channel (10a) and the second cutting channel (10b) on the surface of the flexible substrate (10) is positioned in the orthographic projection of the inorganic material layer (20) on the surface of the flexible substrate (10).
2. The flexible display panel according to claim 1, wherein the inorganic material layer (20) satisfies at least one of:
the thickness of the inorganic material layer (20) at the first cutting path (10a) is smaller than the thickness of the inorganic material layer (20) at two sides of the first cutting path (10 a);
the thickness of the inorganic material layer (20) at the second cutting path (10b) is smaller than the thickness of the inorganic material layer (20) at two sides of the second cutting path (10 b).
3. The flexible display panel of claim 2,
the thickness of the inorganic material layer (20) at the first cutting line (10a) is 1500 to 8000 angstrom;
the thickness of the inorganic material layer (20) at the second scribe line (10b) is 1500 to 8000 angstroms.
4. The flexible display panel according to claim 1, wherein the surface of the flexible display panel further has a third scribe line (10c), the third scribe line (10c) is located at the intersection of the bonding region (102) and the non-display region (104), and is located at an end of the first scribe line (10a) close to the display region (101) and connected to the first scribe line (10a), the third scribe line (10c) has an arc shape, and an orthographic projection of the third scribe line (10c) on the surface of the flexible substrate (10) is located outside an orthographic projection of the inorganic material layer (20) on the surface of the flexible substrate (10).
5. The flexible display panel according to any of claims 1 to 4, further comprising an organic material layer (30), wherein the organic material layer (30) is located on a surface of the inorganic material layer (20) away from the flexible substrate (10).
6. The flexible display panel of claim 5,
the thickness of the organic material layer (30) at the first cutting path (10a) is smaller than the thickness of the organic material layer (30) at two sides of the first cutting path (10 a); and/or the presence of a gas in the gas,
the thickness of the organic material layer (30) at the second cutting line (10b) is smaller than the thickness of the organic material layer (30) at two sides of the second cutting line (10 b).
7. The flexible display panel according to claim 6, wherein the organic material layer (30) comprises a first planarization layer (31), a second planarization layer (32) and a pixel defining layer (33) sequentially stacked on the inorganic material layer (20), and wherein the bottom of the first scribe line (10a) and/or the bottom of the second scribe line (10b) are/is located on the surface of the first planarization layer (31).
8. The flexible display panel according to claim 5, wherein the organic material layer (30) is located outside the first cut (10a) and/or the second cut (10 b).
9. The flexible display panel of claim 8,
the inorganic material layer (20) comprises a barrier layer (21), a gate insulating layer (22) and an interlayer dielectric layer (23) which are sequentially stacked on the surface of the flexible substrate (10), and the bottoms of the first cutting channel (10a) and/or the second cutting channel (10b) are positioned on the surface of the gate insulating layer (22).
10. The flexible display panel according to any one of claims 6 to 9, further comprising a protective layer (40), wherein the protective layer (40) is located on a side of the organic material layer (30) away from the flexible substrate (10), and extends along a sidewall of the first scribe line (10a) to a bottom of the first scribe line (10a) and along a sidewall of the second scribe line (10b) to a bottom of the second scribe line (10 b).
11. A method for manufacturing a flexible display panel, the method comprising:
providing a flexible substrate (10), wherein the flexible substrate (10) is provided with a display area (101), a binding area (102), a rough cutting area (103) and a non-display area (104), the binding area (102) is connected with the display area (101), the rough cutting area (103) is positioned on one side of the binding area (102) far away from the display area (101) and is connected with the binding area (102), and the non-display area (104) surrounds the display area (101), the binding area (102) and the rough cutting area (103);
forming an inorganic material layer (20) on one side of the flexible substrate (10);
forming a first cutting channel (10a) and a second cutting channel (10b) on the surface, far away from the flexible substrate (10), of the inorganic material layer (20), wherein the first cutting channel (10a) is located at the junction of the bonding area (102) and the non-display area (104), the second cutting channel (10b) is located at the junction of the rough cutting area (103) and the non-display area (104) and is connected with the first cutting channel (10a), and the orthographic projection of the first cutting channel (10a) and the orthographic projection of the second cutting channel (10b) on the surface of the flexible substrate (10) are located in the orthographic projection of the inorganic material layer (20) on the surface of the flexible substrate (10).
12. The method of claim 11, wherein the forming of the inorganic material layer (20) on the one side of the flexible substrate (10) comprises:
forming an inorganic material thin film on one side of the flexible substrate (10);
and etching the inorganic material film, and reducing the thickness of the inorganic material film at the positions of the first cutting channel (10a) and the second cutting channel (10b) to be formed to obtain the inorganic material layer (20).
13. The method according to claim 11 or 12, wherein the forming of the first cutting lane (10a) and the second cutting lane (10b) on the side of the inorganic material layer (20) away from the flexible substrate (10) comprises:
forming a thin film of organic material on the surface of the inorganic material layer (20) away from the flexible substrate (10);
and removing at least partial thickness of the organic material film at the position where the first cutting channel (10a) and the second cutting channel (10b) are to be formed, forming the first cutting channel (10a) and the second cutting channel (10b), and obtaining an organic material layer (30).
14. The method of manufacturing according to claim 13, wherein after forming the thin film of inorganic material on one side of the flexible substrate (10), the method further comprises:
etching the inorganic material film, and removing the inorganic material film at a position where a third cutting path (10c) is to be formed;
the manufacturing method further comprises the following steps:
and removing at least partial thickness of the organic material film at a position where the third cutting lane (10c) is to be formed, so as to form the third cutting lane (10c), wherein the third cutting lane (10c) is located at the intersection of the bonding area (102) and the non-display area (104), is located at one end, close to the display area (101), of the first cutting lane (10a), and is connected with the first cutting lane (10a), the third cutting lane (10c) is arc-shaped, and the orthographic projection of the third cutting lane (10c) on the surface of the flexible substrate (10) is located outside the orthographic projection of the inorganic material layer (20) on the surface of the flexible substrate (10).
15. The method of manufacturing of claim 14, further comprising:
and forming a protective layer (40) on the surface of the organic material layer (30), wherein the protective layer (40) is positioned on one surface, away from the flexible substrate (10), of the organic material layer (30), and on the side wall of the first cutting channel (10a) and the side wall of the second cutting channel (10 b).
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