CN103545463A - Flexible display device and manufacturing method thereof - Google Patents
Flexible display device and manufacturing method thereof Download PDFInfo
- Publication number
- CN103545463A CN103545463A CN201310448311.XA CN201310448311A CN103545463A CN 103545463 A CN103545463 A CN 103545463A CN 201310448311 A CN201310448311 A CN 201310448311A CN 103545463 A CN103545463 A CN 103545463A
- Authority
- CN
- China
- Prior art keywords
- display device
- flexible display
- substrate
- flexible
- manufacture method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention discloses a flexible display device and a manufacturing method thereof. the manufacturing method includes the steps of adhering a releasing layer on a glass substrate, coating adhesive on the periphery of the releasing layer to form a carrier substrate, coating organic materials on the carrier substrate to form an organic film, heating the carrier substrate to realize cross-linking solidification of the organic film and the adhesive to form a flexible substrate, sealing edges of the manufactured flexible substrate and the manufactured carrier substrate, respectively forming an organic film and an inorganic film on the flexible substrate by alternately adopting the organic materials and inorganic materials so as to form a blocking layer by the organic film and the inorganic film, manufacturing a TFT (thin film transistor) array for driving the flexible display device on the blocking layer, manufacturing an OLED (organic light emitting diode) device on the TFT array, alternately depositing the organic film and inorganic film to form a sealing layer, and stripping the flexible display device from the carrier substrate along a cutting line to complete manufacturing of the flexible display device.
Description
Technical field
The present invention relates to flexible display device manufacturing technology field, relate in particular to a kind of flexible display device and preparation method thereof.
Background technology
Flexible display is called again can rollable display, be adopt the visual panel that flexible material makes and form can any diastrophic display unit, it comprises Electronic Paper, flexible liquid crystal display and flexible organic electro-luminescence display device.Compare with common rigid display, flexible display has plurality of advantages: lightweight, volume is little, slimming, easy to carry; High-low temperature resistant, shock-resistant, shock resistance is stronger, and adaptable operational environment is wider; Can be curling, profile has more the aesthetic feeling of Art Design; The coil type production technology that adopts typography, cost is cheaper; Low in energy consumption, more energy-conservation; Organic material degradable, environmental protection.
In recent years, flexible demonstration (Flexible Display) technical development is rapid, is the study hotspot of domestic and international each colleges and universities and research institution, and various advanced manufacture crafts and technology are constantly progressive, make flexible display not only screen size constantly increase, and display quality also improves constantly.
In prior art, the preparation method of flexible demonstration product is mainly divided into two classes:
The first kind is the production technology (roll to roll) that adopts volume to volume, by the mode of printing, directly on flexible base, board, prepare display device, but this technique is owing to being subject to the restriction of printing technology and demonstration ink material, can only prepare the lower product of some display precision requirements, and rate of finished products and reliability poor;
Equations of The Second Kind is to adopt the method for taking off that pastes, first flexible base, board is pasted and on hard substrate, prepare display device, after having prepared display device, peel off again hard substrate, take out flexible display device, this method does not affect the making precision of display device, and the traditional TFT-LCD of making apparatus and technique and making is similar, needn't do too large adjustment, therefore be more conducive in a short time volume production application, it is at present than the way that is easier to realize that employing pastes the method for taking off, but this method need to utilize adhesive that organic plastics substrate is pasted on glass substrate, after having prepared display device, at its back side, adopt the method for high energy laser beam scanning, make adhesive generation deterioration by oxidation, adhesive performance declines, thereby organic plastics substrate can be stripped down from glass substrate.Institute is in this way higher to adhesive performance requirement, complex procedures, and stripping process needs high energy laser beam scanning, and energy consumption is high, production efficiency is low, and the uniformity of peeling off is also poor.In addition, its mode pasting cannot guarantee the evenness of plastic base, because the flatness of any one material surface of glass substrate, adhesive or plastic base itself all can directly have influence on the performance of flexible device, so product quality is difficult to control.
Therefore, prior art has yet to be improved and developed.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art, the object of the present invention is to provide a kind of flexible display device and preparation method thereof, be intended to solve complex procedures in existing flexible display preparation technology, energy consumption is high, efficiency is low, the unmanageable problem of product quality.
Technical scheme of the present invention is as follows:
A manufacture method for flexible display device, wherein, comprises step:
A, on glass substrate, attach release layer, then in release layer surrounding, apply bonding agent and form carrier substrate;
B, on carrier substrate, apply organic material and form organic film, and heating, make organic film and bonding agent generation crosslinking curing form flexible substrate;
C, the flexible substrate making and carrier substrate are carried out to edge sealing processing;
D, in flexible substrate, adopt organic material and inorganic material to replace film forming, form respectively organic film and inorganic thin film, by organic film and inorganic thin film, jointly form barrier layer;
E, on barrier layer, make for driving the tft array of flexible display device;
F, on tft array, make OLED device;
G, alternating deposit organic film and inorganic thin film form encapsulated layer;
H, along line of cut, flexible display device is stripped down from carrier substrate, complete the making of flexible display device.
The manufacture method of described flexible display device, wherein, the material of described release layer is poly-fluorine organic film.
The manufacture method of described flexible display device, wherein, the material of described bonding agent is polyimides glue.
The manufacture method of described flexible display device, wherein, described polyimides glue forms the rectangle frame of preset width along the surrounding of carrier substrate.
The manufacture method of described flexible display device, wherein, the ground floor of described barrier layer is organic film, the second layer is inorganic thin film.
The manufacture method of described flexible display device, wherein, the one-tenth membrane material of described organic film is one or more in PEN, PETG, polyimides and Parylene.
The manufacture method of described flexible display device, wherein, the one-tenth membrane material of described inorganic thin film is Al
2o
3, SiN
xand SiO
xn
yin one or more.
The manufacture method of described flexible display device, wherein, wherein one deck inorganic thin film is thermal insulation layer.
The manufacture method of described flexible display device, wherein, the material of described thermal insulation layer is fluorinated diamond-like carbon.
, wherein, adopt manufacture method as above to make.
, wherein, described flexible display device comprises:
Flexible substrate;
Be arranged on the barrier layer alternately being formed by organic film and inorganic thin film on flexible substrate;
Be arranged on the tft array on barrier layer;
Be arranged on the OLED device on tft array;
Be arranged on the encapsulated layer on OLED device.
Beneficial effect: flexible substrate of the present invention adopts coating method film forming, film characteristics is easily controlled, by carrier substrate and flexible substrate are carried out to bound edge processing, obtained good water vapor rejection performance, the harmful effect of effectively having avoided the infiltration of steam in base-plate cleaning and device fabrication processes to bring.Simultaneously, consider at high temperature labile problem of organic material, the present invention adopts organic film, inorganic thin film to replace film forming, thermal insulation layer is set simultaneously, can not only play the effect that intercepts steam and oxygen, can also play good effect of heat insulation, effectively avoid because technological temperature is too high, causing in TFT preparation process fire resistant polyimide glue to lose efficacy, or at high temperature distortion of flexible substrate, bubble, the phenomenon such as come off.
Accompanying drawing explanation
Fig. 1 is the flow chart of the manufacture method preferred embodiment of flexible display device of the present invention.
Fig. 2 is the side structure schematic diagram that in manufacture method of the present invention, glass substrate attaches release layer and bonding agent.
Fig. 3 is the Facad structure schematic diagram that in manufacture method of the present invention, glass substrate attaches release layer and bonding agent.
Fig. 4 is the side structure schematic diagram that applies organic material filming in manufacture method of the present invention on carrier substrate.
Fig. 5 is the side structure schematic diagram that in manufacture method of the present invention, carrier substrate and flexible substrate is carried out to edge sealing processing.
Fig. 6 is the side structure schematic diagram of making barrier layer in manufacture method of the present invention in flexible substrate.
Fig. 7 is the side structure schematic diagram of making tft array in manufacture method of the present invention on barrier layer.
Fig. 8 is the side structure schematic diagram of making OLED device in manufacture method of the present invention on tft array.
Fig. 9 is the side structure schematic diagram of making encapsulated layer in manufacture method of the present invention.
Figure 10 is the side structure schematic diagram while cutting flexible display device in manufacture method of the present invention.
Figure 11 is the side schematic view of the flexible display device that completes in manufacture method of the present invention.
Embodiment
The invention provides a kind of flexible display device and preparation method thereof, for making object of the present invention, technical scheme and effect clearer, clear and definite, below the present invention is described in more detail.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
Refer to Fig. 1, Fig. 1 is the flow chart of preferred embodiment that the invention provides a kind of manufacture method of flexible display device, and as shown in the figure, it comprises step:
S1, on glass substrate, attach release layer, then in release layer surrounding, apply bonding agent and form carrier substrate;
S2, on carrier substrate, apply organic material and form organic film, and heating, make organic film and bonding agent generation crosslinking curing form flexible substrate;
S3, the flexible substrate making and carrier substrate are carried out to edge sealing processing, prevent that steam from permeating from the side;
S4, in flexible substrate, adopt organic material and inorganic material to replace film forming, form respectively organic film and inorganic thin film, by organic film and inorganic thin film, jointly form barrier layer;
S5, on barrier layer, make for driving the tft array of flexible display device;
S6, on tft array, make OLED device;
S7, alternating deposit organic film and inorganic thin film form encapsulated layer;
S8, along line of cut, flexible display device is stripped down and makes flexible display from carrier substrate.
The present embodiment is by attaching release layer at glass substrate, solved the bonding problem that too closely inconvenience is peeled off of organic film and glass substrate, organic material adopts the mode film forming applying simultaneously, film characteristics is easily controlled, after edge sealing is processed, can effectively prevent that in base-plate cleaning and device fabrication processes, water vapor permeable causes flexible substrate to depart from the phenomenon of carrier substrate, in addition the barrier layer that, organic film and inorganic thin film alternating deposit form can be avoided the too high harmful effect that flexible substrate is caused of TFT process temperatures.
Below in conjunction with accompanying drawing, respectively each step of above-described embodiment is elaborated.
In step S1, as shown in Figures 2 and 3, first at glass substrate 11(electron level glass substrate) the upper release layer 12 that attaches, the material of release layer 12 is resistant to elevated temperatures poly-fluorine organic film, RICHMOND A5000 for example, VAC-PAK A6200, E3760, VAC-PAK E4760, E2760 etc., poly-fluorine organic film is to epoxy resin, BMI(bismaleimides), polyimides etc. have chemical inertness, fluorine can not transferred in flexible substrate material, and the cementability of poly-fluorine organic film and glass substrate is also better than flexible substrate, institute so that flexible substrate from carrier substrate, peel off.
Then in release layer 12 surroundings, apply bonding agent 13 and form carrier substrate, bonding agent 13 materials that the present embodiment adopts are polyimides glue, this polyimides glue is preferably the fire resistant polyimide glue through improved properties, it has high-temperature stability, strong to the cementability of flexible substrate and electronic glass substrate.
Described polyimides glue forms the rectangle frame of preset width along the surrounding of carrier substrate, in conjunction with Fig. 2 and Fig. 3, bonding agent 13 rectangle frame width are 10mm, and height and release layer 12 consistency of thickness, can guarantee like this thickness evenness of flexible substrate.Even glass substrate 11 is of a size of 200mm*200mm, and release layer 12 is of a size of 190mm*190mm, and is positioned at glass substrate 11 centers, and polyimides glue is that width is the square frame of 10mm.
In step S2, as shown in Figure 4, on carrier substrate, apply organic material (can adopt the identical material of following organic film 16) film forming, form organic film, to cover release layer 12 and bonding agent 13, then heating, makes organic film and polyimides glue generation crosslinking curing form flexible substrate 14;
In step S3, for fear of flexible substrate 14, in display device manufacturing process, come off, resistant to elevated temperatures polyimides glue is made to the form (sealed plastic box 15) of adhesive tape, then utilize the adhesive tape of making to carry out edge sealing (envelope frame) to whole carrier substrate, flexible substrate 14 and process, prevent that steam from permeating from the side.
As shown in Figure 5, flexible substrate 14 thickness are 20 μ m, release layer 12 thickness are 30 μ m, glass substrate 11 thickness are 0.7mm, the thickness of sealed plastic box 15 extension edges is 50 μ m, the side thickness of sealed plastic box 15 is 850 μ m, the sealed plastic box band of flexible substrate 14 upper and lower surfaces (i.e. two extension edges) area coverage equates with the area coverage of bonding agent 13, can not only guarantee so not to be subject in device fabrication processes solvent effect, another one benefit is, after element manufacturing completes, resistant to elevated temperatures polyimides glue becomes buff, can be used as the mark of device cutting.
In step S4, flexible substrate 13 due to organic material formation such as polyimides, its water oxygen permeability is high, directly affect stability and the useful life of tft array and OLED device (organic light emitting diode), the present embodiment adopts alternately film forming formation barrier layer of organic film 16 and inorganic thin film 17, carry out protection device, the one-tenth membrane material of organic film 16 is wherein PEN (PEN), PETG (PET), one or more in polyimides (PI) and Parylene (Parylene), mainly play the smooth effect in interface, the one-tenth membrane material of inorganic thin film 17 is wherein Al
2o
3, SiN
xand SiO
xn
yin one or more, inorganic thin film 17 has double action: the first, play the effect that stops steam, oxygen, the second, play heat insulation effect.Wherein, heat insulation reason is higher because will further realize resolution, response speed is display effect faster, display device need adopt high temperature TFT technique, and the technological temperature of various high temperature TFT techniques of the prior art is: LTPS TFT technological temperature is up to 550 ℃, a-Si TFT technological temperature reaches 300 ℃, Oxide TFT technological temperature is also 300 ℃ of left and right, general plastic base cannot bear so high temperature at all, so although flexible substrate 14 resistances to elevated temperatures are better in the present invention, but so high temperature still can cause that the phenomenon expanding appears in material, cause affecting the aligning accuracy in TFT manufacturing process, and excess Temperature also can affect the stability of flexible substrate 14, therefore, need to adopt certain heat insulation technique to solve the problems referred to above.In the barrier layer of the present embodiment, inorganic thin film preferably adopts high thermal insulation carbon film, for example C
60f
60deng fluorinated diamond-like carbon material, make, this material has good heat-proof quality, be applied to barrier layer, can not only play the effect that intercepts steam and oxygen, can also play good effect of heat insulation simultaneously, inorganic thin film and organic film alternately form barrier layer simultaneously, can solve preferably the problem of heat insulation problem and obstruct steam and oxygen simultaneously.
Specifically, as shown in Figure 6, in described barrier layer, ground floor is organic film 16, because organic film 16 has good covering property, can play smooth effect, for inorganic thin film 17 depositions provide good surface topography; The second layer is inorganic thin film 17, and inorganic thin film 17 compact structures are good, and water oxygen is had to good iris action; The 3rd layer is organic film 16, because inorganic thin film 17 film forming rear surface flatness are inadequate, deposition of organic thin film 16 can play the effect of flat surfaces; The 4th layer is thermal insulation layer 18, and it can play the heat conducting effect of effective obstruct, avoids flexible substrate 14 performance after high-temperature process to occur the problem of the whole element manufacturing of de-stabilising effect.On the thermal insulation layer 18 of the 4th layer, also can continue to be arranged alternately organic film 16 and inorganic thin film 17, as shown in Figure 6 simultaneously.
In step S5, as shown in Figure 7, on barrier layer, make for driving such as aforesaid LTPS, IGZO, a-Si etc. of tft array 19(of flexible display device); According to the difference of TFT technological temperature, need select flexible substrate material, bonding agent, release layer and barrier layer that resistance to elevated temperatures is different.
In step S6, as shown in Figure 8, on tft array 19, make OLED device 20(Organic Light Emitting Diode); Tft array 19 and OLED device 20 form AMOLED(active matrix light-emitting diode jointly like this).
In step S7; as shown in Figure 9; need alternating deposit organic film and inorganic thin film (can adopt respectively above-mentioned organic film 16, material that inorganic thin film 17 is identical) to form encapsulated layer 21, to protect flexible display device, avoid being subject to the impact of water oxygen, dust and stress in atmospheric environment.
In step S8, as shown in figure 10, along line of cut 22, flexible display device is stripped down from carrier substrate, line of cut 22 is herein positioned at polyimides glue (bonding agent 13) and release layer 12 intersections, resistant to elevated temperatures polyimides glue can also keep cementability after high-temperature process, but darken, so just in time can be used as the mark of line of cut.Cementability different of utilizing release layer 12 and glass substrate 11 and flexible substrate 14, can adopt mechanical system easily that flexible display device is separated with carrier substrate, obtain flexible display device, as shown in figure 11.
Based on said method, the present invention also provides a kind of flexible display device, and it adopts above-mentioned manufacture method to make.Specifically, this flexible display device comprises:
Flexible substrate;
Be arranged on the barrier layer alternately being formed by organic film and inorganic thin film on flexible substrate;
Be arranged on the tft array on barrier layer;
Be arranged on the OLED device on tft array;
Be arranged on the encapsulated layer on OLED device.
In sum, flexible substrate of the present invention adopts coating method film forming, film characteristics is easily controlled, and resistant to elevated temperatures polyimides glue and flexible substrate and carrier substrate are bonding closely, by carrier substrate and flexible substrate being carried out to bound edge processing with Kapton Tape, obtained good water vapor rejection performance, the harmful effect of effectively having avoided the infiltration of steam in base-plate cleaning and device fabrication processes to bring.Simultaneously, the present invention considers at high temperature labile problem of organic material, adopt organic film, inorganic thin film to replace film forming, thermal insulation layer is set simultaneously, can not only play the effect that intercepts steam and oxygen, can also play good effect of heat insulation, effectively avoid because technological temperature is too high, causing in TFT preparation process fire resistant polyimide glue to lose efficacy, or at high temperature distortion of flexible substrate, bubble, the phenomenon such as come off.
Should be understood that, application of the present invention is not limited to above-mentioned giving an example, and for those of ordinary skills, can be improved according to the above description or convert, and all these improvement and conversion all should belong to the protection range of claims of the present invention.
Claims (11)
1. a manufacture method for flexible display device, is characterized in that, comprises step:
A, on glass substrate, attach release layer, then in release layer surrounding, apply bonding agent and form carrier substrate;
B, on carrier substrate, apply organic material and form organic film, and heating, make organic film and bonding agent generation crosslinking curing form flexible substrate;
C, the flexible substrate making and carrier substrate are carried out to edge sealing processing;
D, in flexible substrate, adopt organic material and inorganic material to replace film forming, form respectively organic film and inorganic thin film, by organic film and inorganic thin film, jointly form barrier layer;
E, on barrier layer, make for driving the tft array of flexible display device;
F, on tft array, make OLED device;
G, alternating deposit organic film and inorganic thin film form encapsulated layer;
H, along line of cut, flexible display device is stripped down from carrier substrate, complete the making of flexible display device.
2. the manufacture method of flexible display device according to claim 1, is characterized in that, the material of described release layer is poly-fluorine organic film.
3. the manufacture method of flexible display device according to claim 1, is characterized in that, the material of described bonding agent is polyimides glue.
4. the manufacture method of flexible display device according to claim 3, is characterized in that, described polyimides glue forms the rectangle frame of preset width along the surrounding of carrier substrate.
5. the manufacture method of flexible display device according to claim 3, is characterized in that, the ground floor of described barrier layer is organic film, and the second layer is inorganic thin film.
6. the manufacture method of flexible display device according to claim 5, is characterized in that, the one-tenth membrane material of described organic film is one or more in PEN, PETG, polyimides and Parylene.
7. the manufacture method of flexible display device according to claim 5, is characterized in that, the one-tenth membrane material of described inorganic thin film is Al
2o
3, SiN
xand SiO
xn
yin one or more.
8. the manufacture method of flexible display device according to claim 5, is characterized in that, wherein one deck inorganic thin film is thermal insulation layer.
9. the manufacture method of flexible display device according to claim 8, is characterized in that, the material of described thermal insulation layer is fluorinated diamond-like carbon.
10. a flexible display device, is characterized in that, adopts the manufacture method as described in as arbitrary in claim 1 to 9 to make.
11. 1 kinds of flexible display devices, is characterized in that, described flexible display device comprises:
Flexible substrate;
Be arranged on the barrier layer alternately being formed by organic film and inorganic thin film on flexible substrate;
Be arranged on the tft array on barrier layer;
Be arranged on the OLED device on tft array;
Be arranged on the encapsulated layer on OLED device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310448311.XA CN103545463B (en) | 2013-09-27 | 2013-09-27 | Flexible display device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310448311.XA CN103545463B (en) | 2013-09-27 | 2013-09-27 | Flexible display device and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103545463A true CN103545463A (en) | 2014-01-29 |
| CN103545463B CN103545463B (en) | 2017-02-01 |
Family
ID=49968709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310448311.XA Expired - Fee Related CN103545463B (en) | 2013-09-27 | 2013-09-27 | Flexible display device and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103545463B (en) |
Cited By (48)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104064685A (en) * | 2014-05-19 | 2014-09-24 | 京东方科技集团股份有限公司 | Flexible display substrate as well a manufacturing method thereof and flexible display device |
| CN104952780A (en) * | 2014-03-31 | 2015-09-30 | 新日铁住金化学株式会社 | Method of manufacturing a flexible device, a flexible device, a flexible device manufacturing apparatus and a resin solution for forming a flexible substrate |
| CN105024018A (en) * | 2014-04-29 | 2015-11-04 | Tcl集团股份有限公司 | Flexible display and manufacturing method thereof |
| CN105024016A (en) * | 2014-04-29 | 2015-11-04 | Tcl集团股份有限公司 | Flexible substrate, flexible display and manufacturing method thereof |
| CN105024017A (en) * | 2014-04-29 | 2015-11-04 | Tcl集团股份有限公司 | Flexible substrate, flexible display and manufacturing method thereof |
| CN105185809A (en) * | 2015-08-03 | 2015-12-23 | 深圳市华星光电技术有限公司 | Manufacturing method of flexible display screen, flexible glass substrate and flexible display screen |
| CN105280841A (en) * | 2014-07-18 | 2016-01-27 | Tcl集团股份有限公司 | Flexible AMOLED display device and manufacture method thereof |
| CN105321875A (en) * | 2014-07-18 | 2016-02-10 | Tcl集团股份有限公司 | Flexible substrate, flexible display and preparation methods thereof |
| CN105336875A (en) * | 2014-07-10 | 2016-02-17 | 上海和辉光电有限公司 | Flexible display device and mold release method thereof |
| CN105789243A (en) * | 2014-12-23 | 2016-07-20 | 深圳Tcl工业研究院有限公司 | High temperature TFT (Thin Film Transistor) composite substrate, preparation method of the high temperature TFT flexible substrate and preparation method of flexible display device |
| CN105789440A (en) * | 2014-12-23 | 2016-07-20 | 深圳Tcl工业研究院有限公司 | Composite substrate for fabricating flexible display, fabrication method of composite substrate and fabrication method of active matrix/organic light emitting diode (AMOLED) |
| CN105845844A (en) * | 2016-04-13 | 2016-08-10 | 信利半导体有限公司 | Flexible substrate manufacturing method, OLED (organic light-emitting diode) device manufacturing method and the applications thereof |
| CN104064685B (en) * | 2014-05-19 | 2016-11-30 | 京东方科技集团股份有限公司 | Flexible display substrates and manufacture method thereof and flexible display apparatus |
| WO2017028412A1 (en) * | 2015-08-20 | 2017-02-23 | 京东方科技集团股份有限公司 | Organic light-emitting diode device, manufacturing method, and display apparatus |
| CN106505152A (en) * | 2016-10-31 | 2017-03-15 | 武汉华星光电技术有限公司 | Flexible OLED panel manufacture method and flexible OLED panel |
| CN106654039A (en) * | 2016-09-27 | 2017-05-10 | 上海天马微电子有限公司 | Display panel, display device and manufacturing method of display panel |
| CN106848108A (en) * | 2017-01-23 | 2017-06-13 | 上海天马微电子有限公司 | A kind of flexible display panels and preparation method |
| CN106935596A (en) * | 2017-02-22 | 2017-07-07 | 武汉华星光电技术有限公司 | A kind of preparation method of flexible base board |
| WO2017133106A1 (en) * | 2016-02-06 | 2017-08-10 | 无锡威迪变色玻璃有限公司 | Flexible substrate structure and method of forming same, and flexible electronic device |
| CN107046006A (en) * | 2016-02-06 | 2017-08-15 | 合肥威迪变色玻璃有限公司 | Flexible base board structure and forming method thereof, flexible electronic device |
| CN107111984A (en) * | 2014-08-24 | 2017-08-29 | 柔宇科技有限公司 | Without substrate flexible display and its manufacture method |
| CN107331799A (en) * | 2017-08-11 | 2017-11-07 | 京东方科技集团股份有限公司 | OLED display panel, motherboard and test its cutting zone and the method cut to it |
| CN107482064A (en) * | 2017-08-28 | 2017-12-15 | 武汉华星光电半导体显示技术有限公司 | Thin film transistor (TFT) and preparation method thereof and array base palte |
| CN107546332A (en) * | 2016-06-29 | 2018-01-05 | 张家港市鸿嘉数字科技有限公司 | A kind of Encapsulation Methods for Flexible OLED |
| CN107546330A (en) * | 2016-06-29 | 2018-01-05 | 张家港市鸿嘉数字科技有限公司 | A kind of flexible OLED substrates |
| CN107611261A (en) * | 2017-08-14 | 2018-01-19 | 信利半导体有限公司 | A kind of preparation method of flexible oled substrate |
| CN107742628A (en) * | 2017-09-12 | 2018-02-27 | 奕瑞影像科技（太仓）有限公司 | Flexible scintillation screen, radiation image sensor and preparation method thereof |
| CN107768530A (en) * | 2017-11-15 | 2018-03-06 | 武汉华星光电半导体显示技术有限公司 | Flexible base board and preparation method thereof |
| CN108281388A (en) * | 2018-01-23 | 2018-07-13 | 京东方科技集团股份有限公司 | Array substrate, its production method and display panel |
| CN108336227A (en) * | 2018-01-19 | 2018-07-27 | 云谷（固安）科技有限公司 | Substrat structure of display screen and preparation method thereof, display screen, flexible display apparatus and preparation method thereof |
| CN108333819A (en) * | 2018-01-31 | 2018-07-27 | 武汉华星光电技术有限公司 | Display panel and its manufacturing method |
| CN108511629A (en) * | 2018-05-31 | 2018-09-07 | 京东方科技集团股份有限公司 | Oled display substrate and preparation method thereof, display device |
| CN108767127A (en) * | 2018-05-28 | 2018-11-06 | 武汉华星光电半导体显示技术有限公司 | A kind of production method of display panel, display panel and display device |
| CN108963101A (en) * | 2017-11-30 | 2018-12-07 | 广东聚华印刷显示技术有限公司 | The release layer and composite substrate of production for flexible display device |
| CN108962915A (en) * | 2017-11-30 | 2018-12-07 | 广东聚华印刷显示技术有限公司 | composite substrate and preparation method thereof |
| CN109300839A (en) * | 2018-09-29 | 2019-02-01 | 云谷（固安）科技有限公司 | Flexible substrates and preparation method thereof, flexible display panels, display device |
| CN109637384A (en) * | 2019-01-22 | 2019-04-16 | 深圳市洲明科技股份有限公司 | Display screen and its manufacturing method |
| WO2019178945A1 (en) * | 2018-03-20 | 2019-09-26 | 武汉华星光电半导体显示技术有限公司 | Display panel and manufacturing method therefor |
| CN110310922A (en) * | 2019-06-20 | 2019-10-08 | 信利半导体有限公司 | A kind of preparation method of flexible circuit device |
| CN110890380A (en) * | 2018-08-20 | 2020-03-17 | 瀚宇彩晶股份有限公司 | Method for manufacturing flexible substrate |
| CN111048461A (en) * | 2018-10-12 | 2020-04-21 | 瀚宇彩晶股份有限公司 | Release front structure of electronic device and manufacturing method of electronic device |
| WO2020124864A1 (en) * | 2018-12-18 | 2020-06-25 | 武汉华星光电半导体显示技术有限公司 | Display panel and manufacturing method therefor, and display device |
| CN111508365A (en) * | 2020-05-07 | 2020-08-07 | 深圳市华星光电半导体显示技术有限公司 | Flexible display panel and preparation method thereof |
| WO2021017100A1 (en) * | 2019-07-30 | 2021-02-04 | 武汉华星光电半导体显示技术有限公司 | Flexible substrate and preparation method therefor, and organic light-emitting display panel |
| CN113299426A (en) * | 2021-05-24 | 2021-08-24 | 河北大学 | Transparent conductive barrier film, preparation method and application thereof |
| CN113436533A (en) * | 2014-07-02 | 2021-09-24 | 天马微电子股份有限公司 | Folding display device |
| CN113763844A (en) * | 2021-08-31 | 2021-12-07 | 上海卫星工程研究所 | Red flag mark for Mars detection and mounting method |
| CN113888971A (en) * | 2021-09-30 | 2022-01-04 | 京东方科技集团股份有限公司 | Flexible display panel and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101833215A (en) * | 2009-03-09 | 2010-09-15 | 财团法人工业技术研究院 | Transfer structure of flexible electronic device and manufacturing method thereof |
| CN102176435A (en) * | 2010-12-27 | 2011-09-07 | 友达光电股份有限公司 | Flexible substrate structure and manufacturing method thereof |
| CN202145468U (en) * | 2011-05-06 | 2012-02-15 | 京东方科技集团股份有限公司 | Flexible organic electroluminescent device |
| CN102760846A (en) * | 2012-07-30 | 2012-10-31 | 信利半导体有限公司 | Flexible organic light emitting diode (OLED) and preparation method thereof |
-
2013
- 2013-09-27 CN CN201310448311.XA patent/CN103545463B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101833215A (en) * | 2009-03-09 | 2010-09-15 | 财团法人工业技术研究院 | Transfer structure of flexible electronic device and manufacturing method thereof |
| CN102176435A (en) * | 2010-12-27 | 2011-09-07 | 友达光电股份有限公司 | Flexible substrate structure and manufacturing method thereof |
| CN202145468U (en) * | 2011-05-06 | 2012-02-15 | 京东方科技集团股份有限公司 | Flexible organic electroluminescent device |
| CN102760846A (en) * | 2012-07-30 | 2012-10-31 | 信利半导体有限公司 | Flexible organic light emitting diode (OLED) and preparation method thereof |
Cited By (72)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104952780A (en) * | 2014-03-31 | 2015-09-30 | 新日铁住金化学株式会社 | Method of manufacturing a flexible device, a flexible device, a flexible device manufacturing apparatus and a resin solution for forming a flexible substrate |
| CN104952780B (en) * | 2014-03-31 | 2020-09-29 | 日铁化学材料株式会社 | Method for manufacturing flexible element, and flexible element manufacturing apparatus |
| CN105024016B (en) * | 2014-04-29 | 2018-06-19 | Tcl集团股份有限公司 | A kind of flexible base board, flexible display and preparation method thereof |
| CN105024018A (en) * | 2014-04-29 | 2015-11-04 | Tcl集团股份有限公司 | Flexible display and manufacturing method thereof |
| CN105024016A (en) * | 2014-04-29 | 2015-11-04 | Tcl集团股份有限公司 | Flexible substrate, flexible display and manufacturing method thereof |
| CN105024017A (en) * | 2014-04-29 | 2015-11-04 | Tcl集团股份有限公司 | Flexible substrate, flexible display and manufacturing method thereof |
| CN105024018B (en) * | 2014-04-29 | 2018-05-08 | Tcl集团股份有限公司 | A kind of flexible display and preparation method thereof |
| CN105024017B (en) * | 2014-04-29 | 2018-06-19 | Tcl集团股份有限公司 | A kind of flexible base board, flexible display and preparation method thereof |
| CN104064685B (en) * | 2014-05-19 | 2016-11-30 | 京东方科技集团股份有限公司 | Flexible display substrates and manufacture method thereof and flexible display apparatus |
| CN104064685A (en) * | 2014-05-19 | 2014-09-24 | 京东方科技集团股份有限公司 | Flexible display substrate as well a manufacturing method thereof and flexible display device |
| CN113436533A (en) * | 2014-07-02 | 2021-09-24 | 天马微电子股份有限公司 | Folding display device |
| CN105336875A (en) * | 2014-07-10 | 2016-02-17 | 上海和辉光电有限公司 | Flexible display device and mold release method thereof |
| CN105336875B (en) * | 2014-07-10 | 2017-10-13 | 上海和辉光电有限公司 | Flexible display device and its release method |
| CN105321875A (en) * | 2014-07-18 | 2016-02-10 | Tcl集团股份有限公司 | Flexible substrate, flexible display and preparation methods thereof |
| CN105280841A (en) * | 2014-07-18 | 2016-01-27 | Tcl集团股份有限公司 | Flexible AMOLED display device and manufacture method thereof |
| CN105321875B (en) * | 2014-07-18 | 2018-05-08 | Tcl集团股份有限公司 | A kind of flexible base board, flexible display and preparation method thereof |
| CN105280841B (en) * | 2014-07-18 | 2017-06-06 | Tcl集团股份有限公司 | A kind of flexible displayer part and preparation method thereof |
| CN107111984A (en) * | 2014-08-24 | 2017-08-29 | 柔宇科技有限公司 | Without substrate flexible display and its manufacture method |
| CN105789440A (en) * | 2014-12-23 | 2016-07-20 | 深圳Tcl工业研究院有限公司 | Composite substrate for fabricating flexible display, fabrication method of composite substrate and fabrication method of active matrix/organic light emitting diode (AMOLED) |
| CN105789243A (en) * | 2014-12-23 | 2016-07-20 | 深圳Tcl工业研究院有限公司 | High temperature TFT (Thin Film Transistor) composite substrate, preparation method of the high temperature TFT flexible substrate and preparation method of flexible display device |
| CN105185809B (en) * | 2015-08-03 | 2018-09-11 | 深圳市华星光电技术有限公司 | Production method, flexible glass substrate and the flexible display screen of flexible display screen |
| WO2017020372A1 (en) * | 2015-08-03 | 2017-02-09 | 深圳市华星光电技术有限公司 | Flexible glass substrate, flexible display screen and manufacturing method for flexible display screen |
| CN105185809A (en) * | 2015-08-03 | 2015-12-23 | 深圳市华星光电技术有限公司 | Manufacturing method of flexible display screen, flexible glass substrate and flexible display screen |
| US10181578B2 (en) | 2015-08-20 | 2019-01-15 | Boe Technology Group Co., Ltd. | Organic light-emitting diode (OLED) device, manufacturing method thereof and display device |
| WO2017028412A1 (en) * | 2015-08-20 | 2017-02-23 | 京东方科技集团股份有限公司 | Organic light-emitting diode device, manufacturing method, and display apparatus |
| CN107046006A (en) * | 2016-02-06 | 2017-08-15 | 合肥威迪变色玻璃有限公司 | Flexible base board structure and forming method thereof, flexible electronic device |
| WO2017133106A1 (en) * | 2016-02-06 | 2017-08-10 | 无锡威迪变色玻璃有限公司 | Flexible substrate structure and method of forming same, and flexible electronic device |
| CN105845844A (en) * | 2016-04-13 | 2016-08-10 | 信利半导体有限公司 | Flexible substrate manufacturing method, OLED (organic light-emitting diode) device manufacturing method and the applications thereof |
| CN107546332A (en) * | 2016-06-29 | 2018-01-05 | 张家港市鸿嘉数字科技有限公司 | A kind of Encapsulation Methods for Flexible OLED |
| CN107546330A (en) * | 2016-06-29 | 2018-01-05 | 张家港市鸿嘉数字科技有限公司 | A kind of flexible OLED substrates |
| CN106654039A (en) * | 2016-09-27 | 2017-05-10 | 上海天马微电子有限公司 | Display panel, display device and manufacturing method of display panel |
| CN106505152A (en) * | 2016-10-31 | 2017-03-15 | 武汉华星光电技术有限公司 | Flexible OLED panel manufacture method and flexible OLED panel |
| CN106848108A (en) * | 2017-01-23 | 2017-06-13 | 上海天马微电子有限公司 | A kind of flexible display panels and preparation method |
| CN106935596A (en) * | 2017-02-22 | 2017-07-07 | 武汉华星光电技术有限公司 | A kind of preparation method of flexible base board |
| CN107331799A (en) * | 2017-08-11 | 2017-11-07 | 京东方科技集团股份有限公司 | OLED display panel, motherboard and test its cutting zone and the method cut to it |
| CN107331799B (en) * | 2017-08-11 | 2018-10-19 | 京东方科技集团股份有限公司 | OLED display panel, motherboard and the method tested its cutting region and it is cut |
| CN107611261A (en) * | 2017-08-14 | 2018-01-19 | 信利半导体有限公司 | A kind of preparation method of flexible oled substrate |
| CN107482064B (en) * | 2017-08-28 | 2019-10-25 | 武汉华星光电半导体显示技术有限公司 | Thin film transistor and its manufacturing method and array substrate |
| CN107482064A (en) * | 2017-08-28 | 2017-12-15 | 武汉华星光电半导体显示技术有限公司 | Thin film transistor (TFT) and preparation method thereof and array base palte |
| WO2019041387A1 (en) * | 2017-08-28 | 2019-03-07 | 武汉华星光电半导体显示技术有限公司 | Thin-film transistor and manufacturing method therefor, and array substrate |
| US10483401B2 (en) | 2017-08-28 | 2019-11-19 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Thin-film transistor having oxide semiconductor channel layer vertically exending along lateral sides of source electrode, separation layer, and drain electrode and array substrate including same |
| CN107742628A (en) * | 2017-09-12 | 2018-02-27 | 奕瑞影像科技（太仓）有限公司 | Flexible scintillation screen, radiation image sensor and preparation method thereof |
| CN107768530A (en) * | 2017-11-15 | 2018-03-06 | 武汉华星光电半导体显示技术有限公司 | Flexible base board and preparation method thereof |
| US10658600B2 (en) | 2017-11-15 | 2020-05-19 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Method of fabricating flexible substrate having laminated material made of silicon oxide and amorphous silicon |
| CN107768530B (en) * | 2017-11-15 | 2020-01-17 | 武汉华星光电半导体显示技术有限公司 | Flexible substrate and manufacturing method thereof |
| CN108963101B (en) * | 2017-11-30 | 2022-08-26 | 广东聚华印刷显示技术有限公司 | Release layer for manufacturing flexible display device and composite substrate |
| CN108963101A (en) * | 2017-11-30 | 2018-12-07 | 广东聚华印刷显示技术有限公司 | The release layer and composite substrate of production for flexible display device |
| CN108962915A (en) * | 2017-11-30 | 2018-12-07 | 广东聚华印刷显示技术有限公司 | composite substrate and preparation method thereof |
| CN108336227A (en) * | 2018-01-19 | 2018-07-27 | 云谷（固安）科技有限公司 | Substrat structure of display screen and preparation method thereof, display screen, flexible display apparatus and preparation method thereof |
| CN108281388A (en) * | 2018-01-23 | 2018-07-13 | 京东方科技集团股份有限公司 | Array substrate, its production method and display panel |
| CN108281388B (en) * | 2018-01-23 | 2021-02-26 | 京东方科技集团股份有限公司 | Array substrate, manufacturing method thereof and display panel |
| CN108333819A (en) * | 2018-01-31 | 2018-07-27 | 武汉华星光电技术有限公司 | Display panel and its manufacturing method |
| CN108333819B (en) * | 2018-01-31 | 2021-03-23 | 武汉华星光电技术有限公司 | Display panel and method for manufacturing the same |
| WO2019178945A1 (en) * | 2018-03-20 | 2019-09-26 | 武汉华星光电半导体显示技术有限公司 | Display panel and manufacturing method therefor |
| CN108767127A (en) * | 2018-05-28 | 2018-11-06 | 武汉华星光电半导体显示技术有限公司 | A kind of production method of display panel, display panel and display device |
| US11751421B2 (en) | 2018-05-31 | 2023-09-05 | Beijing Boe Display Technology Co., Ltd. | OLED display substrate and method for preparing the same, and display device |
| CN108511629A (en) * | 2018-05-31 | 2018-09-07 | 京东方科技集团股份有限公司 | Oled display substrate and preparation method thereof, display device |
| CN110890380A (en) * | 2018-08-20 | 2020-03-17 | 瀚宇彩晶股份有限公司 | Method for manufacturing flexible substrate |
| CN109300839A (en) * | 2018-09-29 | 2019-02-01 | 云谷（固安）科技有限公司 | Flexible substrates and preparation method thereof, flexible display panels, display device |
| CN111048461A (en) * | 2018-10-12 | 2020-04-21 | 瀚宇彩晶股份有限公司 | Release front structure of electronic device and manufacturing method of electronic device |
| WO2020124864A1 (en) * | 2018-12-18 | 2020-06-25 | 武汉华星光电半导体显示技术有限公司 | Display panel and manufacturing method therefor, and display device |
| CN109637384A (en) * | 2019-01-22 | 2019-04-16 | 深圳市洲明科技股份有限公司 | Display screen and its manufacturing method |
| CN110310922A (en) * | 2019-06-20 | 2019-10-08 | 信利半导体有限公司 | A kind of preparation method of flexible circuit device |
| CN110310922B (en) * | 2019-06-20 | 2022-05-06 | 信利半导体有限公司 | Preparation method of flexible circuit device |
| WO2021017100A1 (en) * | 2019-07-30 | 2021-02-04 | 武汉华星光电半导体显示技术有限公司 | Flexible substrate and preparation method therefor, and organic light-emitting display panel |
| CN111508365B (en) * | 2020-05-07 | 2021-12-28 | 深圳市华星光电半导体显示技术有限公司 | Flexible display panel and preparation method thereof |
| CN111508365A (en) * | 2020-05-07 | 2020-08-07 | 深圳市华星光电半导体显示技术有限公司 | Flexible display panel and preparation method thereof |
| CN113299426A (en) * | 2021-05-24 | 2021-08-24 | 河北大学 | Transparent conductive barrier film, preparation method and application thereof |
| CN113299426B (en) * | 2021-05-24 | 2022-09-02 | 河北大学 | Transparent conductive barrier film, preparation method and application thereof |
| CN113763844A (en) * | 2021-08-31 | 2021-12-07 | 上海卫星工程研究所 | Red flag mark for Mars detection and mounting method |
| CN113888971A (en) * | 2021-09-30 | 2022-01-04 | 京东方科技集团股份有限公司 | Flexible display panel and manufacturing method thereof |
| CN113888971B (en) * | 2021-09-30 | 2023-11-17 | 京东方科技集团股份有限公司 | Flexible display panel and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103545463B (en) | 2017-02-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103545463A (en) | Flexible display device and manufacturing method thereof | |
| US20140162522A1 (en) | Method for manufacturing a flexible display device | |
| CN104465479B (en) | Flexible display substrates motherboard and the preparation method of flexible display substrates | |
| RU2671935C1 (en) | Matrix substrate and method of its production, flexible display panel and display device | |
| TWI432835B (en) | Flexible display panel and method of fabricating the same | |
| US10185422B2 (en) | Touch control structure of an AMOLED display screen | |
| US11195889B2 (en) | Method of manufacturing flexible display panel | |
| TWI377646B (en) | Substrate structures applied in flexible electrical devices and fabrication method thereof | |
| CN105024018B (en) | A kind of flexible display and preparation method thereof | |
| JP2013238863A5 (en) | Method of manufacturing a flexible display | |
| CN104409408A (en) | Manufacture method of rigid substrate and flexible display | |
| CN104751773B (en) | A kind of flexible display and its manufacture method | |
| US20190386215A1 (en) | Stripping method of flexible oled display device | |
| CN103177998A (en) | Method for taking off flexible device | |
| CN104377118A (en) | Manufacturing method of flexible displaying substrate and flexible displaying substrate | |
| CN106129088A (en) | A kind of display floater and preparation method, display device | |
| US11476420B2 (en) | Method of fabricating flexible OLED display panel and flexible OLED display panel | |
| WO2016011712A1 (en) | Method for manufacturing flexible display panel, and flexible display apparatus | |
| JP2012027177A (en) | Method of manufacturing flexible thin film transistor substrate | |
| TW201441675A (en) | Method of fabricating flexible color filter and flexible color display device | |
| CN104009059A (en) | Organic light emitting diode display and manufacturing method thereof, and donor substrate | |
| JP2013026546A (en) | Substrate for thin film device and method of manufacturing thin film device | |
| CN105280841A (en) | Flexible AMOLED display device and manufacture method thereof | |
| US20180213650A1 (en) | Manufacturing methods of flexible substrates and flexible panels by screen printing machines | |
| TWI457881B (en) | Flexible electronic paper display apparatus and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170201 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |