CN106935596A - A kind of preparation method of flexible base board - Google Patents
A kind of preparation method of flexible base board Download PDFInfo
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- CN106935596A CN106935596A CN201710098365.6A CN201710098365A CN106935596A CN 106935596 A CN106935596 A CN 106935596A CN 201710098365 A CN201710098365 A CN 201710098365A CN 106935596 A CN106935596 A CN 106935596A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 188
- 239000011521 glass Substances 0.000 claims abstract description 76
- 238000000034 method Methods 0.000 claims abstract description 39
- 239000000463 material Substances 0.000 claims description 67
- 239000004642 Polyimide Substances 0.000 claims description 13
- 229920001721 polyimide Polymers 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 claims description 11
- 238000000576 coating method Methods 0.000 claims description 11
- 230000008569 process Effects 0.000 claims description 8
- UHPJWJRERDJHOJ-UHFFFAOYSA-N ethene;naphthalene-1-carboxylic acid Chemical compound C=C.C1=CC=C2C(C(=O)O)=CC=CC2=C1 UHPJWJRERDJHOJ-UHFFFAOYSA-N 0.000 claims 1
- 239000012528 membrane Substances 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 description 8
- 230000035882 stress Effects 0.000 description 7
- 230000008901 benefit Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 229920001621 AMOLED Polymers 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000002679 ablation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- -1 formic acid glycol ester Chemical class 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 150000002790 naphthalenes Chemical class 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
- H01L21/7813—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate leaving a reusable substrate, e.g. epitaxial lift off
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses a kind of preparation method of flexible base board, including：Flexible substrates are formed on the glass substrate；The flexible substrates are mutually peeled off with the glass substrate；The edge of the flexible substrates is fixed on the glass substrate；Residual substrate processing procedure is completed in the flexible substrates；The flexible substrates are cut along desired trajectory, to obtain the flexible base board；Wherein, the desired trajectory is located at the inside in the region surrounded by the edge.The method can effectively discharge produced membrane stress in flexible substrates film forming processing procedure so that the flexible base board being made will not produce warpage, enhance the reliability of flexible base board and corresponding flexible device.
Description
Technical field
The invention belongs to display technology field, more particularly to a kind of preparation method of flexible base board.
Background technology
So-called flexible base board, is a kind of board structure that device is prepared on the substrate surface that flexible material is constituted.With
The continuous renewal of Display Technique and development, the flexible flexible device being made of flexible base board are expected to turn into photoelectricity of future generation
The main flow equipment of sub- device.Such as display, chip, circuit, power supply, sensor flexible device, they can not only realize passing
The irrealizable function of system opto-electronic device institute, while having the advantage of low cost, also helps improvement Consumer's Experience.
Existing flexible base board has that stress is difficult release.Such as conventional flexible AMOLED devices, use at present
Base material be generally polyimides (PI) or PEN (PEN), in the FEOL of flexible AMOLED
In need to carry out high-temperature process to flexible substrates, because the thermal expansion coefficient difference between base material and glass is larger, therefore,
Thermal stress can be produced in high temperature process., it is necessary to by flexible base board after manufacturing process on the whole plates for completing flexible base board
Mutually peeled off with glass substrate, flexible base board can discharge thermal stress, in turn result in the curling of flexible base board, can also be to flexibility when serious
The performance of the devices such as the thin film transistor (TFT) on substrate is affected greatly.
Therefore, need a kind of method of proposition badly, between releasing such glass substrate and flexible substrates due to thermal expansion coefficient difference
Caused membrane stress, improves the buckle resistance energy of flexible base board.
The content of the invention
One of technical problems to be solved by the invention be propose a kind of method with releasing such glass substrate and flexible substrates it
Between membrane stress caused by thermal expansion coefficient difference.
In order to solve the above-mentioned technical problem, embodiments herein provide firstly a kind of preparation method of flexible base board,
Including：Flexible substrates are formed on the glass substrate；The flexible substrates are mutually peeled off with the glass substrate；By the flexible base
The edge at bottom is fixed on the glass substrate；Residual substrate processing procedure is completed in the flexible substrates；Along desired trajectory to institute
State flexible substrates to be cut, to obtain the flexible base board；Wherein, the desired trajectory is located at the area surrounded by the edge
The inside in domain.
Preferably, the edge by the flexible substrates is fixed on the glass substrate, is specifically included：Will be described soft
Property substrate is laid on the surface of the glass substrate；In the fixed material of edge coating of the flexible substrates, and make described
Fixed material is contacted with the surface of the glass substrate；The fixed material is processed, so that the side of the flexible substrates
Edge is fixed on the glass substrate.
Preferably, the edge by the flexible substrates is fixed on the glass substrate, is specifically included：In the glass
Fixed material is coated on glass substrate, the coating position of the fixed material corresponds to the edge of the flexible substrates；Will be described soft
Property substrate is laid on the surface of the glass substrate, makes the fixed material completely by the edges cover of the flexible substrates；
The fixed material is processed, so that the edge of the flexible substrates is fixed on the glass substrate.
Preferably, it is non-volatile within the temperature range of the fixed material is at 450 DEG C or more than 450 DEG C.
Preferably, the fixed material is identical with the material of the flexible substrates.
Preferably, the fixed material includes polyimides or PEN.
Preferably, the fixed material is processed, so that the edge of the flexible substrates is fixed on the glass base
On plate, including：Carry out hot setting to the fixed material within the temperature range of 200-400 DEG C, the hot setting is held
The continuous time is 5-10min.
Preferably, the flexible substrates are mutually peeled off with the glass substrate using laser method.
Preferably, the energy range of the laser is 300-500mJ/cm2, the scanning overlapping range of laser is 20-60%.
Preferably, the minimum range between the desired trajectory and the edge keeps the skew of 5-10mm.
Compared with prior art, one or more embodiments in such scheme can have the following advantages that or beneficial effect
Really：
In the manufacturing process of flexible base board, by first mutually peeling off flexible substrates with glass substrate, then make flexible substrates
The mode mutually fixed with glass substrate of edge, effectively discharge produced membrane stress in flexible substrates film forming processing procedure,
So that the flexible base board being made will not produce warpage, the reliability of flexible base board and corresponding flexible device is improve.
Other advantages of the invention, target, and feature will be illustrated in the following description to a certain extent, and
And to a certain extent, based on being will be apparent to those skilled in the art to investigating hereafter, Huo Zheke
To be instructed from the practice of the present invention.Target of the invention and other advantages can be wanted by following specification, right
Specifically noted structure in book, and accompanying drawing is asked to realize and obtain.
Brief description of the drawings
Accompanying drawing is used for providing to the technical scheme of the application or further understanding for prior art, and constitutes specification
A part.Wherein, the accompanying drawing of expression the embodiment of the present application is used to explain the technical side of the application together with embodiments herein
Case, but do not constitute the limitation to technical scheme.
Fig. 1 is the schematic flow sheet of the preparation method of the flexible base board according to first embodiment of the invention；
Fig. 2 a- Fig. 2 f are the process chart of the preparation method of the flexible base board according to second embodiment of the invention；
Fig. 3 is the top view of Fig. 2 f；
Fig. 4 a- Fig. 4 f are the process chart of the preparation method of the flexible base board according to third embodiment of the invention；
Fig. 5 is the top view of Fig. 4 c.
Specific embodiment
Describe embodiments of the present invention in detail below with reference to drawings and Examples, how the present invention is applied whereby
Technological means solves technical problem, and reaches the implementation process of relevant art effect and can fully understand and implement according to this.This Shen
Each feature that please be in embodiment and embodiment, can be combined with each other under the premise of not colliding, the technical scheme for being formed
Within protection scope of the present invention.
First embodiment：
As shown in figure 1, the preparation method of flexible base board according to a first embodiment of the present invention specifically includes following steps：
Step S110, flexible substrates are formed on the glass substrate.
Step S120, flexible substrates are mutually peeled off with glass substrate.
Step S130, the edge of flexible substrates is fixed on the glass substrate.
Step S140, on a flexible substrate completion residual substrate processing procedure.
Step S150, flexible substrates are cut along desired trajectory, to obtain flexible base board.
Specifically, in step s 110, one layer of flexible material is first coated on the surface of the glass substrate of hard, for making
The substrate of standby flexible base board.The flexible material for being used can be flexible material commonly used in the prior art, for example, can be poly-
Polyimide PI or PEN PEN.
In a specific embodiment of the invention, flexible material is coated and toasted by the way of coating.
Making technology parameter could be arranged to, and carry out hot setting to flexible material within the temperature range of 120-450 DEG C, and high temperature is solid
The duration of change is 30-60min, and programming rate maintains 4-7 DEG C/min.The flexible substrates thickness of dry film of formation is 10-20 μ
m。
In the step s 120, flexible substrates and glass substrate are completely exfoliated (lift-off).
Lift-off manufacturing process is that glass substrate is contacted with flexible substrates using the means with high-energy-density
The flexible substrates of interface (atom bed boundary) carry out ablation, cause glass substrate to be separated from each other with flexible substrates.
In the present embodiment, specifically flexible substrates can mutually be peeled off with glass substrate using laser method.To soft
Property substrate and glass substrate when being peeled off, the energy range of laser is generally 300-500mJ/cm2, the scanning overlap model of laser
It is 20-60% to enclose.
In step s 130, it should be noted that flexible substrates is mutually fixed with glass substrate in edge, it is flexible
Other are used to form metal level and the part of insulating barrier remains in that the state being separated from each other with glass substrate in substrate.
In step S140, described residual substrate processing procedure refer in addition to the forming step of flexible substrates remaining be used for
The processing step of metal level and insulating barrier is formed on a flexible substrate.Formation, the data wire of thin film transistor (TFT) can for example be included
And the formation and the operation such as formation of each insulating barrier of scan line.It is not limited in the present embodiment, can be according to reality
Needs are implemented.
After step S140 is completed, in the flexible substrates for carrying out edge fixation with glass substrate, actually formed
Constitute the entire infrastructure of flexible base board.
In step S150, the inside in the region that the edge that described desired trajectory is located at above-mentioned fixation is surrounded, and should ensure that
Minimum range between the desired trajectory and the edge of above-mentioned fixation maintains the side-play amount of 5-10mm, in order to eliminate the thin of residual
Membrane stress.
In embodiments of the present invention, flexible substrates are fixed on the surface of glass substrate in the way of edge is fixed, by
It is to be laid in glass baseplate surface by way of edge is fixed in flexible substrates, therefore implements residual substrate on a flexible substrate
During processing procedure, will not be influenceed by thermal coefficient of expansion.Finally after the completion of processing procedure, the flexible substrates fixed with edge are cut
Cut, stressless flexible device can be obtained.
The preparation method of the embodiment of the present invention can be effectively discharged in existing flexible base board processing procedure, due to flexible substrates and glass
The difference of the thermal coefficient of expansion between glass substrate and the stress that produces, improve the stability of flexible product.
Second embodiment：
In the present embodiment, it is further provided method on the glass substrate is fixed at a kind of edge by flexible substrates,
Comprise the following steps：
Step S1301, flexible substrates are laid on the surface of glass substrate.
Step S1302, the fixed material of edge coating in flexible substrates, and make to fix the surface of material and glass substrate
Contact.
Step S1303, fixed material is processed, so that the edge of flexible substrates is fixed on the glass substrate.
Above-mentioned various method steps are described in detail with reference to Fig. 2 a- Fig. 2 f.
Fig. 2 a- Fig. 2 f give complete flexible base board processing procedure, and as shown in Figure 2 a, expression is to be formed on the glass substrate
The manufacturing process of flexible substrates.1 expression is glass substrate, 2 tools for being flexible substrates, forming flexible substrates 2 for representing in figure
Body implementation method may be referred to the step S110 in first embodiment.
As shown in Figure 2 b, expression is the manufacturing process that flexible substrates 2 are mutually peeled off with glass substrate 1.As can be seen that
, it is necessary to make laser be shone from the side of glass substrate 1 when being peeled off to flexible substrates 2 and glass substrate 1 using laser method
Penetrate the contact interface of flexible substrates 2 and glass substrate 1.
The flexible substrates 2 obtained after stripping are directly laid on the surface of glass substrate 1.
As shown in Figure 2 c, one week fixed material 3 is coated in the edge of flexible substrates 2, and makes to fix material 3 and glass base
The surface contact of plate 1.
In a specific embodiment, fixed material 3 needs to meet being heated to 450 DEG C, or is heated to 450 DEG C
During the temperature of the above, still ensure that without volatility.Because, it is necessary to carry out height to fixed material 3 in subsequent treatment
Temperature treatment, if fixed material has volatility, it is likely that polluted to flexible substrates 2.
In another specific embodiment, in order to avoid fixed material 3 produces pollution to flexible substrates 2, can also select
Select and fix material with the material identical of flexible substrates 2.For example, when the material of flexible substrates 2 is polyimides PI or poly- naphthalenes two
During formic acid glycol ester PEN, corresponding fixed material can also select to be PI or PEN.
As shown in Figure 2 d, fixed material is processed.Assuming that have chosen in figure 2 c identical with the material of flexible substrates 2
Fixed material, such as PI or PEN, the PI and PEN of coating are solution shape.The treatment tool to PI or PEN in step S1303
Body includes that carry out hot setting to PI or PEN within the temperature range of 200-400 DEG C, the duration of hot setting is 5-
10min。
Because fixation material 3 is identical with the material of flexible substrates 2, therefore, in figure 2d, it is expressed as flexible substrates 2 and consolidates
Determine the structure that material 3 forms an integral type.
Next, as shown in Figure 2 e, residual substrate processing procedure is completed in flexible substrates 2, referring specifically in first embodiment
The step of S140.
After residual substrate processing procedure is completed, flexible substrates 2 are cut along desired trajectory, as shown in figure 2f.In Fig. 2 f
Dotted line be used to represent the position of line of cut.Top view with reference to shown in Fig. 3, what the rectangular broken line frame in Fig. 3 was represented is desirable
Flexible base board size, when being cut along the rectangular broken line frame, what D was indicated in figure 3 is the rectangular broken line frame, and soft
Property built-in edge between substrate 2 and glass substrate 1 between minimum range, to ensure that the flexible base board after cutting is not remained
Membrane stress, should make the value of D be maintained 5-10mm.
Method on the glass substrate is fixed at the edge by flexible substrates in the embodiment of the present invention, it is only necessary to original soft
Property substrate manufacturing process in the step of add the fixed material of coating and fixed material processed (it should be noted that
The step of flexible substrates are mutually peeled off with glass substrate belongs to and changes former process sequence, but does not increase new technique actually
Step), therefore, do not dramatically increase the operation of existing process processing procedure, it is easy to implement, and the cost of production will not be dramatically increased.
3rd embodiment：
In the present embodiment, there is provided method on the glass substrate is fixed at another edge by flexible substrates, including
Following steps：
The fixed material of step S1310, on the glass substrate coating, the coating position of fixed material corresponds to flexible substrates
Edge.
Step S1320, flexible substrates are laid on the surface of glass substrate, make to fix material completely by flexible substrates
Edges cover.
Step S1330, fixed material is processed, so that the edge of flexible substrates is fixed on the glass substrate.
Above-mentioned steps are illustrated with reference to Fig. 4 a- Fig. 4 f, wherein, Fig. 4 a, Fig. 4 b, Fig. 4 e and Fig. 4 f may refer to
Fig. 2 a, Fig. 2 b, Fig. 2 e and Fig. 2 f in second embodiment.
As illustrated in fig. 4 c, after flexible substrates 2 are mutually peeled off with glass substrate 1, flexible substrates 2 from glass substrate 1 are made
Remove on surface.Fixed material 3 is coated on the surface of glass substrate 1, the coating position of fixed material 3 corresponds to flexible substrates 2
Edge, may refer to the top view shown in Fig. 5, fixed material 3 surrounds a rectangle corresponding with the edge of flexible substrates 2
Region, and the rectangular area is slightly less than the edge of flexible substrates 2.
Next, as shown in figure 4d, flexible substrates 2 are laid on the surface of glass substrate 1 again.It is readily appreciated that
It is that the major part for making flexible substrates 2 falls in the rectangular area surrounded in fixed material 3, while flexible substrates 2 are completely covered
Fixed material 3.
In this embodiment, it is preferred to use fix material with the material identical of flexible substrates 2, avoiding between different materials
Cross-diffusion produce pollution.
In the embodiment of the present invention, put down in the way of edge is fixed and flexible substrates interfix with glass substrate, therefore
Will not be influenceed by thermal coefficient of expansion during processing procedure, be conducive to improving the stability of flexible device.
The preparation method of the flexible base board in the present embodiment can be widely applied in the manufacturing process such as flexible AMOLED.
Although disclosed herein implementation method as above, described content is only to facilitate understanding the present invention and adopting
Implementation method, is not limited to the present invention.Any those skilled in the art to which this invention pertains, are not departing from this
On the premise of the disclosed spirit and scope of invention, any modification and change can be made in the formal and details implemented,
But scope of patent protection of the invention, must be still defined by the scope of which is defined in the appended claims.
Claims (10)
1. a kind of preparation method of flexible base board, including：
Flexible substrates are formed on the glass substrate；
The flexible substrates are mutually peeled off with the glass substrate；
The edge of the flexible substrates is fixed on the glass substrate；
Residual substrate processing procedure is completed in the flexible substrates；
The flexible substrates are cut along desired trajectory, to obtain the flexible base board；
Wherein, the desired trajectory is located at the inside in the region surrounded by the edge.
2. preparation method according to claim 1, it is characterised in that the edge by the flexible substrates is fixed on institute
State on glass substrate, specifically include：
The flexible substrates are laid on the surface of the glass substrate；
In the fixed material of edge coating of the flexible substrates, and the fixed material is set to be connect with the surface of the glass substrate
Touch；
The fixed material is processed, so that the edge of the flexible substrates is fixed on the glass substrate.
3. preparation method according to claim 1, it is characterised in that the edge by the flexible substrates is fixed on institute
State on glass substrate, specifically include：
Fixed material is coated on the glass substrate, the coating position of the fixed material corresponds to the side of the flexible substrates
Edge；
The flexible substrates are laid on the surface of the glass substrate, make the fixed material completely by the flexible substrates
Edges cover；
The fixed material is processed, so that the edge of the flexible substrates is fixed on the glass substrate.
4. the preparation method according to Claims 2 or 3, it is characterised in that the fixed material is at 450 DEG C or at 450 DEG C
It is non-volatile within the temperature range of above.
5. the preparation method according to Claims 2 or 3, it is characterised in that the fixed material and the flexible substrates
Material is identical.
6. the preparation method according to Claims 2 or 3, it is characterised in that the fixed material includes polyimides or poly-
(ethylene naphthalate).
7. preparation method according to claim 6, it is characterised in that process the fixed material, so that described
The edge of flexible substrates is fixed on the glass substrate, including：
Hot setting, the duration of the hot setting are carried out to the fixed material within the temperature range of 200-400 DEG C
It is 5-10min.
8. preparation method according to claim 1, it is characterised in that using laser method by the flexible substrates and institute
Glass substrate is stated mutually to peel off.
9. preparation method according to claim 8, it is characterised in that the energy range of the laser is 300-500mJ/
cm2, the scanning overlapping range of laser is 20-60%.
10. preparation method according to claim 1, it is characterised in that between the desired trajectory and the edge most
Small distance keeps the skew of 5-10mm.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710098365.6A CN106935596A (en) | 2017-02-22 | 2017-02-22 | A kind of preparation method of flexible base board |
| PCT/CN2017/076599 WO2018152889A1 (en) | 2017-02-22 | 2017-03-14 | Preparation method for flexible substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710098365.6A CN106935596A (en) | 2017-02-22 | 2017-02-22 | A kind of preparation method of flexible base board |
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| CN106935596A true CN106935596A (en) | 2017-07-07 |
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| CN201710098365.6A Pending CN106935596A (en) | 2017-02-22 | 2017-02-22 | A kind of preparation method of flexible base board |
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| WO (1) | WO2018152889A1 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107464895A (en) * | 2017-09-19 | 2017-12-12 | 武汉华星光电半导体显示技术有限公司 | The preparation method of flexible display screen |
| CN109389903A (en) * | 2017-08-04 | 2019-02-26 | 京东方科技集团股份有限公司 | Flexible base board and its processing method, system of processing |
| WO2019080241A1 (en) * | 2017-10-27 | 2019-05-02 | 武汉华星光电半导体显示技术有限公司 | Display panel motherboard and method for cutting display panel motherboard |
| CN110473985A (en) * | 2019-08-27 | 2019-11-19 | 云谷（固安）科技有限公司 | A kind of production method of flexible base board, flexible display panels and flexible base board |
| CN110828505A (en) * | 2018-07-23 | 2020-02-21 | 京东方科技集团股份有限公司 | Manufacturing method and manufacturing device of flexible panel |
| CN111613580A (en) * | 2020-05-21 | 2020-09-01 | 深圳市华星光电半导体显示技术有限公司 | Preparation method of flexible substrate and flexible substrate |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103545463A (en) * | 2013-09-27 | 2014-01-29 | Tcl集团股份有限公司 | Flexible display device and manufacturing method thereof |
| CN103996698A (en) * | 2014-05-29 | 2014-08-20 | 友达光电股份有限公司 | Manufacturing method of soft panel |
| CN105493287A (en) * | 2015-09-18 | 2016-04-13 | 京东方科技集团股份有限公司 | Preparation method of flexible display device |
| CN106098940A (en) * | 2016-08-26 | 2016-11-09 | 武汉华星光电技术有限公司 | The method of nondestructively peeling flexible base board |
| CN106328683A (en) * | 2016-10-11 | 2017-01-11 | 武汉华星光电技术有限公司 | Flexible OLED display and the preparing method thereof |
-
2017
- 2017-02-22 CN CN201710098365.6A patent/CN106935596A/en active Pending
- 2017-03-14 WO PCT/CN2017/076599 patent/WO2018152889A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103545463A (en) * | 2013-09-27 | 2014-01-29 | Tcl集团股份有限公司 | Flexible display device and manufacturing method thereof |
| CN103996698A (en) * | 2014-05-29 | 2014-08-20 | 友达光电股份有限公司 | Manufacturing method of soft panel |
| CN105493287A (en) * | 2015-09-18 | 2016-04-13 | 京东方科技集团股份有限公司 | Preparation method of flexible display device |
| CN106098940A (en) * | 2016-08-26 | 2016-11-09 | 武汉华星光电技术有限公司 | The method of nondestructively peeling flexible base board |
| CN106328683A (en) * | 2016-10-11 | 2017-01-11 | 武汉华星光电技术有限公司 | Flexible OLED display and the preparing method thereof |
Cited By (12)
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|---|---|---|---|---|
| CN109389903A (en) * | 2017-08-04 | 2019-02-26 | 京东方科技集团股份有限公司 | Flexible base board and its processing method, system of processing |
| JP2020529118A (en) * | 2017-08-04 | 2020-10-01 | 京東方科技集團股▲ふん▼有限公司Ｂｏｅ Ｔｅｃｈｎｏｌｏｇｙ Ｇｒｏｕｐ Ｃｏ．，Ｌｔｄ． | Flexible substrate and its processing method, processing system |
| EP3664066A4 (en) * | 2017-08-04 | 2021-05-05 | BOE Technology Group Co., Ltd. | Flexible substrate, and processing method and processing system therefor |
| US11430351B2 (en) * | 2017-08-04 | 2022-08-30 | Boe Technology Group Co., Ltd. | Processing method and processing system of a flexible substrate |
| JP7340931B2 (en) | 2017-08-04 | 2023-09-08 | 京東方科技集團股▲ふん▼有限公司 | Flexible substrates, their processing methods, and processing systems |
| CN107464895A (en) * | 2017-09-19 | 2017-12-12 | 武汉华星光电半导体显示技术有限公司 | The preparation method of flexible display screen |
| WO2019080241A1 (en) * | 2017-10-27 | 2019-05-02 | 武汉华星光电半导体显示技术有限公司 | Display panel motherboard and method for cutting display panel motherboard |
| CN110828505A (en) * | 2018-07-23 | 2020-02-21 | 京东方科技集团股份有限公司 | Manufacturing method and manufacturing device of flexible panel |
| CN110828505B (en) * | 2018-07-23 | 2022-06-07 | 京东方科技集团股份有限公司 | Manufacturing method and manufacturing device of flexible panel |
| CN110473985A (en) * | 2019-08-27 | 2019-11-19 | 云谷（固安）科技有限公司 | A kind of production method of flexible base board, flexible display panels and flexible base board |
| CN111613580A (en) * | 2020-05-21 | 2020-09-01 | 深圳市华星光电半导体显示技术有限公司 | Preparation method of flexible substrate and flexible substrate |
| CN111613580B (en) * | 2020-05-21 | 2023-04-18 | 深圳市华星光电半导体显示技术有限公司 | Preparation method of flexible substrate and flexible substrate |
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| WO2018152889A1 (en) | 2018-08-30 |
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