CN103996698A - Manufacturing method of soft panel - Google Patents
Manufacturing method of soft panel Download PDFInfo
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- CN103996698A CN103996698A CN201410234137.3A CN201410234137A CN103996698A CN 103996698 A CN103996698 A CN 103996698A CN 201410234137 A CN201410234137 A CN 201410234137A CN 103996698 A CN103996698 A CN 103996698A
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- plastic base
- adhesive layer
- soft panel
- manufacture method
- base plate
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Abstract
The invention provides a manufacturing method of a soft panel. The manufacturing method comprises the steps that a rigid base plate is provided; a patterning binding layer is formed above the rigid base plate; a plastic base plate is arranged above the binding layer in a coating mode; a switch component is formed above the plastic base plate; the switch component, the plastic base plate, the binding layer and the rigid base plate are cut in sequence along a cutting line; and an LLO manufacturing process is used for peeling off the switch element on a non-binding zone and the plastic base plate form the rigid base plate. Compared with the prior art, the patterning binding layer is used for enhancing the attaching force between the plastic base plate and the rigid base plate, so that for the cut plastic base plate and the rigid base plate, the phenomenon that the edge of the plastic base plate is lifted up during a following water washing process or other manufacturing processes is avoided.
Description
Technical field
The present invention relates to a kind of flexible base plate, relate in particular to a kind of manufacturing method thereof of making soft panel based on this flexible base plate.
Background technology
Current, the shortcoming of frangible, the not shock-resistant and high weight of glass displays and thickness cannot meet the carry-on product of individual digital of the demands such as lightweight, slimming and deflection use.Development along with substrate fabrication techniques, the flexible base plate of usining replaces glass substrate and not only can address the above problem as display base plate, more can provide the design freedom of flat-panel screens in external form and crimpiness, so the research and development of flexible display have become one of development priority of industry.For example, flexible display has stronger competitiveness on the products such as mobile phone, car-mounted display, smart card, electronic mark display, personal digital assistant (PDA, Personal Digital Assistance) or soft electronic books.
In the prior art, the manufacture method of flexible display comprises the following steps: on bearing substrate, make release layer, then be coated with flexible base plate, on flexible base plate, carry out device technology (as thin film transistor (TFT) array technique) etc., and then take off the making flow process that (debonding) completes flexible display.Known solution is to be to adopt absorbing process to take off a soft panel, but can stress problem cause the curling of soft panel, in addition, and the not good effect of taking off that also can affect suction type of the evenness of soft panel.Another kind of known solution is directly plastic base to be coated to the top of glass substrate, then cuts plastic base and glass substrate, then washes operation to obtain soft panel.But after washing, tend to the phenomenon that occurs that flexible base plate edge is started, cause carrying out the successive process such as OLED evaporation etc.Moreover, although the tin indium oxide of electrically conducting transparent material (ITO) layer can reinforced plastics substrate and glass substrate between adhesive force, when but the ITO of whole adopts laser lift-off technique to take off, need very high laser energy, this will increase the processing procedure cost of soft panel undoubtedly.
In view of this, how the manufacture method of existing soft panel is improved, to avoid flexible base plate edge to peel off the situation being started because of part, thereby eliminating the above-mentioned defect that current processing procedure occurs, is a person skilled problem urgently to be resolved hurrily in the industry.
Summary of the invention
The above-mentioned defect occurring in processing procedure for the soft panel of prior art, the invention provides a kind of manufacture method of soft panel of novelty, by ITO adhesive layer, carry out the adhesive force between reinforced plastics substrate and rigid substrates, to avoid the edge of flexible base plate to occur the phenomenon being started after cutting washing.
According to one aspect of the present invention, a kind of manufacture method of soft panel is provided, comprise the following steps:
One rigid substrates is provided;
Form an adhesive layer in the top of described rigid substrates, wherein, described adhesive layer has a predetermined pattern;
Be coated with a plastic base in the top of described adhesive layer;
Form a switch module in the top of described plastic base;
Along line of cut, cut successively described switch module, described plastic base, described adhesive layer and described rigid substrates; And
Adopt laser lift-off processing procedure, the described switch module of adhesion area is not peeled off from described rigid substrates together with described plastic base, thereby obtained described soft panel.
An embodiment therein, the material of described adhesive layer is tin indium oxide.
An embodiment therein, the predetermined pattern of described adhesive layer is square frame or block.
An embodiment therein, described adhesive layer is positioned at the below, edge of described line of cut and described plastic base, and its width is between 2mm～10mm.
An embodiment therein, the material of described rigid substrates is glass.
An embodiment therein, the material of described plastic base is polyimides.
An embodiment therein, described switch module is a thin film transistor (TFT) array.
An embodiment therein, described switch module is an Organic Light Emitting Diode.
An embodiment therein, in LLO processing procedure, is positioned at the not plastic base required laser energy separated with rigid substrates of adhesion area, lower than the separated required laser energy of the plastic base in adhesion area, adhesive layer and rigid substrates.
Adopt the manufacture method of soft panel of the present invention, first form the adhesive layer of a patterning in the top of rigid substrates, then be coated with a plastic base in the top of adhesive layer, then form a switch module in the top of plastic base, along line of cut, cut successively switch module, plastic base, adhesive layer and rigid substrates, finally adopt laser lift-off processing procedure that the switch module of adhesion area is not peeled off from rigid substrates together with plastic base.Than prior art, the present invention carrys out the adhesive force between reinforced plastics substrate and rigid substrates by the adhesive layer of patterning, make cutting after plastic base and rigid substrates between avoid occurring in follow-up washing or other processing procedure the situation that plastic base edge is started.
Accompanying drawing explanation
Reader, after having read the specific embodiment of the present invention with reference to accompanying drawing, will become apparent various aspects of the present invention.Wherein,
Figure 1A to Fig. 1 C illustrates the fabrication steps schematic diagram of the manufacture method of soft panel of the prior art;
Fig. 2 illustrates the FB(flow block) according to the manufacture method of the soft panel of an embodiment of the present invention;
Fig. 3 A to Fig. 3 D illustrates the fabrication steps schematic diagram that adopts the manufacture method of Fig. 2 to form a view of soft panel; And
Fig. 4 A to Fig. 4 F illustrates the fabrication steps schematic diagram that adopts the manufacture method of Fig. 2 to form another view of soft panel.
Embodiment
For the technology contents that the application is disclosed is more detailed and complete, can be with reference to accompanying drawing and following various specific embodiments of the present invention, in accompanying drawing, identical mark represents same or analogous assembly.Yet those of ordinary skill in the art should be appreciated that the embodiment that hereinafter provided is not used for limiting the scope that the present invention is contained.In addition, accompanying drawing, only for being schematically illustrated, is not drawn according to its life size.
With reference to the accompanying drawings, the embodiment of various aspects of the present invention is described in further detail.
Figure 1A to Fig. 1 C illustrates the fabrication steps schematic diagram of the manufacture method of soft panel of the prior art.With reference to Figure 1A, first form a rigid substrates 100, then above this rigid substrates 100, be coated with a plastic base 102, then on plastic base 102, form a switch module (such as thin film transistor (TFT) array) 104.Along line of cut C, cut successively switch module 104, plastic base 102 and glass substrate 100, to obtain the substrate after cutting as shown in Figure 1B.In carrying out follow-up washing processing procedure, can there is the situation being started owing to peeling off (peel up) in the part edge between glass substrate 100 and plastic base 102, causes process rate to decline, as shown in the arrow locations of Fig. 1 C.
In order to solve the aforementioned problems in the prior, the present invention has carried out effective improvement to the manufacture method of current soft panel.Fig. 2 illustrates the FB(flow block) according to the manufacture method of the soft panel of an embodiment of the present invention.
With reference to Fig. 2, in this manufacture method, first perform step S101, a rigid substrates is provided.Then in step S103, form an adhesive layer (bonding layer) in the top of rigid substrates, this adhesive layer has a predetermined pattern.Then,, in step S105 and step S107, be coated with successively (coating) plastic base in the top of adhesive layer, and form a switch module in the top of plastic base.Then perform step S109, along line of cut, cut successively switch module, plastic base, adhesive layer and rigid substrates.Finally adopt laser lift-off (Laser Lift Off, LLO) processing procedure, the switch module of adhesion area is not peeled off from rigid substrates together with plastic base, thereby obtained soft panel, as shown in step S111.
Hereinafter, in connection with Fig. 3 A～3D and Fig. 4 A～4F, the manufacture method of above-mentioned soft panel is described in detail.Fig. 3 A to Fig. 3 D illustrates the fabrication steps schematic diagram that adopts the manufacture method of Fig. 2 to form a view of soft panel.
In conjunction with Fig. 3 A～3D, first form a rigid substrates 200.Then above this rigid substrates 200, form an adhesive layer (bonding layer) 206, this adhesive layer 206 has a predetermined pattern, as shown in the filling part of Fig. 3 A.Then, be coated with a plastic base 202 in the top of adhesive layer 206, and on plastic base 202, form a switch module (such as thin film transistor (TFT) array) 204.Along line of cut C, cut successively switch module 204, plastic base 202, adhesive layer 206 and rigid substrates 200, with the substrate after being cut, as shown in Figure 3 B.Then, adopt laser lift-off (Laser Lift Off, LLO) processing procedure, the switch module 204 of adhesion area A1 is not peeled off from rigid substrates 200 together with plastic base 202, finally obtain soft panel, as shown in Figure 3 C.This soft panel consists of plastic base 202 and switch module 204, as shown in Figure 3 D.
In one embodiment, the material of adhesive layer 206 is tin indium oxide (ITO).The predetermined pattern of adhesive layer 206 is square frame or block, that is, when adhesive layer 206 is arranged at the top of rigid substrates 200, can form square frame or the block of patterning.Preferably, the width of the adhesive layer 206 of this patterning is 2mm～10mm.
In one embodiment, the material of rigid substrates 200 is glass (Glass).The material of plastic base 202 is polyimides (Polyimide, PI).In addition, switch module 204 can be a thin film transistor (TFT) array (Thin Film Transistor Array) or an Organic Light Emitting Diode (Organic Light Emitting Diode, OLED).
Fig. 4 A to Fig. 4 F illustrates the fabrication steps schematic diagram that adopts the manufacture method of Fig. 2 to form another view of soft panel.
In conjunction with Fig. 4 A～4F, first on rigid substrates 200, form the adhesive layer 206 (shown in Fig. 4 A) of whole, then this adhesive layer 206 is carried out to patterned process, to obtain the patterned adhesive layer 206 (as shown in Figure 4 B) such as square frame or block shape.For example, the width of the adhesive layer 206 of this patterning is 2mm～10mm.Above adhesive layer 206, be coated with a plastic base 202, as shown in Figure 4 C, the adhesive layer of empty wire frame representation plastic base 202 belows in figure.Next, as shown in Figure 4 D, on plastic base 202, form a switch module 204.Preferably, this switch module 204 is a thin film transistor (TFT) array or an Organic Light Emitting Diode.In Fig. 4 E, along line of cut C, cut successively switch module 204, plastic base 202, adhesive layer 206 and rigid substrates 200, with the substrate after being cut.After washing processing procedure, obtain final soft panel, this soft panel only comprises plastic base 202 and switch module 204, as shown in Fig. 4 F.
In one embodiment, being arranged in the not plastic base 202 of adhesion area (such as PI substrate) and the separated required laser energy of rigid substrates 200 (such as Glass substrate) is plastic base, adhesive layer (such as ITO) and the separated required laser energy of rigid substrates (PI/ITO/Glass) lower than adhesion area.Test data shows, when PI/Glass carries out separation after via absorbing laser, its laser energy is 190mJ/cm
2.And PI/ITO/Glass is while carrying out separation after via absorbing laser, its laser energy is 220mJ/cm
2, required laser energy when separated higher than PI/Glass.This is explanation simultaneously also, by ITO adhesive layer can reinforced plastics substrate and rigid substrates between bonding adhesive attraction, while making plastic base in adhesion area not separated with rigid substrates, still can there is not relative displacement in the plastic base in adhesion area and rigid substrates, thus, the part edge of plastic base also can be avoided the bad situation that appearance is started.Moreover, because the predetermined pattern of adhesive layer 206 of the present invention is square frame or block, and not if prior art is whole, therefore the present invention is when the plastic base 202 that makes adhesion area is not separated with rigid substrates 200, only need lower laser energy, therefore can effectively reduce the processing procedure cost of soft panel.
Adopt the manufacture method of soft panel of the present invention, first form the adhesive layer of a patterning in the top of rigid substrates, then be coated with a plastic base in the top of adhesive layer, then form a switch module in the top of plastic base, along line of cut, cut successively switch module, plastic base, adhesive layer and rigid substrates, finally adopt laser lift-off processing procedure that the switch module of adhesion area is not peeled off from rigid substrates together with plastic base.Than prior art, the present invention carrys out the adhesive force between reinforced plastics substrate and rigid substrates by the adhesive layer of patterning, make cutting after plastic base and rigid substrates between avoid occurring in follow-up washing or other processing procedure the situation that plastic base edge is started.And the present invention makes that the plastic base of adhesion area is not separated with rigid substrates only needs lower laser energy, therefore can reduce processing procedure cost.
Above, describe the specific embodiment of the present invention with reference to the accompanying drawings.But those skilled in the art can understand, without departing from the spirit and scope of the present invention in the situation that, can also do various changes and replacement to the specific embodiment of the present invention.These changes and replacement all drop in the claims in the present invention book limited range.
Claims (9)
1. a manufacture method for soft panel, is characterized in that, the manufacture method of described soft panel comprises the following steps:
One rigid substrates is provided;
Form an adhesive layer in the top of described rigid substrates, wherein, described adhesive layer has a predetermined pattern;
Be coated with a plastic base in the top of described adhesive layer;
Form a switch module in the top of described plastic base;
Along line of cut, cut successively described switch module, described plastic base, described adhesive layer and described rigid substrates; And
Adopt laser lift-off processing procedure, the described switch module of adhesion area is not peeled off from described rigid substrates together with described plastic base, thereby obtained described soft panel.
2. the manufacture method of soft panel according to claim 1, is characterized in that, the material of described adhesive layer is tin indium oxide.
3. the manufacture method of soft panel according to claim 2, is characterized in that, the predetermined pattern of described adhesive layer is square frame or block.
4. the manufacture method of soft panel according to claim 2, is characterized in that, described adhesive layer is positioned at the below, edge of described line of cut and described plastic base, and its width is between 2mm～10mm.
5. the manufacture method of soft panel according to claim 1, is characterized in that, the material of described rigid substrates is glass.
6. the manufacture method of soft panel according to claim 1, is characterized in that, the material of described plastic base is polyimides.
7. the manufacture method of soft panel according to claim 1, is characterized in that, described switch module is a thin film transistor (TFT) array.
8. the manufacture method of soft panel according to claim 1, is characterized in that, described switch module is an Organic Light Emitting Diode.
9. the manufacture method of soft panel according to claim 1, it is characterized in that, in described LLO processing procedure, be positioned at the not plastic base required laser energy separated with rigid substrates of adhesion area, lower than the separated required laser energy of the plastic base in adhesion area, adhesive layer and rigid substrates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410234137.3A CN103996698A (en) | 2014-05-29 | 2014-05-29 | Manufacturing method of soft panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410234137.3A CN103996698A (en) | 2014-05-29 | 2014-05-29 | Manufacturing method of soft panel |
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| CN103996698A true CN103996698A (en) | 2014-08-20 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104716081A (en) * | 2015-03-26 | 2015-06-17 | 京东方科技集团股份有限公司 | Flexible device and fabrication method thereof |
| CN106935596A (en) * | 2017-02-22 | 2017-07-07 | 武汉华星光电技术有限公司 | A kind of preparation method of flexible base board |
| CN108336227A (en) * | 2018-01-19 | 2018-07-27 | 云谷（固安）科技有限公司 | Substrat structure of display screen and preparation method thereof, display screen, flexible display apparatus and preparation method thereof |
| CN109309172A (en) * | 2018-10-11 | 2019-02-05 | 信利半导体有限公司 | Flexible OLED devices and its manufacturing method, display device |
| CN109475041A (en) * | 2018-10-31 | 2019-03-15 | 上海奕瑞光电子科技股份有限公司 | A kind of binding method of flexible parent metal display panel |
-
2014
- 2014-05-29 CN CN201410234137.3A patent/CN103996698A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104716081A (en) * | 2015-03-26 | 2015-06-17 | 京东方科技集团股份有限公司 | Flexible device and fabrication method thereof |
| CN104716081B (en) * | 2015-03-26 | 2017-09-15 | 京东方科技集团股份有限公司 | Flexible apparatus and preparation method thereof |
| US10046548B2 (en) | 2015-03-26 | 2018-08-14 | Boe Technology Group Co., Ltd. | Flexible device and fabrication method thereof, display apparatus |
| CN106935596A (en) * | 2017-02-22 | 2017-07-07 | 武汉华星光电技术有限公司 | A kind of preparation method of flexible base board |
| WO2018152889A1 (en) * | 2017-02-22 | 2018-08-30 | 武汉华星光电技术有限公司 | Preparation method for flexible substrate |
| CN108336227A (en) * | 2018-01-19 | 2018-07-27 | 云谷（固安）科技有限公司 | Substrat structure of display screen and preparation method thereof, display screen, flexible display apparatus and preparation method thereof |
| CN109309172A (en) * | 2018-10-11 | 2019-02-05 | 信利半导体有限公司 | Flexible OLED devices and its manufacturing method, display device |
| CN109475041A (en) * | 2018-10-31 | 2019-03-15 | 上海奕瑞光电子科技股份有限公司 | A kind of binding method of flexible parent metal display panel |
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Application publication date: 20140820 |
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