CN109309172A - Flexible OLED devices and its manufacturing method, display device - Google Patents
Flexible OLED devices and its manufacturing method, display device Download PDFInfo
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- CN109309172A CN109309172A CN201811186705.1A CN201811186705A CN109309172A CN 109309172 A CN109309172 A CN 109309172A CN 201811186705 A CN201811186705 A CN 201811186705A CN 109309172 A CN109309172 A CN 109309172A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
This application provides a kind of flexible OLED devices and its manufacturing methods, display device, it is related to field of display technology, the flexible OLED devices include flexible base board, and organic light-emitting units on flexible substrates are arranged, and the water vapor rejection film being encapsulated on organic light-emitting units；Organic light-emitting units include anode, anode auxiliary electrode, pixel separation layer, cathode insulated column, organic material layer and cathode；The side of the close organic light-emitting units of water vapor rejection film is pasted with water suction glue-line.A kind of water vapor rejection film for being pasted with water suction glue-line is utilized in this way, it is directly bonded with the flexible base board for being formed with organic light-emitting units to be packaged, compared with prior art, the processing procedure of other coating UV frame glue and liquid desiccant is not needed, effectively improve a series of brought process problems when coating UV frame glue and liquid desiccant, to reduce the difficulty of manufacture OLED device, the yield and reliability of OLED device are improved.
Description
Technical field
This application involves field of display technology, fill more particularly, to a kind of flexible OLED devices and its manufacturing method, display
It sets.
Background technique
More AM- is applied in consumer electronics display field with the quick update of electronic product, and instantly
OLED (Active Matrix-Organic Light Emitting Diode, active matrix organic light-emitting diode) curved surface and
Under the stimulation of flexible product, the demand of household electrical appliances class display, wearing class display to curved surface and flexible display increasingly increases.
Different from the driving method of AM-OLED, PM-OLED (Passive Matrix-Organic Light Emitting
Diode, passive-matrix Organic Light Emitting Diode) merely constituted with cathode, anode rectangular, it is lighted in array with scanning mode
Pixel, each pixel operates under burst mode, shines for moment high brightness.The structure of PM-OLED is simple, can be with
Manufacturing cost is effectively reduced.
Traditional plate PM-OLED device needs other coating UV (ultraviolet, purple when carrying out rear cover encapsulation
Outside line) frame glue and liquid (or solid-state, subsequent identical) desiccant processing procedure.However exist when coating UV frame glue and liquid desiccant
Coating weight is not easy to control, zones of extensibility is unable to control, UV glue frame easily occurs gas and rushes the problems such as bad, leads to the system of PM-OLED device
It is larger to make difficulty.
Summary of the invention
In view of this, the application's is designed to provide a kind of flexible OLED devices and its manufacturing method, display device, with
The difficulty for reducing manufacture OLED device, improves the yield and reliability of OLED device.
In a first aspect, the embodiment of the present application provides a kind of flexible OLED devices, including flexible base board, it is arranged described soft
Organic light-emitting units on property substrate, and the water vapor rejection film being encapsulated on the organic light-emitting units；The organic light emission
Unit includes anode, anode auxiliary electrode, pixel separation layer, cathode insulated column, organic material layer and cathode；The water vapor rejection
The side close to the organic light-emitting units of film is pasted with water suction glue-line.
With reference to first aspect, the embodiment of the present application provides the first possible embodiment of first aspect, wherein
Thin-film encapsulation layer is also formed between the organic light-emitting units and the water vapor rejection film.
Second aspect, the embodiment of the present application provide a kind of manufacturing method of flexible OLED devices, which comprises
Make flexible base board；
Organic light-emitting units are formed on the flexible base board, the organic light-emitting units include anode, anode auxiliary electricity
Pole, pixel separation layer, cathode insulated column, organic material layer and cathode；
Encapsulation is pasted with the water vapor rejection film of water suction glue-line on the organic light-emitting units, to form flexibility OLED device
Part.
In conjunction with second aspect, the embodiment of the present application provides the first possible embodiment of second aspect, wherein institute
It states before making flexible base board, further includes:
Release layer is formed on the surface of glass substrate, and solidifies the release layer；
Adhesion promoter layer is formed in the peripheral inactive area of the release layer, and solidifies the adhesion promoter layer.
In conjunction with the first possible embodiment of second aspect, the embodiment of the present application provides second of second aspect
Possible embodiment, wherein the production flexible base board, comprising:
Corona treatment is carried out to the release layer and the adhesion promoter layer；
By slit coating, spin coating or spraying process, release layer and adhesion promoter layer after plasma processing
Upper formation Kapton.
In conjunction with second of possible embodiment of second aspect, the embodiment of the present application provides the third of second aspect
Possible embodiment, wherein form polyamides on the release layer and the adhesion promoter layer after plasma processing
After imines film, the method also includes:
Aqueous vapor separation layer is formed on the Kapton.
In conjunction with the first possible embodiment of second aspect, the embodiment of the present application provides the 4th kind of second aspect
Possible embodiment, wherein the encapsulation on the organic light-emitting units is pasted with the water vapor rejection film of water suction glue-line, with
It is formed after flexible OLED devices, further includes:
From the glass substrate for being formed with the release layer and the adhesion promoter layer, the flexibility OLED device is removed
Part.
In conjunction with second aspect, the embodiment of the present application provides the 5th kind of possible embodiment of second aspect, wherein institute
The encapsulation on the organic light-emitting units is stated to be pasted with before the water vapor rejection film of water suction glue-line, further includes:
Thin-film encapsulation layer is formed on the organic light-emitting units.
In conjunction with second aspect, the embodiment of the present application provides the 6th kind of possible embodiment of second aspect, wherein institute
State the water vapor rejection film that the encapsulation on the organic light-emitting units is pasted with water suction glue-line, comprising:
Water suction glue-line is coated on water vapor rejection film；
Under the conditions of vacuum condition or nitrogen protection, the water suction glue-line side of the water vapor rejection film is fitted in institute
It states on organic light-emitting units.
The third aspect, the embodiment of the present application also provide a kind of display device, including such as above-mentioned first aspect or its first
Flexible OLED devices described in possible embodiment.
The embodiment of the present application bring it is following the utility model has the advantages that
Flexible OLED devices provided by the present application and its manufacturing method, display device are pasted with water suction glue-line using one kind
Water vapor rejection film, be directly bonded with the flexible base board for being formed with organic light-emitting units to be packaged, compared with prior art,
The processing procedure for not needing other coating UV frame glue and liquid desiccant effectively improves coating UV frame glue and liquid desiccant when institute band
A series of process problems come improve the yield and reliability of OLED device to reduce the difficulty of manufacture OLED device.
Other feature and advantage of the application will illustrate in the following description, also, partly become from specification
It obtains it is clear that being understood and implementing the application.The purpose of the application and other advantages are in specification and attached drawing
Specifically noted structure is achieved and obtained.
To enable the above objects, features, and advantages of the application to be clearer and more comprehensible, preferred embodiment is cited below particularly, and cooperate
Appended attached drawing, is described in detail below.
Detailed description of the invention
It, below will be to specific in order to illustrate more clearly of the application specific embodiment or technical solution in the prior art
Embodiment or attached drawing needed to be used in the description of the prior art be briefly described, it should be apparent that, it is described below
Attached drawing is some embodiments of the application, for those of ordinary skill in the art, before not making the creative labor
It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is a kind of structural schematic diagram of flexible OLED devices provided by the embodiments of the present application；
Fig. 2 is the structural schematic diagram of another flexible OLED devices provided by the embodiments of the present application；
Fig. 3 is that each stage corresponding structure is shown in a kind of manufacturing method of flexible OLED devices provided by the embodiments of the present application
It is intended to；
Fig. 4 a is a kind of schematic diagram of adhesion promoter layer dispensing area provided by the embodiments of the present application；
Fig. 4 b is the schematic diagram of another adhesion promoter layer dispensing area provided by the embodiments of the present application；
Fig. 4 c is the schematic diagram of another adhesion promoter layer dispensing area provided by the embodiments of the present application；
Fig. 5 is each stage corresponding structure in the manufacturing method of another flexible OLED devices provided by the embodiments of the present application
Schematic diagram；
Fig. 6 is each stage corresponding structure in the manufacturing method of another flexible OLED devices provided by the embodiments of the present application
Schematic diagram；
Fig. 7 is each stage corresponding structure in the manufacturing method of another flexible OLED devices provided by the embodiments of the present application
Schematic diagram.
Icon:
101- protective film；102- flexible base board；103- anode；104- pixel separation layer；105- cathode insulated column；106- has
Machine material layer；107- cathode；108- thin-film encapsulation layer；109- water suction glue-line；110- water vapor rejection film；201- glass substrate；
202- release layer；203- adhesion promoter layer；204- Kapton；205- aqueous vapor separation layer.
Specific embodiment
Below in conjunction with the attached drawing in the application, the technical solution in the application is clearly and completely described.It is aobvious
So, described embodiment is only a part of the embodiment of the application, instead of all the embodiments.Usual attached drawing here
Described and illustrated in the component of the application can arrange and design with a variety of different configurations.
Therefore, the detailed description of the embodiments herein provided in the accompanying drawings is not intended to limit below claimed
Scope of the present application, but be merely representative of the selected embodiment of the application.Based on embodiments herein, those skilled in the art
Member's every other embodiment obtained without making creative work, shall fall in the protection scope of this application.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.
Referring to Fig. 1, the embodiment of the present application provides a kind of flexible OLED devices, which includes flexible base board
102, the organic light-emitting units on flexible base board 102 are set, and the water vapor rejection film being encapsulated on organic light-emitting units
110；Organic light-emitting units include anode 103, anode auxiliary electrode, pixel separation layer 104, cathode insulated column 105, organic material
Layer 106 and cathode 107；The side of the close organic light-emitting units of water vapor rejection film 110 is pasted with water suction glue-line 109.
In the embodiment of the present application, it is organic that absorb water glue-line 109 and water vapor rejection film 110 can prevent external water vapour from entering
Luminescence unit, realizes the function of liquid desiccant and encapsulation rear cover in classic flat-plate type PM-OLED device, simultaneously as inhaling
Gelatine layer 109 has water suction and sticky two kinds of characteristics, can substitute UV frame glue in the prior art and liquid desiccant, therefore logical
Crossing water suction glue-line 109 can be realized the direct patch of water vapor rejection film 110 with the flexible base board 102 for being formed with organic light-emitting units
It closes, compared with prior art, does not need the processing procedure of other coating UV frame glue and liquid desiccant, effectively improve coating UV frame glue
A series of brought process problems when with liquid desiccant improve OLED to reduce the difficulty of manufacture OLED device
The yield and reliability of device.
Optionally, flexible base board 102 can use PI (Polyimide, polyimides) film.Organic material layer 106 can
To include electron injecting layer, hole injection layer, hole transmission layer and organic luminous layer etc..The glue-line 109 that absorbs water has water absorbing properties,
It is made after being mixed using calcium oxide, zeolite (molecular sieve) with PSA (Pressure Sensitive Adhesive, pressure sensitive adhesive)
Adhesion material made of work.(water vapourtransmission rate, vapor are saturating by the WVTR of water vapor rejection film 110
Cross rate) it can be 1 × 10-4g/m2Day is horizontal.In addition, as shown in Figure 1, the separate organic light-emitting units of flexible base board 102
It can also be formed with protective film (Cover Film) 101 on one side.
In a specific embodiment, the use of flexible base board 102 PI film, and the close organic light-emitting units of PI film
Side is formed with aqueous vapor separation layer (not shown).The thickness of PI film can be, but not limited to be 5-20 μm.Aqueous vapor separation layer
It can be, but not limited to using silicon nitride SiNx optical thin film.The thickness of aqueous vapor separation layer can be, but not limited to as 300-600nm.Water
Water vapor rejection functional layer of the vapor barrier coatings as real estate, can prevent water vapour from entering outside flexible base board 102 organic
Luminescence unit.
Based on above-mentioned Fig. 1, present invention also provides another flexible OLED devices.As shown in Fig. 2, on the basis of Fig. 1,
Thin-film encapsulation layer 108 is formed between organic light-emitting units and water vapor rejection film 110.
Specifically, as shown in Fig. 2, being formed with thin-film encapsulation layer on organic light-emitting units surface (such as 107 surface of cathode)
108.Optionally, thin-film encapsulation layer 108 can use silicon nitride material.Thin-film encapsulation layer 108 can further prevent carrying out self-priming
The water vapour of gelatine layer 109 enters inside organic light-emitting units.
In the embodiment of the present application, using it is a kind of be pasted with water suction glue-line 109 water vapor rejection film 110, directly be formed with
The flexible base boards 102 of organic light-emitting units is bonded to be packaged, compared with prior art, do not need other coating UV frame glue and
The processing procedure of liquid desiccant effectively improves a series of brought process problems when coating UV frame glue and liquid desiccant, from
And the difficulty of manufacture OLED device is reduced, the yield and reliability of OLED device are improved, while in organic light-emitting units table
It is formed with thin-film encapsulation layer 108 on face, the water vapour from water suction glue-line 109 has been further prevented to enter in organic light-emitting units
Portion.
Corresponding to the flexible OLED devices of above-described embodiment description, the embodiment of the present application also provides a kind of flexibility OLED devices
The manufacturing method of part, comprising the following steps:
Step S101 makes flexible base board.
Step S102 forms organic light-emitting units on above-mentioned flexible base board.
Organic light-emitting units include anode, anode auxiliary electrode, pixel separation layer, cathode insulated column, organic material layer and
Cathode.
Step S103, encapsulation is pasted with the water vapor rejection film of water suction glue-line on above-mentioned organic light-emitting units, soft to be formed
Property OLED device.
The manufacturing method of flexible OLED devices provided by the embodiments of the present application utilizes a kind of steam for being pasted with water suction glue-line
Barrier film is directly bonded to be packaged with the flexible base board for being formed with organic light-emitting units, compared with prior art, does not need
In addition the processing procedure of coating UV frame glue and liquid desiccant effectively improves brought one when coating UV frame glue and liquid desiccant
Series of process problem improves the yield and reliability of OLED device to reduce the difficulty of manufacture OLED device.
A kind of detailed process of the manufacturing method of flexible OLED devices described below with reference to Fig. 3, it is above-mentioned soft in this method
Property substrate includes polyimides (PI) film.
(1) about step S101.
As shown in figure 3, before production flexible base board, further includes: release layer 202 is formed on the surface of glass substrate 201,
And solidify release layer 202；Adhesion promoter layer is formed in the periphery (inactive areas of corresponding flexible OLED devices) of release layer 202
203, and solidify adhesion promoter layer 203.Above-mentioned steps S101 includes: to be formed on release layer 202 and adhesion promoter layer 203
Kapton 204.
Specifically, the material of release layer (De-Bonding Layer, DBL) 202 can be thermal weight loss rate under the condition of high temperature
Organic matter, inorganic matter or the organic and nothing of lower (after solidifying, thermal weight loss rate < 1%wt under the conditions of highest process temperatures)
The mixture of machine.Adhesion promoter layer 203 is AP (Adhesive Promote, adhesion promoter) material, adhesion promoter layer
203 adhesion strength is greater than the adhesion strength of release layer 202.Release layer 202 is used for: after completing whole processing procedures, keeping polyimides thin
Film 204 can relatively easily pass through the mode of MLO (Machine Lift-Off, mechanical stripping) from 201 surface of glass substrate
It strips down.Adhesion promoter layer 203 is used for: increase substrate edges Kapton 204 and glass substrate 201 (or from
Type layer 202) between adhesion strength, avoid Kapton 204 in wet process from 201 sur-face peeling of glass substrate.It is optional
The thickness of ground, release layer 202 and adhesion promoter layer 203 is at 1 μm or less.
The embodiment of the present application provides the schematic diagram of three kinds of 203 dispensing areas of adhesion promoter layer, such as Fig. 4 a, Fig. 4 b and figure
(wherein each rectangle frame indicates a flexible OLED devices) shown in 4c, the application place of adhesion promoter layer 203 can be list
The periphery (as shown in fig. 4 a) of a product (single flexible OLED device), is also possible to big flake products (multiple flexible OLED devices
The entirety of composition) periphery (as shown in figures 4 b and 4 c).In the actual production process, it can according to need and determine that adhesion promotes
The dispensing area of oxidant layer 203.
In a specific implementation, in soda or the glass baseplate surface of borosilicate substrate, it is coated with one layer of DBL material, Gu
Change DBL and continues coating one circle AP (Adhesive Promote, adhesion rush in the substrate outermost inactive area for having made DBL
Into agent) material, and solidify AP；It then proceedes to form PI film on DBL and AP.
Optionally, the mode of heating is all made of to solidify DBL and AP, naturally it is also possible to using other curing modes, such as
Irradiate different-energy UV light.Pass through slit coating (Slit-Coating), spin coating (Spin-Coating) or spraying (Spray)
Etc. techniques, formed one layer solidify after about 5-20 μm of PI film.
In order to further increase the yield and reliability of OLED device, in some possible embodiments, above-mentioned steps
S101 is specifically included: carrying out corona treatment to release layer 202 and adhesion promoter layer 203；Pass through slit coating, spin coating
Or spraying process, Kapton 204 is formed on release layer 202 and adhesion promoter layer 203 after plasma processing.
Specifically, vacuum plasma can be used, atmosphere plasma can also be used, to release layer 202 and adhesion
Oxidant layer 203 is promoted to be surface-treated, to adjust the adhesion strength of release layer 202 and adhesion promoter layer 203.
By corona treatment, Kapton 204 and glass substrate 201 can be made to reach a kind of suitable adherency
Power critical value --- guarantee Kapton 204 when by all processing procedures, will not from 201 sur-face peeling of glass substrate, no
Rupture and Drug leakage can occur between Kapton 204 and glass substrate 201；And it completes all processing procedures and is being bonded
Afterwards, additionally it is possible to smoothly Kapton 204 be got off from 201 sur-face peeling of glass substrate using MLO mode, without damaging
Hurt the structure and functional pin of OLED device.
(2) about step S102.
As shown in figure 3, above-mentioned steps S102 includes: that sequentially form anode 103, anode on Kapton 204 auxiliary
Help electrode, pixel separation layer 104, cathode insulated column 105, organic material layer 106 and cathode 107.
First on Kapton 204 carry out anode 103 production, specifically can on Kapton 204 shape
At one layer of ITO:Indium tin oxide, tin indium oxide (or other transparent conductive materials), for example, by using PVD (Physical
Vapor Deposition, physical vapour deposition (PVD)) or CVD (Chemical Vapor Deposition, chemical vapor deposition)
Method forms ITO, a layer photoresist is then coated on ITO, using mask plate patterning processes, through overexposure, development, etching etc.
Step forms the figure of anode, finally removes remaining photoresist, forms anode 103.It is auxiliary that anode is completed again after formation anode 103
The production of electrode (not shown) is helped, the specific production method of anode auxiliary electrode is referred to the relative production technique of ITO.
Then the production of pixel separation layer 104 is carried out again.Specifically, an insulating layer is formed on Kapton 204,
The insulating layer inherently can be used light-sensitive material (such as negative photoresist or positive photoresist), thus directly to the insulating layer into
Row exposure, development can form the figure of pixel separation layer 104.
The production of cathode insulated column 105 is further carried out in the block of pixels of pixel separation layer 104.Specifically, in polyamides
An insulating layer is re-formed on imines film 204, which can also be used light-sensitive material (such as negative photoresist), directly to this
Insulating layer is exposed, PEB (Post Exposure Bake, postexposure bake), cathode insulated column 105 can be formed by developing
Figure.
In a specific implementation, as shown in figure 3, organic material layer 106 is located on anode 103 and is filled between pixel
Between block of pixels in interlayer 104, cathode 107 is covered on 105 surface of organic material layer 106 and cathode insulated column.It can specifically adopt
Organic material layer 106 and cathode 107 are sequentially formed with evaporation process.From figure 3, it can be seen that organic material layer 106 is multilayer
Structure, including hole injection layer, hole transmission layer, electron injecting layer etc..In another specific implementation, organic material
All positions in layer covering visible area.
So far, anode 103, anode auxiliary electrode, pixel separation layer 104, yin can be formed on Kapton 204
Pole insulated column 105, organic material layer 106 and cathode 107.
(3) about step S103.
As shown in figure 3, above-mentioned steps S103 includes: by water suction glue-line 109 coating (or attaching) in water vapor rejection film 110
On；Under the conditions of vacuum condition or nitrogen protection, 109 side of water suction glue-line of water vapor rejection film 110 is fitted in above-mentioned organic
On luminescence unit, to form flexible OLED devices.
After packaged water vapour locking diaphragm 110, further includes: from the glass for being formed with release layer 202 and adhesion promoter layer 203
On substrate 201, remove flexible OLED devices, using attachment protective film after flexible OLED devices as shown in Figure 1 can be obtained.
The part excision that first will be covered with adhesion promoter layer 203 before removing, then can carry out the stripping of flexible OLED devices using MLO
From.
The detailed process of the manufacturing method of another flexible OLED devices, polyamides in this method are described below with reference to Fig. 5
Aqueous vapor separation layer is formed between imines film and anode.In addition the part not specifically described in this method is referred in above-mentioned
The associated description of appearance.Referring to Fig. 5, method includes the following steps:
Step S201 forms release layer 202 on the surface of glass substrate 201, and solidifies release layer 202.
Step S202 forms adhesion promoter layer 203 in the peripheral inactive area of release layer 202, and solidifies adhesion and promote
Into oxidant layer 203.
Step S203 carries out corona treatment to release layer 202 and adhesion promoter layer 203.
Step S204, by slit coating, spin coating or spraying process, 202 He of release layer after plasma processing
Kapton 204 is formed on adhesion promoter layer 203.
Step S205 forms aqueous vapor separation layer 205 on Kapton 204.
Specifically, it can be, but not limited to make aqueous vapor separation layer 205 by techniques such as PVD, CVD or vapor depositions.Water vapor rejection
Layer 205 can be, but not limited to using silicon nitride SiNx optical thin film, and aqueous vapor separation layer 205 can prevent water vapour from flexible base board
Organic light-emitting units are entered outside 102.
Step S206, on aqueous vapor separation layer 205 formed include anode 103, anode auxiliary electrode, pixel separation layer 104,
The organic light-emitting units of cathode insulated column 105, organic material layer 106 and cathode 107.
Step S207, encapsulation is pasted with the water vapor rejection film 110 of water suction glue-line 109 on organic light-emitting units, to be formed
Flexible OLED devices.
Step S208, from the glass substrate 201 for being formed with release layer 202 and adhesion promoter layer 203, removing is flexible
OLED device, using attachment protective film after flexible OLED devices as shown in Figure 1 can be obtained.
It is organic in this method below with reference to the detailed process of the manufacturing method of another flexible OLED devices of Fig. 6 description
Thin-film encapsulation layer is formed on luminescence unit.In addition the part not specifically described in this method is referred to the correlation of above content
Description.Referring to Fig. 6, method includes the following steps:
Step S301 forms release layer 202 on the surface of glass substrate 201, and solidifies release layer 202.
Step S302 forms adhesion promoter layer 203 in the peripheral inactive area of release layer 202, and solidifies adhesion and promote
Into oxidant layer 203.
Step S303 carries out corona treatment to release layer 202 and adhesion promoter layer 203.
Step S304, by slit coating, spin coating or spraying process, 202 He of release layer after plasma processing
Kapton 204 is formed on adhesion promoter layer 203.
Step S305, being formed on Kapton 204 includes anode 103, anode auxiliary electrode, pixel separation layer
104, the organic light-emitting units of cathode insulated column 105, organic material layer 106 and cathode 107.
Step S306 forms thin-film encapsulation layer 108 on cathode 107.
Specifically, it can be, but not limited to make thin-film encapsulation layer 108 by techniques such as vapor deposition or low temperature CVDs.Make film
Metallic mask can be used in the process of encapsulated layer 108, covers to binding and procedural test region.Thin-film encapsulation layer 108
The water vapour from water suction glue-line 109 can be further prevented to enter inside organic light-emitting units.
Step S307, encapsulation is pasted with water suction glue-line 109 on the organic light-emitting units for being formed with thin-film encapsulation layer 108
Water vapor rejection film 110, to form flexible OLED devices.
Step S308, from the glass substrate 201 for being formed with release layer 202 and adhesion promoter layer 203, removing is flexible
OLED device, using attachment protective film after flexible OLED devices as shown in Figure 2 can be obtained.
The detailed process of the manufacturing method of another flexible OLED devices, polyamides in this method are described below with reference to Fig. 7
It is formed with aqueous vapor separation layer between imines film and anode, and is formed with thin-film encapsulation layer on organic light-emitting units.In addition the party
The part not specifically described in method is referred to the associated description of above content.Referring to Fig. 7, method includes the following steps:
Step S401 forms release layer 202 on the surface of glass substrate 201, and solidifies release layer 202.
Step S402 forms adhesion promoter layer 203 in the peripheral inactive area of release layer 202, and solidifies adhesion and promote
Into oxidant layer 203.
Step S403 carries out corona treatment to release layer 202 and adhesion promoter layer 203.
Step S404, by slit coating, spin coating or spraying process, 202 He of release layer after plasma processing
Kapton 204 is formed on adhesion promoter layer 203.
Step S405 forms aqueous vapor separation layer 205 on Kapton 204.
Step S406, on aqueous vapor separation layer 205 formed include anode 103, anode auxiliary electrode, pixel separation layer 104,
The organic light-emitting units of cathode insulated column 105, organic material layer 106 and cathode 107.
Step S407 forms thin-film encapsulation layer 108 on cathode 107.
Step S408, encapsulation is pasted with water suction glue-line 109 on the organic light-emitting units for being formed with thin-film encapsulation layer 108
Water vapor rejection film 110, to form flexible OLED devices.
Step S409, from the glass substrate 201 for being formed with release layer 202 and adhesion promoter layer 203, removing is flexible
OLED device, using attachment protective film after flexible OLED devices as shown in Figure 2 can be obtained.
In conclusion not needing other coating UV using the manufacturing method of the flexible OLED devices in the embodiment of the present application
The processing procedure of frame glue and liquid desiccant, a series of brought processing procedures are asked when effectively improving coating UV frame glue and liquid desiccant
Topic improves the yield and reliability of OLED device to reduce the difficulty of manufacture OLED device.In addition, based on to release
The corona treatment of layer and adhesion promoter layer can make Kapton and glass substrate reach a kind of suitable adherency
Power critical value, to guarantee that Kapton when by all processing procedures, will not be removed from glass baseplate surface, will not occur
Rupture and Drug leakage are between Kapton and glass substrate；And after completing all processing procedures and being bonded, additionally it is possible to adopt
Smoothly Kapton is stripped down from glass baseplate surface with MLO mode, the structure without damaging OLED device
And functional pin.
The embodiment of the present application also provides a kind of display device, which includes the flexible OLED in above-described embodiment
Device.
In the description of the present application, it is also necessary to explanation, the orientation of the instructions such as term " on ", "lower", "inner", "outside" or
Positional relationship be based on the orientation or positional relationship shown in the drawings or the invention product using when the orientation usually put or
Positional relationship is merely for convenience of description the application and simplifies description, rather than the device or element of indication or suggestion meaning must
There must be specific orientation, be constructed and operated in a specific orientation, therefore should not be understood as the limitation to the application.In addition, art
Language " first ", " second " etc. are only used for distinguishing description, are not understood to indicate or imply relative importance.
The foregoing is merely preferred embodiment of the present application, are not intended to limit this application, for the skill of this field
For art personnel, various changes and changes are possible in this application.Within the spirit and principles of this application, made any to repair
Change, equivalent replacement, improvement etc., should be included within the scope of protection of this application.
Claims (10)
1. a kind of flexible OLED devices, which is characterized in that including flexible base board, the organic light emission on the flexible base board is arranged in
Unit, and the water vapor rejection film being encapsulated on the organic light-emitting units；The organic light-emitting units include that anode, anode are auxiliary
Help electrode, pixel separation layer, cathode insulated column, organic material layer and cathode；Close organic hair of the water vapor rejection film
The side of light unit is pasted with water suction glue-line.
2. flexible OLED devices according to claim 1, which is characterized in that in the organic light-emitting units and the steam
Thin-film encapsulation layer is also formed between barrier film.
3. a kind of manufacturing method of flexible OLED devices, which is characterized in that the described method includes:
Make flexible base board；
Form organic light-emitting units on the flexible base board, the organic light-emitting units include anode, anode auxiliary electrode, as
Plain wall, cathode insulated column, organic material layer and cathode；
Encapsulation is pasted with the water vapor rejection film of water suction glue-line on the organic light-emitting units, to form flexible OLED devices.
4. according to the method described in claim 3, it is characterized in that, before the production flexible base board, further includes:
Release layer is formed on the surface of glass substrate, and solidifies the release layer；
Adhesion promoter layer is formed in the peripheral inactive area of the release layer, and solidifies the adhesion promoter layer.
5. according to the method described in claim 4, it is characterized in that, the production flexible base board, comprising:
Corona treatment is carried out to the release layer and the adhesion promoter layer；
By slit coating, spin coating or spraying process, shape on release layer and adhesion promoter layer after plasma processing
At Kapton.
6. according to the method described in claim 5, it is characterized in that, the release layer after plasma processing and described viscous
Formed after Kapton in promotion oxidant layer, the method also includes:
Aqueous vapor separation layer is formed on the Kapton.
7. according to the method described in claim 4, it is characterized in that, the encapsulation on the organic light-emitting units is pasted with suction
The water vapor rejection film of gelatine layer, to be formed after flexible OLED devices, further includes:
From the glass substrate for being formed with the release layer and the adhesion promoter layer, the flexible OLED devices are removed.
8. according to the method described in claim 3, it is characterized in that, the encapsulation on the organic light-emitting units is pasted with suction
Before the water vapor rejection film of gelatine layer, further includes:
Thin-film encapsulation layer is formed on the organic light-emitting units.
9. according to the method described in claim 3, it is characterized in that, the encapsulation on the organic light-emitting units is pasted with suction
The water vapor rejection film of gelatine layer, comprising:
Water suction glue-line is coated on water vapor rejection film；
Under the conditions of vacuum condition or nitrogen protection, the water suction glue-line side of the water vapor rejection film, which is fitted in, described to be had
On machine luminescence unit.
10. a kind of display device, which is characterized in that including such as above-mentioned flexible OLED devices of any of claims 1 or 2.
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Cited By (1)
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