CN106158740A - Flexible substrate substrate and the preparation method of flexible OLED display - Google Patents
Flexible substrate substrate and the preparation method of flexible OLED display Download PDFInfo
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- CN106158740A CN106158740A CN201610850542.7A CN201610850542A CN106158740A CN 106158740 A CN106158740 A CN 106158740A CN 201610850542 A CN201610850542 A CN 201610850542A CN 106158740 A CN106158740 A CN 106158740A
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- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L2021/775—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate comprising a plurality of TFTs on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
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Abstract
A kind of flexible substrate substrate and the preparation method of flexible OLED display, wherein the preparation method of this flexible substrate substrate includes step: provide hard carrier substrate；Forming one layer of RF magnetron sputtering layer on this hard carrier substrate, this RF magnetron sputtering layer is pattern structure and includes spaced multiple RF magnetron sputtering patterns, and each RF magnetron sputtering pattern is corresponding to a screen body region；Forming one layer of inorganic barrier layer on this RF magnetron sputtering layer, this inorganic barrier layer is whole structure and covers the plurality of RF magnetron sputtering pattern simultaneously and be coated with the surrounding sidewall of each RF magnetron sputtering pattern, thus makes flexible substrate substrate.In the preparation method of this flexible substrate substrate, the surrounding sidewall of each RF magnetron sputtering pattern (corresponding to each screen body) is all coated with by inorganic barrier layer, it is greatly promoted the front of flexible substrate substrate and the obstruct water oxygen ability of side, is effectively improved the obstruct water oxygen performance of flexible display screen body side surface.
Description
Technical field
The present invention relates to flexible display technologies field, particularly relate to a kind of flexible substrate substrate and flexible OLED display
Preparation method.
Background technology
Organic Light Emitting Diode (English full name Organic Light-Emitting Diode, be called for short OLED) is actively to send out
Optical device, has the advantages such as high-contrast, wide viewing angle, low-power consumption, fast response time, volume are thinner, is expected to become of future generation main
Stream flat panel display.And, flexibility can be realized in place of Organic Light Emitting Diode most glamour exactly, specifically by organic
Light emitting diode makes on flexible substrates, and these flexible substrate are so that Organic Light Emitting Diode bends, and can roll up
Become arbitrary shape.
It is different from traditional panel display apparatus, the lining used by flexible AMOLED (active matric organic light emitting diode)
Bottom material mainly has ultra-thin glass, metallic film and organic polymer three class, and wherein, ultra-thin glass hinders with the water oxygen of metallic film
Good every characteristic, but the pliability of ultra-thin glass is poor, crisp, very sensitive to crack defect；Metallic film then poor transparency, and
Surface roughness is higher, needs extra flatening process, and these all limit ultra-thin glass with metallic film at flexible OLED
The application in field.
Polymeric material (such as PET, PEN, PC, PI etc.) have compared with glass, metal pliability more preferably, quality lighter,
More resistant to advantages such as impacts, relatively it is suitable as the backing material of flexible AMOLED, but polymeric material there is also defect: it is to sky
Water in gas is poor with the barrier properties of oxygen, and water is readily permeable with oxygen decomposes OLED material in display device, reduces display
Service life.
Owing to organic luminescent device is very sensitive to the erosion of water oxygen, the water oxygen of trace will result in organic material in device
The deterioration of oxidation, crystallization or electrode, affect the life-span of device or directly result in the damage of device, therefore preparing high water resistant oxygen
The flexible substrate substrate of performance is most important.In prior art, the most conventional obstruct water oxygen invades from flexible substrate substrate to be had
The method of machine luminescent device has a following two:
One, in flexible polymer substrate, prepare water oxygen barrier layer, intercept with the water oxygen that this promotes flexible polymer substrate
Performance, water oxygen barrier layer is generally made inorganic barrier layer by the composite of inorganic material or two or more inorganic matter, logical
Cross this inorganic barrier layer to be penetrated into inside display device by polymer substrate to the water intercepting in air with oxygen.This kind of method
The water oxygen barriering effect realized in the front (being i.e. perpendicular to substrate direction) of display still can, but water oxygen readily penetrates through substrate
Surrounding sidewall penetrate into device inside.
Two, flexible glass or metallic film etc. is used to intercept water oxygen as substrate.As mentioned above, although ultra-thin glass and gold
The water oxygen barrier properties belonging to thin film is good, but ultra-thin glass and metallic film the most all there are self open defect, limit
The application in flexible OLED field of ultra-thin glass and metallic film.
Summary of the invention
It is an object of the invention to provide a kind of flexible substrate substrate and the preparation method of flexible OLED display, to promote
The front of flexible substrate substrate and the obstruct water oxygen ability of side, it is achieved preferably water oxygen barriering effect.
The present invention provides the preparation method of a kind of flexible substrate substrate, including step:
Hard carrier substrate is provided；
Forming one layer of RF magnetron sputtering layer on this hard carrier substrate, this RF magnetron sputtering layer is pattern structure and includes phase
Multiple RF magnetron sputtering patterns at interval mutually, each RF magnetron sputtering pattern is corresponding to a screen body region；
Forming one layer of inorganic barrier layer on this RF magnetron sputtering layer, this inorganic barrier layer is whole structure and covers this simultaneously
Multiple RF magnetron sputtering patterns are also coated with the surrounding sidewall of each RF magnetron sputtering pattern, thus make flexible substrate substrate.
Further, on this RF magnetron sputtering layer formed one layer of inorganic barrier layer, this inorganic barrier layer be whole structure and
After covering the plurality of RF magnetron sputtering pattern simultaneously and being coated with the surrounding sidewall of each RF magnetron sputtering pattern, this preparation method also includes
It is alternately repeated and prepares RF magnetron sputtering layer and inorganic barrier layer, to be formed corresponding to each screen body region on this hard carrier substrate
Alternately laminated RF magnetron sputtering layer and inorganic barrier layer.
Further, the material of this RF magnetron sputtering layer is polyimides, polyethylene, polypropylene, polystyrene, polyether sulfone tree
In fat, polyethylene naphthalate, polyethylene terephthalate, Merlon, polyarylate, fiber-reinforced plastic
One or more mixture.
Further, this RF magnetron sputtering layer is by first coating organic polymer soln, then reheating the mode of solidification
It is produced on this hard carrier substrate.
Further, the one during the material of this inorganic barrier layer is the nitride of metal-oxide, the oxide of silicon, silicon
Or multiple mixture.
Further, this inorganic barrier layer is to deposit making by the way of physical vapour deposition (PVD) or chemical gaseous phase deposition
On this RF magnetron sputtering layer.
The present invention also provides for the preparation method of a kind of flexible OLED display, including step:
Hard carrier substrate is provided；
Forming one layer of RF magnetron sputtering layer on this hard carrier substrate, this RF magnetron sputtering layer is pattern structure and includes phase
Multiple RF magnetron sputtering patterns at interval mutually, each RF magnetron sputtering pattern is corresponding to a screen body region；
Forming one layer of inorganic barrier layer on this RF magnetron sputtering layer, this inorganic barrier layer is whole structure and covers this simultaneously
Multiple RF magnetron sputtering patterns are also coated with the surrounding sidewall of each RF magnetron sputtering pattern, thus make flexible substrate substrate；
This flexible substrate substrate is formed OLED layer；
This OLED layer is formed encapsulated layer；
Screen body line of cut along each screen body surrounding cuts, and obtains multiple flexible OLED display, the most each
The flexible substrate substrate of flexible OLED display has the RF magnetron sputtering layer of stacking and inorganic barrier layer and this RF magnetron sputtering layer
Surrounding sidewall is coated with by this inorganic barrier layer.
Further, on this RF magnetron sputtering layer formed one layer of inorganic barrier layer, this inorganic barrier layer be whole structure and
After covering the plurality of RF magnetron sputtering pattern simultaneously and being coated with the surrounding sidewall of each RF magnetron sputtering pattern, this preparation method also includes
It is alternately repeated and prepares RF magnetron sputtering layer and inorganic barrier layer, to be formed corresponding to each screen body region on this hard carrier substrate
Alternately laminated RF magnetron sputtering layer and inorganic barrier layer.
Further, this encapsulated layer is multiple structure, including mutually overlapping organic layer and inorganic layer or include multilamellar
Inorganic layer.
Further, this preparation method is additionally included in before carrying out shielding body cutting, by this hard carrier substrate from this flexibility
Peel off on underlay substrate.
The flexible substrate substrate of the present embodiment offer and the preparation method of flexible OLED display, stacking preparation has patterning
RF magnetron sputtering layer and the inorganic barrier layer of whole, wherein flexible RF magnetron sputtering layer is that patterning is prepared and (is different from whole system
Make) and include spaced multiple RF magnetron sputtering patterns, each RF magnetron sputtering pattern is corresponding to a screen body region, the most again
Whole preparation inorganic barrier layer, below inorganic barrier layer covering, each RF magnetron sputtering pattern in RF magnetron sputtering layer, the most each
The surrounding sidewall of RF magnetron sputtering pattern (corresponding to each screen body) is all coated with by inorganic barrier layer, is greatly promoted flexible liner base
The front of plate and the obstruct water oxygen ability of side, be effectively improved the oxygen performance that blocks water of flexible display screen body side surface, it is achieved that more preferably
Water oxygen barriering effect.
Accompanying drawing explanation
Fig. 1 is the flow chart of the preparation method of flexible substrate substrate in present pre-ferred embodiments.
Fig. 2 is the flow chart of the preparation method of flexible OLED display in present pre-ferred embodiments.
Fig. 3 A is the floor map preparing ground floor RF magnetron sputtering layer in present pre-ferred embodiments.
Fig. 3 B is the cross-sectional schematic in Fig. 3 A along III-III.
Fig. 4 A is the floor map preparing ground floor inorganic barrier layer in present pre-ferred embodiments.
Fig. 4 B is the cross-sectional schematic in Fig. 4 A along IV-IV.
Fig. 5 A is the floor map preparing second layer RF magnetron sputtering layer in present pre-ferred embodiments.
Fig. 5 B is the cross-sectional schematic in Fig. 5 A along V-V.
Fig. 6 A is the floor map preparing second layer inorganic barrier layer in present pre-ferred embodiments.
Fig. 6 B is the cross-sectional schematic in Fig. 6 A along VI-VI.
Fig. 7 A is the floor map preparing OLED layer in present pre-ferred embodiments.
Fig. 7 B is the cross-sectional schematic in Fig. 7 A along VII-VII.
Fig. 8 A is the floor map preparing encapsulated layer in present pre-ferred embodiments.
Fig. 8 B is the cross-sectional schematic in Fig. 8 A along VIII-VIII.
Fig. 9 is the structural representation cutting the single flexible OLED display obtained in Fig. 8 B.
Figure 10 is the structural representation of X section in Fig. 9.
Detailed description of the invention
By further illustrating the technical approach and effect that the present invention taked by reaching predetermined goal of the invention, below in conjunction with
Drawings and Examples, detailed description of the invention, structure, feature and the effect thereof to the present invention, after describing in detail such as.
The present invention provides the preparation method of a kind of flexible substrate substrate, and please join Fig. 1, Fig. 1 is in present pre-ferred embodiments
The flow chart of the preparation method of flexible substrate substrate, including step:
Step S1: hard carrier substrate 10 is provided；
Step S2: forming one layer of RF magnetron sputtering layer 21 on this hard carrier substrate 10, this RF magnetron sputtering layer 21 is pattern
Changing structure and include spaced multiple RF magnetron sputtering patterns 210, each RF magnetron sputtering pattern 210 is corresponding to a Ge Pingti district
Territory, as shown in Figure 3 A and Figure 3 B；
Step S3: forming one layer of inorganic barrier layer 22 on this RF magnetron sputtering layer 21, this inorganic barrier layer 22 is whole knot
Structure and cover the plurality of RF magnetron sputtering pattern 210 simultaneously and be coated with the surrounding sidewall of each RF magnetron sputtering pattern 210, thus make
Flexible substrate substrate 20, as shown in Figure 4 A and 4 B shown in FIG.；
Preferably, forming one layer of inorganic barrier layer 22 on this RF magnetron sputtering layer 21, this inorganic barrier layer 22 is whole knot
Structure and cover simultaneously the plurality of RF magnetron sputtering pattern 210 and be coated with each RF magnetron sputtering pattern 210 surrounding sidewall after, this system
Preparation Method also includes step S4: repeat the above steps S2 and step S3, is alternately repeated and prepares RF magnetron sputtering layer 21 and inorganic barrier
Layer 22, to form alternately laminated RF magnetron sputtering layer 21 and inorganic corresponding to each screen body region on this hard carrier substrate 10
Barrier layer 22, as shown in Fig. 5 A and Fig. 5 B and Fig. 6 A and Fig. 6 B.
In order to realize flexibility, the thickness of this RF magnetron sputtering layer 21 and this inorganic barrier layer 22 is the thinnest, causes only making
Standby one group of RF magnetron sputtering layer 21 and inorganic barrier layer 22 can not make this flexible substrate substrate 20 intercept at stress buffer and water oxygen
Etc. aspect obtain optimum efficiency, therefore can prepare many groups by RF magnetron sputtering layer 21 and inorganic barrier layer 22 structure by being alternately repeated
The stepped construction become, so that this flexible substrate substrate 20 obtains more preferably effect at aspects such as stress buffer and water oxygen obstructs.
In step sl, this hard carrier substrate 10 is used for providing carrying supporting role, and it can be glass substrate, metal
One or more in substrate, quartz base plate or organic substrate, select glass substrate in the present embodiment.
In step s 2, the material of this RF magnetron sputtering layer 21 can be polyimides (PI), polyethylene (PE), polypropylene
(PP), polystyrene (PS), polyethersulfone resin (PES), polyethylene naphthalate (PEN), poly terephthalic acid second two
One or more mixture in alcohol ester (PET), Merlon (PC), polyarylate (PAR), fiber-reinforced plastic (FRP).This reality
Executing in example, the material of this RF magnetron sputtering layer 21 is preferably polyimides (PI), and PI material can tolerate higher temperature, thermal decomposition temperature
Degree Tg reaches more than 350 DEG C, can coordinate TFT high temperature process, makes the tft array of function admirable, is advantageously implemented high-resolution
Flexible AMOLED (active matric organic light emitting diode) display.
It is hard that this RF magnetron sputtering layer 21 is produced on this preferably through coating organic polymer soln and the mode being heating and curing
On matter carrier substrate 10.Such as, first pass through the mode of evaporation, hard carrier substrate 10 deposits a strata xylol, shape
Become one layer of release layer, then polyimides (PI) solution is coated in shape on hard carrier substrate 10 by such as knife coating (slit)
Become pattern structure (i.e. PI solution is not that whole topcoating is covered, but subregion coats), then reheat the PI coated by solidification molten
Liquid (is such as sent in high temperature oven), to form Kapton i.e. this RF magnetron sputtering layer 21.Wherein, this release layer is conducive to
From hard carrier substrate 10, (ginseng below step S8) is easily peeled off by making the flexible substrate substrate 20 formed.
In other embodiments, it would however also be possible to employ the organic polymer thin film prepared is fitted to by binding agent
To form this RF magnetron sputtering layer 21 in zones of different on this hard carrier substrate 10, but laminating type is used to need consideration higher
Para-position requirement.
In step s3, the material of this inorganic barrier layer 22 can be metal-oxide, such as aluminium oxide, titanium oxide, oxygen
Change magnesium, zirconium oxide or stannum oxide, it is also possible to for oxide or the nitride of silicon of silicon, such as silicon oxide, silicon nitride or nitrogen oxygen
SiClx.Whole of this inorganic barrier layer 22 covers on this RF magnetron sputtering layer 21, it is possible to effectively isolation steam or oxygen are from this flexibility
Underlay substrate 20 penetrates into.
This inorganic barrier layer 22 deposits the mode of (CVD) preferably through physical vapour deposition (PVD) (PVD) or chemical gaseous phase
It is produced on this RF magnetron sputtering layer 21.Such as, the preparation method of this inorganic barrier layer 22 includes but not limited to d.c. sputtering, radio frequency
One in sputtering, reactive sputtering, plasma enhanced chemical vapor deposition, ald.
In step s 4, be formed as many groups by making RF magnetron sputtering layer 21 and inorganic barrier layer 22 replace preparation successively, with
Promote water oxygen barriering effect.In the present embodiment, this flexible substrate substrate 20 includes two groups by RF magnetron sputtering layer 21 and inorganic barrier
The stepped construction (as shown in Figure 6B) that layer 22 is constituted so that water oxygen transmission path is elongated, adds water oxygen barriering effect, Er Qiewu
It is the thinnest that machine barrier layer 22 can do, and makes inorganic barrier layer 22 be not likely to produce crack when bending, thus increases this flexible substrate
The pliability of substrate 20 and bending property, multilamellar RF magnetron sputtering layer 21 can provide more preferable stress buffer effect.Real at other
Executing in example, this flexible substrate substrate 20 can also include that three groups (or more groups) of stacking are by RF magnetron sputtering layer 21 and inorganic barrier
The stepped construction that layer 22 is constituted, to improve the combination property of this flexible substrate substrate 20 further.
In the present embodiment, prepared by the RF magnetron sputtering layer 21 that will be patterned into inorganic barrier layer 22 stacking with whole, Qi Zhongrou
The RF magnetron sputtering layer 21 of property is prepared (being different from whole making) for patterning and includes spaced multiple RF magnetron sputtering patterns
210, corresponding to a screen body region, (each RF magnetron sputtering pattern 210 area is slightly larger than or is equal to each RF magnetron sputtering pattern 210
Screen bulk area), the most whole preparation inorganic barrier layer 22, each in RF magnetron sputtering layer 21 below inorganic barrier layer 22 covering
RF magnetron sputtering pattern 210, the surrounding sidewall of the most each RF magnetron sputtering pattern 210 (corresponding to each screen body) is all by inorganic barrier
Layer 22 is coated with, and is greatly promoted the front of flexible substrate substrate 20 and the obstruct water oxygen ability of side, is effectively improved Flexible Displays
The oxygen performance that blocks water of screen body side surface, it is achieved that preferably water oxygen barriering effect.
The present invention also provides for the preparation method of a kind of flexible OLED display, and please join Fig. 2, Fig. 2 is that the present invention preferably implements
The flow chart of the preparation method of flexible OLED display in example, including step:
Step S1: hard carrier substrate 10 is provided；
Step S2: forming one layer of RF magnetron sputtering layer 21 on this hard carrier substrate 10, this RF magnetron sputtering layer 21 is pattern
Changing structure and include spaced multiple RF magnetron sputtering patterns 210, each RF magnetron sputtering pattern 210 is corresponding to a Ge Pingti district
Territory, as shown in Figure 3 A and Figure 3 B；
Step S3: forming one layer of inorganic barrier layer 22 on this RF magnetron sputtering layer 21, this inorganic barrier layer 22 is whole knot
Structure and cover the plurality of RF magnetron sputtering pattern 210 simultaneously and be coated with the surrounding sidewall of each RF magnetron sputtering pattern 210, thus make
Flexible substrate substrate 20, as shown in Figure 4 A and 4 B shown in FIG.；
Preferably, this preparation method also includes step S4: repeat the above steps S2 and step S3, be alternately repeated prepare organic
Substrate layer 21 and inorganic barrier layer 22, to be formed alternately laminated corresponding to each screen body region on this hard carrier substrate 10
RF magnetron sputtering layer 21 and inorganic barrier layer 22, as shown in Fig. 5 A and Fig. 5 B and Fig. 6 A and Fig. 6 B；
Step S5: form OLED layer 30 on this flexible substrate substrate 20, as shown in figures 7 a and 7b；
Step S6: form encapsulated layer 40 on this OLED layer 30, as shown in Figure 8 A and 8 B；
Step S7: the screen body line of cut CL along each screen body surrounding cuts, and obtains multiple flexible OLED display
100, the flexible substrate substrate 20 of the most each flexible OLED display 100 has RF magnetron sputtering layer 21 and the inorganic barrier of stacking
The surrounding sidewall of layer 22 and this RF magnetron sputtering layer 21 is coated with by this inorganic barrier layer 22, as shown in Fig. 8 A and Fig. 8 B and Fig. 9.
Wherein, step S1 to step S4 may refer to the preparation method of above-mentioned flexible substrate substrate, does not repeats them here.
In step s 5, as a example by AMOLED (active matric organic light emitting diode), this OLED layer 30 includes
Image element circuit layer 31 (including tft array and the circuit such as scan line and data wire) and be formed on this image element circuit layer 31 organic
Light emitting diode 32, the method particular by thin film deposition repeatedly, mask exposure, the method for etching or continuous printing first exists
Make on this flexible substrate substrate 20 and form this image element circuit layer 31, then by the method for evaporation on this image element circuit layer 31
Make again and form this Organic Light Emitting Diode 32.
The concrete preparation method of image element circuit layer 31 and Organic Light Emitting Diode 32 can be found in Figure 10, first topmost one
Semiconductor channel layer 311 is set in the inorganic barrier layer 22 of layer, then the gate insulator covering semiconductor channel layer 311 is set
312；It is provided above grid 313 at semiconductor channel layer 311, then covering grid 313 and gate insulator are set on grid 313
The interlayer dielectric layer 314 of layer 312；In interlayer dielectric layer 314 and gate insulator 312, conducting semiconductor channel layer 311 is set
Through hole (figure do not mark), source electrode 315 and drain electrode 316 are set at the two ends of grid 313, source electrode 315 and drain electrode 316 are arranged and covers
Cover the interlayer planarization layer 317 of whole pixel circuit region to protect TFT and to make the top side of TFT planarize, smooth at interlayer
The through hole (figure is not marked) of conduction Drain 316 is set in changing layer 317；Interlayer planarization layer 317 is arranged pixel confining layers 320 with
Limit the different subpixel regions such as such as red, green, blue；Each subpixel area limited in pixel confining layers 320 sets gradually
Anode 321, organic luminous layer 323 and negative electrode 322, to form Organic Light Emitting Diode 32.Wherein, anode 321 and negative electrode 322
Between except organic luminous layer 323, it is also possible to electron injecting layer, electron transfer layer, hole injection layer, hole transmission layer etc. are set
Organic function layer.
In step s 6, this encapsulated layer 40 can be multiple structure, such as, include the most overlapping organic layer and inorganic layer,
Or the inorganic layer including multilamellar.In the present embodiment, this encapsulated layer 40 is preferably had by least one of which of the most alternately laminated setting
Machine layer and at least one of which inorganic layer are constituted, and are i.e. sequentially prepared overlapping organic layer and inorganic layer on this OLED layer 30 and shape
Become this encapsulated layer 40, to improve the encapsulation performance of device.
In the step s 7, only it is formed at and each screen body due to the multiple RF magnetron sputtering layers 21 on this hard carrier substrate 10
In corresponding region, the most the plurality of RF magnetron sputtering layer 21 is not formed at the non-display area between adjacent screen body.Therefore, on edge
The screen body line of cut CL of each screen body surrounding when cutting, screen body line of cut CL is corresponding to non-display area.After cutting
To each flexible OLED display 100 in, as it is shown in figure 9, flexible substrate substrate 20 has RF magnetron sputtering layer 21 He of stacking
Inorganic barrier layer 22, and the surrounding sidewall of this RF magnetron sputtering layer 21 is coated with by this inorganic barrier layer 22, OLED display 100 side
The oxygen performance that blocks water be greatly promoted.
Further, this preparation method also includes step S8: before carrying out shielding body cutting, by this hard carrier substrate 10
Peel off from this flexible substrate substrate 20.This hard carrier substrate 10 after stripping can reuse.Hold above-mentioned, by advance
Forming one layer of release layer on this hard carrier substrate 10, the flexible substrate substrate 20 that this release layer can make making be formed is light
Ground is peeled off from this hard carrier substrate 10.It should be noted that after peeling off hard carrier substrate 10, it is also possible to
One layer of flexible protective film (not shown) is covered again, to play a protective role below on the RF magnetron sputtering layer 21 of a layer.
In the present embodiment, prepared by the RF magnetron sputtering layer 21 that will be patterned into inorganic barrier layer 22 stacking with whole, Qi Zhongrou
The RF magnetron sputtering layer 21 of property is prepared (being different from whole making) for patterning and includes spaced multiple RF magnetron sputtering patterns
210, corresponding to a screen body region, (each RF magnetron sputtering pattern 210 area is slightly larger than or is equal to each RF magnetron sputtering pattern 210
Screen bulk area), the most whole preparation inorganic barrier layer 22, each in RF magnetron sputtering layer 21 below inorganic barrier layer 22 covering
RF magnetron sputtering pattern 210, the surrounding sidewall of the most each RF magnetron sputtering pattern 210 (corresponding to each screen body) is all by inorganic barrier
Layer 22 is coated with, and then carries out shielding body cutting after the making completing OLED layer 30 and encapsulated layer 40, obtains multiple flexibility
OLED display 100.In each flexible OLED display 100, it is coated with organic lining by the edge of inorganic barrier layer 22
The surrounding sidewall of bottom 21, invades from the front of flexible substrate substrate 20 and side and reduces the display device longevity intercepting water oxygen
Life, is greatly improved the obstruct water oxygen ability of flexible OLED display 100 front and side, is effectively improved flexible OLED display
The obstruct water oxygen effect of 100 sides.
The present invention also provides for a kind of flexible substrate substrate 20, and this flexible substrate substrate 20 uses flexible substrate as above
The preparation method of substrate is made.
The present invention also provides for a kind of flexible OLED display 100, and this flexible OLED display 100 uses the most soft
The preparation method of property OLED display is made.
The above, be only presently preferred embodiments of the present invention, and the present invention not makees any pro forma restriction, though
So the present invention is disclosed above with preferred embodiment, but is not limited to the present invention, any technology people being familiar with this specialty
Member, in the range of without departing from technical solution of the present invention, when the technology contents of available the disclosure above makes a little change or modification
For the Equivalent embodiments of equivalent variations, as long as being without departing from technical solution of the present invention content, according to the technical spirit pair of the present invention
Any simple modification, equivalent variations and the modification that above example is made, all still falls within the range of technical solution of the present invention.
Claims (10)
1. the preparation method of a flexible substrate substrate, it is characterised in that include step:
Hard carrier substrate is provided；
Forming one layer of RF magnetron sputtering layer on this hard carrier substrate, this RF magnetron sputtering layer is pattern structure and includes each other
Every multiple RF magnetron sputtering patterns, each RF magnetron sputtering pattern corresponding to one screen body region；
Forming one layer of inorganic barrier layer on this RF magnetron sputtering layer, this inorganic barrier layer is whole structure and covers the plurality of simultaneously
RF magnetron sputtering pattern is also coated with the surrounding sidewall of each RF magnetron sputtering pattern, thus makes flexible substrate substrate.
The preparation method of flexible substrate substrate the most according to claim 1, it is characterised in that shape on this RF magnetron sputtering layer
Becoming one layer of inorganic barrier layer, this inorganic barrier layer is whole structure and covers the plurality of RF magnetron sputtering pattern simultaneously and be coated with each
After the surrounding sidewall of RF magnetron sputtering pattern, this preparation method also includes being alternately repeated prepares RF magnetron sputtering layer and inorganic barrier layer,
To form alternately laminated RF magnetron sputtering layer and inorganic barrier layer corresponding to each screen body region on this hard carrier substrate.
The preparation method of flexible substrate substrate the most according to claim 1, it is characterised in that the material of this RF magnetron sputtering layer
For polyimides, polyethylene, polypropylene, polystyrene, polyethersulfone resin, polyethylene naphthalate, poly-terephthaldehyde
One or more mixture in acid glycol ester, Merlon, polyarylate, fiber-reinforced plastic.
The preparation method of flexible substrate substrate the most according to claim 3, it is characterised in that this RF magnetron sputtering layer is to pass through
First coating organic polymer soln, the mode then reheating solidification is produced on this hard carrier substrate.
The preparation method of flexible substrate substrate the most according to claim 1, it is characterised in that the material of this inorganic barrier layer
For metal-oxide, the oxide of silicon, silicon nitride in one or more mixture.
The preparation method of flexible substrate substrate the most according to claim 5, it is characterised in that this inorganic barrier layer is to pass through
The mode of physical vapour deposition (PVD) or chemical gaseous phase deposition deposits and is produced on this RF magnetron sputtering layer.
7. the preparation method of a flexible OLED display, it is characterised in that include step:
Hard carrier substrate is provided；
Forming one layer of RF magnetron sputtering layer on this hard carrier substrate, this RF magnetron sputtering layer is pattern structure and includes each other
Every multiple RF magnetron sputtering patterns, each RF magnetron sputtering pattern corresponding to one screen body region；
Forming one layer of inorganic barrier layer on this RF magnetron sputtering layer, this inorganic barrier layer is whole structure and covers the plurality of simultaneously
RF magnetron sputtering pattern is also coated with the surrounding sidewall of each RF magnetron sputtering pattern, thus makes flexible substrate substrate；
This flexible substrate substrate is formed OLED layer；
This OLED layer is formed encapsulated layer；
Screen body line of cut along each screen body surrounding cuts, and obtains multiple flexible OLED display, the most each flexibility
The flexible substrate substrate of OLED display has the RF magnetron sputtering layer of stacking and inorganic barrier layer and the surrounding of this RF magnetron sputtering layer
Sidewall is coated with by this inorganic barrier layer.
The preparation method of flexible OLED display the most according to claim 7, it is characterised in that on this RF magnetron sputtering layer
Forming one layer of inorganic barrier layer, this inorganic barrier layer is whole structure and covers the plurality of RF magnetron sputtering pattern simultaneously and be coated with every
After the surrounding sidewall of individual RF magnetron sputtering pattern, this preparation method also includes being alternately repeated prepares RF magnetron sputtering layer and inorganic barrier
Layer, to form alternately laminated RF magnetron sputtering layer and inorganic barrier corresponding to each screen body region on this hard carrier substrate
Layer.
The preparation method of flexible OLED display the most according to claim 7, it is characterised in that this encapsulated layer is multilamellar knot
Structure, including mutually overlapping organic layer and inorganic layer or the inorganic layer including multilamellar.
The preparation method of flexible OLED display the most according to claim 7, it is characterised in that this preparation method is also wrapped
Included before carrying out shielding body cutting, this hard carrier substrate is peeled off from this flexible substrate substrate.
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