CN109313868A - Display device manufacturing method - Google Patents
Display device manufacturing method Download PDFInfo
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- CN109313868A CN109313868A CN201780036286.0A CN201780036286A CN109313868A CN 109313868 A CN109313868 A CN 109313868A CN 201780036286 A CN201780036286 A CN 201780036286A CN 109313868 A CN109313868 A CN 109313868A
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- glass substrate
- display device
- resin film
- organic
- organic resin
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 239000011521 glass Substances 0.000 claims abstract description 76
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 239000011347 resin Substances 0.000 claims abstract description 36
- 229920005989 resin Polymers 0.000 claims abstract description 36
- 238000005530 etching Methods 0.000 claims description 25
- 238000005507 spraying Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 19
- 239000010410 layer Substances 0.000 description 40
- 239000010408 film Substances 0.000 description 39
- 229920001721 polyimide Polymers 0.000 description 19
- 239000000243 solution Substances 0.000 description 19
- 239000000565 sealant Substances 0.000 description 14
- 230000008569 process Effects 0.000 description 11
- 239000004642 Polyimide Substances 0.000 description 7
- 239000012528 membrane Substances 0.000 description 7
- 230000001681 protective effect Effects 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000002243 precursor Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 230000027756 respiratory electron transport chain Effects 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 229940113088 dimethylacetamide Drugs 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1615—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function
- G06F1/1616—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
- G06F1/1641—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being formed by a plurality of foldable display components
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Physics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The present invention provides a kind of removing without organic resin film and glass substrate and can carry out curved display device with simple method, display device manufacturing method according to the present invention, comprising: in the step of forming organic resin film (14) on the first interarea of glass substrate (12)；The layer (16,18,20) for including the steps that display element is formed on organic resin film；And the first main surface side by covering the glass substrate including organic resin film by elching resistant component (22), and the second main surface side is etched, thus the step of being thinned glass substrate.
Description
Technical field
The present invention relates to a kind of manufacturing methods of the display devices such as organic el display, extremely more particularly, to a kind of slimming
The manufacturing method of the curved display device of energy.
Background technique
In the past, various uses was used for using the display device of the flat-panel monitors such as liquid crystal display or organic el display.
Particularly, in recent years from the viewpoint of design, flexible display is concerned.It is mostly used when manufacturing flexible display easily
Organic el display corresponding to meandering.
Existing organic el display is using glass substrates such as cover glasses come display elements such as sealing organic el elements.Pass through
Glass substrate keeps the air-tightness and watertightness of organic EL element, the deterioration of element caused by preventing because of oxygen, moisture.But
Due to being further thinned the requirement with meandering as described above, develops shown using organic EL of resin substrate in recent years
Device.Resin substrate is flexible high compared with glass substrate, is less likely to be damaged bending, passes through the stacking of inoranic membrane and organic film
Structure seals display element, can be realized the gas barrier property with glass substrate equal extent.
However, be formed as sufficiently thin so that flexible resin substrate is very difficult to handle in manufacturing process, knot
Fruit is likely to become the reason of yield deteriorates.Therefore, in general, forming the organic resin films such as polyimides in supporting glass, so as to
In being handled in manufacturing process.In the state of ensuring the rigidity of entire substrate by supporting glass on organic resin film shape
Organic resin film is removed (for example, referring to special from supporting glass at display elements such as functional membranes, and after being sealed processing
Sharp document 1).Operation from supporting glass removing organic resin film is that supporting glass and having in advance by being removed by laser aid
The peeling layer formed between machine resin film carries out.
Existing technical literature
Patent document
Patent document 1:JP special open 2016-004112
Summary of the invention
(subject to be solved by the invention)
But it is unfavorable in the presence of being generated due to the laser irradiation when removing supporting glass to display element in the above-mentioned methods
The risk of influence.In addition, it is necessary to import the manufacturing device of the valuableness such as excimer laser, and production cost is also very high.
Particularly, multiple display devices are produced in the state of carrying out chamfering to multiple display devices on large substrate in recent years, but with
Substrate become larger, the irradiated area of laser increases, therefore production efficiency reduces, and peeling-off bad situation becomes more.
In addition, the display device being only made of resin film is difficult to the display element that adequately protects, and there are reliability deficiencies
The problem of.Particularly, in organic el display, the deterioration of display element is the obstacle to the long-life, it is therefore desirable to prevent from coming
From the substrate of the high reliablity of the immersion of external moisture, oxygen.
The object of the present invention is to provide it is a kind of can be with simple without carrying out the removing of organic resin film and glass substrate
Method carry out curved display device.
(a technical solution to solve project)
Display device manufacturing method according to the present invention, comprising: form organic resin on the first interarea of glass substrate
The step of film；The layer for including the steps that display element is formed on organic resin film；And by being covered by elching resistant component
Lid includes the first main surface side of the glass substrate of organic resin film, and is etched to the second main surface side, to make glass base
The step of plate is thinned.
It is formed in the process of organic resin film on the glass substrate, for example, by existing used supporting glass
Using coating units such as slit type coaters, and organic resin film is coated on the glass substrate.As organic resin film, preferably make
Use polyimides.In the process for forming display element, being formed on organic resin film includes thin film transistor (TFT) or organic EL
The functional layer of luminescent layer etc..After forming such display element, display element is sealed so as to be not exposed to outside air.?
In sealing process, processing is sealed by resin film made of alternately laminated inoranic membrane and organic film.Encapsulation process it
Afterwards, with elching resistant film or anticorrosive additive material come overlay tree adipose membrane, and glass substrate is etched.Etching process
In, it is etched by contacting the interarea of the glass substrate configured with display device with etching solution, to make glass substrate
Plate thickness it is thinning.
In the present invention, it is used due to glass substrate not as making the convenient supporting glass of manufacturing process, and
It is a part as the constituent element of display device and uses, therefore does not need to carry out the stripping of glass substrate and organic resin film
From.It further,, will not even if not removing resin film from supporting glass due to being thinned glass substrate by etching
The increased undesirable condition of thickness of display device is generated, and makes each glass substrate free bend as needed.In addition, due to
Protect display element by organic resin film and glass substrate, thus display element be exposed in outside air and deteriorate can
Energy property reduces, to improve the reliability of display device.
Furthermore it is preferred that being thinned glass substrate to the degree for enabling display device free bend.It is preferred that by glass base
Plate is thinned to 50~150 μm.By by glass substrate etching to the range, even thus include glass substrate display fill
It sets, can also make its bending.
In addition, being etched through for glass substrate sprays etching solution to glass substrate to carry out.By this composition, etching solution is non-
The case where other regions of display device other than necessity contact glass substrate, tails off.Therefore display element is deteriorated because of moisture
Possibility becomes smaller.
Invention effect
In accordance with the invention it is possible to provide it is a kind of can be with simple without carrying out the removing of organic resin film and glass substrate
Method carries out curved display device.
Detailed description of the invention
Fig. 1 is the figure for showing the structure of display device according to embodiment of the present invention.
Fig. 2 is the figure for showing the manufacturing process of display device.
Fig. 3 is the figure for showing the Etaching device used in this embodiment.
Specific embodiment
Display device according to embodiment of the present invention is illustrated using Fig. 1.Fig. 1 is organic EL panel 10
Schematic side elevation.Organic EL panel 10 has supporting glass 12, polyimide film 14, transparent electrode layer 16, luminescent layer 18
With sealant 20.
The configuration of supporting glass 12 is watching the opposite side in the side of image with user, and is formed in an interarea poly-
Acid imide film 14.In the present embodiment, polyimide film 14 is equivalent to the organic resin film in technical solution of the present invention.At this
In embodiment, as organic resin film, polyimides has been used, but has been not particularly limited, as long as being resistant to film forming work
The resin film of the treatment temperature of skill, is not particularly limited.
Transparent electrode layer 16 and luminescent layer 18 are sequentially laminated on polyimide film 14.It is excellent as transparent electrode layer 16
Form slection is at known low-temperature polysilicon silicon fiml.Luminescent layer 18 includes the functions such as hole transmission layer, organic EL element and electron transfer layer
Layer.In the present embodiment, transparent electrode layer 16 and luminescent layer 18 are equivalent to the display element in technical solution of the present invention.Sealing
Layer 20 is configured to cover luminescent layer 18, so that light-emitting component etc. be prevented to be externally exposed the moisture in air or oxygen and deteriorate.It is logical
Often, sealant 20 is formed by the way that the resin film of different compositions is laminated.In the present embodiment, although passing through five layers of sealant
It carries out diaphragm seal, but the structure of sealant 20 can be changed as appropriate.The organic EL panel 10 is from configured with close
The top emission type that the mode of the side visuognosis image of sealing 20 is constituted.
Here, being illustrated using (D) of (A) to Fig. 2 of Fig. 2 to the manufacturing method of organic EL panel 10.Firstly, to
The process that polyimide film 14 is formed in supporting glass 12 is illustrated.It is dissolved in dimethyl acetamide or methyl pyrrolidone
Solvent in polyimide precursor be coated in supporting glass 12 on (referring to Fig. 2 (A)).Supporting glass 12 is preferably that can make
The material used in the known manufacturing methods and with 300~800 μm of plate thickness.Polyimide precursor can pass through slit
The coating units such as coating machine or roll coater are coated.In such a situation it is preferred to applied to the thickness for making polyimide film 14
It is 7~30 μm.By the way that polyimide precursor is put into the drying oven for be warming up to predetermined temperature to carry out curing process.Separately
Outside, the prime coat for increasing contiguity power can be formed before coating polyimide film 14 in supporting glass 12.
After forming polyimide film 14, transparent electrode layer 16 is formed on polyimide film 14.In present embodiment
In, low-temperature polysilicon silicon fiml is formed on polyimide film 14 by known methods such as sputterings.In the top shape of transparent electrode layer 16
At luminescent layer 18 (referring to (B) of Fig. 2).The known methods such as vapor deposition mode or ink-jet mode can be used to be formed in luminescent layer 18
Machine material.In addition, luminescent layer 18 not only includes the luminescent layer being made of organic material, it further include hole transmission layer, electron-transport
Layer.In the present embodiment, hole transmission layer, luminescent layer and electron transfer layer are sequentially laminated on transparent electrode layer 16.
Transparent electrode layer 16 and luminescent layer 18 are capped (referring to (C) of Fig. 2) by the way that multiple sealants 20 are laminated.Sealing
Layer 20 is that have the resin film of gas barrier property, and constituted in a manner of the air-tightness and watertightness that keep luminescent layer 18.Sealant
20 can more effectively protect luminescent layer 18 by alternately laminated inoranic membrane and organic film.In the present embodiment, although it is logical
It crosses five layers of sealant and carries out diaphragm seal, but can suitably change stepped construction.
As the inoranic membrane in sealant, can be used silicon nitride, silica, silicon oxynitride, oxycarbide, carbonitride,
Aluminium oxide etc..As organic film, polyester, methacrylic acid, polystyrene, transparent fluororesin, polyimides, poly- ammonia can be used
Ester, cyclic olefine copolymer, acrylic resin, epoxy resin etc..In addition, these sealants are visual in order to ensure display device
Property, total light transmittance is preferably 90% or more.
In the organic EL panel 10 through diaphragm seal, (reference is handled by the slimming that etching carries out supporting glass 12
(D) of Fig. 2).Etching process is preferably carried out by contacting at least etching solution containing hydrofluoric acid with supporting glass 12.Herein
The engraving method of supporting glass 12 is illustrated.
Firstly, covering sealant 20 with protective film 22 before being etched.Protective film 22 is by having etching solution
The component of resistance is constituted, and at least has the resistance to hydrofluoric acid.In addition, in the present embodiment, being carried out by membrane element
Protection, but resist also can be used etc. etch resistants coating is covered.In addition, when the sealant 20 for being configured at most surface has
When having acid resistance, protective film 22 can not used.
In order to etch supporting glass 12, it is preferable to use the one chip Etaching device 30 as shown in (A) of Fig. 3.Etaching device
30 at least have conveying roller 32 and sprayer unit 34.Conveying roller 32 is configured along the length direction of Etaching device 30, and with defeated
The mode of organic EL panel 10 is sent to constitute.At this point, supporting glass 12 is loaded in a manner of contacting with conveying roller 32 (referring to Fig. 3
(B)).
Sprayer unit 34 is configured at the lower section of conveying roller 32 and the structure in a manner of spraying etching solution towards supporting glass 12
At.Sprayer unit 34 has multiple nozzles, equably to spray etching solution to supporting glass 12.Etching solution at least contains hydrogen fluorine
Acid can also add the inorganic acids such as hydrochloric acid or surfactant as needed.
Additionally, it is preferred that being configured to the sprayer unit spray from the position for being configured at the loading unit and moving section close to Etaching device
Cleaning solution is penetrated, supporting glass 12 is cleaned.The cleaning solution of present embodiment uses tap water, and but not limited to this.
Protective film 22 is stripped after being etched.Protective film 22 can be removed by applying the power of physics.?
In the case where using anticorrosive additive material, removed although can be immersed in stripper etc., it should be not to display element
The mode impacted is handled in a short time.
While supporting glass 12 is conveyed in the horizontal direction by conveying roller 32, the erosion sprayed from sprayer unit 34 is utilized
Liquid is carved to carry out slimming processing.In the present embodiment, pass through the injection etching of supporting glass 12 from below to configuring downwards
Liquid, etching solution will not be contacted optionally with organic EL panel 10.It directly falls, accommodates when etching solution is contacted with supporting glass 12
In accumulator tank (not shown) etc..
In addition, the injection pressure of etching solution, sprayer unit 34 at a distance from organic EL panel 10 can appropriate adjustment, with erosion
The mode that carving liquid will not disperse to the region other than supporting glass 12 is constituted.If etching solution connects with 10 long-time of organic EL panel
Touching, then the moisture of etching solution gradually permeates, and luminescent layer 18 is possible to deteriorate because of moisture.Therefore, it is necessary to by increasing sealant
20 number of plies more reliably protects luminescent layer 18, to generate additional cost, the plate thickness for generating organic EL panel 10 increases
Unfavorable condition.
In addition, when being thinned supporting glass 12, preferably in such a way that the plate thickness of supporting glass 12 becomes 50~200 μm
It is etched.By the way that supporting glass 12 is etched to the range, the organic el display that can have and be only made of resin film
The flexibility of equal extent.For example, by 8 inches of the organic el display 10 that supporting glass 12 is etched to 100 μm can be bent to
Radius of curvature 300mm or so.It is etched by further progress, additionally it is possible to reduce flexible radius of curvature.
In addition, even if supporting glass 12 is thinning, can also stablize since organic EL panel 10 is conveyed by conveying roller 32
Ground is handled.In turn, if common glass substrate is thinned to 100 μm or less, it is likely that generate flexure etc. in etching
Unfavorable condition, but the intensity due to keeping the entirety of organic EL panel 10 by polyimide film 14, sealant 20 etc.,
A possibility that can reduce the rupture of supporting glass 12 in an etching process.In addition, just in case due to make supporting glass 12 be thinned and
In the case where generating unfavorable condition in conveying, as long as making the injection pressure reduction of etching solution or making the narrower intervals of conveying roller
?.In the case where the adjusting of Etaching device is difficult, preferably further configure on the top of protective film 22 with acid proof
Supporting substrates.
What such display device was usually manufactured in the state that large substrate has carried out chamfering to multiple display devices
Situation is more.In this case, it carries out from large substrate disjunction after etching process into the processing of each substrate.Disjunction processing can make
With scoring device or laser aid etc..Since supporting glass 12 is thinning by etching process, even if using in resin base
Existing laser aid used in the disjunction of plate also can easily be done disjunction.
In the present embodiment, the existing manufacturing process of change is hardly needed, and can not be shelled from supporting glass 12
From polyimide film 14.Supporting glass 12 is able to maintain a part for being configured to organic EL panel 10 and manufactures flexible display, because
This production efficiency improves.Moreover, can more reliably protect luminescent layer 18 by the way that there are supporting glass 12.
The explanation of above embodiment is all to illustrate in all respects, it should not be assumed that is restrictive.Model of the invention
Enclosing is not indicated by above embodiment instead of, is indicated by claims.Moreover, the scope of the present invention includes and claim
Being had altered in the book equivalent meaning and range.
Symbol description
10- organic EL panel
12- supporting glass
14- polyimide film
16- transparent electrode layer
18- luminescent layer
20- sealant
22- protective film
30- Etaching device
32- conveying roller
34- sprayer unit
Claims (3)
1. a kind of display device manufacturing method manufactures display device, the display device shows image using display element, special
Sign is, comprising:
In the step of forming organic resin film on the first interarea of glass substrate；
The layer for including the steps that display element is formed on the organic resin film；And
By covering the first main surface side of the glass substrate including the organic resin film by elching resistant component, and it is right
Second main surface side is etched, thus the step of being thinned the glass substrate.
2. display device manufacturing method according to claim 1, which is characterized in that
It is thinned the glass substrate to the thickness of energy free bend.
3. display device manufacturing method according to claim 1 or 2, which is characterized in that
In the step of being thinned the glass substrate, it is etched by spraying etching solution to the glass substrate.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-097561 | 2016-05-16 | ||
| JP2016097561A JP6531319B2 (en) | 2016-05-16 | 2016-05-16 | Display device manufacturing method |
| PCT/JP2017/018266 WO2017199928A1 (en) | 2016-05-16 | 2017-05-16 | Method for manufacturing display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109313868A true CN109313868A (en) | 2019-02-05 |
Family
ID=60325309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780036286.0A Pending CN109313868A (en) | 2016-05-16 | 2017-05-16 | Display device manufacturing method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6531319B2 (en) |
| KR (1) | KR20190010871A (en) |
| CN (1) | CN109313868A (en) |
| WO (1) | WO2017199928A1 (en) |
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| CN112599570A (en) * | 2020-12-08 | 2021-04-02 | 深圳市华星光电半导体显示技术有限公司 | Display panel and preparation method thereof |
| CN113054130A (en) * | 2021-03-04 | 2021-06-29 | 深圳市华星光电半导体显示技术有限公司 | Preparation method of display panel |
| CN113488515A (en) * | 2021-06-28 | 2021-10-08 | 深圳市华星光电半导体显示技术有限公司 | Display panel and preparation method thereof |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20190010871A (en) | 2019-01-31 |
| WO2017199928A1 (en) | 2017-11-23 |
| JP6531319B2 (en) | 2019-06-19 |
| JP2017207528A (en) | 2017-11-24 |
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