CN109300839A - Flexible substrates and preparation method thereof, flexible display panels, display device - Google Patents

Flexible substrates and preparation method thereof, flexible display panels, display device Download PDF

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Publication number
CN109300839A
CN109300839A CN201811152051.0A CN201811152051A CN109300839A CN 109300839 A CN109300839 A CN 109300839A CN 201811152051 A CN201811152051 A CN 201811152051A CN 109300839 A CN109300839 A CN 109300839A
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China
Prior art keywords
fiber
flexible substrates
organic layer
layer
preparation
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CN201811152051.0A
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Inventor
李钧书
武思平
陈闻凯
吴伟力
邱林林
王会
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Yungu Guan Technology Co Ltd
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Yungu Guan Technology Co Ltd
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Priority to CN201811152051.0A priority Critical patent/CN109300839A/en
Publication of CN109300839A publication Critical patent/CN109300839A/en
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Laminated Bodies (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

This application provides a kind of flexible substrates and preparation method thereof, flexible display panels, display devices.Contain fiber in at least partly thickness of the flexible substrates.In the embodiment of the present invention, due to containing fiber in flexible substrates, flexible substrates are in bending, flexible substrates bending stress can be dispersed in fiber, it concentrates on the bending stress of flexible substrates on fiber, so that the rigidity of flexible substrates be made to increase, and then matches the bending stress of flexible substrates with the bending stress of adjacent film layers, it prevents organic layer peeling-off with adjacent film layers, improves the display effect and service life of display device.

Description

Flexible substrates and preparation method thereof, flexible display panels, display device
Technical field
This application involves display device technology fields more particularly to a kind of flexible substrates and preparation method thereof, Flexible Displays Panel, display device.
Background technique
Flexible display panels have the characteristics that it is flexible or foldable, be widely used in communication terminal, tablet computer, In many electronic devices such as e-book, navigation equipment.
In bending, flexible substrates are easily separated with adjacent layer flexible display panels, to influence the aobvious of display device Show effect and service life.
Summary of the invention
According to the embodiment of the present application in a first aspect, providing a kind of flexible substrates, the flexible substrates are at least partly Contain fiber in thickness.
In one embodiment of the application, the flexible substrates include the organic layer and inorganic layer being arranged alternately, described Fiber is located in the organic layer.
According to the second aspect of the embodiment of the present application, a kind of preparation method of flexible substrates, the preparation method are provided Include:
Rigid basement is provided;
Form flexible substrates in the rigid basement, the step of formation flexible substrates includes: in the rigid base Fiber is laid on bottom;The coated polymer solution on the fiber, and curing process is carried out to form organic layer.
In one embodiment of the application, the step of the formation flexible substrates further include: the shape on the organic layer At inorganic layer.
In one embodiment of the application, the fiber is latticed fiber.
In one embodiment of the application, the fiber include in carbon fiber, glass fibre and aramid fiber at least It is a kind of.
According to the third aspect of the embodiment of the present application, a kind of preparation method of flexible substrates, the preparation method are provided Include:
Rigid basement is provided;Form flexible substrates in the rigid basement, the step of formation flexible substrates includes:
Organo-mineral complexing structure is prepared in the rigid basement, the organo-mineral complexing structure includes being arranged alternately At least one organic layer and at least one inorganic layer, and the top layer of the organo-mineral complexing structure be inorganic layer;
Fiber is laid on the top layer of the organo-mineral complexing structure;
The coated polymer solution on the fiber carries out curing process to form organic layer.
In one embodiment of the application, the coated polymer solution on the fiber carries out curing process to be formed After organic layer, the step of the formation flexible substrates further include: form inorganic layer on the organic layer.
In one embodiment of the application, the fiber is latticed fiber.
In one embodiment of the application, the fiber include in carbon fiber, glass fibre and aramid fiber at least It is a kind of.
According to the fourth aspect of the embodiment of the present application, a kind of preparation method of flexible substrates is provided, which comprises
Rigid basement is provided;
Form flexible substrates in the rigid basement, the step of formation flexible substrates includes: in polymer solution Middle doping fiber;It will be coated in the rigid basement doped with the polymer solution of fiber, and carry out curing process, to be formed Organic layer containing fiber.
In one embodiment of the application, the step of the formation flexible substrates further include: described containing fiber Inorganic layer is formed on organic layer.
In one embodiment of the application, the fiber is single filamentary fibers.
In one embodiment of the application, the fiber include in carbon fiber, glass fibre and aramid fiber at least It is a kind of.
According to the 5th of the embodiment of the present application the aspect, a kind of preparation method of flexible substrates is provided, which comprises
Rigid basement is provided;Form flexible substrates in the rigid basement, the step of formation flexible substrates includes:
Organo-mineral complexing structure is prepared in the rigid basement, the organo-mineral complexing structure includes being arranged alternately At least one organic layer and at least one inorganic layer, and the top layer of the organo-mineral complexing structure be inorganic layer;
The polymer solution doped with fiber is coated on the top layer of the organo-mineral complexing structure, and is carried out at solidification Reason is to form the organic layer containing fiber.
In one embodiment of the application, the step of the formation flexible substrates further include: described containing fiber Inorganic layer is prepared on organic layer.
In one embodiment of the application, the fiber is single filamentary fibers.
In one embodiment of the application, the fiber include in carbon fiber, glass fibre and aramid fiber at least It is a kind of.
According to the 6th of the embodiment of the present application the aspect, a kind of flexible display panels are provided, comprising:
Above-mentioned flexible substrates;
The functional layer being formed on the flexible substrates;
The encapsulated layer being formed on the functional layer.
According to the 7th of the embodiment of the present application aspect, a kind of display device is provided, which is characterized in that including above-mentioned soft Property display panel.
Flexible substrates provided by the embodiments of the present application and preparation method thereof, flexible display panels, display device, flexible substrates In contain fiber, then flexible substrates bending when, bending stress can be dispersed in fiber, concentrate on bending stress on fiber, thus Increase the rigidity of flexible substrates, and then match the bending stress of flexible substrates with the bending stress of adjacent film layers, prevents soft Property substrate and adjacent film layers are peeling-off, improve the display effect and service life of display device.
It should be understood that above general description and following detailed description be only it is exemplary and explanatory, not It can the limitation present invention.
Detailed description of the invention
Fig. 1 is a kind of flow chart of the preparation method of flexible substrates provided by the embodiments of the present application;
Fig. 2 is the structural schematic diagram for the flexible substrates being prepared using method shown in FIG. 1;
Fig. 3 is the flow chart of the preparation method of another flexible substrates provided by the embodiments of the present application;
Fig. 4 and Fig. 5 is respectively the structural schematic diagram for the flexible substrates being prepared using method shown in Fig. 3;
Fig. 6 is the flow chart of the preparation method of another flexible substrates provided by the embodiments of the present application;
Fig. 7 is the structural schematic diagram for the flexible substrates being prepared using method shown in fig. 6;
Fig. 8 is the flow chart of the preparation method of another flexible substrates provided by the embodiments of the present application;
Fig. 9 is the structural schematic diagram for the flexible substrates being prepared using method shown in Fig. 8;
Figure 10 is the structural schematic diagram of flexible display panels provided by the embodiments of the present application.
Specific embodiment
Example embodiments are described in detail here, and the example is illustrated in the accompanying drawings.
It is only to be not intended to be limiting the application merely for for the purpose of describing particular embodiments in term used in this application. Unless otherwise defined, technical term or scientific term used in this application, which are should be in fields of the present invention, has general skill The ordinary meaning that the personage of energy is understood.The classes such as "one" or " one " used in present specification and claims It does not indicate that quantity limits like word yet, but indicates that there are at least one.The similar word such as " connection " or " connected " is not It is defined in physics or mechanical connection, and may include electrical connection, it is either direct or indirect.It is " more It is a " it include two, it is equivalent at least two.In present specification and singular used in the attached claims "an", " described " and "the" are also intended to including most forms, unless the context clearly indicates other meaning.It should also manage Solution, term "and/or" used herein refers to and includes one or more associated any or all of project listed can It can combination.
With reference to the accompanying drawing, the embodiment of the present application is described in detail.In the absence of conflict, following embodiment And the feature in embodiment can be complementary to one another or be combined with each other.
The embodiment of the present application provides a kind of preparation method of flexible substrates, which includes: offer rigid basement, Flexible substrates are formed in rigid basement.Wherein, referring to Fig. 1, the step of formation flexible substrates, includes the following steps 101 Hes Step 102.
In a step 101, fiber is laid in the rigid basement.
In one embodiment, fiber is latticed fiber.
In one embodiment, fiber includes at least one of carbon fiber, glass fibre and aramid fiber.
In one embodiment, the production such as glass material or metal material can be used in rigid basement.
In a step 102, the coated polymer solution on the fiber, and curing process is carried out to form organic layer.
Polymer solution generates certain coating function during cured to fiber, the organic layer formed after solidification and Fiber is integrally formed.For flexible substrates in bending, the bending stress of the organic layer is can be dispersed in fiber, to enhance the rigid of organic layer Degree, matches the bending stress between organic layer and adjacent film layers, prevents organic layer peeling-off with adjacent film layers.
In one embodiment, fiber can be uniformly distributed in rigid basement.It in other embodiments, can be according to flexible base The region that bottom is bent determines distribution density of the fiber in rigid basement.For example, fiber rigid basement with it is soft Property the corresponding region in substrate bent area distribution density be greater than region corresponding with the non-bent area of flexible substrates distribution density, To which the fibre density of the bent area of the organic layer formed is larger, it can effectively disperse the bending stress of organic layer bent area.
In one embodiment, polymer can be PI (polyimides), PEN (polyethylene naphthalate), PET One of (polyethylene terephthalate), PES (polyethersulfone resin), PC (polycarbonate), PEI (polyetherimide) Or it is a variety of.
In one embodiment, after step 102, the step of formation flexible substrates may also include that have described Inorganic layer is formed on machine layer.Inorganic layer can obstruct water or oxygen is infiltrated into organic layer and damaged to organic layer.Meanwhile it is inorganic Layer can also play the role of planarizing organic layer.
Above-mentioned after the step of forming inorganic layer on the organic layer, the step of formation flexible substrates, may be used also It include: at least one organic layer and at least one inorganic layer for preparing and being arranged alternately on the inorganic layer of above-mentioned formation.
After preparation process, rigid basement is removed, obtains flexible substrates.
The preparation method of flexible substrates provided by the embodiments of the present application, by being laid with fiber in rigid basement, in fiber The organic layer that the polymer solution of upper coating is formed after solidifying is integrally formed with fiber.In bending, fiber can divide flexible substrates The bending stress for dissipating organic layer, concentrates on the bending stress of organic layer on fiber, to make the rigidity of organic layer increase, in turn It matches the bending stress of organic layer with the bending stress of adjacent film layers, prevents organic layer peeling-off with adjacent film layers, improve The display effect and service life of display device.
Fig. 2 is a kind of structural schematic diagram of flexible substrates 200 provided by the embodiments of the present application, which uses Preparation method shown in FIG. 1 is prepared.Referring to fig. 2, which includes fiber 21 and is arranged alternately organic Layer 22,23 and inorganic layer 24,25, organic layer 22 are located at lowest level, and inorganic layer 25 is located at top layer.Fiber 21 is located at organic layer 22 It lower section and is integrated with organic layer 22.
Fig. 2 only includes that two layers of organic layer 22,23 and two layers of inorganic layer 24,25 carry out example with flexible substrates, in other realities It applies in example, the organic layer of flexible substrates 200 and the quantity of inorganic layer may respectively be one layer, or also may respectively be two layers or more.
The embodiment of the present application provides the preparation method of another flexible substrates, which includes: to provide rigid base Bottom forms flexible substrates in rigid basement.Wherein, referring to Fig. 3, the step of formation flexible substrates, includes the following steps 301 to step 303.
In step 301, organo-mineral complexing structure, the organo-mineral complexing structure are prepared in the rigid basement Including at least one organic layer and at least one inorganic layer being arranged alternately, and the top layer of the organo-mineral complexing structure is nothing Machine layer.
In one embodiment, the organic layer of organo-mineral complexing structure can be by rigid basement or its lower layer Inorganic layer on coated polymer solution and carry out curing process and obtain, inorganic layer can be prepared by atom layer deposition process It arrives.
In one embodiment, the production such as glass material or metal material can be used in rigid basement.
In step 302, fiber is laid on the top layer of the organo-mineral complexing structure.
In one embodiment, fiber is latticed fiber.
In one embodiment, fiber includes at least one of carbon fiber, glass fibre and aramid fiber.
In step 303, the coated polymer solution on the fiber carries out curing process to form organic layer.
Polymer solution generates certain coating function to fiber during cured, and after solidification and fiber becomes one Body.For flexible substrates in bending, the bending stress that organic layer can be dispersed in fiber makes organic layer to enhance the rigidity of organic layer With the Stress match between adjacent inorganic layer, prevent organic layer and adjacent inorganic layer peeling-off.
In one embodiment, after step 303, the step of formation flexible substrates may also include that in step 303 Inorganic layer is formed on the organic layer of middle formation.Inorganic layer can obstruct water or oxygen infiltrates into organic layer and causes to damage to organic layer Evil.Meanwhile inorganic layer can also play the role of planarizing organic layer.
Further, after above-mentioned formation inorganic layer, the step of formation flexible substrates, may also include that in above-mentioned shape At inorganic layer on prepare at least one organic layer for being arranged alternately and at least one inorganic layer.
In one embodiment, before step 301, which may also include that is laid with fiber in rigid basement. Accordingly, in step 301, after being laid with fiber in rigid basement, coated polymer is molten on the fiber first in rigid basement Liquid simultaneously carries out curing process to form the organic layer with fiber one, prepares inorganic layer on the organic layer later.Further, When the organo-mineral complexing structure formed in step 301 includes two or more organic layers and inorganic layer, in preparation In the process, for each inorganic layer of formation, fiber, and the coated polymer solution on fiber can be laid on inorganic layer respectively To form the organic layer with fiber one above inorganic layer.
In one embodiment, polymer solution can be one of PI, PEN, PET, PES, PC and PEI or a variety of.
The preparation method of flexible substrates provided by the embodiments of the present application, by the inorganic of organo-mineral complexing structure top layer It is laid with fiber on layer, the organic layer that the polymer solution coated on fiber is formed after solidifying is integrally formed with fiber.Flexible base In bending, the bending stress of organic layer is can be dispersed in fiber at bottom, concentrates on the bending stress of organic layer on fibrous layer, to make The rigidity of organic layer increases, and then matches the bending stress of organic layer and the bending stress of adjacent inorganic layer, prevents organic layer It is peeling-off with adjacent inorganic layer, improve the display effect and service life of display device.
Fig. 4 is another flexible substrates 400 provided by the embodiments of the present application, and the flexible substrates 400 are using shown in Fig. 3 Preparation method is prepared.Referring to fig. 4, which includes fiber 41 and the organic layer 42,43 and nothing that are arranged alternately Machine layer 44,45, wherein organic layer 42 is lowest level, and inorganic layer 45 is top layer.Fiber 41 be located at the lower section of organic layer 43 and with have Machine layer 43 is integrally formed.
Further, referring to Fig. 5, it may also set up fiber 46 below organic layer 42, fiber 46 is integrally formed with organic layer 42.
Fig. 4 and Fig. 5 is only respectively that two layers of carry out example has in other embodiments with the number of plies of organic layer and inorganic layer The number of plies of machine layer and inorganic layer is also possible to multilayer, wherein being arranged under at least one organic layer in the organic layer of non-bottom There is the fiber with organic layer one.
The embodiment of the present application also provides the preparation method of another flexible substrates, which includes: to provide rigidity Substrate forms flexible substrates in rigid basement.Wherein, referring to Fig. 6, the step of formation flexible substrates, includes the following steps 601 and step 602.
In step 601, fiber is adulterated in a polymer solution.
In one embodiment, fiber is single filamentary fibers.Preferably, the length of single filamentary fibers is shorter.It can be to polymerization A plurality of single filamentary fibers are added in object solution.
In one embodiment, fiber includes at least one of carbon fiber, glass fibre and aramid fiber.
In one embodiment, polymer can be one of PEN, PET, PI, PES, PC, PEI or a variety of.
In one embodiment, after adulterating fiber into polymer solution, polymer solution can be stirred, so that Fiber is uniformly distributed in polymer solution, so that the fiber in the organic layer being prepared be made to be uniformly distributed.
In step 602, it will be coated in the rigid basement, and carried out at solidification doped with the polymer solution of fiber Reason, to form the organic layer containing fiber.
During polymer solution is cured, polymer is integrally formed with fiber.
In one embodiment, after step 602, the step of formation flexible substrates may also include that be contained described Have and forms inorganic layer on the organic layer of fiber.Inorganic layer can obstruct water or oxygen infiltrates into organic layer and causes to damage to organic layer Evil.Meanwhile inorganic layer can also play the role of planarizing organic layer.
Further, after the above-mentioned formation inorganic layer the step of, the step of formation flexible substrates, be may additionally include At least one organic layer and at least one inorganic layer being arranged alternately are prepared on the inorganic layer of above-mentioned formation.
After preparation process, rigid basement is removed, obtains flexible substrates.
The preparation method of flexible substrates provided by the embodiments of the present application is then gathered by adulterating fiber in a polymer solution Contain fiber in the organic layer that polymer solution is formed after solidifying.For flexible substrates in bending, the bending of organic layer is can be dispersed in fiber Stress increases the rigidity of organic layer, and then matches the bending stress of organic layer with the bending stress of adjacent film layers, thus anti- Only organic layer is peeling-off with adjacent film layers, improves the display effect and service life of display device.
Fig. 7 is the structural schematic diagram for another flexible substrates 700 that embodiment itself provides, which uses Preparation method shown in fig. 6 is prepared.Referring to Fig. 7, the flexible substrates 700 include organic layer 71 and be formed in organic layer 71 it On inorganic layer 72.Wherein, fiber 73 is contained in organic layer 71.
Fig. 7 only includes that one layer of organic layer 71 and one layer of inorganic layer 72 carry out example with flexible substrates, in other embodiments, The organic layer of flexible substrates 100 and the quantity of inorganic layer may respectively be two layers or two layers or more, and at least bottom is organic Contain fiber in layer.
The embodiment of the present application provides the preparation method of another flexible substrates, which includes: to provide rigid base Bottom forms flexible substrates in rigid basement.Wherein, referring to Fig. 8, the preparation method for forming flexible substrates includes following step Rapid 801 and step 802.
In step 801, organo-mineral complexing structure, the organo-mineral complexing structure are prepared in the rigid basement Including at least one organic layer and at least one inorganic layer being arranged alternately, and the top layer of the organo-mineral complexing structure is nothing Machine layer.
In one embodiment, the organic layer of the organo-mineral complexing structure can be by rigid basement or nothing It coated polymer solution and carries out curing process on machine layer and obtains, inorganic layer can be formed by atom layer deposition process.
In one embodiment, the production such as glass material or metal material can be used in rigid basement.
In step 802, the polymer solution doped with fiber is coated on the top layer of the organo-mineral complexing structure, And curing process is carried out to form the organic layer containing fiber.
In one embodiment, fiber is single filamentary fibers.Preferably, the length of single filamentary fibers is shorter.It can be to polymerization A plurality of single filamentary fibers are added in object solution.
In one embodiment, fiber includes at least one of carbon fiber, glass fibre and aramid fiber.
In one embodiment, polymer can be one of PEN, PET, PI, PES, PC, PEI or a variety of.
In one embodiment, in the organic layer prepared in step 801, fiber can be contained at least one layer of organic layer.
After step 802, the step of formation flexible substrates may also include that be prepared on the organic layer containing fiber Inorganic layer.Inorganic layer can obstruct water or oxygen is infiltrated into organic layer and damaged to organic layer.Meanwhile inorganic layer can also play The effect for planarizing organic layer.
In one embodiment, described after the step of forming inorganic layer on the organic layer containing fiber, the formation The step of flexible substrates, may also include that at least one layer of organic layer of preparation and at least one layer are inorganic on the inorganic layer of above-mentioned formation Layer, wherein organic layer and inorganic layer are arranged alternately.
The preparation method of flexible substrates provided by the embodiments of the present application is polymerize by adulterating fiber in a polymer solution It include fiber in the organic layer that object solution is formed after solidifying.In bending, the fiber in organic layer can be dispersed organic flexible substrates The bending stress of layer, increases the rigidity of organic layer, and then make the bending stress of organic layer and the bending stress of adjacent film layers Match, to prevent organic layer peeling-off with adjacent film layers, improves the display effect and service life of display device.
Fig. 9 is the structural schematic diagram for another flexible substrates 900 that embodiment itself provides, which uses Preparation method shown in Fig. 8 is prepared.Referring to Fig. 9, which includes the organic layer 91,92 being arranged alternately and nothing Machine layer 93,94, organic layer 91 are located at lowest level, and inorganic layer 94 is located at top layer.Wherein, fiber 95 is contained in organic layer 92.
In other embodiments, fiber can also be contained in organic layer 91.
Fig. 9 only includes that two organic layers and two inorganic layers carry out example with flexible substrates, in other embodiments, organic Layer and inorganic layer are also possible to multiple, in the organic layer of non-bottom, contain fiber at least one organic layer.
Figure 10 is a kind of structural schematic diagram of flexible display panels provided by the embodiments of the present application.It is described soft referring to Figure 10 Property display panel include flexible substrates 1, the functional layer 2 being formed on the flexible substrates 1 and be formed in the functional layer 2 it On encapsulated layer 3.Wherein, Fig. 1, Fig. 3, Fig. 6 or preparation method shown in Fig. 8 preparation can be used in flexible substrates 1.
In one embodiment, functional layer 2 include TFT (Thin Film Transistor, thin film transistor (TFT)) layer 21 and OLED (Organic Light-Emitting Diode, the Organic Light Emitting Diode) layer 22 being formed on TFT layer 21.
For flexible display panels provided by the embodiments of the present application in bending, organic layer is can be dispersed in the fiber in flexible substrates Bending stress increases the rigidity of organic layer, and then makes the bending stress of organic layer and the bending stress of adjacent inorganic layer Match, to prevent organic layer and adjacent inorganic layer peeling-off, the display effect of flexible display panels can be improved and use the longevity Life.
The embodiment of the present application also provides a kind of display device, the display device includes above-mentioned flexible display panels. In one embodiment, display device further includes shell, and flexible display panels are fixed on the shell.
Display device in the embodiment of the present application can for Electronic Paper, mobile phone, tablet computer, television set, laptop, Any products or components having a display function such as Digital Frame, navigator.
The above is only the preferred embodiment of the application, not does limitation in any form to the application, though Right the application has been disclosed in a preferred embodiment above, however is not limited to the application, any technology people for being familiar with this profession Member, in the range of not departing from technical scheme, when the technology contents using the disclosure above are modified or are repaired Decorations are the equivalent embodiment of equivalent variations, but all contents without departing from technical scheme, the technology according to the application are real Matter any simple modification, equivalent change and modification to the above embodiments, still fall within the range of technical scheme It is interior.

Claims (10)

1. a kind of flexible substrates, which is characterized in that contain fiber in at least partly thickness of the flexible substrates.
2. flexible substrates according to claim 1, which is characterized in that the flexible substrates include the organic layer being arranged alternately And inorganic layer, the fiber are located in the organic layer.
3. a kind of preparation method of flexible substrates, which is characterized in that the preparation method includes:
Rigid basement is provided;
Form flexible substrates in the rigid basement, the step of formation flexible substrates includes: in the rigid basement It is laid with fiber;The coated polymer solution on the fiber carries out curing process to form organic layer.
4. a kind of preparation method of flexible substrates, which is characterized in that the preparation method includes:
Rigid basement is provided;Form flexible substrates in the rigid basement, the step of formation flexible substrates includes:
Prepare organo-mineral complexing structure in the rigid basement, the organo-mineral complexing structure include be arranged alternately to A few organic layer and at least one inorganic layer, and the top layer of the organo-mineral complexing structure is inorganic layer;
Fiber is laid on the top layer of the organo-mineral complexing structure;
The coated polymer solution on the fiber carries out curing process to form organic layer.
5. preparation method according to claim 3 or 4, which is characterized in that the fiber is latticed fiber;
The fiber includes at least one of carbon fiber, glass fibre and aramid fiber.
6. a kind of preparation method of flexible substrates, which is characterized in that the described method includes:
Rigid basement is provided;
Form flexible substrates in the rigid basement, the step of formation flexible substrates includes: to mix in a polymer solution Miscellaneous fiber;It will be coated in the rigid basement doped with the polymer solution of fiber, and carry out curing process, contained with being formed The organic layer of fiber.
7. a kind of preparation method of flexible substrates, which is characterized in that the described method includes:
Rigid basement is provided;Form flexible substrates in the rigid basement, the step of formation flexible substrates includes:
Prepare organo-mineral complexing structure in the rigid basement, the organo-mineral complexing structure include be arranged alternately to A few organic layer and at least one inorganic layer, and the top layer of the organo-mineral complexing structure is inorganic layer;
On the top layer of the organo-mineral complexing structure coat doped with fiber polymer solution, and carry out curing process with Form the organic layer containing fiber.
8. preparation method according to claim 6 or 7, which is characterized in that the fiber is single filamentary fibers;
The fiber includes at least one of carbon fiber, glass fibre and aramid fiber.
9. a kind of flexible display panels characterized by comprising
Flexible substrates of any of claims 1 or 2;
The functional layer being formed on the flexible substrates;
The encapsulated layer being formed on the functional layer.
10. a kind of display device, which is characterized in that including flexible display panels as claimed in claim 9.
CN201811152051.0A 2018-09-29 2018-09-29 Flexible substrates and preparation method thereof, flexible display panels, display device Pending CN109300839A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111697158A (en) * 2020-05-29 2020-09-22 云谷(固安)科技有限公司 Display panel and manufacturing method thereof

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070042168A1 (en) * 2003-11-25 2007-02-22 Nitto Denko Corporation Resin sheet, liquid crystal cell substrate, liquid crystal display device, substrate for an electroluminescence display device, electroluminescence display device, and a substrate for a solar cell
CN102201534A (en) * 2010-12-24 2011-09-28 北京精诚铂阳光电设备有限公司 Large-area flexible photoelectric device
CN103531724A (en) * 2013-09-29 2014-01-22 京东方科技集团股份有限公司 Display device, flexible substrate and manufacturing method of flexible substrate
CN103545463A (en) * 2013-09-27 2014-01-29 Tcl集团股份有限公司 Flexible display device and manufacturing method thereof
CN106206945A (en) * 2016-09-08 2016-12-07 京东方科技集团股份有限公司 A kind of flexible base board and preparation method thereof, flexible display apparatus
CN106338852A (en) * 2016-11-01 2017-01-18 上海天马微电子有限公司 Flexible substrate, display panel and manufacturing method of flexible substrate
CN106847832A (en) * 2017-03-23 2017-06-13 武汉华星光电技术有限公司 Flexible base board and flexible display
CN108461648A (en) * 2018-03-07 2018-08-28 云谷(固安)科技有限公司 Thin-film package body and display panel

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070042168A1 (en) * 2003-11-25 2007-02-22 Nitto Denko Corporation Resin sheet, liquid crystal cell substrate, liquid crystal display device, substrate for an electroluminescence display device, electroluminescence display device, and a substrate for a solar cell
CN102201534A (en) * 2010-12-24 2011-09-28 北京精诚铂阳光电设备有限公司 Large-area flexible photoelectric device
CN103545463A (en) * 2013-09-27 2014-01-29 Tcl集团股份有限公司 Flexible display device and manufacturing method thereof
CN103531724A (en) * 2013-09-29 2014-01-22 京东方科技集团股份有限公司 Display device, flexible substrate and manufacturing method of flexible substrate
CN106206945A (en) * 2016-09-08 2016-12-07 京东方科技集团股份有限公司 A kind of flexible base board and preparation method thereof, flexible display apparatus
CN106338852A (en) * 2016-11-01 2017-01-18 上海天马微电子有限公司 Flexible substrate, display panel and manufacturing method of flexible substrate
CN106847832A (en) * 2017-03-23 2017-06-13 武汉华星光电技术有限公司 Flexible base board and flexible display
CN108461648A (en) * 2018-03-07 2018-08-28 云谷(固安)科技有限公司 Thin-film package body and display panel

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111697158A (en) * 2020-05-29 2020-09-22 云谷(固安)科技有限公司 Display panel and manufacturing method thereof

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Application publication date: 20190201