CN106654039A - Display panel, display device and manufacturing method of display panel - Google Patents
Display panel, display device and manufacturing method of display panel Download PDFInfo
- Publication number
- CN106654039A CN106654039A CN201610858299.3A CN201610858299A CN106654039A CN 106654039 A CN106654039 A CN 106654039A CN 201610858299 A CN201610858299 A CN 201610858299A CN 106654039 A CN106654039 A CN 106654039A
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- Prior art keywords
- film layer
- protection film
- flexible substrate
- display floater
- display
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- 238000004519 manufacturing process Methods 0.000 title abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 76
- 239000000463 material Substances 0.000 claims abstract description 62
- 239000010410 layer Substances 0.000 claims description 151
- 208000034699 Vitreous floaters Diseases 0.000 claims description 78
- 238000000034 method Methods 0.000 claims description 24
- 238000007641 inkjet printing Methods 0.000 claims description 14
- 238000002360 preparation method Methods 0.000 claims description 14
- 239000004642 Polyimide Substances 0.000 claims description 13
- -1 polyethylene terephthalate Polymers 0.000 claims description 13
- 229920001721 polyimide Polymers 0.000 claims description 13
- 239000005416 organic matter Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 10
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 5
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229910052749 magnesium Inorganic materials 0.000 claims description 5
- 239000011777 magnesium Substances 0.000 claims description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 5
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 239000002356 single layer Substances 0.000 claims description 5
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 claims description 4
- 229910001195 gallium oxide Inorganic materials 0.000 claims description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 4
- 230000003647 oxidation Effects 0.000 claims description 2
- 238000007254 oxidation reaction Methods 0.000 claims description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims 1
- 150000002148 esters Chemical class 0.000 claims 1
- GVINIKRAUKVLRA-UHFFFAOYSA-N ethane-1,2-diol;naphthalene-1,2-dicarboxylic acid Chemical compound OCCO.C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 GVINIKRAUKVLRA-UHFFFAOYSA-N 0.000 claims 1
- 229910052733 gallium Inorganic materials 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 239000003292 glue Substances 0.000 abstract description 29
- 238000005452 bending Methods 0.000 abstract description 15
- 238000004806 packaging method and process Methods 0.000 abstract description 8
- 230000001681 protective effect Effects 0.000 abstract 2
- 239000010408 film Substances 0.000 description 75
- 238000005516 engineering process Methods 0.000 description 8
- 238000007639 printing Methods 0.000 description 7
- 239000012528 membrane Substances 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 5
- 208000014674 injury Diseases 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 208000027418 Wounds and injury Diseases 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- FYIBGDKNYYMMAG-UHFFFAOYSA-N ethane-1,2-diol;terephthalic acid Chemical compound OCCO.OC(=O)C1=CC=C(C(O)=O)C=C1 FYIBGDKNYYMMAG-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 208000012260 Accidental injury Diseases 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000031018 biological processes and functions Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000003678 scratch resistant effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention provides a display panel, a display device and a manufacturing method of the display panel, wherein the display panel comprises: a flexible substrate; a light emitting device on one side of the flexible substrate; the packaging layer is positioned on one side, away from the flexible substrate, of the light-emitting device; and the protective film layer is formed on at least one of one side of the flexible substrate, which is far away from the light-emitting device, and one side of the packaging layer, which is far away from the light-emitting device, and is in direct contact with the flexible substrate and/or the packaging layer. According to the invention, the protective film layer is printed on the packaging layer and/or the flexible substrate, and is in direct contact with the packaging layer and/or the flexible substrate, and a glue material is omitted, so that the packaging layer and/or the flexible substrate are protected from being scratched, the display panel is thinner, the bending resistance of the display panel is stronger, and the performance of the display panel for recovering the original shape after being bent is improved.
Description
Technical field
It is the present invention relates to display technology field more particularly to a kind of display floater for strengthening display floater bending resistance, aobvious
The manufacture method of showing device and display floater.
Background technology
Flexible display apparatus are made up of soft material, deformable flexible device.It is of the prior art flexible aobvious
Showing device typically adopts OLED (Organic Light-Emitting Diode, Organic Light Emitting Diode) technology, this technology
With the advantage such as low-power consumption, small volume, light, display mode be various, therefore it is widely used in various electronic products.
Be illustrated in figure 1 a typical display floater diaphragm schematic top plan view in prior art, Fig. 2 be A1 ' in Fig. 1-
The sectional view in A2 ' directions, illustrated therein is the cross section structure of display floater, be included in the flexibility in z directions from the bottom to top in figure
Substrate 3 ', luminescent device 2 ' and encapsulated layer 1 '.Wherein, the material of flexible substrate 3 ' can select plastic supporting base or fabric substrate,
Plastic supporting base can adopt hypocrystalline high glass transition temperature polymers, such as PI (polyimides) material etc., can provide
Preferable mechanical property and chemical property.In order to meet the flexible bending demand of display floater, encapsulated layer 1 ' is ordinarily selected to thin
Film encapsulation technology (TFE), so as to obtain more preferable telescopicing performance.The weight of display floater can also be greatly reduced using thin-film package
Amount, reduces the cost of encapsulating material.
During the use of display floater, its flexible substrate 3 ' and encapsulated layer 1 ' may be subject to accidental injury, for example
Situations such as impact, collision, scuffing, the injury that cannot recover, serious meeting is caused to directly affect display device to display floater
Use.Therefore, in order to protect to flexible substrate 3 ' and encapsulated layer 1 ', diaphragm is often set up in display floater, specifically
The lower section for being included in flexible substrate 3 ' arranges the first diaphragm 5 ', and in the top of encapsulated layer 1 ' the second diaphragm 4 ' is arranged, to
Stop extraneous destructive factor.
Simultaneous with glue material and membrane material on diaphragm of the prior art, in the preparation process of display floater, in encapsulation
After the completion of prepared by layer 1 ', first the second glue material 6 ' is coated with the top of encapsulated layer 1 ', flexible substrate 3 ' is removed from carrier,
The lower section of flexible substrate 3 ' is coated with the first glue material 7 ', then the second diaphragm 4 ' is fitted to encapsulated layer 1 ' using attaching process
Top, the first diaphragm 5 ' fits to the lower section of flexible substrate 3 '.Such diaphragm can cause following problem：
The membrane material of the diaphragm for nowadays adopting is generally polyethylene terephthalate (PET) base material, is solid-state, in order to
Problem and the Cost Problems matched with glue material are considered, as shown in figure 3, gross thickness B of the first diaphragm 5 ' and the first glue material 7 ' '
Typically arrange thicker, it is impossible to meet the requirement of 20 μm of gross thickness, even if reducing the thickness of diaphragm by force, also can produce high
Price, increase attaching process difficulty；It is integrally harder that thicker diaphragm also results in diaphragm, and bending is difficult, so as to
The bendable folding endurance for causing flexible display apparatus is had a greatly reduced quality；Meanwhile, glue material is generally viscoelastic body, delayed with very strong recovery
Property, after bending to a certain extent, it is impossible to return to original state, so as to the flexural deformation that flexible display apparatus can be caused overall.
The content of the invention
For the problems of the prior art, it is an object of the invention to provide a kind of display floater, in flexible substrate and/or
One protection film layer is set on encapsulated layer, the use of glue material is saved, is made while protection flexible substrate and/or injury-free encapsulated layer
Display floater is thinner, strengthens the bending resistance of display floater.
The embodiment of the present invention provides a kind of display floater, including：
Flexible substrate；
Luminescent device, positioned at the side of the flexible substrate；
Encapsulated layer, positioned at the luminescent device away from the side of the flexible substrate；
Protection film layer, is formed at the flexible substrate away from the side of the luminescent device and the encapsulated layer away from described
At least one of luminescent device side, the protection film layer and the flexible substrate and/or the encapsulated layer directly contact.It is excellent
Selection of land, the protection film layer is formed by the way of inkjet printing.
Preferably, the protection film layer is single layer structure.
Preferably, the thickness range of the protection film layer is 10～30 μm.
Preferably, the protection film layer includes the first protection film layer, and first protection film layer is formed at the flexible liner
Bottom is away from the side of the luminescent device.
Preferably, the protection film layer also includes the second protection film layer, and second protection film layer is formed at the encapsulation
Layer is away from the side of the luminescent device.
Preferably, the material of the protection film layer includes organic matter or metal.
Preferably, the organic matter includes acrylic or silicon oxide carbide, and the metal includes magnesium, silver or copper.
Preferably, the material of the flexible substrate include polyimides, Merlon, polyethylene terephthalate or
Any one in PEN.
Preferably, the material of the encapsulated layer includes aluminum oxide, gallium oxide, silicon nitride, polyimides, Merlon, poly-
At least one in ethylene glycol terephthalate or PEN.
The embodiment of the present invention further relates to a kind of display device, including above-mentioned display floater.
The embodiment of the present invention further relates to a kind of preparation method of display floater, comprises the following steps：
One flexible substrate is provided；
Luminescent device is formed in the flexible substrate；
Encapsulated layer is formed in the luminescent device away from the side of the flexible substrate；
In the flexible substrate away from the side of the luminescent device and/or the encapsulated layer by way of inkjet printing
Protection film layer is formed away from the side of the luminescent device.
Preferably, formed after the protection film layer, also include the process solidified to the protection film layer.
Preferably, the ultraviolet being cured as using wavelength more than 365nm irradiates, and temperature is less than 80 °.
Preferably, also including a carrier is provided, the flexible substrate is formed at the side of the carrier；
Before the flexible substrate forms the protection film layer away from the side of the luminescent device, also including will be described
The process that flexible substrate is removed from the carrier.
Preferably, the thickness range of the protection film layer is 10～30 μm.
Preferably, the material of the protection film layer includes organic matter or metal.
Preferably, the organic matter includes acrylic or silicon oxide carbide, and the metal includes magnesium, silver or copper.
Preferably, the material of the flexible substrate include polyimides, Merlon, polyethylene terephthalate or
Any one in PEN.
Preferably, the material of the encapsulated layer includes aluminum oxide, gallium oxide, silicon nitride, polyimides, Merlon, poly-
At least one in ethylene glycol terephthalate or PEN.
The manufacture method of display floater provided by the present invention, display device and display floater has following advantages：
The invention provides it is a kind of replace prior art in the second diaphragm and/or the first diaphragm technical scheme,
A protection film layer is printed on encapsulated layer and/or flexible substrate, the protection film layer directly connects with encapsulated layer and/or flexible substrate
Touch, make display floater thinner while thus protection packaging layer and/or flexible substrate are not scratched, so that display floater
Bending resistance is higher；On the other hand, because protection film layer is formed directly into flexible substrate by printing, glue is eliminated
Material, is not related to the matching problem of membrane material and glue material, and display floater restorable performance after bending is improved.
Description of the drawings
The detailed description by reading non-limiting example made with reference to the following drawings, the further feature of the present invention,
Objects and advantages will become more apparent upon.
Fig. 1 is the schematic top plan view of a typical display floater diaphragm in prior art.
Fig. 2 is the sectional view in A1 '-A2 ' directions in Fig. 1.
Fig. 3 is the thickness schematic diagram of the diaphragm in Fig. 2 and glue material.
Fig. 4 is the schematic top plan view of the display floater protection film layer of one embodiment of the invention.
Fig. 5 is the sectional view in A1-A2 directions in Fig. 4.
Fig. 6 is the schematic cross-section of the protection film layer in Fig. 5.
Fig. 7 is the schematic cross-section of the display floater of another embodiment of the present invention.
Fig. 8 is the schematic cross-section of the display floater of yet another embodiment of the invention.
Fig. 9 is the process schematic of the protection film layer of formation first of one embodiment of the invention.
Figure 10 is the process schematic of the protection film layer of formation second of one embodiment of the invention.
Figure 11 is the flow chart of the protection film layer of formation first of one embodiment of the invention.
Specific embodiment
Example embodiment is described more fully with referring now to accompanying drawing.However, example embodiment can be with various shapes
Formula is implemented, and is not understood as limited to embodiment set forth herein；Conversely, thesing embodiments are provided so that the present invention will
Fully and completely, and by the design of example embodiment those skilled in the art is comprehensively conveyed to.Identical is attached in figure
Icon note represents same or similar structure, thus will omit repetition thereof.
The embodiment of the present invention provides a kind of display floater, as shown in figure 4, the display floater for one embodiment of the invention is protected
Film layer schematic top plan view.The sectional view in A1-A2 directions in Fig. 4 is illustrated in figure 5, the section knot of display floater is illustrated therein is
Structure, including direction z the first protection film layer 5, the flexible substrates 3, photophore from bottom to up of the vertically displayed panel in figure
Part 2 and encapsulated layer 1.Wherein, the first protection film layer 5 and the directly contact of flexible substrate 3, are not fitted by glue material, but by print
Brush mode is formed directly into the surface of flexible substrate 3.
First protection film layer 5 is the single layer structure not comprising glue material, the surface directly contact with flexible substrate 3, therefore, save
Go thinner after glue material, more pliable, while being not related to the matching problem of membrane material and glue material, display floater recovers after bending
The performance of original state is improved.
As shown in fig. 6, the schematic diagram of the first protection film layer 5 for the embodiment, illustrated therein is the first protection film layer 5
Thickness B, thickness B is preferably 10～30 μm.Herein the thickness of protection film layer is a preferred scope, using in this span
Protection film layer, not only can play a part of protect flexible substrate, also reduce the thickness of protection film layer, it is aobvious so as to reduce
Show the integral thickness of panel, the volume of display floater is reduced, with more portability.In actual applications, the thickness of protection film layer
Degree can also be selected according to actual needs as other numerical value, within protection scope of the present invention.
As shown in fig. 7, the schematic cross-section of the display floater for another embodiment of the present invention.Itself and previous embodiment
Difference is：Also include being arranged on the second protection film layer 4 above encapsulated layer 1, the second protection film layer 4 directly connects with encapsulated layer 1
Touch, do not fitted by glue material, but the surface of encapsulated layer 1 is formed directly into by mode of printing.Similarly, the second protection film layer
Thickness be preferably also 10～30 μm.
As shown in figure 8, the schematic cross-section of the display floater for one more embodiment of the present invention.Itself and the first two embodiment
Difference be that, only including the second protection film layer 4 being arranged on above encapsulated layer 1, the second protection film layer 4 is direct with encapsulated layer 1
Contact, is not fitted by glue material, but is formed directly into the surface of encapsulated layer 1 by mode of printing, and encapsulated layer 1 is protected
Shield.
Therefore, in actual applications, the first protection film layer 5 of the lower section of flexible substrate 3 can be as needed provided separately within,
Or the second protection film layer 4 of the top of encapsulated layer 1 is provided separately within, or while the first protection film layer 5 and the second protection film layer are set
4, there is the effect for reducing display floater thickness and strengthening display floater bending property relative to prior art, belong to the present invention's
Within protection domain.
Because the second protection film layer 4 is directly formed in the top of encapsulated layer 1, and the first protection film layer 5 is directly formed
In the lower section of flexible substrate 3, without being pre-coated with one layer of glue material before protection film layer is fitted, so as in the guarantor of prior art
One layer of glue material is eliminated on the basis of cuticula, the integral thickness of display floater is reduced；And due to not using glue material, will not
Affected by the recovery hysteresis quality of glue material, even if display floater bends to a certain extent, it is also possible to return to original state well, no
The flexural deformation of display floater can be caused, so as to extend the service life of display floater.
Mode of printing herein is preferably inkjet printing mode (Ink Jet Printing, IJP).The diaphragm of the present invention
Organic matter or metal material can in advance be made the liquid suitable for inkjet printing mode by the material of layer from organic matter or metal
Body, under protection film layer is formed directly into the top of the encapsulated layer 1 or the flexible substrate 3 by ink jet printing device
Side.
The organic matter can select the metals such as magnesium, silver, copper from acrylic or silicon oxide carbide, the metal.Separately
Outward, other are applied to the material made for the liquid of inkjet printing mode can be used for the protection film layer of the present invention, and not
It is limited to above-mentioned situation about enumerating.
The material of the flexible substrate can select polyimides (PI), Merlon (PC), poly terephthalic acid second two
Any one in alcohol ester (PET) or PEN (PEN).The material of the encapsulated layer can include oxidation
In aluminium, gallium oxide, silicon nitride, polyimides, Merlon, polyethylene terephthalate or PEN
At least one, specifically, the encapsulated layer can at least one of which organic encapsulation layer or at least one of which inorganic encapsulated layer or extremely
The stepped construction of few one layer of organic encapsulation layer and at least one of which inorganic encapsulated layer.
Similarly, to be also not necessarily limited to the above several for the material of the flexible substrate and encapsulated layer, and other are suitable for as flexible liner
Some materials of bottom and encapsulated layer can also be selected.
The embodiment of the present invention also provides a kind of display device, and the display device includes above-mentioned display floater.It is described aobvious
Showing device can be the wide variety of display device such as computer monitor, mobile phone, panel computer, electron album.Display device
Display floater can need to carry out the bending of different degrees of, different directions according to design, and volume can also be less, while display surface
Plate shock resistance and scratch resistant ability are also greatly improved, and while user experience is lifted, also substantially prolongs display surface
The service life of plate.
Due to adopting OLED technology flexible display apparatus of the prior art, it is possible to achieve the less thickness of display floater more
Degree, portability and pliable folding endurance.Therefore, luminescent device 2 of the invention is preferably Organic Light Emitting Diode, is arranged in flexibility
The top of substrate 3.But the present invention is not limited.
The embodiment of the present invention also provides a kind of preparation method of display floater, as shown in figure 9, being shape in the embodiment of the present invention
It is the flow process that the first protection film layer is formed in the embodiment of the present invention as shown in figure 11 into the process schematic of the first protection film layer
Figure, comprises the following steps：
One carrier 6 is provided；
Flexible substrate 3 is formed in the top of carrier 6；
Luminescent device 2 is prepared in the top of flexible substrate 3；
Encapsulated layer 1 is prepared in the top of luminescent device 2；
Carrier 6 is departed from flexible substrate 3；
In the lower section of flexible substrate 3 by inkjet printing C-shaped into the first protection film layer 5.
Wherein, carrier 6 can be from rigid carriers such as glass, or other can carry soft in display floater preparation process
Property substrate 3 and the top of flexible substrate 3 other devices carrier, after the completion of prepared by the basic structure of display floater will its go
Remove, removing the mode of carrier 6 can select laser ablation D.
The first protection film layer 5 formed using said method is the single layer structure not comprising glue material, the table with flexible substrate
Face directly contact, therefore, eliminate it is thinner after glue material, it is more pliable, while be not related to the matching problem of membrane material and glue material, show
Show that panel restorable performance after bending is improved.
During due to using inkjet printing mode, fluent material is used, after first protection film layer 5 is formed, also
The process solidified to the first protection film layer 5 can be included.
As shown in Figure 10, the preparation method of the display floater is additionally may included in the top of encapsulated layer 1 and is beaten by ink-jet
The step of print C-shaped is into the second protection film layer 4, and after the second protection film layer 4 is formed, can also include to the second protection film layer
4 processes for being solidified.Similarly, the second protection film layer 4 of formation is the single layer structure not comprising glue material, with encapsulated layer 1
Surface directly contact.In addition, in actual applications, the second protection film layer 4 and the first protection film layer 5 can be formed in display surface
The both sides of plate, it is also possible to which selection only forms the second protection film layer 4 or only forms the first protection film layer 5, in the protection of the present invention
Within the scope of.
The inkjet printing that the present invention is adopted is a kind of technology of printing that ink droplet is ejected into stock image forming surface,
In the present invention, as by film material liquid injection to flexible substrate 3 and/or encapsulated layer 1.Inkjet printing has following special
Point：
It is contactless printing, therefore noise very little in process of production；Ink jet printing device is relatively simple for structure, body
Little, the conveniently moving of product；The processing step for smearing glue material in advance not only can be saved, and print speed is very fast, it is with short production cycle,
Operating cost is low, so as to accelerate the overall process of display floater；The shape of product control printed is more accurate, can obtain
Size is more accurate, the protection film layer that fabrication error is less.
During protection film layer is formed, the thickness range B of protection film layer is controlled at 10～30 μm, it is possible to obtain one
The individual more suitable protection film layer thickness relative to most of display floaters, compared to diaphragm of the prior art, it is thick
Degree is greatly reduced, while can carry out effectively and comprehensively protecting to the surface of flexible substrate 3 and/or encapsulated layer 1.Due in manufacture
During, the process of coating glue material is eliminated, shorten the whole processing procedure of display floater；Reduce using for equipment in processing procedure to plant
Class, without the matching relationship considered between glue-line and film layer, reduces the difficulty of production technology, using simpler technique and
Less operation can obtain bending the more preferable display floater of effect.
Wherein solidification refers to that material is changed into high molecular process from low molecule.The curing mode that the present invention is adopted is preferably
Ultraviolet (UV) solidifies, i.e., using the irradiation of ultraviolet light so that light trigger in material is stimulated be changed into free radical or sun from
Son, so as to cause the macromolecular material containing active function groups to aggregate into the process of insoluble insoluble solid paint film.
Ultraviolet of the solidification that the present invention is adopted preferably using wavelength more than 365nm irradiates, and temperature is less than 80 °, this
It is because that ultraviolet of the wavelength less than 365nm may cause to damage to luminescent device, too high temperature also easily causes display
The bad reaction of panel other parts, so as to avoid the other parts to display floater from having a negative impact.In actual applications,
Specific curing mode and cure parameter can also be selected according to actual needs, not with preferred embodiment party provided herein
Formula is limited.
To sum up, the manufacture method of display floater provided by the present invention, display device and display floater has following advantages：
The present invention deviates from least one of the side of luminescent device and encapsulated layer in luminescent device side in flexible substrate
Individual formation protection film layer, protection film layer and flexible substrate and/or encapsulated layer directly contact, thus protection packaging layer and/or flexibility
Make display floater thinner while substrate is not scratched, so that the bending resistance of display floater is higher；On the other hand, due to
Protection film layer is formed directly into flexible substrate by printing, eliminates glue material, is not related to the matching of membrane material and glue material
Problem, display floater restorable performance after bending is improved.
Above content is to combine specific preferred embodiment further description made for the present invention, it is impossible to assert
The present invention be embodied as be confined to these explanations.For general technical staff of the technical field of the invention,
On the premise of without departing from present inventive concept, some simple deduction or replace can also be made, should all be considered as belonging to the present invention's
Protection domain.
Claims (20)
1. a kind of display floater, it is characterised in that include：
Flexible substrate；
Luminescent device, positioned at the side of the flexible substrate；
Encapsulated layer, positioned at the luminescent device away from the side of the flexible substrate；
Protection film layer, is formed at the flexible substrate away from the side of the luminescent device and the encapsulated layer away from described luminous
At least one of device side, the protection film layer and the flexible substrate and/or the encapsulated layer directly contact.
2. display floater according to claim 1, it is characterised in that protection film layer shape by the way of inkjet printing
Into.
3. display floater according to claim 1, it is characterised in that the protection film layer is single layer structure.
4. display floater according to claim 1, it is characterised in that the thickness range of the protection film layer is 10～30 μ
m。
5. display floater according to claim 1, it is characterised in that the protection film layer includes the first protection film layer, institute
State the first protection film layer and be formed at the flexible substrate away from the side of the luminescent device.
6. display floater according to claim 5, it is characterised in that the protection film layer also includes the second protection film layer,
Second protection film layer is formed at the encapsulated layer away from the side of the luminescent device.
7. display floater according to claim 1, it is characterised in that the material of the protection film layer includes organic matter or gold
Category.
8. display floater according to claim 7, it is characterised in that the organic matter includes acrylic or silicon oxide carbide,
The metal includes magnesium, silver or copper.
9. display floater according to claim 1, it is characterised in that the material of the flexible substrate include polyimides,
Any one in Merlon, polyethylene terephthalate or PEN.
10. display floater according to claim 1, it is characterised in that the material of the encapsulated layer includes aluminum oxide, oxidation
In gallium, silicon nitride, polyimides, Merlon, polyethylene terephthalate or PEN at least
It is a kind of.
11. a kind of display devices, it is characterised in that including the display floater any one of claim 1 to 10.
12. a kind of preparation methods of display floater, it is characterised in that comprise the following steps：
One flexible substrate is provided；
Luminescent device is formed in the flexible substrate；
Encapsulated layer is formed in the luminescent device away from the side of the flexible substrate；
Deviated from away from the side of the luminescent device and/or the encapsulated layer in the flexible substrate by way of inkjet printing
The side of the luminescent device forms protection film layer.
The preparation method of 13. display floaters according to claim 12, it is characterised in that formed the protection film layer it
Afterwards, the process solidified to the protection film layer is also included.
The preparation method of 14. display floaters according to claim 13, it is characterised in that described to be cured as adopting wavelength big
Irradiate in the ultraviolet of 365nm, and temperature is less than 80 °.
The preparation method of 15. display floaters according to claim 12, it is characterised in that also including providing a carrier, institute
State the side that flexible substrate is formed at the carrier；
Before the flexible substrate forms the protection film layer away from the side of the luminescent device, also include the flexibility
The process that substrate is removed from the carrier.
The preparation method of 16. display floaters according to claim 12, it is characterised in that the thickness model of the protection film layer
Enclose for 10～30 μm.
The preparation method of 17. display floaters according to claim 12, it is characterised in that the material bag of the protection film layer
Include organic matter or metal.
The preparation method of 18. display floaters according to claim 17, it is characterised in that the organic matter includes acrylic
Or silicon oxide carbide, the metal include magnesium, silver or copper.
The preparation method of 19. display floaters according to claim 12, it is characterised in that the material bag of the flexible substrate
Include any one in polyimides, Merlon, polyethylene terephthalate or PEN.
The preparation method of 20. display floaters according to claim 12, it is characterised in that the material of the encapsulated layer includes
Aluminum oxide, gallium oxide, silicon nitride, polyimides, Merlon, polyethylene terephthalate or poly- naphthalenedicarboxylic acid ethylene glycol
At least one in ester.
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| CN201610858299.3A CN106654039A (en) | 2016-09-27 | 2016-09-27 | Display panel, display device and manufacturing method of display panel |
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| CN201610858299.3A CN106654039A (en) | 2016-09-27 | 2016-09-27 | Display panel, display device and manufacturing method of display panel |
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| CN201610858299.3A Pending CN106654039A (en) | 2016-09-27 | 2016-09-27 | Display panel, display device and manufacturing method of display panel |
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Application publication date: 20170510 |