CN102437288A - Packaging structure of OLED - Google Patents
Packaging structure of OLED Download PDFInfo
- Publication number
- CN102437288A CN102437288A CN2011103633638A CN201110363363A CN102437288A CN 102437288 A CN102437288 A CN 102437288A CN 2011103633638 A CN2011103633638 A CN 2011103633638A CN 201110363363 A CN201110363363 A CN 201110363363A CN 102437288 A CN102437288 A CN 102437288A
- Authority
- CN
- China
- Prior art keywords
- layer
- organic electroluminescence
- electroluminescence device
- encapsulating structure
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title abstract description 8
- 239000010410 layer Substances 0.000 claims abstract description 60
- 239000000758 substrate Substances 0.000 claims abstract description 36
- 239000012044 organic layer Substances 0.000 claims abstract description 9
- 238000000231 atomic layer deposition Methods 0.000 claims abstract description 8
- 239000012528 membrane Substances 0.000 claims abstract description 8
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 4
- 239000002131 composite material Substances 0.000 claims abstract description 4
- 239000011810 insulating material Substances 0.000 claims abstract description 4
- 238000005401 electroluminescence Methods 0.000 claims description 50
- 239000000463 material Substances 0.000 claims description 18
- 239000004033 plastic Substances 0.000 claims description 14
- 229920003023 plastic Polymers 0.000 claims description 14
- 239000011241 protective layer Substances 0.000 claims description 12
- 239000011521 glass Substances 0.000 claims description 11
- 229920000642 polymer Polymers 0.000 claims description 9
- 238000005229 chemical vapour deposition Methods 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 7
- 239000004695 Polyether sulfone Substances 0.000 claims description 6
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 6
- 229920006393 polyether sulfone Polymers 0.000 claims description 6
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 claims description 6
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 6
- BAZVSMNPJJMILC-UHFFFAOYSA-N triadimenol Chemical compound C1=NC=NN1C(C(O)C(C)(C)C)OC1=CC=C(Cl)C=C1 BAZVSMNPJJMILC-UHFFFAOYSA-N 0.000 claims description 6
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 claims description 3
- 229910001573 adamantine Inorganic materials 0.000 claims description 3
- 238000005755 formation reaction Methods 0.000 claims description 3
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 3
- 239000013047 polymeric layer Substances 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 14
- 239000001301 oxygen Substances 0.000 abstract description 14
- 229910052760 oxygen Inorganic materials 0.000 abstract description 14
- 238000000034 method Methods 0.000 abstract description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 11
- 238000000151 deposition Methods 0.000 abstract description 10
- 230000008021 deposition Effects 0.000 abstract description 6
- 239000010408 film Substances 0.000 description 20
- 238000005538 encapsulation Methods 0.000 description 14
- 239000010409 thin film Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 239000012530 fluid Substances 0.000 description 4
- 239000000565 sealant Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000010406 cathode material Substances 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000008595 infiltration Effects 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 241000532412 Vitex Species 0.000 description 1
- 230000004931 aggregating effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 235000009347 chasteberry Nutrition 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000006056 electrooxidation reaction Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention relates to a packaging structure of an OLED. The structure comprises a substrate of the OLED. One side of the substrate is provided with an anode of the OLED, an organic layer and a cathode. The outboard of the cathode is at least provided with a packaging layer. The packaging layer is a multilayer composite membrane structure which is formed by alternative deposition of two inorganic insulating materials through an atomic layer deposition system. The packaging structure of the OLED in the invention has a low deposition temperature. The organic layer of a luminescent device can not be damaged. Other organic film formation equipment is not needed. Equipment investment costs and land occupation areas can be saved. The inorganic film layer structure alternatively prepared by using an atomic layer deposition method is compact. Pinholes are less. Water and oxygen can be effectively avoided to penetrate into a device. A protection layer is processed on the packaging layer so as to effectively protect the packaging layer and obstruct the water and the oxygen.
Description
Technical field
The present invention relates to the encapsulating structure of organic electroluminescence device (OLED).
Background technology
Characteristics such as that organic electroluminescence device (OLED) has is low in energy consumption, light, brightness is high, the visual field is wide and high-contrast and reaction be fast, and can realize flexible the demonstration well.Organic electroluminescence device has been obtained huge progress in the time of more than ten years in the past, and producers such as Samsung, LG, Sony have released relevant application product, and other display producer also drops into research and development one after another.
At present, also there are some problems so far in the organic electroluminescence device technical development, device lifetime short limit to a great extent the process of organic electroluminescence device industrialization.The life-span of organic electroluminescence device is relevant with the performance and the life-span of the organic material of being selected for use, relevant with the method for packing of luminescent device on the other hand on the one hand.Cause that the principal element that organic electro-luminescence device lifetime reduces has: 1, mostly the metal material of organic electroluminescence device negative electrode is the metal that chemical property is comparatively active; Very easily in air or other contain in the atmosphere of aerobic and suffer erosion, electrochemical corrosion particularly takes place in containing the environment of steam more easily.Physical vaporous deposition is generally adopted in the making of organic electroluminescence device cathode material, and small dust granule sticks to and all very easily makes cathode material produce pin hole on the organic function layer, becomes the passage that steam, oxygen contact with organic function layer.2, the carbonyls of oxygen and luminescent layer generation oxidation generation is effective quencher, can significantly reduce the luminous quantum efficiency of organic electroluminescence device.Steam makes the generation hydrolysis of organic layer compound and influences electric conductivity, causes stability to reduce greatly.3, organic electroluminescence device when work the heat that produces further the luminescent material in the aggravation organic electroluminescence device, auxiliary material, electrode etc. are aerial aging, and then influence the useful life of device.In order to make organic electro-luminescence device lifetime reach practical requirement, the water vapor permeable rate that requires light is less than 10
-6G/ (m
2D), oxygen permeability is less than 10
-5～10
-3G/ (m
2D).When real work, negative electrode be corroded 10% will have a strong impact on device work.
Traditional organic electroluminescence device encapsulation technology is rigid substrates (glass or metal) to be gone up the electrode of making encapsulate with each organic function layer.This packaged type generally is to add a cover plate to luminescent device, at the inboard drier that attaches of cover plate, through fluid sealants such as epoxy resin substrate and cover plate is combined.Encapsulation cover plate mainly is divided into metal cover board and glass cover-plate two big classes; Compositions such as metal cover board promptly can block water, oxygen are to the infiltration of light; Can make device firm again, but its opaqueness, weight and cost issues limit the application of this method for packing on organic electroluminescence device.Glass cover-plate has excellent chemical stability, electrical insulating property, compactness, but its bad mechanical strength is easy to generate micro-crack, and the large scale cover plate is easy to generate distortion.The encapsulation of tradition organic electroluminescence device needs fluid sealant, because the porousness of fluid sealant, airborne moisture penetrates into device inside easily, produces stain.Though traditional organic electroluminescence device encapsulation technology is effectively but very clumsy, and cost is high, if organic electroluminescence device adopts these mechanical parts to encapsulate, is difficult on the price and competes with LCD (LCD).
The thin-film package material mainly contains thin polymer film, metallic film, inorganic insulation body thin film etc., does not re-use metal or glass cover-plate, fluid sealant and drier, and the advantage of bringing thus has: 1, the weight of display and thickness reduce by half; 2, substitute the mechanical encapsulation part with film moisture separator, greatly reduce cost; If 3 thin-film package materials are transparent material, organic electroluminescence device manufacturer can cast away the bottom-emission mode that light is stopped by the TFT transistor fully, adopts the top light emitting mode, effectively improves luminous efficiency and resolution; 4, thin-film package is that flexible display technologies is brought breakthrough progress.
Number according to encapsulated layer can be divided into single thin film encapsulation and plural layers encapsulation, and the monofilm encapsulation is difficult to satisfy organic electroluminescence device encapsulation requirement.The plural layers encapsulation is like polymer/inorganic thing structure; Like the Barix encapsulated layer of Vitex Systems company exploitation, need to accomplish the polymer/inorganic depositing of thin film at the indoor distinct methods of multi-cavity, partial polymer also needs UV to solidify to form film; This mode operating procedure is many, long processing period.Methods such as physical vapor deposition (PVD) commonly used, chemical vapor deposition (CVD) are produced the needed higher temperature of inorganic insulation film has certain damage to the device organic layer, and is easy to generate pin hole.
Flexible organic electroluminescent device only is the different of substrate with common the different of organic electroluminescence device, thereby substrate has just become to influence the main cause in flexible organic electroluminescent device efficient and life-span.Plastic substrate is compared with glass substrate has following shortcoming: 1, the evenness of plastic substrate is than glass substrate difference, and small uneven meeting brings defective for the device film layer structure, causes device failure; 2, the water oxygen permeability of plastic substrate is higher than glass substrate far away, influences the life-span of device.
For this reason, people have carried out modification to plastic substrate, are mainly improving the surface smoothness of plastic substrate, reduce to cause that modified layer produces the uneven state of pin hole, improves water and oxygen barrier property.The patent No. is that 02149122.4 patent of invention provides a kind of method of plastic substrate being carried out modification; This method need be on plastic substrate the liquid unpolymerized polymer monomer layer of vapor deposition one deck; After aggregating into smooth solid film after the ultraviolet irradiation; Deposit one deck ceramic material layer on polymer material layer then, recirculation repeats repeatedly polymer/ceramic material layer.This method to the plastic substrate modification needs the polymer monomer layer on plastic substrate, to form smooth solid film, and processing technology is complicated, and equipment has high input, and is difficult to realize flexible coiled strip production.
Summary of the invention
The invention provides a kind of encapsulating structure of organic electroluminescence device, this encapsulating structure is fine and close, and pin hole is few; Can intercept water oxygen effectively and penetrate into device inside; Satisfy the requirement of device application, and can reduce the investment of devices cost, be fit to large-area preparation and mass production.
The encapsulating structure of organic electroluminescence device of the present invention; Include the substrate of organic electroluminescence devices; Be provided with anode, organic layer and the negative electrode of organic electroluminescence devices in a side of substrate; At least be provided with encapsulated layer in the outside of said negative electrode, described encapsulated layer is the MULTILAYER COMPOSITE membrane structures of at least two kinds of inorganic insulating materials through the atomic layer deposition system alternating deposit.Atomic layer deposition system is a kind of film deposition apparatus, is mainly used in semiconductor device manufacturing, solar cell, catalyst research etc., also is useful on the preparation of passivation layer in the organic electroluminescence device.In organic electroluminescence device luminescent device film encapsulation field; Generally be to be divided into organic membrane encapsulation, inoranic membrane encapsulation, the encapsulation of organic/inorganic film; Ald is a kind of mode that forms inoranic membrane, and its depositing temperature is low, can not injure organic layer in the device; And the film forming compact structure can intercept water oxygen effectively and penetrate into device inside.
Optional, said substrate is glass, metal or plastics, wherein the cost of metallic substrates is higher, uses less aborning.Plastic-substrates can adopt the material of polyesters or polyimides compounds.When substrate was glass, only need encapsulate in the negative electrode outside of organic electroluminescence device and get final product.
Preferred a kind of mode does; When substrate is plastics; Described encapsulated layer is provided with respectively in the outside of negative electrode and the inboard of substrate; This is because plastic-substrates can not be prevented the infiltration of sealing oxygen effectively, so need deposit setting in two sides of organic electroluminescence device, guarantees that water oxygen permeability is low.
The multilayer complex films of said encapsulated layer is made up of 2～50 layers monofilm, and said monofilm is by Al
2O
3, SiO
x, Si
3N
4, SiN
xO
y, AlN, ZrO
2, HfO
2, Ta
2O
5, La
2O
3, ZnO, TaN, TiO
2Or at least two kinds of metabolies formations, wherein Si among the TiN
3N
4In 0＜x≤1,0＜y≤1, SiO
xMiddle x is 1 or 2.
Further, the multilayer complex films of said encapsulated layer is made up of 2～50 layers monofilm, is good with 15～30 layers wherein.Said monofilm is by Al
2O
3, SiO
x, Si
3N
4, SiN
xO
y, AlN, ZrO
2, HfO
2, Ta
2O
5, La
2O
3, ZnO, TaN, TiO
2Or at least two kinds of materials formations, wherein Si among the TiN
3N
4In 0＜x≤1,0＜y≤1, SiO
xMiddle x is 1 or 2.
Preferably, said monofilm is by Al
2O
3/ ZrO
2, or Al
2O
3/ Si
3N
4, or Al
2O
3/ SiO
xConstitute.Depositing temperature is less than 300 ℃ when encapsulated layer is deposited.The membrane material of being close to the organic electroluminescence device negative electrode is preferably Al
2O
3, SiO
x, Si
3N
4, SiN
xO
y, AlN.
Further, in the encapsulated layer in every layer of monofilm the thickness of every kind of material be 2～50nm, be preferably 2～10nm.
Because the thickness of encapsulated layer has only hundreds of nanometers, and is extremely thin, be damaged easily, therefore be provided with protective layer in the outside of encapsulated layer.Except preparing the protective layer with conventional method, a kind of preferred protective layer is that AlN, SiC or adamantine at least a material are the film of 10～1000nm through the thickness that magnetron sputtering, chemical vapour deposition (CVD) or ald form.Another kind of preferred construction is that protective layer is to be coated on the encapsulated layer outside and thickness is the polymeric layer of 10～1000um, is good with 100um thickness.Said polymer is polymethyl methacrylate, PETG, Merlon, Triafol T or polyether sulfone.Can also preferred a kind of structure do; Protective layer is for being attached to encapsulated layer outside rete, and said rete is the sheet material of reeling that at least a material in polymethyl methacrylate, PETG, Merlon, Triafol T or the polyether sulfone constitutes.
The encapsulating structure of organic electroluminescence device of the present invention, depositing temperature is low, can not injure the organic layer of luminescent device, and does not need other organic film-forming apparatus, has practiced thrift equipment investment cost and floor space.Adopt the alternately inorganic film compact structure of preparation of atomic layer deposition method, pin hole is few, can intercept water oxygen effectively and penetrate into device inside.Process layer protective layer protection packaging layer effectively on the encapsulated layer, can further intercept again water, oxygen.
Below in conjunction with embodiment, foregoing of the present invention is remake further detailed description by the accompanying drawing illustrated embodiment.But should this be interpreted as that the scope of the above-mentioned theme of the present invention only limits to following instance.Do not breaking away under the above-mentioned technological thought situation of the present invention, various replacements or change according to ordinary skill knowledge and customary means are made all should comprise within the scope of the invention.
Description of drawings
Fig. 1 is a kind of sketch map of the encapsulating structure of organic electroluminescence device of the present invention.
Fig. 2 is a kind of component sketch map of the encapsulated layer of Fig. 1.
Fig. 3 is the another kind of component sketch map of the encapsulated layer of Fig. 1.
Fig. 4 is the another kind of sketch map of the encapsulating structure of organic electroluminescence device of the present invention.
Embodiment
Embodiment 1:
The encapsulating structure of organic electroluminescence device of the present invention as shown in Figure 1; Comprise the substrate 1 of the organic electroluminescence devices that constitutes by glass; Be provided with anode 2, organic layer 3 and the negative electrode 4 of organic electroluminescence devices in a side of substrate 1; Be provided with encapsulated layer 5 in the outside of said negative electrode 4, described encapsulated layer 5 is the MULTILAYER COMPOSITE membrane structures of at least two kinds of inorganic insulating materials through the atomic layer deposition system alternating deposit.
As shown in Figure 2, after the organic electroluminescence device that will not encapsulate places atomic layer deposition system, carry out the mask plate contraposition; Shelter from the device extraction electrode; Feed high purity inert gas, after vacuumizing, deposit thickness is the Al of 2～5nm on the negative electrode 4 of luminescent device
2O
3Rete is again at Al
2O
3The outer deposit thickness of rete is the ZrO of 2～5nm
2Rete repeats above-mentioned film deposition step 20 times (promptly 20 layers), obtains the Al that thickness is 80～200nm
2O
3/ ZrO
2Film encapsulated layer 5.
Embodiment 2:
As shown in Figure 3, on the basis of embodiment 1, different is that deposit thickness is the Al of 2～5nm on the negative electrode 4 of luminescent device
2O
3Rete is again at Al
2O
3The outer deposit thickness of rete is the Si of 2～5nm
3N
4Rete repeats above-mentioned film deposition step 20 times (promptly 20 layers), obtains the Al that thickness is 80～200nm
2O
3/ Si
3N
4Film encapsulated layer 5.
Embodiment 3:
On the basis of embodiment 1 or 2, substrate 1 is respectively arranged with encapsulated layer 5 for plastics constitute in the outside of negative electrode 4 and the inboard of substrate 1.
Embodiment 4:
As shown in Figure 4, on the basis of embodiment 1 or 2, the outside of encapsulated layer 5 is provided with protective layer 6.Protective layer 6 can be that AlN, SiC or adamantine at least a material are the film of 10～1000nm through the thickness that magnetron sputtering, chemical vapour deposition (CVD) or ald form; Also can be to be coated on encapsulated layer 5 outsides and thickness is the polymeric layer of 10～1000um, said polymer be polymethyl methacrylate, PETG, Merlon, Triafol T or polyether sulfone; Can also be to be attached to encapsulated layer 5 outside retes, said rete be the sheet material of reeling that at least a material in polymethyl methacrylate, PETG, Merlon, Triafol T or the polyether sulfone constitutes.
Claims (10)
1. the encapsulating structure of organic electroluminescence device; Include the substrate (1) of organic electroluminescence devices; Be provided with anode (2), organic layer (3) and the negative electrode (4) of organic electroluminescence devices in a side of substrate (1); It is characterized by: be provided with encapsulated layer (5) in the outside of said negative electrode (4) at least, described encapsulated layer (5) is the MULTILAYER COMPOSITE membrane structures of at least two kinds of inorganic insulating materials through the atomic layer deposition system alternating deposit.
2. the encapsulating structure of organic electroluminescence device as claimed in claim 1 is characterized by: said substrate (1) is glass, metal or plastics.
3. the encapsulating structure of organic electroluminescence device as claimed in claim 2 is characterized by: when substrate (1) during for plastics, described encapsulated layer (5) is provided with respectively in the outside of negative electrode (4) and the inboard of substrate (1).
4. the encapsulating structure of organic electroluminescence device as claimed in claim 1, it is characterized by: the multilayer complex films of said encapsulated layer (5) is made up of 2～50 layers monofilm, and said monofilm is by Al
2O
3, SiO
x, Si
3N
4, SiN
xO
y, AlN, ZrO
2, HfO
2, Ta
2O
5, La
2O
3, ZnO, TaN, TiO
2Or at least two kinds of metabolies formations, wherein Si among the TiN
3N
4In 0＜x≤1,0＜y≤1, SiO
xMiddle x is 1 or 2.
5. the encapsulating structure of organic electroluminescence device as claimed in claim 4, it is characterized by: said monofilm is by Al
2O
3/ ZrO
2, or Al
2O
3/ Si
3N
4, or Al
2O
3/ SiO
xConstitute.
6. the encapsulating structure of organic electroluminescence device as claimed in claim 5, it is characterized by: the thickness of every kind of material is 2～50nm in the said monofilm.
7. the encapsulating structure of organic electroluminescence device as claimed in claim 1 is characterized by: be provided with protective layer (6) in the outside of encapsulated layer (5).
8. the encapsulating structure of organic electroluminescence device as claimed in claim 7 is characterized by: said protective layer (6) is the film of 10～1000nm for AlN, SiC or adamantine at least a material through the thickness that magnetron sputtering, chemical vapour deposition (CVD) or ald form.
9. the encapsulating structure of organic electroluminescence device as claimed in claim 7; It is characterized by: said protective layer (6) is for being coated on outside the encapsulated layer (5) and thickness is the polymeric layer of 10～1000um, and said polymer is polymethyl methacrylate, PETG, Merlon, Triafol T or polyether sulfone.
10. the encapsulating structure of organic electroluminescence device as claimed in claim 7; It is characterized by: said protective layer (6) is for being attached to encapsulated layer (5) outside rete, and said rete is the sheet material of reeling that at least a material in polymethyl methacrylate, PETG, Merlon, Triafol T or the polyether sulfone constitutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103633638A CN102437288A (en) | 2011-11-16 | 2011-11-16 | Packaging structure of OLED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103633638A CN102437288A (en) | 2011-11-16 | 2011-11-16 | Packaging structure of OLED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102437288A true CN102437288A (en) | 2012-05-02 |
Family
ID=45985257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103633638A Pending CN102437288A (en) | 2011-11-16 | 2011-11-16 | Packaging structure of OLED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102437288A (en) |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102864417A (en) * | 2012-08-22 | 2013-01-09 | 吉林大学 | Method for encapsulating organic devices by passivation layer prepared by electron beam evaporation and atomic layer deposition |
| CN103715366A (en) * | 2013-12-20 | 2014-04-09 | 京东方科技集团股份有限公司 | OLED film packaging structure, OLED device and display apparatus |
| CN104078600A (en) * | 2013-03-29 | 2014-10-01 | 海洋王照明科技股份有限公司 | Organic light-emitting diode device and manufacturing method thereof |
| CN104183769A (en) * | 2013-05-22 | 2014-12-03 | 海洋王照明科技股份有限公司 | Organic light emitting diode and preparation method thereof |
| WO2015043064A1 (en) * | 2013-09-27 | 2015-04-02 | 京东方科技集团股份有限公司 | Display panel, display device and manufacturing method for display panel |
| CN104716270A (en) * | 2015-03-16 | 2015-06-17 | 上海和辉光电有限公司 | Film packaging structure and organic light-emitting device with same |
| WO2015165182A1 (en) * | 2014-04-29 | 2015-11-05 | 京东方科技集团股份有限公司 | Packaging structure and packaging method for organic electroluminescent device, and display apparatus |
| CN105679964A (en) * | 2016-03-28 | 2016-06-15 | 中国电子科技集团公司第五十五研究所 | Organic light-emitting device (OLED) packaging structure and method |
| CN106058071A (en) * | 2016-07-01 | 2016-10-26 | 沈阳拓荆科技有限公司 | Barrier layer structure of OLED device and preparation method thereof |
| CN106654039A (en) * | 2016-09-27 | 2017-05-10 | 上海天马微电子有限公司 | Display panel, display device and manufacturing method of display panel |
| CN107068904A (en) * | 2017-04-18 | 2017-08-18 | 京东方科技集团股份有限公司 | Inorganic encapsulated film, the preparation method of OLED packaging films and related device |
| CN107240648A (en) * | 2017-05-22 | 2017-10-10 | 茆胜 | Composite package film and preparation method thereof |
| CN108106748A (en) * | 2017-11-09 | 2018-06-01 | 中国电子科技集团公司第四十八研究所 | A kind of flexibility ablation resistance film and preparation method thereof |
| US10008689B2 (en) | 2013-09-27 | 2018-06-26 | Boe Technology Group Co., Ltd. | Display panel, display device and method of manufacturing display panel |
| CN108649138A (en) * | 2018-04-28 | 2018-10-12 | 武汉华星光电半导体显示技术有限公司 | Display panel and preparation method thereof |
| CN108666352A (en) * | 2018-05-14 | 2018-10-16 | 云谷（固安）科技有限公司 | Display panel motherboard, display panel and preparation method thereof |
| TWI694930B (en) * | 2014-07-31 | 2020-06-01 | 德商巴斯夫塗料有限公司 | Encapsulation structure for an oled display incorporating antireflection properties |
| WO2020206980A1 (en) * | 2019-04-12 | 2020-10-15 | 深圳市华星光电半导体显示技术有限公司 | Flexible oled display apparatus and preparation method therefor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080024382A (en) * | 2006-09-13 | 2008-03-18 | 주성엔지니어링(주) | Organic electroluminescent element and method of manufacturing the same |
| CN101933173A (en) * | 2008-01-30 | 2010-12-29 | 奥斯兰姆奥普托半导体有限责任公司 | Method for producing an electronic component and electronic component |
-
2011
- 2011-11-16 CN CN2011103633638A patent/CN102437288A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080024382A (en) * | 2006-09-13 | 2008-03-18 | 주성엔지니어링(주) | Organic electroluminescent element and method of manufacturing the same |
| CN101933173A (en) * | 2008-01-30 | 2010-12-29 | 奥斯兰姆奥普托半导体有限责任公司 | Method for producing an electronic component and electronic component |
Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102864417A (en) * | 2012-08-22 | 2013-01-09 | 吉林大学 | Method for encapsulating organic devices by passivation layer prepared by electron beam evaporation and atomic layer deposition |
| CN104078600A (en) * | 2013-03-29 | 2014-10-01 | 海洋王照明科技股份有限公司 | Organic light-emitting diode device and manufacturing method thereof |
| CN104183769A (en) * | 2013-05-22 | 2014-12-03 | 海洋王照明科技股份有限公司 | Organic light emitting diode and preparation method thereof |
| US10008689B2 (en) | 2013-09-27 | 2018-06-26 | Boe Technology Group Co., Ltd. | Display panel, display device and method of manufacturing display panel |
| WO2015043064A1 (en) * | 2013-09-27 | 2015-04-02 | 京东方科技集团股份有限公司 | Display panel, display device and manufacturing method for display panel |
| US9472784B2 (en) | 2013-12-20 | 2016-10-18 | Boe Technology Group Co., Ltd. | Packaging structure for OLED having inorganic and organic films with moisture absorbent layers |
| CN103715366A (en) * | 2013-12-20 | 2014-04-09 | 京东方科技集团股份有限公司 | OLED film packaging structure, OLED device and display apparatus |
| WO2015165182A1 (en) * | 2014-04-29 | 2015-11-05 | 京东方科技集团股份有限公司 | Packaging structure and packaging method for organic electroluminescent device, and display apparatus |
| US9362528B2 (en) | 2014-04-29 | 2016-06-07 | Boe Technology Group Co., Ltd. | Packaging structure and packaging method of organic electroluminescent device, and display device |
| TWI694930B (en) * | 2014-07-31 | 2020-06-01 | 德商巴斯夫塗料有限公司 | Encapsulation structure for an oled display incorporating antireflection properties |
| CN104716270A (en) * | 2015-03-16 | 2015-06-17 | 上海和辉光电有限公司 | Film packaging structure and organic light-emitting device with same |
| US9608235B2 (en) | 2015-03-16 | 2017-03-28 | Everdisplay Optronics (Shanghai) Limited | Thin film encapsulation structure and organic light emitting device having the same |
| CN105679964A (en) * | 2016-03-28 | 2016-06-15 | 中国电子科技集团公司第五十五研究所 | Organic light-emitting device (OLED) packaging structure and method |
| CN106058071A (en) * | 2016-07-01 | 2016-10-26 | 沈阳拓荆科技有限公司 | Barrier layer structure of OLED device and preparation method thereof |
| CN106654039A (en) * | 2016-09-27 | 2017-05-10 | 上海天马微电子有限公司 | Display panel, display device and manufacturing method of display panel |
| CN107068904A (en) * | 2017-04-18 | 2017-08-18 | 京东方科技集团股份有限公司 | Inorganic encapsulated film, the preparation method of OLED packaging films and related device |
| CN107240648A (en) * | 2017-05-22 | 2017-10-10 | 茆胜 | Composite package film and preparation method thereof |
| CN108106748A (en) * | 2017-11-09 | 2018-06-01 | 中国电子科技集团公司第四十八研究所 | A kind of flexibility ablation resistance film and preparation method thereof |
| CN108649138A (en) * | 2018-04-28 | 2018-10-12 | 武汉华星光电半导体显示技术有限公司 | Display panel and preparation method thereof |
| CN108649138B (en) * | 2018-04-28 | 2020-09-04 | 武汉华星光电半导体显示技术有限公司 | Display panel and manufacturing method thereof |
| CN108666352A (en) * | 2018-05-14 | 2018-10-16 | 云谷（固安）科技有限公司 | Display panel motherboard, display panel and preparation method thereof |
| US11050042B2 (en) | 2018-05-14 | 2021-06-29 | Yungu (Gu'an) Technology Co., Ltd. | Display panel motherboard, display panel and method of manufacturing the same |
| WO2020206980A1 (en) * | 2019-04-12 | 2020-10-15 | 深圳市华星光电半导体显示技术有限公司 | Flexible oled display apparatus and preparation method therefor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102437288A (en) | Packaging structure of OLED | |
| US9799854B2 (en) | Multilayer film for encapsulating oxygen and/or moisture sensitive electronic devices | |
| CN102593371A (en) | Packaging structure for organic light-emitting device (OLED) | |
| KR101385262B1 (en) | Inorganic graded barrier film and methods for their manufacture | |
| JP2002532850A (en) | Environmental barrier material for organic light emitting device and method of manufacturing the same | |
| KR101465212B1 (en) | Ultra-flexible encapsulation thin-film | |
| CN103258955A (en) | Encapsulation method of organic electronic device | |
| WO2013143287A1 (en) | Thin-film packaging element, photoelectronic component, and packaging method therefor | |
| CN104638189A (en) | Organic light-emitting device and preparation method thereof | |
| CN102299120A (en) | Packaging method of optoelectronic device | |
| CN103730595A (en) | Organic light-emitting device and preparation method thereof | |
| CN106848089A (en) | A kind of preparation method of flexible OLED display film | |
| US20230165037A1 (en) | Packaged filed, packaging method for light-emitting device, and ligth-emitting apparatus | |
| CN106920865A (en) | The preparation method of quantum dot film layer structure | |
| CN102299121A (en) | Method for packaging photoelectronic device | |
| CN102856509A (en) | OLED (organic light emitting diode) encapsulation layer and OLED device and preparation method thereof | |
| Erlat et al. | Substrates and thin-film barrier technology for flexible electronics | |
| CN103855316A (en) | Organic light-emitting device and preparation method thereof | |
| CN103594647A (en) | Organic electroluminescent device and preparation method thereof | |
| CN103855321A (en) | Organic light-emitting device and preparation method thereof | |
| CN103855320A (en) | Organic light-emitting device and preparation method thereof | |
| Li et al. | Encapsulation of organic light-emitting devices for the application of display | |
| CN103855308B (en) | A kind of organic electroluminescence device and preparation method thereof | |
| CN102299122A (en) | Method for packaging photoelectronic device | |
| CN103427039A (en) | Organic electroluminescent device and production method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120502 |