CN108766986A - Make the encapsulating structure of the method and oled panel of oled panel - Google Patents
Make the encapsulating structure of the method and oled panel of oled panel Download PDFInfo
- Publication number
- CN108766986A CN108766986A CN201810544443.5A CN201810544443A CN108766986A CN 108766986 A CN108766986 A CN 108766986A CN 201810544443 A CN201810544443 A CN 201810544443A CN 108766986 A CN108766986 A CN 108766986A
- Authority
- CN
- China
- Prior art keywords
- oled panel
- protective film
- transparent protective
- support baseboard
- tetrafluoroethene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention provides a kind of method making oled panel and a kind of encapsulating structure of oled panel.The method includes：One support baseboard is provided；An OLED array layers are formed on the support baseboard；A tetrafluoroethene encapsulated layer is formed on the OLED array layers；And form a transparent protective film on the tetrafluoroethene encapsulated layer；The thickness of the wherein described transparent protective film is 10-50 microns.
Description
【Technical field】
The present invention relates to organic LED panel field, more particularly to a kind of method making oled panel and one kind
The encapsulating structure of oled panel.
【Background technology】
In flat panel display, Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED) is aobvious
Show utensil have it is frivolous, actively shine, fast response time, angle of visibility is big, colour gamut is wide, brightness is high and many merits such as low in energy consumption, by
Gradually become the display technology of a new generation.
Laser cutting has important and is widely applied in oled panel production process.The efficiency of laser cutting and cutting
Quality and the thickness of oled panel product have substantial connection.
Fig. 1 is please referred to, Fig. 1 is the schematic diagram of the structure of the oled panel made by the prior art.The prior art
Oled panel manufacturing process includes：A flexible base board 101 is formed on glass film plates 100；One is formed on flexible base board 101
OLED array layers 102；A tetrafluoroethene (tetrafluoroethylene, TFE) encapsulation is formed on an OLED array layers 102
Layer 103；And formed on TFE encapsulated layers 103 polyethylene terephthalate (polyethylene terephthalate,
PET) protective film 104.In the technical solution of the prior art, the thickness of glass film plates is about 500 microns, flexible base board 101
Thickness is about 20 microns, and the thickness of OLED array layers 102 is about 0.3 micron, and the thickness of TFE encapsulated layers 103 is about 5 microns, PET
The thickness of protective film 104 is about 150 microns.
The material that the prior art is formed by protective film is PET.In order to ensure to attach quality, it is formed by PET protection film
There must be thicker thickness, about 150 microns, account for entire product needs cutting thickness 1/2.Therefore, it is subsequent will be big
Plate was cut in the step of forming small panel, and the thickness of PET protection film will have a direct impact on the efficiency of cutting, and in cutting process meeting
It generates a large amount of cutting ashes and influences to cut quality.Also, cutting process also needs other than needing to cut the edge of oled panel
Cut the PET protection film in the terminal region of removal oled panel.In addition, in follow-up polarizer sheet sticking step, PET protection film
It needs to be removed, this also results in the waste of material.
Therefore, it is necessary to a kind of method making oled panel and a kind of encapsulating structure of oled panel be provided, to solve
The problems of prior art.
【Invention content】
The purpose of the present invention is to provide a kind of method making oled panel and a kind of encapsulating structure of oled panel, with
Solve the prior art cutting efficiency it is low, cutting poor quality and Protective coatings waste the technical issues of.
In order to solve the above technical problems, the present invention provides a kind of method making oled panel, which is characterized in that including with
Lower step：
One support baseboard is provided；
An OLED array layers are formed on the support baseboard；
A tetrafluoroethene encapsulated layer is formed on the OLED array layers；And
A transparent protective film is formed on the tetrafluoroethene encapsulated layer；
The thickness of the wherein described transparent protective film is 10-50 microns.
According to one preferred embodiment of the present invention, the support baseboard is the material of a glass film plates and the transparent protective film
Matter is polyvinyl chloride or polymethyl methacrylate.
According to one preferred embodiment of the present invention, using the transparent protective film is either physically or chemically formed in described four
It is described either physically or chemically to be beaten including physical vapor deposition, chemical meteorology deposition, printing or ink-jet on vinyl fluoride encapsulated layer
Print.
According to one preferred embodiment of the present invention, the oled panel includes a terminal region, and the terminal region has multiple ends
Son, the transparent protective film are not formed in the terminal region.
According to one preferred embodiment of the present invention, it after the support baseboard is provided, and is formed on the support baseboard
Before the OLED array layers, the method further includes following steps：
A flexible base board is formed on the support baseboard.
According to one preferred embodiment of the present invention, described after forming a transparent protective film on the tetrafluoroethene encapsulated layer
Method further includes following steps：
The cutting at edge is carried out to the oled panel；And
By a polarizer sheet sticking to the oled panel.
The present invention also provides a kind of encapsulating structures of oled panel, including：
One support baseboard；
One OLED array layers are arranged on the support baseboard；
One tetrafluoroethene encapsulated layer is arranged on the OLED array layers；And
One transparent protective film is arranged on the tetrafluoroethene encapsulated layer；
The thickness of the wherein described transparent protective film is 10-50 microns.
According to one preferred embodiment of the present invention, the support baseboard is the material of a glass film plates and the transparent protective film
Matter is polyvinyl chloride or polymethyl methacrylate.
According to one preferred embodiment of the present invention, the transparent protective film is to be formed in institute by being either physically or chemically arranged
It states on tetrafluoroethene encapsulated layer, described includes either physically or chemically physical vapor deposition, chemical meteorology deposition, printing or ink-jet
Printing.
According to one preferred embodiment of the present invention, the oled panel includes a terminal region, and the terminal region has multiple ends
Son does not have the transparent protective film in the terminal region.
Compared to the prior art, the present invention is formed by the thinner thickness of transparent protective film, can be lifted at it is subsequent will be big
Plate cuts the cutting efficiency for the step of forming small panel, and cutting process not will produce a large amount of cutting ashes and influence cutting product
Matter.Also, transparent protective film is not formed in the terminal region of oled panel, the faces cutting removal OLED in the prior art are eliminated
The step of protective film in the terminal region of plate.It need not be removed, will not be caused in addition, the present invention is formed by transparent protective film
The waste of material.
【Description of the drawings】
Fig. 1 is the schematic diagram of the structure of the oled panel made by the prior art.
Fig. 2A to 2E is the flow diagram according to a kind of method making oled panel of the preferred embodiment of the present invention.
Fig. 3 is the oled panel vertical view according to the preferred embodiment of the present invention after forming transparent protective film.
【Specific implementation mode】
The explanation of following embodiment is to refer to additional schema, to illustrate the particular implementation that the present invention can be used to implement
Example.The direction term that the present invention is previously mentioned, such as "upper", "lower", "front", "rear", "left", "right", "inner", "outside", " side "
Deng being only the direction with reference to annexed drawings.Therefore, the direction term used be illustrate and understand the present invention, rather than to
The limitation present invention.The similar unit of structure is to be given the same reference numerals in the figure.
Fig. 2A to 2E is please referred to, Fig. 2A to 2E is a kind of method making oled panel according to the preferred embodiment of the present invention
Flow diagram.It the described method comprises the following steps.
First, as shown in Figure 2 A, a support baseboard is provided.
Secondly, as shown in Figure 2 B, a flexible base board 201 is formed on the support baseboard 200.
Then, as shown in Figure 2 C, an OLED array layers 202 are formed on the flexible base board 201.
In turn, as shown in Figure 2 D, a tetrafluoroethene is formed on the OLED array layers 202
(tetrafluoroethylene, TFE) encapsulated layer 203.
Finally, as shown in Figure 2 E, a transparent protective film 204 is formed on the tetrafluoroethene encapsulated layer 203.
After forming a transparent protective film on the tetrafluoroethene encapsulated layer, the method can further include a cutting step with
One pastes step partially.In specific words, the cutting step is the cutting that edge is carried out to the oled panel；The inclined patch step is
By a polarizer sheet sticking to the oled panel.
Preferably, the support baseboard 200 can be a glass film plates, but the present invention is not limited to this.
Preferably, the material of the flexible base board 201 can be polyimides (polyimide, PI), but the present invention not office
It is limited to this.
According to the present invention, the material of the transparent protective film is polyvinyl chloride (polyvinylchloride, PVC) or pressure
Gram force, the acryl can be such as polymethyl methacrylates (polymethyl methacrylate, PMMA).It can adopt
With either physically or chemically the transparent protective film 204 is formed on the tetrafluoroethene encapsulated layer 203, the physics or change
Method includes physical vapor deposition, chemical meteorology deposition, printing or inkjet printing.The thickness of the transparent protective film 204 is
10-50 microns.
It is the oled panel vertical view according to the preferred embodiment of the present invention after forming transparent protective film 204 with reference to Fig. 3, Fig. 3
Figure.As shown in figure 3, the oled panel includes a terminal region 302, the terminal region has multiple terminal (not shown).Institute
It states in the step of forming a transparent protective film on tetrafluoroethene encapsulated layer, transparent protective film 301 is not formed on the terminal region
In 302.
Therefore, the present invention proposes to prepare one layer of protection in tetrafluoroethene encapsulation layer surface using chemistry or this physical film deposition method
The technical solution of film.The preparation method of protective film can pass through physical vapor deposition, chemical meteorology deposition, printing or inkjet printing
To complete.Between the thickness of the protective film is 10-50 microns, but it is not limited to the thickness range.Protective film is transparent, with will not
Influence the OLED characteristics of luminescences.The material of protective film can be polyvinyl chloride or acryl, and the acryl can be for example poly- first
Base methyl acrylate.
Referring again to Fig. 2 E, the present invention also provides a kind of encapsulating structures of oled panel.The encapsulation knot of the oled panel
Structure includes：
One support baseboard 200；
One flexible base board 201 is arranged on the support baseboard 200；
One OLED array layers 202 are arranged on the flexible base board 201；
One tetrafluoroethene encapsulated layer 203 is arranged on the OLED array layers 202；And
One transparent protective film 204 is arranged on the tetrafluoroethene encapsulated layer 203.
Preferably, the support baseboard 200 can be a glass film plates, but the present invention is not limited to this.
Preferably, the material of the flexible base board 201 can be polyimides (polyimide, PI), but the present invention not office
It is limited to this.
According to the present invention, the material of the transparent protective film is polyvinyl chloride (polyvinylchloride, PVC) or pressure
Gram force, the acryl can be such as polymethyl methacrylates (polymethyl methacrylate, PMMA).It is described
Transparent protective film is formed on the tetrafluoroethene encapsulated layer by being either physically or chemically arranged, the physically or chemically side
Method includes physical vapor deposition, chemical meteorology deposition, printing or inkjet printing.The thickness of the transparent protective film is that 10-50 is micro-
Rice.
As shown in figure 3, the oled panel includes a terminal region 302, there are multiple terminals (not show for the terminal region 302
Go out), do not have the transparent protective film 301 in the terminal region 302.
Since transparent protective film is formed using chemistry or this physical film deposition method, the present invention can reach following technology effect
Fruit：
(1) thickness of transparent protective film can be controlled to the thickness of relatively thin 10-50 microns, can be increased substantially and be cut
Cut quality.
(2) before carrying out subsequent inclined patch step, without removing the transparent protective film, the work of manufacturing process can be optimized
Skill.
(3) when forming transparent protective film, forming region range of the film layer on oled panel can be controlled.Traditional technology side
Case is other than needing to cut the edge of oled panel, it is also necessary to cut the terminal region of oled panel.Relatively, present invention proposition is adopted
It is prepared with using physics or chemical method, can effectively control film-forming region range, transparent protective film may make to be not formed
In terminal region, the cutting of subsequent terminal region can be directly reduced, need to only carry out the cutting that oled panel carries out edge.
Therefore compared to the prior art, the present invention is formed by the thinner thickness of transparent protective film, can be lifted at subsequent
Big plate is cut to the cutting efficiency for the step of forming small panel, and cutting process not will produce a large amount of cutting ashes and influence to cut
Cut quality.Also, transparent protective film is not formed in the terminal region of oled panel, cutting removal in the prior art is eliminated
The step of protective film in the terminal region of oled panel.It need not be removed in addition, the present invention is formed by transparent protective film, no
It can cause the waste of material.
In conclusion although the present invention is disclosed above with preferred embodiment, above preferred embodiment is not to limit
The system present invention, those skilled in the art can make various changes and profit without departing from the spirit and scope of the present invention
Decorations, therefore protection scope of the present invention is subject to the range that claim defines.
Claims (10)
1. a kind of method making oled panel, which is characterized in that include the following steps：
One support baseboard is provided；
An OLED array layers are formed on the support baseboard；
A tetrafluoroethene encapsulated layer is formed on the OLED array layers；And
A transparent protective film is formed on the tetrafluoroethene encapsulated layer；
The thickness of the wherein described transparent protective film is 10-50 microns.
2. the method according to claim 1 for making oled panel, which is characterized in that the support baseboard is a glass bottom
The material of plate and the transparent protective film is polyvinyl chloride or polymethyl methacrylate.
3. the method according to claim 1 for making oled panel, which is characterized in that using either physically or chemically by institute
It states transparent protective film to be formed on the tetrafluoroethene encapsulated layer, described includes either physically or chemically physical vapor deposition, change
Learn vapor phase deposition, printing or inkjet printing.
4. the method according to claim 3 for making oled panel, which is characterized in that the oled panel includes a terminal
There are multiple terminals, the transparent protective film not to be formed in the terminal region for area, the terminal region.
5. the method according to claim 1 for making oled panel, which is characterized in that provide the support baseboard it
Afterwards, and on the support baseboard it is formed before the OLED array layers, the method further includes following steps：
A flexible base board is formed on the support baseboard.
6. the method according to claim 1 for making oled panel, which is characterized in that on the tetrafluoroethene encapsulated layer
After forming a transparent protective film, the method further includes following steps：
The cutting at edge is carried out to the oled panel；And
By a polarizer sheet sticking to the oled panel.
7. a kind of encapsulating structure of oled panel, including：
One support baseboard；
One OLED array layers are arranged on the support baseboard；
One tetrafluoroethene encapsulated layer is arranged on the OLED array layers；And
One transparent protective film is arranged on the tetrafluoroethene encapsulated layer；
The thickness of the wherein described transparent protective film is 10-50 microns.
8. the encapsulating structure of oled panel according to claim 7, which is characterized in that the support baseboard is a glass bottom
The material of plate and the transparent protective film is polyvinyl chloride or polymethyl methacrylate.
9. the encapsulating structure of oled panel according to claim 7, which is characterized in that the transparent protective film is to pass through object
Reason or chemical method setting are formed on the tetrafluoroethene encapsulated layer, described either physically or chemically heavy including physical vapor
Product, chemical meteorology deposition, printing or inkjet printing.
10. the encapsulating structure of oled panel according to claim 9, which is characterized in that the oled panel includes one end
Sub-district, the terminal region have multiple terminals, do not have the transparent protective film in the terminal region.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810544443.5A CN108766986A (en) | 2018-05-31 | 2018-05-31 | Make the encapsulating structure of the method and oled panel of oled panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810544443.5A CN108766986A (en) | 2018-05-31 | 2018-05-31 | Make the encapsulating structure of the method and oled panel of oled panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108766986A true CN108766986A (en) | 2018-11-06 |
Family
ID=64000835
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810544443.5A Pending CN108766986A (en) | 2018-05-31 | 2018-05-31 | Make the encapsulating structure of the method and oled panel of oled panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108766986A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110571350A (en) * | 2019-08-14 | 2019-12-13 | 武汉华星光电半导体显示技术有限公司 | Display panel mother board, preparation method thereof and display panel |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103682155A (en) * | 2013-12-10 | 2014-03-26 | 京东方科技集团股份有限公司 | Organic electroluminescence display, optical thin film stacking body of organic electroluminescence display and preparing method of optical thin film stacking body |
| CN104009058A (en) * | 2013-02-27 | 2014-08-27 | 宏达国际电子股份有限公司 | Display module and method for manufacturing same |
| CN104103662A (en) * | 2013-04-15 | 2014-10-15 | 三星显示有限公司 | Organic light emitting display device |
| CN106654039A (en) * | 2016-09-27 | 2017-05-10 | 上海天马微电子有限公司 | Display panel, display device and manufacturing method of display panel |
| CN107994129A (en) * | 2017-11-20 | 2018-05-04 | 武汉华星光电半导体显示技术有限公司 | The preparation method of flexible OLED display panel |
-
2018
- 2018-05-31 CN CN201810544443.5A patent/CN108766986A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104009058A (en) * | 2013-02-27 | 2014-08-27 | 宏达国际电子股份有限公司 | Display module and method for manufacturing same |
| CN104103662A (en) * | 2013-04-15 | 2014-10-15 | 三星显示有限公司 | Organic light emitting display device |
| CN103682155A (en) * | 2013-12-10 | 2014-03-26 | 京东方科技集团股份有限公司 | Organic electroluminescence display, optical thin film stacking body of organic electroluminescence display and preparing method of optical thin film stacking body |
| CN106654039A (en) * | 2016-09-27 | 2017-05-10 | 上海天马微电子有限公司 | Display panel, display device and manufacturing method of display panel |
| CN107994129A (en) * | 2017-11-20 | 2018-05-04 | 武汉华星光电半导体显示技术有限公司 | The preparation method of flexible OLED display panel |
Non-Patent Citations (1)
| Title |
|---|
| 赵俊会: "《高分子化学与物理》", 28 February 2010 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110571350A (en) * | 2019-08-14 | 2019-12-13 | 武汉华星光电半导体显示技术有限公司 | Display panel mother board, preparation method thereof and display panel |
| WO2021027061A1 (en) * | 2019-08-14 | 2021-02-18 | 武汉华星光电半导体显示技术有限公司 | Mother board of display panel and preparation method therefor, and display panel |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105914223B (en) | The manufacturing method and display panel of display panel | |
| CN106653812A (en) | Flexible display panel making method | |
| CN102509770A (en) | Mother board structure of light emitting device, light emitting device and manufacturing method thereof | |
| US20100244056A1 (en) | Addressable Or Static Light Emitting, Power Generating Or Other Electronic Apparatus | |
| CN107706221B (en) | The production method and OLED display of OLED display | |
| CN203787433U (en) | OLED display member and display device | |
| KR102185577B1 (en) | OLED substrate and its manufacturing method | |
| CN107403828B (en) | Display panel and manufacturing method thereof | |
| US10476004B2 (en) | Method of manufacturing flexible display panel | |
| CN105489611A (en) | Printed type light emitting display and manufacturing method therefor | |
| US10868090B2 (en) | Display substrate, manufacture method of the same, display panel | |
| CN107768543A (en) | A kind of flexible touch-control display panel | |
| WO2019014994A1 (en) | Hardened film and preparation method therefor, and flexible amoled display device | |
| CN108766986A (en) | Make the encapsulating structure of the method and oled panel of oled panel | |
| EP3352238A1 (en) | Method for preparing uneven particle layer, organic electroluminescent device, and display device | |
| KR101485490B1 (en) | Chromatically-patterned thin-film solar cell and method for fabricating the same | |
| US10388704B2 (en) | Organic electroluminescence device and method for producing the same | |
| CN105374852B (en) | A kind of printed form active display and preparation method thereof of no pixel bank | |
| CN104393179A (en) | Organic light-emitting diode, illuminating apparatus, and display apparatus | |
| CN108511502A (en) | A kind of array substrate, the preparation method of display panel, display device and array substrate | |
| CN204179111U (en) | A kind of top emitting white light OLED device and display unit | |
| CN205428932U (en) | Mother board, display panel and display device | |
| CN106430083B (en) | The preparation method of nano level columnar thing woods | |
| CN1877453A (en) | Method for making reverse ladder structure by using architecture-complementary micro-patterning technique | |
| CN107731885A (en) | Flexible display panels and preparation method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181106 |
|
| RJ01 | Rejection of invention patent application after publication |