CN110571350A - Display panel mother board, preparation method thereof and display panel - Google Patents
Display panel mother board, preparation method thereof and display panel Download PDFInfo
- Publication number
- CN110571350A CN110571350A CN201910746896.0A CN201910746896A CN110571350A CN 110571350 A CN110571350 A CN 110571350A CN 201910746896 A CN201910746896 A CN 201910746896A CN 110571350 A CN110571350 A CN 110571350A
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- China
- Prior art keywords
- display panel
- substrate
- area
- display
- layer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The invention provides a display panel mother board, which comprises a plurality of display panel areas and a cutting area surrounding the display panel areas; each display panel area is provided with a terminal area and a display area. The display panel mother board is provided with a protective layer, the protective layer corresponds to the display area of each display panel area, and the terminal area is not provided with the protective layer. The invention enables the terminal area to be exposed on the protective layer, thereby reducing the steps of one-step etching, improving the efficiency of panel preparation and reducing the cost of panel preparation.
Description
Technical Field
the invention relates to the field of display, in particular to a display panel mother board, a preparation method of the display panel mother board and a display panel.
Background
With the continuous progress of the display industry, the Organic Light-Emitting Diode (OLED) display panel industry is a new growth point of the future display industry, and with the progress of the display technology, the flexible screen OLED will become the mainstream of the future display device for different display function applications.
With the exploration of the manufacturing technology of the OLED flexible display screen, the advantages and disadvantages of the manufacturing methods of different manufacturing processes and the technical difficulty are discovered, so that more functions are required by required equipment, and the relative equipment cost is increased. The conventional panel preparation technology completes the preparation of an array substrate on a large substrate andafter the light emitting layer is fabricated, a thin film encapsulation Process (TFE Process) is performed to prevent moisture and oxygen from entering the light emitting device, which may cause accelerated aging and failure of the device. And then, a layer of Protective Film (PF) is attached to the surface of the packaging layer to prevent the surface of the packaging layer from being scratched to cause water/oxygen invasion so as to prevent the light-emitting device from being failed and scrapped. The first step in panel fabrication is Laser Cutting, the main purpose of which is to cut several panels out of a large substrate using a Laser. Because the whole large substrate is completely attached by the protective film, CO is firstly used2the protective film on the product terminal area is firstly cut off by the laser, the terminal area is exposed, and then the product size is cut by the ultraviolet laser. Since the large substrate includes a plurality of single-sided board substrates, efficiency is poor in cutting a single terminal area, thereby affecting a panel process speed.
therefore, it is necessary to provide a new mother board of a display panel, which can improve the panel manufacturing efficiency and reduce the manufacturing cost.
Disclosure of Invention
The invention aims to provide a display panel mother board, a preparation method thereof and a display panel. This exposes the terminal area to the protective layer, which can reduce the number of etching steps, improve the efficiency of panel fabrication, and reduce the cost of panel fabrication.
in order to achieve the above object, the present invention provides a display panel mother board, including a plurality of display panel regions and a cutting region surrounding the display panel regions; each display panel area is provided with a terminal area and a display area; and the display panel mother board is provided with a protective layer, and the protective layer corresponds to the display area of each display panel area.
Further, the material of the protective layer is polyimide.
Further, still include: a flexible substrate; the first substrate is arranged on the flexible substrate; the organic light-emitting layer is arranged on one side, far away from the flexible substrate, of the first substrate; and the thin film packaging layer is arranged on one side of the organic light emitting layer, which is far away from the first substrate.
the invention also provides a preparation method of the display panel mother board, which comprises the following steps: providing a first substrate and a grid plate; providing a flexible substrate, wherein the flexible substrate is provided with a plurality of display panel areas and a cutting area surrounding the display panel areas, and each display panel area is provided with a terminal area and a display area; arranging the first substrate on the flexible substrate; forming an organic light emitting layer on one side of the first substrate far away from the flexible substrate; forming a thin film encapsulation layer on one side of the organic light emitting layer far away from the first substrate; and forming a protective layer on the film packaging layer and corresponding to the display areas of all the display panel areas.
Further, the shape and the size of the grid plate are the same as those of the thin film packaging layer.
further, the grid plate is provided with a plurality of openings, and the shape and the size of the openings are the same as those of the display area.
further, the step of forming the protection layer on the thin film encapsulation layer includes: covering the grid plate on the film packaging layer, wherein each opening is opposite to the display area of the display panel area; and dripping a polyimide solution into the open pore, curing to form the protective layer, and removing the grid plate.
The invention also provides a display panel, and the display panel is formed by cutting the display panel mother board along the cutting area.
Further, the cutting mode is ultraviolet laser cutting.
Furthermore, the display panel also comprises a polaroid which is covered on the protective layer of the display panel.
the invention has the beneficial effects that: the invention provides a display panel mother board, a preparation method thereof and a display panel. This enables the terminal area to be exposed outside the protective layer, which can also reduce the number of etching steps, improve the efficiency of panel preparation, and reduce the cost of panel preparation.
Drawings
The invention is further described below with reference to the figures and examples.
FIG. 1 is a schematic plan view of a display panel mother board according to the present invention;
FIG. 2 is a schematic structural diagram of a display panel motherboard according to the present invention;
FIG. 3 is a schematic plan view of a grid plate according to the present invention;
FIG. 4 is a schematic diagram of a structure for providing a flexible substrate according to the present invention;
FIG. 5 is a schematic view of a display panel according to the present invention;
A display panel mother substrate 100; a display panel 20;
A display panel region 10; a cutting area 130; a terminal region 120;
A display area 110; a protective layer 105; a polarizer 106;
A flexible substrate 101; a first substrate 102; an organic light-emitting layer 103;
A thin film encapsulation layer 104; a mesh plate 30; an opening 310;
Detailed Description
the following description of the embodiments refers to the accompanying drawings for illustrating the specific embodiments in which the invention may be practiced. Directional phrases used herein, such as, for example, upper, lower, front, rear, left, right, inner, outer, lateral, etc., refer only to the orientation of the accompanying drawings. The names of the elements, such as the first, the second, etc., mentioned in the present invention are only used for distinguishing different elements and can be better expressed. In the drawings, elements having similar structures are denoted by the same reference numerals.
Embodiments of the present invention will be described in detail herein with reference to the accompanying drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. These embodiments are provided to explain the practical application of the invention and to enable others skilled in the art to understand the invention for various embodiments and with various modifications as are suited to the particular use contemplated.
in the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1, the present invention provides a display panel mother board 100, which includes a plurality of display panel regions 10 and a cutting region 130 surrounding the display panel regions 10; each display panel area 10 has a terminal area 120 and a display area 110.
as shown in fig. 2, the display panel mother board 100 is provided with a protection layer 105, the protection layer 105 corresponds to the display region 110 of each display panel region 10, and the terminal region 120 is not provided with the protection layer 105, such that the terminal region 120 is exposed to the protection layer 105. Fig. 2 is a cross-sectional structure of fig. 1, so that it can be seen that the protection layer 105 is disposed on the display panel mother substrate 100 at intervals, and the protection layer 105 corresponds to the display region 110.
The terminal area 120 of the present invention is directly exposed to the protective layer 105, which reduces the steps of gas laser, improves the production efficiency of the panel, and saves the amount of gas CO 2.
The material of the protective layer 105 is polyimide.
the display panel mother substrate 100 includes a flexible substrate 101, a first substrate 102, an organic light emitting layer 103, and a thin film encapsulation layer 104.
The first substrate 102 is arranged on the flexible substrate 101; the first substrate 102 is an array substrate.
The organic light emitting layer 103 is disposed on a side of the first substrate 102 away from the flexible substrate 101.
The thin film encapsulation layer 104 is disposed on a side of the organic light emitting layer 103 away from the first substrate 102, and the thin film encapsulation layer 104 plays a role in isolating water and oxygen, and can effectively protect a film structure of the display panel 20.
The invention also provides a preparation method of the display panel mother board 100, which comprises the following steps of S1-S6.
S1) providing a first substrate 102 and a grid plate 30;
As shown in fig. 3, the mesh plate 30 has the same size and shape as the thin film encapsulation layer 104. The mesh panel 30 has at least two openings 310.
the opening 310 corresponds to the display area 110; the shape and size of the opening 310 are the same as those of the display area 110.
S2), providing a flexible substrate 101, as shown in fig. 4, the flexible substrate 101 having a plurality of display panel regions 10 and a cutting region 130 surrounding the display panel regions 10, each display panel region 10 having a terminal region 120 and a display region 110.
s3) disposing the first base plate 102 on the flexible substrate 101; the first substrate 102 is an array substrate.
S4) forming an organic light emitting layer 103 on a side of the first substrate 102 away from the flexible substrate 101.
S5) forming a thin film encapsulation layer 104 on the side of the organic light emitting layer 103 away from the first substrate 102.
S6) forming a protection layer 105 on the thin film encapsulation layer 104 and corresponding to the display region 110. The material of the protective layer 105 is polyimide.
In the step of forming the protection layer 105 on the thin film encapsulation layer 104, the method includes:
Covering the grid plate 30 on the thin film encapsulation layer 104, wherein each opening 310 is opposite to the display area 110 of the display panel; dropping a polyimide solution into the opening 310, forming the protective layer 105 at the position of the display area 110 after curing, and then removing the grid plate 30.
the protective layer 105 is prepared by the grid plate 30, so that the protective layer 105 is disposed above the display area 110. This exposes the terminal region 120 outside the protective layer 105, which can reduce the number of etching steps, improve the efficiency of panel fabrication, and reduce the cost of panel fabrication.
as shown in fig. 5, the present invention further provides a display panel 20, wherein the display panel 20 is formed by cutting the display panel mother board 100 along the cutting region 130, and the terminal region 120 and the display region 110 are reserved. The cutting mode is ultraviolet laser cutting.
after cutting the display panel mother substrate 100, a polarizer 106 is attached to the protection layer 105 of the display panel 20.
It should be noted that many variations and modifications of the embodiments of the present invention fully described are possible and are not to be considered as limited to the specific examples of the above embodiments. The above examples are intended to be illustrative of the invention and are not intended to be limiting. In conclusion, the scope of the present invention should include those changes or substitutions and modifications which are obvious to those of ordinary skill in the art.
Claims (10)
1. a display panel mother board is characterized by comprising a plurality of display panel areas and a cutting area surrounding the display panel areas; each display panel area is provided with a terminal area and a display area;
And the display panel mother board is provided with a protective layer, and the protective layer corresponds to the display area of each display panel area.
2. the display panel motherboard according to claim 1,
The protective layer is made of polyimide.
3. The display panel motherboard according to claim 1, further comprising:
a flexible substrate;
The first substrate is arranged on the flexible substrate;
The organic light-emitting layer is arranged on one side, far away from the flexible substrate, of the first substrate;
And the thin film packaging layer is arranged on one side of the organic light emitting layer, which is far away from the first substrate.
4. A preparation method of a display panel mother board is characterized by comprising the following steps:
Providing a first substrate and a grid plate;
Providing a flexible substrate, wherein the flexible substrate is provided with a plurality of display panel areas and a cutting area surrounding the display panel areas, and each display panel area is provided with a terminal area and a display area;
Arranging the first substrate on the flexible substrate;
Forming an organic light emitting layer on one side of the first substrate far away from the flexible substrate;
Forming a thin film encapsulation layer on one side of the organic light emitting layer far away from the first substrate;
And forming a protective layer on the film packaging layer and corresponding to the display areas of all the display panel areas.
5. The method for manufacturing a display panel mother substrate according to claim 4,
the shape and size of the grid plate are the same as those of the thin film packaging layer.
6. The method for manufacturing a display panel mother substrate according to claim 4,
the grid plate is provided with a plurality of openings, and the shape and the size of the openings are the same as those of the display area.
7. the method for manufacturing a display panel mother substrate according to claim 6,
In the step of forming the protection layer on the thin film encapsulation layer, the method includes:
covering the grid plate on the film packaging layer, wherein each opening is opposite to the display area of the display panel area;
and dripping a polyimide solution into the open pore, curing to form the protective layer, and removing the grid plate.
8. A display panel formed by cutting the display panel mother substrate of claim 1 along the cutting region.
9. the display panel according to claim 8,
The cutting mode is ultraviolet laser cutting.
10. The display panel according to claim 8, further comprising:
and the polaroid is covered on the protective layer of the display panel.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910746896.0A CN110571350A (en) | 2019-08-14 | 2019-08-14 | Display panel mother board, preparation method thereof and display panel |
| PCT/CN2019/112420 WO2021027061A1 (en) | 2019-08-14 | 2019-10-22 | Mother board of display panel and preparation method therefor, and display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910746896.0A CN110571350A (en) | 2019-08-14 | 2019-08-14 | Display panel mother board, preparation method thereof and display panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110571350A true CN110571350A (en) | 2019-12-13 |
Family
ID=68775445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910746896.0A Withdrawn CN110571350A (en) | 2019-08-14 | 2019-08-14 | Display panel mother board, preparation method thereof and display panel |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110571350A (en) |
| WO (1) | WO2021027061A1 (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1501750A (en) * | 2002-11-14 | 2004-06-02 | ������������ʽ���� | Manufacturing method of organic electric field luminous panel |
| CN101340747A (en) * | 2007-07-03 | 2009-01-07 | 索尼株式会社 | Method for producing display device and display device |
| CN104022233A (en) * | 2014-05-28 | 2014-09-03 | 京东方科技集团股份有限公司 | Packaging method for organic light-emitting display panel and organic light-emitting display panel |
| CN106299124A (en) * | 2016-08-29 | 2017-01-04 | 西安电子科技大学 | Based on CH3nH3pbI3nmos device of material and preparation method thereof |
| CN108766986A (en) * | 2018-05-31 | 2018-11-06 | 武汉华星光电半导体显示技术有限公司 | Make the encapsulating structure of the method and oled panel of oled panel |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105679967B (en) * | 2014-11-18 | 2018-06-26 | 昆山国显光电有限公司 | Mask plate, the method for preparing organic light-emitting display device |
| CN105633281B (en) * | 2016-01-06 | 2018-07-17 | 京东方科技集团股份有限公司 | A kind of flexible display panels and its packaging method, display device |
| KR102322135B1 (en) * | 2017-09-15 | 2021-11-08 | 삼성디스플레이 주식회사 | Method for manufacturing of display device |
| CN109148716B (en) * | 2018-08-14 | 2020-05-05 | 武汉华星光电半导体显示技术有限公司 | Preparation method of flexible OLED display panel and motherboard structure thereof |
-
2019
- 2019-08-14 CN CN201910746896.0A patent/CN110571350A/en not_active Withdrawn
- 2019-10-22 WO PCT/CN2019/112420 patent/WO2021027061A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1501750A (en) * | 2002-11-14 | 2004-06-02 | ������������ʽ���� | Manufacturing method of organic electric field luminous panel |
| CN101340747A (en) * | 2007-07-03 | 2009-01-07 | 索尼株式会社 | Method for producing display device and display device |
| CN104022233A (en) * | 2014-05-28 | 2014-09-03 | 京东方科技集团股份有限公司 | Packaging method for organic light-emitting display panel and organic light-emitting display panel |
| CN106299124A (en) * | 2016-08-29 | 2017-01-04 | 西安电子科技大学 | Based on CH3nH3pbI3nmos device of material and preparation method thereof |
| CN108766986A (en) * | 2018-05-31 | 2018-11-06 | 武汉华星光电半导体显示技术有限公司 | Make the encapsulating structure of the method and oled panel of oled panel |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021027061A1 (en) | 2021-02-18 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20191213 |