CN109449315B - Display mother board, preparation method thereof and display substrate - Google Patents
Display mother board, preparation method thereof and display substrate Download PDFInfo
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- CN109449315B CN109449315B CN201811278358.5A CN201811278358A CN109449315B CN 109449315 B CN109449315 B CN 109449315B CN 201811278358 A CN201811278358 A CN 201811278358A CN 109449315 B CN109449315 B CN 109449315B
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Abstract
The invention provides a display mother board, a preparation method thereof and a display substrate. The display mother board comprises a plurality of sub-substrate areas, adjacent sub-substrate areas are spaced from each other, a supporting structure is arranged in a spacing area of the adjacent sub-substrate areas, and the supporting structure can support a mask plate when a film layer in the sub-substrate areas is deposited. The display motherboard is provided with the support structure, so that the middle area of the mask plate can be prevented from drooping under the action of gravity, the distance difference between the middle area and the edge area of the mask plate and the surface of the substrate in the sub-substrate area is reduced, and the narrow frame of the substrate in the sub-substrate area is further ensured; the damage to the substrate caused by local contact of the mask plate and the surface of the substrate in the sub-substrate area can be avoided; the height difference between the edge of the substrate in the sub-substrate area and the display area in the middle of the substrate before the protective film is attached at last can be relatively reduced, so that the phenomenon that the film layer on the surface layer of the substrate is damaged by particle dirt due to the pressing action force of the subsequent protective film is avoided, and the quality of the display mother board is ensured.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display mother board, a preparation method thereof and a display substrate.
Background
In the process of producing an OLED substrate, in order to improve the production efficiency, a plurality of OLED sub-substrates are generally prepared and formed simultaneously by one mother substrate. Because the size of the OLED mother board is larger, a MASK plate (MASK Sheet) used in the preparation process is closer to the substrate in the middle area under the action of gravity, and the distance between the edge area of the MASK plate and the substrate is larger, so that the width of a packaging gap at the edge of a produced OLED product is larger, and the narrow frame of the OLED product is not facilitated; meanwhile, the middle area of the mask plate sags under the action of gravity, and if the middle area of the mask plate is contacted with the substrate, the substrate is damaged.
In addition, in the preparation process of the OLED substrate, particle dirt is easy to fall off from the area, which is only packaged by the inorganic packaging film, of the edge of the OLED substrate, the difference between the height of the edge of the OLED substrate and the height of the display area is about 10 mu m, the inorganic packaging film is brittle, and the particle dirt is easy to cause the inorganic packaging film to crack under the pressing action of the subsequent protective film bonding, so that water and oxygen permeate into the light-emitting functional layer, and finally the OLED substrate is poor.
Disclosure of Invention
The invention provides a display mother board, a preparation method thereof and a display substrate, aiming at the technical problems in the prior art. The display motherboard is provided with the support structure, so that the middle area of the mask plate can be prevented from drooping under the action of gravity, the distance difference between the middle area and the edge area of the mask plate and the surface of the substrate in the sub-substrate area is reduced, and the narrow frame of the substrate in the sub-substrate area is further ensured; meanwhile, the mask plate can be prevented from sagging so as to avoid damage to the substrate caused by local contact with the surface of the substrate in the sub-substrate area; in addition, the height difference between the edge of the substrate in the sub-substrate area and the display area in the middle of the substrate before the protective film is finally attached can be relatively reduced, so that when the protective film is attached to the substrate in the subsequent sub-substrate area, the phenomenon that the film layer on the surface layer of the substrate is damaged by particle dirt due to the pressing action force of the attached protective film is avoided, and the quality of the display mother board is ensured.
The invention provides a display mother board which comprises a plurality of sub-substrate areas, wherein the adjacent sub-substrate areas are mutually spaced, and a supporting structure is arranged in the spacing area of the adjacent sub-substrate areas and can support a mask plate when an inner film layer of the sub-substrate area is deposited.
Preferably, the sub-substrate region includes a display region and a frame region surrounding the display region, and the sub-substrate region further includes a binding region located outside the frame region; the binding area comprises a binding wiring area, a flexible wiring area and a binding connection area; the binding wiring area is adjacent to the frame area, and the flexible wiring area and the binding connection area are sequentially arranged away from the frame area;
the supporting structure is further arranged in the binding wiring area and the flexible wiring area.
Preferably, an end face of the support structure, which is far away from the surface of the sub-substrate area, is used for contacting with the mask plate to support the mask plate, and the mask plate supported by the support structure can contact with the surface of the sub-substrate area.
Preferably, an organic encapsulation film, a first blocking dam and a second blocking dam are arranged in the sub-substrate region, the organic encapsulation film is located in the display region, and the first blocking dam and the second blocking dam are located in the frame region; the first blocking dam is arranged around the periphery of the organic packaging film in a surrounding mode; the second blocking dam is arranged around the periphery of the first blocking dam in an enclosing mode;
the distance between the second blocking dam and the support structure adjacent to the second blocking dam ranges from 100 to 1000 microns.
Preferably, the height dimension of the support structure ranges from 3 to 20 μm.
Preferably, a pixel definition layer is further disposed in the sub-substrate region, and the support structure and the pixel definition layer are made of the same material and disposed in the same layer.
Preferably, the number of the supporting structures arranged in the spacing region of the sub-substrate region, the binding wiring region and the flexible wiring region is multiple, and the multiple supporting structures are uniformly distributed in each region.
Preferably, the orthographic shape of the support structure on the surface of the sub-substrate region comprises a strip shape, a square shape or a circular shape.
The invention also provides a display substrate which is formed by cutting the display mother board.
The invention also provides a preparation method of the display mother board, which comprises the step of forming a supporting structure in the interval area of the adjacent sub-substrate areas.
Preferably, the preparation method further comprises: and forming the supporting structure in the binding wiring area and the flexible wiring area of the sub-substrate area.
Preferably, the preparation method comprises: the supporting structure and the pixel definition layer in the sub-substrate region are formed simultaneously by adopting the same composition process.
Preferably, after forming the support structure, the preparation method further comprises: depositing to form an inner film layer of the sub-substrate area;
the step of forming the film layer in the sub-substrate area by deposition comprises the following steps:
adjusting a mask plate adopted for forming the film layer to an alignment position to perform alignment of the mask plate;
adjusting the mask plate to a deposition position where the mask plate is in contact with the support structure; at the deposition position, the mask plate is in contact with the surface of the sub-substrate area;
and depositing the film layer.
The invention has the beneficial effects that: according to the display mother board provided by the invention, the support structure is arranged, so that a mask plate during deposition of the inner film layer of the sub-substrate area can be supported, the middle area of the mask plate is prevented from sagging under the action of gravity, the distance difference between the middle area and the edge area of the mask plate and the surface of the substrate in the sub-substrate area is further reduced, and the narrow frame of the substrate in the sub-substrate area is further ensured; meanwhile, the mask plate can be prevented from sagging so as to avoid damage to the substrate caused by local contact with the surface of the substrate in the sub-substrate area; in addition, the supporting structure can relatively reduce the height difference between the edge of the substrate in the sub-substrate area and the display area in the middle of the substrate before the protective film is finally attached, so that when the protective film is attached to the substrate in the subsequent sub-substrate area, even if particle dirt falls off from the edge of the substrate in the sub-substrate area, the top end of the supporting structure is higher than the top end of the particle dirt, under the supporting action of the supporting structure, the pressing action force of the attached protective film cannot cause damage to the film layer on the surface layer of the substrate, and the quality of the display mother board is ensured.
The display substrate provided by the invention is formed by cutting the display mother board, so that a narrow frame can be realized, and the damage to a film layer attached to a protective film in the display substrate caused by particle dirt falling in the edge region of the display substrate when the protective film is attached to the display substrate can be avoided, thereby ensuring the quality of the display substrate.
Drawings
Fig. 1 is a schematic top view of a structure of a mother substrate according to embodiment 1 of the present invention;
FIG. 2 is a schematic cross-sectional view of the motherboard along the section line AA' in FIG. 1 according to embodiment 1 of the present invention;
FIG. 3 is a cross-sectional view of the motherboard along the AA' cut line in the Area of Area1 in FIG. 1 according to embodiment 2 of the present invention;
FIG. 4 is a schematic top view of the structure of the motherboard shown in FIG. 3;
FIG. 5 is a schematic cross-sectional view of the motherboard along the BB' cut line in the Area2 in FIG. 1 in embodiment 2 of the present invention;
FIG. 6 is a schematic top view of the structure of the motherboard shown in FIG. 5;
FIG. 7 is a schematic top view of one configuration of the support structure;
fig. 8 is a schematic top view of yet another configuration of a support structure.
Wherein the reference numbers indicate:
1. a sub-substrate region; 11. a display area; 12. a frame region; 13. a binding region; 130. binding a wiring area; 131. a flexible routing area; 132. binding a connecting region; 2. a spacing region; 3. a support structure; 4. a mask plate; 5. an organic encapsulation film; 6. a first dam; 7. a second dam; 8. an inorganic encapsulation film; s. the spacing between the second dam and its adjacent support structure.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the following describes a display mother board, a method for manufacturing the display mother board, and a display substrate provided by the present invention in further detail with reference to the accompanying drawings and the detailed description.
Example 1:
the present embodiment provides a display mother board, as shown in fig. 1 and fig. 2, including a plurality of sub-substrate areas 1, where adjacent sub-substrate areas 1 are spaced from each other, a support structure 3 is disposed in a spacing area2 of adjacent sub-substrate areas 1, and the support structure 3 can support a mask plate 4 during deposition of a film layer in the sub-substrate area 1.
The Area1 in fig. 1 is a spacing Area2 between adjacent sub-substrate regions 1 in the row direction in which the sub-substrate regions 1 are arranged. The Area2 in fig. 1 is a spacing Area2 between adjacent sub-substrate areas 1 in the column direction in which the sub-substrate areas 1 are arranged. The sub-substrate region 1 of the display mother substrate is used to form an OLED display substrate. The support structure 3 is mainly used for supporting the mask plate 4 during deposition of the inorganic encapsulation film in the sub-substrate region 1. Of course, the supporting structure 3 may also support the mask plate 4 when depositing other film layers in the sub-substrate region 1, and as long as the mask plate 4 is required to be used when depositing the film layer, the mask plate 4 may be supported by the supporting structure 3.
In addition, in this embodiment, the display mother board may be any mother board that needs to be formed with the film layer of the mask plate 4 during the preparation in the sub-substrate region 1 (i.e., a display mother board with different film layers is formed, and the display mother board is a semi-finished product), or may be any mother board that needs to be formed with the film layer of the mask plate 4 during the preparation in the sub-substrate region 1 (i.e., a display mother board with different film layers is formed, and the display mother board is a semi-finished product or a finished product).
Based on the above structure configuration of the display mother board, the present embodiment further provides a manufacturing method of the display mother board, including forming a support structure in an interval region between adjacent sub-substrate regions.
The support structure is made of a resin material such as polyimide by a patterning process, the patterning process comprises the process steps of material coating, exposure and development, and the patterning process is a traditional mature preparation process and is not described in detail.
According to the display mother board, the support structure is arranged, so that a mask plate during deposition of a film layer in the sub-substrate area can be supported, the middle area of the mask plate is prevented from sagging under the action of gravity, the distance difference between the middle area and the edge area of the mask plate and the surface of the substrate in the sub-substrate area is reduced, and the narrow frame of the substrate in the sub-substrate area is ensured; meanwhile, the mask plate can be prevented from sagging so as to avoid damage to the substrate caused by local contact with the surface of the substrate in the sub-substrate area; in addition, the supporting structure can relatively reduce the height difference between the edge of the substrate in the sub-substrate area and the display area in the middle of the substrate before the protective film is finally attached, so that when the protective film is attached to the substrate in the subsequent sub-substrate area, even if particle dirt falls off from the edge of the substrate in the sub-substrate area, the top end of the supporting structure is higher than the top end of the particle dirt, under the supporting action of the supporting structure, the pressing action force of the attached protective film cannot cause damage to the film layer on the surface layer of the substrate, and the quality of the display mother board is ensured.
Example 2:
the present embodiment provides a display mother board, as shown in fig. 3 and fig. 4, including a plurality of sub-substrate areas 1, where adjacent sub-substrate areas 1 are spaced from each other, and a support structure 3 is disposed in a spacing area2 of adjacent sub-substrate areas 1, where the support structure 3 can support a mask plate 4 during deposition of a film layer in the sub-substrate area 1.
The sub-substrate region 1 of the display mother board is used for forming an OLED display substrate. The support structure 3 is mainly used for supporting the mask plate 4 when depositing the inorganic encapsulation film 8 in the sub-substrate region 1. Of course, the supporting structure 3 may also support the mask plate 4 when depositing other film layers in the sub-substrate region 1, and as long as the mask plate 4 is required to be used when depositing the film layer, the mask plate 4 may be supported by the supporting structure 3.
As shown in fig. 5 and fig. 6, on the basis of the above structure of the display mother board, in this embodiment, the sub-substrate region 1 includes a display region 11 and a frame region 12 surrounding the display region 11, the sub-substrate region 1 further includes a binding region 13, and the binding region 13 is located outside the frame region 12; the binding region 13 includes a binding wiring region 130, a flexible wiring region 131, and a binding connection region 132; the binding wiring area 130 is adjacent to the frame area 12, and the flexible wiring area 131 and the binding connection area 132 are sequentially arranged away from the frame area 12; the supporting structure 3 is further disposed in the binding wiring region 130 and the flexible wiring region 131.
Before the protective film is finally attached to the display mother board, because a larger height difference exists between the area of the frame area 12 adjacent to the binding wiring area 130 and the display area in the middle of the substrate in the sub-substrate area1, and the area of the frame area 12 adjacent to the binding wiring area 130 only usually forms the inorganic encapsulation film 8 with larger fragility, the arrangement of the support structure 3 in the binding wiring area 130 and the flexible wiring area 131 can better reduce the height difference between the edge of the substrate in the sub-substrate area1 and the display area 11 in the middle of the substrate, so that when the protective film is attached to the substrate in the subsequent sub-substrate area1, even if the edge of the substrate in the sub-substrate area1 drops with particle dirt, because the top end of the support structure 3 is higher than the top end of the particle dirt, under the supporting action of the support structure 3, the pressing action force of the attached protective film cannot cause damage to the brittle inorganic encapsulation film 8 layer on the surface layer of the substrate by the particle dirt, thereby better ensuring the quality of the display motherboard.
Preferably, an end face of the support structure 3, which is located at an end far from the surface of the sub-substrate 1, is used to contact with the mask plate 4 to support the mask plate 4, and the mask plate 4 supported by the support structure 3 can contact with the surface of the sub-substrate 1. The supporting structure 3 is arranged, so that when a film layer is formed in the sub-substrate area1 by deposition of the mask plate 4, the mask plate 4 can be in contact with the surface of the substrate in the sub-substrate area1, namely, the distance between the mask plate 4 and the surface of the substrate in the sub-substrate area1 is 0, the difference between the distances between the middle area and the edge area of the mask plate 4 and the surface of the substrate in the sub-substrate area1 can be further reduced, and the narrow frame of the substrate in the sub-substrate area1 is further ensured; meanwhile, the supporting structure 3 can also prevent the mask plate 4 from damaging the substrate when contacting the substrate surface in the sub-substrate area 1.
Note that the distance between the mask plate 4 and the substrate surface in the sub-substrate region 1 may not be 0.
In this embodiment, the sub-substrate region 1 is provided with the organic encapsulation film 5, the first blocking dam 6 and the second blocking dam 7, the organic encapsulation film 5 is located in the display region 11, and the first blocking dam 6 and the second blocking dam 7 are located in the frame region 12; the first blocking dam 6 is arranged around the organic packaging film 5; the second blocking dam 7 is arranged around the periphery of the first blocking dam 6; wherein the first blocking dam 6 and the second blocking dam 7 serve to prevent an organic encapsulation film material from overflowing when the organic encapsulation film 5 is formed. The distance S between the second blocking dam 7 and the support structure 3 adjacent thereto is in the range of 100 to 1000 μm. This interval S scope ' S setting is favorable to further reducing relatively before the protective film of final laminating the difference in height between the display area 11 in the middle of the interior substrate edge of sub-substrate district 1 and the base plate to when the base plate in follow-up sub-substrate district 1 laminates the protective film, even the substrate edge in sub-substrate district 1 has dropped the granule filth, because bearing structure 3 ' S top is higher than the top of granule filth, under bearing structure 3 ' S supporting role, the pressing effort of laminating the protective film can not make the granule filth cause the damage to 8 layers of fragile inorganic encapsulation membrane on substrate top layer, and then has guaranteed the quality of this display mother board better.
In addition, a display structure is further disposed in the sub-substrate region 1, the display structure includes a TFT backplane and a light emitting device (OLED), the organic encapsulation film 5 and the inorganic encapsulation film 8 are used for encapsulating the light emitting device, in this embodiment, a film layer for encapsulating the light emitting device is a lamination of the inorganic encapsulation film 8, the organic encapsulation film 5 and the inorganic encapsulation film 8. Wherein, each inorganic packaging film 8 is formed by deposition of the mask plate 4.
Preferably, the height dimension of the support structure 3 is in the range of 3 to 20 μm. In this embodiment, since a plurality of inorganic encapsulation films 8 need to be sequentially formed in the sub-substrate region 1 of the display mother board, a plurality of support structures 3 with different heights are provided in this embodiment, and the support structures 3 with the height size range can sufficiently support the mask plate 4 when films (such as the inorganic encapsulation films 8) of the mask plate 4 need to be adopted at will in the deposition sub-substrate region 1, so that the distance difference between the middle area and the edge area of the mask plate 4 and the substrate surface in the sub-substrate region 1 is reduced, and the narrow frame of the substrate in the sub-substrate region 1 is ensured; meanwhile, the mask plate 4 can be prevented from drooping so as to prevent the mask plate from being locally contacted with the surface of the substrate in the sub-substrate area1 to damage the substrate; in addition, the height difference between the edge of the substrate and the display area in the middle of the substrate in the sub-substrate area1 before the protective film is finally attached can be relatively reduced, so that the pressing acting force of the attached protective film can not cause the damage of the particle dirt to the film layer on the surface layer of the substrate, and the quality of the display mother board is ensured.
Preferably, a pixel definition layer is further disposed in the sub-substrate region 1, and the support structure 3 and the pixel definition layer are made of the same material and disposed in the same layer. Therefore, the manufacturing process steps are not additionally added when the support structures 3 are manufactured, and the manufacturing cost of the display mother board is not additionally increased.
In this embodiment, as shown in fig. 4 and fig. 6, the number of the supporting structures 3 disposed in the spacing region 2, the binding wiring region 130, and the flexible wiring region 131 of the sub-substrate region 1 is plural, and the plural supporting structures 3 are uniformly distributed in each region. Therefore, the mask plate 4 can be supported in a balanced manner, and the distance difference between the middle area and the edge area of the mask plate 4 and the surface of the substrate in the sub-substrate area1 can be further reduced.
In this embodiment, the orthogonal projection shape of the support structure 3 on the surface of the sub-substrate region 1 is a circle. Of course, the orthographic shape of the support structure 3 may be other shapes such as a bar (as shown in fig. 7) or a square (as shown in fig. 8).
Based on the above structure configuration of the display mother board, the present embodiment further provides a manufacturing method of the display mother board, including forming a support structure in an interval region between adjacent sub-substrate regions.
In this embodiment, the method for manufacturing a display mother board further includes: and forming a supporting structure in the binding wiring area and the flexible wiring area of the sub-substrate area.
The support structure is made of a resin material such as polyimide by a patterning process, the patterning process comprises the process steps of material coating, exposure and development, and the patterning process is a traditional mature preparation process and is not described in detail.
Preferably, the preparation method comprises the following steps: the supporting structure and the pixel definition layer in the sub-substrate region are formed simultaneously by the same patterning process. Therefore, the preparation process step can not be additionally increased when the support structure is prepared and formed, and the preparation cost of the display mother board can not be additionally increased.
In this embodiment, after forming the support structure, the preparation method further includes: depositing to form an inner film layer of the sub-substrate area; the method comprises the following steps:
and transferring the display mother board substrate into a deposition chamber.
And dropping the display mother board substrate onto the deposition base station.
And adjusting the mask plate adopted for forming the film layer to an alignment position to perform alignment of the mask plate.
The mask plate is adjusted to a deposition position where it is brought into contact with the support structure.
In this step, the mask plate is brought into contact with the surface of the sub-substrate area at the deposition position. Compared with the existing method for performing film deposition at the alignment position after adjusting the mask plate to the alignment position, the film deposition method in the embodiment can further reduce the distance difference between the middle area and the edge area of the mask plate and the surface of the substrate in the sub-substrate area, and further ensure the narrow frame of the substrate in the sub-substrate area.
And depositing a film layer.
Advantageous effects of examples 1 to 2: in the display mother board provided in embodiment 1-2, by providing the support structure, a mask plate during deposition of the inner film layer of the sub-substrate region can be supported, so that a middle region of the mask plate is prevented from sagging under the action of gravity, a gap difference between the middle region and an edge region of the mask plate and the surface of the substrate in the sub-substrate region is reduced, and a narrow frame of the substrate in the sub-substrate region is ensured; meanwhile, the mask plate can be prevented from sagging so as to avoid damage to the substrate caused by local contact with the surface of the substrate in the sub-substrate area; in addition, the supporting structure can relatively reduce the height difference between the edge of the substrate in the sub-substrate area and the display area in the middle of the substrate before the protective film is finally attached, so that when the protective film is attached to the substrate in the subsequent sub-substrate area, even if particle dirt falls off from the edge of the substrate in the sub-substrate area, the top end of the supporting structure is higher than the top end of the particle dirt, under the supporting action of the supporting structure, the pressing action force of the attached protective film cannot cause damage to the film layer on the surface layer of the substrate, and the quality of the display mother board is ensured.
Example 3:
this embodiment provides a display substrate formed by cutting the display mother substrate of embodiment 1 or 2.
Through the display substrate formed after cutting the display mother board in embodiment 1 or 2, not only a narrow frame can be realized, but also damage to the film layer attached to the protective film in the display substrate when particle dirt falling into the edge region of the display substrate is attached to the protective film in the display substrate can be avoided, and the quality of the display substrate is ensured.
The display substrate may be a display substrate formed by cutting any display mother board before a film layer deposited by using a mask plate is formed (i.e., a display substrate formed with different film layers, which is a semi-finished product). The display substrate may also be a display substrate formed by cutting any display motherboard after a film layer deposited by using a mask plate is formed (i.e., a display substrate formed with different film layers, which is a semi-finished product or a finished product).
The display substrate provided by the invention can be any product or component with a display function, such as an OLED panel, an OLED television, a display, a mobile phone, a navigator and the like, and can also be a semi-finished product of the product or component with the display function.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (11)
1. A display mother board comprises a plurality of sub-substrate areas, and adjacent sub-substrate areas are mutually spaced, and the display mother board is characterized in that a support structure is arranged in a spacing area adjacent to the sub-substrate areas, and the support structure can support a mask plate when an inner film layer of the sub-substrate area is deposited;
the sub-substrate area comprises a display area and a frame area surrounding the display area, and further comprises a binding area positioned on the outer side of the frame area; the binding area comprises a binding wiring area, a flexible wiring area and a binding connection area; the binding wiring area is adjacent to the frame area, and the flexible wiring area and the binding connection area are sequentially arranged away from the frame area;
the supporting structure is further arranged in the binding wiring area and the flexible wiring area.
2. The display motherboard according to claim 1, wherein an end face of the support structure remote from the sub-substrate area surface is adapted to contact the mask plate to support the mask plate and to enable the mask plate supported by the support structure to contact the sub-substrate area surface.
3. The display mother substrate according to claim 1, wherein an organic encapsulation film, a first blocking dam, and a second blocking dam are disposed in the sub-substrate region, the organic encapsulation film being located in the display region, the first blocking dam and the second blocking dam being located in the frame region; the first blocking dam is arranged around the periphery of the organic packaging film in a surrounding mode; the second blocking dam is arranged around the periphery of the first blocking dam in an enclosing mode;
the distance between the second blocking dam and the support structure adjacent to the second blocking dam ranges from 100 to 1000 microns.
4. The display motherboard of claim 1, wherein the support structures have a height dimension in a range of 3-20 μm.
5. The display motherboard according to claim 1, wherein a pixel definition layer is further disposed in the sub-substrate region, and the support structure and the pixel definition layer are made of the same material and disposed in the same layer.
6. The display mother board according to claim 1, wherein the number of the supporting structures provided in the spacing region of the sub-substrate region, the bonding wiring region, and the flexible wiring region is plural, and the plural supporting structures are uniformly distributed in each region.
7. The display motherboard of claim 1, wherein an orthographic shape of the support structure on the face of the submount area comprises a bar, a square, or a circle.
8. A display substrate, wherein the display substrate is formed by cutting the display mother substrate according to any one of claims 1 to 7.
9. A method of manufacturing a display mother panel according to any one of claims 1 to 7, comprising forming support structures in spaced regions of adjacent sub-substrate regions;
further comprising: and forming the supporting structure in the binding wiring area and the flexible wiring area of the sub-substrate area.
10. The method for manufacturing a display mother substrate according to claim 9, wherein the display mother substrate is the display mother substrate according to claim 5, and the method includes: the supporting structure and the pixel definition layer in the sub-substrate region are formed simultaneously by adopting the same composition process.
11. The method of manufacturing a display mother panel according to claim 9, further comprising, after forming the support structure: depositing to form an inner film layer of the sub-substrate area;
the step of forming the film layer in the sub-substrate area by deposition comprises the following steps:
adjusting a mask plate adopted for forming the film layer to an alignment position to perform alignment of the mask plate;
adjusting the mask plate to a deposition position where the mask plate is in contact with the support structure; at the deposition position, the mask plate is in contact with the surface of the sub-substrate area;
and depositing the film layer.
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| CN201811278358.5A CN109449315B (en) | 2018-10-30 | 2018-10-30 | Display mother board, preparation method thereof and display substrate |
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| CN112376015A (en) * | 2020-11-09 | 2021-02-19 | 京东方科技集团股份有限公司 | Mask and manufacturing method thereof, display substrate and manufacturing method thereof |
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| KR101156432B1 (en) * | 2009-12-15 | 2012-06-18 | 삼성모바일디스플레이주식회사 | Mask frame assembly for thin layer deposition and organic light emitting display device |
| CN104166273A (en) * | 2014-06-26 | 2014-11-26 | 京东方科技集团股份有限公司 | Display substrate, display substrate mother board and display device |
| CN205556762U (en) * | 2016-05-05 | 2016-09-07 | 鄂尔多斯市源盛光电有限责任公司 | Mask plate, mother board, mask plate manufacture equipment and display substrates coating by vaporization system |
| CN108004503B (en) * | 2017-12-15 | 2021-01-19 | 京东方科技集团股份有限公司 | Mask plate, evaporation equipment and device |
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2018
- 2018-10-30 CN CN201811278358.5A patent/CN109449315B/en active Active
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