CN105679967B - Mask plate, the method for preparing organic light-emitting display device - Google Patents
Mask plate, the method for preparing organic light-emitting display device Download PDFInfo
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- CN105679967B CN105679967B CN201410659247.4A CN201410659247A CN105679967B CN 105679967 B CN105679967 B CN 105679967B CN 201410659247 A CN201410659247 A CN 201410659247A CN 105679967 B CN105679967 B CN 105679967B
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- mask plate
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Abstract
The present invention relates to a kind of mask plate, the methods for preparing organic light-emitting display device; the mask plate during organic light-emitting display device is prepared by evaporation process can contact conductor region, IC and FPC bondings region conducting terminal on form protective layer; in organic light-emitting display device production process guard electrode lead areas, IC and FPC bondings region conducting terminal from water oxygen corrode; so as to effectively improve the water resistant oxygen corrosion ability of organic light-emitting display device, and then improve the product reliability and product yield of organic light-emitting display device.
Description
Technical field
The present invention relates to field of photoelectric technology, and in particular to a kind of to be shown for the organic light emission with water resistant oxygen corrosion to be deposited
The mask plate of showing device and a kind of method for preparing organic light-emitting display device.
Background technology
As the display device of a new generation, organic light-emitting display device (English full name organic lighting
Emitting display, abbreviation OLED) advantage that has conventional display device incomparable, such as self-luminous do not need to backlight
Source, ultra-thin display and Flexible Displays can be achieved, driving voltage is low, reaction speed is fast etc..But it is produced in organic light-emitting display device
In the process, the aerial various terminals of exposure and lead are easily influenced by factors such as water, oxygen, oxidation, corrosion etc. occur
Bad phenomenon, the influence to the organic light-emitting display device service life are very big.
Chinese patent literature CN101162314A discloses a kind of display device, prepares it with mask plate and the display device
Preparation method, wherein the mask plate, which is used in, forms the photoetching workshop section of the netted insulating layer in display area, while also need to pass through
Wet etching or dry etch process etch netted layer pattern and antisitic defect figure.The mask plate is exposure mask
Plate, structure are chromium plating on quartz glass or soda glass, and the position of non-chromium plating can penetrate ultraviolet light；Therefore the mask plate is only suitable
For etching technics, structure design limit its can only guard electrode lead, for integrated circuit (IC) and flexible circuit board
(FPC) conducting terminal cannot play a protective role.In addition, forming antisitic defect pattern by lithography and etching technique, gone back after etching
It needs to be purged remaining photoresist, step is various, and process costs are high.
Invention content
The technical problems to be solved by the invention are integrated circuit and flexible circuitry in existing organic light-emitting display device
The problem of plate conducting terminal is easily corroded by water oxygen shows so as to provide a kind of organic light emission for having water resistant oxygen corrosion for vapor deposition
The mask plate of showing device carries out vapor deposition using the mask plate and prepares organic light-emitting display device, can be integrated circuit and
Flexible circuit board conducting terminal forms protective layer, the guard electrode lead, integrated in the production process of organic light-emitting display device
Circuit and flexible circuit board conducting terminal corrode from water oxygen, so as to effectively improve the water resistant oxygen corrosion of organic light-emitting display device
Ability, and then improve the product reliability and product yield of organic light-emitting display device.
In order to solve the above technical problems, the present invention is achieved by the following technical solutions：
A kind of mask plate of the present invention, the mask plate include blocked area and open region, open region packet
Include at least one of IC open areas, FPC open areas and lead open area；
The IC open areas are arranged on the corresponding position in IC bondings region of organic light-emitting display device；
The FPC open areas are arranged on the corresponding position in FPC bondings region of organic light-emitting display device；
The lead open area is arranged on the corresponding position in contact conductor region of organic light-emitting display device.
The open region further includes display area open region, and the display area open region is shown with being arranged on organic light emission
The display area position of showing device corresponds to.
A kind of method for preparing organic light-emitting display device of the present invention, includes the following steps：
S1, display area on substrate form Organic Light Emitting Diode, and in IC bondings region and/or FPC bondings area
Domain is respectively formed IC bondings terminal and FPC bonding terminals；
S2, the mask plate is covered in substrate described in step S1 close to the upper of the Organic Light Emitting Diode side
Side is respectively formed in IC bondings region and FPC bondings region by evaporation process and covers its corrosion-resistant conductive material layer.
The step S2 is further included：It is formed by the mask plate and evaporation process in display area and covers corrosion-resistant lead
Material layer.
The step S2 is further included：
Covering insulation is respectively formed on display area and/or contact conductor region by the mask plate and evaporation process
The step of material layer.
The insulating materials is one kind or wherein several in acrylic resin, polyester, fluorocarbon polymer or lithium fluoride
Mixture.
The insulation material layer is one or more layers in acrylic resin, polyester, fluorocarbon polymer or lithium fluoride
Stacked combination.
The corrosion-resistant conductive material is aluminium, gold, copper, zinc, one kind in silver or wherein several alloys.
The corrosion-resistant conductive material layer is one or more layers the stacked combination in aluminium, gold, copper, zinc, silver.
The above technical solution of the present invention has the following advantages over the prior art：
Mask plate provided by the invention can be in electrode by evaporation process during organic light-emitting display device is prepared
Lead areas, IC and FPC bondings region conducting terminal on form protective layer, protected in organic light-emitting display device production process
The conducting terminal in contact conductor region, IC and FPC bondings region is protected from water oxygen corrosion, so as to effectively improve organic light emitting display
The water resistant oxygen corrosion ability of device, and then improve the product reliability and product yield of organic light-emitting display device.
Description of the drawings
In order to make the content of the present invention more clearly understood, below in conjunction with the accompanying drawings, the present invention is made further detailed
Thin explanation, wherein,
Fig. 1 is the structure diagram of organic light-emitting display device described in embodiment 1；
Fig. 2 is the structure diagram of organic light-emitting display device described in embodiment 2；
Fig. 3 is the structure diagram of mask plate described in embodiment 1；
Fig. 4 is the structure diagram of another mask plate in embodiment 1；
Fig. 5 is the structure diagram of mask plate described in embodiment 2；
Fig. 6 is the structure diagram of another mask plate in embodiment 2.
Reference numeral is expressed as in figure：
1-substrate, 2-package substrate, 3-display area, 4-IC bondings region, 5-FPC bondings region, 6-electrode
Lead areas, 7-insulation material layer, 8-display area open region, 9-blocked area, 10-IC open regions, 11-FPC openings
Area, 12-lead open area.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with attached drawing to embodiment party of the present invention
Formula is described in further detail.
The present invention can be embodied in many different forms, and should not be construed as limited to embodiment set forth herein.
On the contrary, provide these embodiments so that the disclosure will be thorough and complete, and the design of the present invention will be fully conveyed to
Those skilled in the art, the present invention will only be defined by the appended claims.In the accompanying drawings, for clarity, Ceng He areas can be exaggerated
The size and relative size in domain.It should be understood that when element such as layer, region or substrate are referred to as " being formed in " or " setting
" another element " on " when, which can be arranged directly on another element or there may also be intermediary elements.
On the contrary, when element is referred to as on " being formed directly into " or " being set up directly on " another element, there is no intermediary elements.
Embodiment 1
As shown in figure 3, the present embodiment provides a kind of mask plate, the mask plate includes blocked area 9 and open region, described
Open region include：
IC open areas 10, the IC bondings region 4 that the IC open areas 10 are arranged on organic light-emitting display device correspond to
Position；
FPC open areas 11, the FPC bondings region 5 that the FPC open areas 11 are arranged on organic light-emitting display device are right
The position answered；
Display area open region 8, the display area open region 8 are arranged on the display area 3 of organic light-emitting display device
Corresponding position.
As shown in Figure 1, the present embodiment also provides a kind of organic light-emitting display device and preparation method thereof, the organic light emission
The preparation method of display device, includes the following steps：
S1, display area 3 on substrate 1 form Organic Light Emitting Diode, and in IC bondings region 4 and FPC bondings area
Domain 5 is respectively formed IC bondings terminal and FPC bonding terminals.
S2, the mask plate is covered in substrate 1 described in step S1 close to the upper of the Organic Light Emitting Diode side
Side is respectively formed in display area 3, IC bondings region 4 and FPC bondings region 5 by evaporation process and covers the corrosion-resistant of its and lead
Material layer (not shown)；Again in the encapsulation for having the setting covering display area 3 on corrosion-resistant conductive material layer
Substrate 2.
The corrosion-resistant conductive material layer material is selected from, but not limited to, aluminium, gold, copper, zinc, one kind of silver or wherein several
Alloy.
The corrosion-resistant conductive material layer can also be selected from, but not limited to, one or more layers heap of aluminium, gold, copper, zinc, silver
Stacked group is closed.
Corrosion-resistant conductive material layer described in the present embodiment is preferably layer gold.
As the convertible embodiment of the present invention, as shown in figure 4, the open area of the mask plate can also only include IC
Open area 10 and FPC open areas 11, can also achieve the object of the present invention, belong to the scope of protection of the present invention.
Embodiment 2
The present embodiment provides a kind of mask plate, as shown in figure 5, the mask plate includes blocked area 9 and open region, it is described
Open region include：
Display area open region 8, the display area open region 8 and the display area for being arranged on organic light-emitting display device
3 positions correspond to.
Lead open area 12, the lead open area 12 and the contact conductor area for being arranged on organic light-emitting display device
6 position of domain is corresponding.
The present embodiment also provides a kind of organic light-emitting display device and preparation method thereof, as shown in Fig. 2, the organic light emission
The preparation method of display device includes the following steps：
S1, display area 3 on substrate 1 form Organic Light Emitting Diode, and in IC bondings region 4, FPC bondings region
5 and contact conductor region 6 be respectively formed IC bondings terminal, FPC bondings terminal and contact conductor.
S2, the mask plate is covered in substrate 1 described in step S1 close to the Organic Light Emitting Diode side
Top is respectively formed on display area 3 and contact conductor region 6 by evaporation process and covers its (covering of insulation material layer 7
Insulation material layer on the display area 3 is not shown in figure)；Setting covering is described aobvious on the insulation material layer 7 again
Show the package substrate 2 in region 3.
The insulating materials is selected from, but not limited to, one kind in acrylic resin, polyester, fluorocarbon polymer or lithium fluoride
Or wherein several mixture.
The insulation material layer 7 is selected from, but not limited to, one in acrylic resin, polyester, fluorocarbon polymer or lithium fluoride
The stacked combination of layer or multilayer.Insulation material layer 7 described in the present embodiment be preferably stack gradually setting acrylate layer and
Layer of lithium fluoride.
As the convertible embodiment of the present invention, the mask plate can be with as shown in fig. 6, the open region of the mask plate
Domain only includes lead open area 12, can also achieve the object of the present invention, belong to the scope of protection of the present invention.
Obviously, the above embodiments are merely examples for clarifying the description, and is not intended to limit the embodiments.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
It changes.There is no necessity and possibility to exhaust all the enbodiments.And the obvious variation thus extended out or
Among changing still in the protection domain of the invention.
Claims (9)
1. a kind of mask plate, the mask plate includes blocked area (9) and open region, which is characterized in that the open region packet
Include at least one of IC open areas (10), FPC open areas (11) and lead open area (12)
The IC open areas (10) are arranged on the corresponding position in IC bondings region (4) of organic light-emitting display device, for
IC bondings region (4), which is formed, covers its corrosion-resistant conductive material layer；
The FPC open areas (11) are arranged on the corresponding position in FPC bondings region (5) of organic light-emitting display device, are used for
FPC bondings region (5), which is formed, covers its corrosion-resistant conductive material layer；
The lead open area (12) is arranged on the corresponding position in contact conductor region (6) of organic light-emitting display device.
2. mask plate according to claim 1, which is characterized in that the open region further includes display area open region
(8), the display area open region (8) is corresponding with display area (3) position for being arranged on organic light-emitting display device.
A kind of 3. method for preparing organic light-emitting display device, which is characterized in that include the following steps：
S1, the display area (3) on substrate (1) form Organic Light Emitting Diode, and in IC bondings region (4) and FPC bondings
Region (5) is respectively formed IC bondings terminal and FPC bonding terminals；
S2, the mask plate described in claims 1 or 2 is covered in substrate (1) described in step S1 close to the organic light emission
The top of diode side is respectively formed in IC bondings region (4) and/or FPC bondings region (5) by evaporation process and covers it
Corrosion-resistant conductive material layer.
4. the method according to claim 3 for preparing organic light-emitting display device, which is characterized in that the step S2 is also
Including：
Covering corrosion-resistant conductive material layer is formed in display area (3) by the mask plate and evaporation process.
5. the method according to claim 3 for preparing organic light-emitting display device, which is characterized in that the step S2 is also
Including：
It is exhausted that covering is respectively formed on display area (3) and/or contact conductor region (6) by the mask plate and evaporation process
The step of edge material layer.
6. the method according to claim 5 for preparing organic light-emitting display device, which is characterized in that the insulating materials is
One kind or wherein several mixtures in acrylic resin, polyester, fluorocarbon polymer or lithium fluoride.
7. the method according to claim 5 for preparing organic light-emitting display device, which is characterized in that the insulation material layer
For one or more layers the stacked combination in acrylic resin, polyester, fluorocarbon polymer or lithium fluoride.
8. according to any methods for preparing organic light-emitting display device of claim 3-7, which is characterized in that the corrosion resistant
Erosion conductive material is aluminium, gold, copper, zinc, one kind in silver or wherein several alloys.
9. according to any methods for preparing organic light-emitting display device of claim 3-7, which is characterized in that the corrosion resistant
Erosion conductive material layer is one or more layers the stacked combination in aluminium, gold, copper, zinc, silver.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410659247.4A CN105679967B (en) | 2014-11-18 | 2014-11-18 | Mask plate, the method for preparing organic light-emitting display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410659247.4A CN105679967B (en) | 2014-11-18 | 2014-11-18 | Mask plate, the method for preparing organic light-emitting display device |
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| Publication Number | Publication Date |
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| CN105679967A CN105679967A (en) | 2016-06-15 |
| CN105679967B true CN105679967B (en) | 2018-06-26 |
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| CN201410659247.4A Active CN105679967B (en) | 2014-11-18 | 2014-11-18 | Mask plate, the method for preparing organic light-emitting display device |
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Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106201145B (en) * | 2016-07-21 | 2018-10-30 | 京东方科技集团股份有限公司 | A kind of touch screen, its production method and display device |
| CN107689430A (en) * | 2017-09-06 | 2018-02-13 | 武汉华星光电半导体显示技术有限公司 | The preparation method and flexible OLED panel of flexible OLED panel |
| CN108004521A (en) | 2017-11-27 | 2018-05-08 | 武汉华星光电半导体显示技术有限公司 | Mask plate and film encapsulation method |
| CN108375595B (en) * | 2018-02-27 | 2020-09-01 | 北京工商大学 | Method for testing distribution of surface stress of metal workpiece along depth direction |
| WO2020181980A1 (en) * | 2019-03-08 | 2020-09-17 | 京东方科技集团股份有限公司 | Mask, display panel, and display device |
| CN110212091B (en) * | 2019-06-13 | 2023-09-15 | 京东方科技集团股份有限公司 | Evaporation mask plate, OLED display substrate, manufacturing method of OLED display substrate and display device |
| CN110571350A (en) * | 2019-08-14 | 2019-12-13 | 武汉华星光电半导体显示技术有限公司 | Display panel mother board, preparation method thereof and display panel |
| CN111399708A (en) * | 2020-04-07 | 2020-07-10 | 惠州易晖光电材料股份有限公司 | Electrode wiring structure of touch functional sheet and preparation method thereof |
| CN114574803A (en) * | 2022-02-28 | 2022-06-03 | 云谷（固安）科技有限公司 | Mask, display panel manufacturing method and display panel |
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| CN105679967A (en) | 2016-06-15 |
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