CN114574803A - Mask, display panel manufacturing method and display panel - Google Patents

Mask, display panel manufacturing method and display panel Download PDF

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Publication number
CN114574803A
CN114574803A CN202210186934.3A CN202210186934A CN114574803A CN 114574803 A CN114574803 A CN 114574803A CN 202210186934 A CN202210186934 A CN 202210186934A CN 114574803 A CN114574803 A CN 114574803A
Authority
CN
China
Prior art keywords
area
display
layer
mask
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210186934.3A
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Chinese (zh)
Inventor
赵栋
赵晶晶
许亚军
李金库
刘明星
王腾雨
李妍妍
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yungu Guan Technology Co Ltd
Original Assignee
Yungu Guan Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yungu Guan Technology Co Ltd filed Critical Yungu Guan Technology Co Ltd
Priority to CN202210186934.3A priority Critical patent/CN114574803A/en
Publication of CN114574803A publication Critical patent/CN114574803A/en
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Abstract

The embodiment of the application provides a mask, a display panel manufacturing method and a display panel. The first opening area corresponds to a display area of the display module, and the second opening area corresponds to a bonding area of the display module. Thus, when the film packaging layer of the display module is formed, the film packaging layer can be formed in the display area and the protective layer can be formed in the bonding area at the same time by using the mask plate with the first opening area and the second opening area. When the touch module is manufactured, the bonding area is protected from being etched through the protective layer without forming a touch buffer layer. Therefore, on one hand, the manufacturing process can be reduced, the material cost can be reduced, on the other hand, the weight of the mask can be reduced, and the boundary precision of the thin film packaging layer in the evaporation process can be improved.

Description

Mask plate, display panel manufacturing method and display panel
Technical Field
The application relates to the field of display equipment manufacturing, in particular to a mask, a display panel manufacturing method and a display panel.
Background
A display panel with a touch function generally includes a display module and a touch module. In the manufacturing process of such display panels, a display module having a display area and a bonding area is usually manufactured, and the bonding area is used for connecting with other circuits of the electronic device. Then, a Thin-Film Encapsulation (TFE) layer is formed in a display area of the display module, and then the touch module is manufactured on the TFE Encapsulation layer. The touch module at least comprises two metal layers and an insulating layer positioned between the metal layers. Because the metal layer needs to be patterned through an etching process, before the metal layer of the touch module is manufactured, a touch buffer layer covering the display area and the bonding area of the display module generally needs to be manufactured first, so that the metal contact exposed from the bonding area of the display module is prevented from being influenced when the metal layer of the touch module is etched. However, the existing display panel manufacturing engineering with the touch function has the problems of process redundancy, material waste and the like.
Disclosure of Invention
In order to solve the above technical problem, an embodiment of the present application provides a mask for manufacturing a thin film encapsulation layer of a display module, the mask includes:
a mask body;
the mask plate comprises a mask plate body, at least one first opening area and a second opening area, wherein the first opening area is arranged on the mask plate body and corresponds to a display area of a display module;
and the second opening area corresponds to the bonding area of the display module.
In a possible implementation manner, the mask includes a plurality of first opening regions, and each of the first opening regions exposes a display region of one of the display modules; the second opening area exposes bonding areas of the display modules;
preferably, the display module is located on a module substrate, and the module substrate comprises display modules arranged in multiple rows and multiple columns; the plurality of second opening areas are arranged in multiple rows, and each second opening area exposes at least two bonding areas of the display modules, which are positioned on the same row.
In one possible implementation, each row of the first open areas corresponds to at least two of the second open areas.
In a possible implementation manner, the bonding area of the display module includes a plurality of bonding contacts, and the second opening includes a plurality of sub-openings, and each sub-opening exposes at least one of the bonding contacts.
In a possible implementation manner, the area of the second opening area is not smaller than the area of the metal contact setting area in the bonding area.
In one possible implementation, there is a space between the first open area and the second open area.
In one possible implementation, the second open area is a full-scale open area.
Another object of the present application is to provide a method for manufacturing a display panel, the display panel including a display area and a bonding area, the method including:
forming a light emitting layer on the array substrate;
placing the mask provided by the application on one side of the light-emitting layer, which is far away from the array substrate;
evaporating a film packaging material from one side of the mask plate, which is far away from the light-emitting layer, so as to form a film packaging layer on a display area of the display panel and form a protective layer on the bonding area;
manufacturing a touch module on the thin film packaging layer;
and removing the protective layer on the bonding area.
In a possible implementation manner, the step of manufacturing the touch module on the thin film encapsulation layer includes:
manufacturing a first metal layer on the thin film packaging layer;
manufacturing an insulating layer on the first metal layer;
manufacturing a second metal layer on the insulating layer;
and manufacturing an optical transparent adhesive layer on the second metal layer.
Another object of the present application is to provide a display panel, which is manufactured by the method for manufacturing a display panel provided by the present application.
According to the mask, the display panel manufacturing method and the display panel, when the film packaging layer of the display module is formed, the mask with the first opening area and the second opening area is used, the film packaging layer can be formed in the display area, and meanwhile the protective layer is also formed in the bonding area. When the touch module is manufactured, the bonding area is protected from being etched through the protective layer without forming a touch buffer layer. Therefore, on one hand, the manufacturing process can be reduced, the material cost can be reduced, and the manufacturing efficiency of the display panel can be improved, on the other hand, the weight of the mask can be reduced, and the boundary precision of the thin film packaging layer in the evaporation process can be improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.
FIG. 1 is a schematic view of a display module for area division;
fig. 2 is a schematic view of a mask according to an embodiment of the present disclosure;
fig. 3 is a second schematic view of a mask provided in the present embodiment;
fig. 4 is a third schematic view of a mask according to an embodiment of the present disclosure;
FIG. 5 is a fourth schematic view of a mask provided in an embodiment of the present application;
fig. 6 is a fifth schematic view of a mask provided in the present embodiment;
FIG. 7 is a sixth schematic view of a mask according to an embodiment of the present disclosure;
fig. 8 is a flowchart illustrating a manufacturing method of a display panel according to an embodiment of the present disclosure.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present application, it should be noted that the terms "upper", "lower", and the like refer to orientations or positional relationships based on orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the application usually place when using, are only used for convenience of description and simplification of description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.
It should be noted that, in case of conflict, different features in the embodiments of the present application may be combined with each other.
The inventor of the present invention has found that the manufacturing process of some display panels with touch function generally includes a display module manufacturing process and a touch module manufacturing process. Referring to fig. 1, the display module may include a display area 210 and a bonding area 220, and the manufacturing process of the display module further includes a step of forming a thin film encapsulation layer covering the display area 210, and the display area 210 is protected by the thin film encapsulation layer. In the manufacturing process of the touch module, a touch buffer layer is first formed, and the bonding area 220 of the display module is prevented from being etched in the subsequent manufacturing process by the touch buffer layer. Moreover, the thin film encapsulation layer and the touch buffer layer may be made of the same material (e.g., silicon nitride SiN). The film structure of the same material needs to be manufactured by two devices in the whole manufacturing process of the display panel 200, which causes problems of redundant manufacturing processes and material cost waste.
In view of the above, the present embodiment provides a mask for evaporating a thin film encapsulation layer, through which a protective layer is formed in the bonding region 220 while a thin film encapsulation layer is formed in the display region 210 in a manufacturing process of a display module, so that a touch buffer layer does not need to be formed in a manufacturing process of a touch module. The scheme provided by the present embodiment is explained in detail below.
Referring to fig. 2, fig. 2 is a schematic view of a mask of the present embodiment, which may include a mask body 110, at least one first opening region 120 disposed on the mask body 110, and at least one second opening region 130 disposed on the mask body 110. The first opening area 120 corresponds to a display area 210 of the display module, and the second opening area 130 corresponds to a bonding area 220 of the display module. The bonding region 220 may be a region where the display module is bonded to a Flexible Printed Circuit (FPC) or an Integrated Circuit (IC) chip.
In the process of manufacturing the display module, the mask plate can be used for vapor deposition to form a thin film packaging layer of the display module. For example, the inorganic layer of the thin film encapsulation layer of silicon nitride SiN may be formed by Chemical Vapor Deposition (CVD).
Since the mask has the first opening region 120 and the second opening region 130, a protection layer may be formed in the bonding region 220 at the same time as the thin film encapsulation layer is formed in the display region 210 during an evaporation process. Therefore, in the subsequent manufacturing process of the touch module, a touch buffer layer is not required to be formed, and the protective layer of the bonding area 220 can protect the bonding area 220 from being etched during the manufacturing of the metal layer of the touch module.
Based on the above design, the mask provided in this embodiment is used in the process of manufacturing the display panel 200 with touch function, which can reduce the manufacturing process and reduce the material cost. On the other hand, the weight of the mask plate can be reduced, the evaporation shadow caused by the self-weight sag of the mask plate in the evaporation process is reduced, and the boundary precision of the thin film packaging layer in the evaporation process is improved.
In this embodiment, the bonding area 220 may include a metal contact arrangement area having exposed metal contacts, and the area of the second opening area 130 is not smaller than the area of the metal contact arrangement area in the bonding area 220. Therefore, when the evaporation film packaging material is used, the evaporation film packaging material can completely cover the metal contact setting area.
In some possible implementations, the second opening region 130 may be a full-scale opening region, so as to ensure that the protection layer formed by evaporation can closely cover the bonding region 220.
In one possible implementation manner, referring to fig. 2 again, the second opening 130 may expose the entire bonding area of the display module.
In other possible implementations, the bonding area of the display module includes a plurality of bonding contacts, referring to fig. 3, the second opening includes a plurality of sub openings 131, and each sub opening 131 exposes at least one bonding contact.
In some possible implementations, the display modules are located on a module substrate, and the module substrate includes display modules arranged in a plurality of rows and columns. Referring to fig. 4, the mask may include a plurality of first opening regions 120, each of the first opening regions 120 exposes a display region 210 of one of the display modules, and each of the second opening regions 130 exposes a bonding region 220 of one of the display modules.
In other possible implementations, the display modules are located on a module substrate, and the module substrate includes display modules arranged in a plurality of rows and columns. Referring to fig. 5, the mask may include a plurality of first opening regions 120, each of the first opening regions 120 exposes a display region 210 of one display module, and the second opening region 130 exposes bonding regions 220 of a plurality of display modules. Specifically, the plurality of second opening regions 130 are arranged in a plurality of rows, and each of the second opening regions 130 exposes bonding regions 220 of at least two display modules located in the same row.
Further, referring to fig. 6, when there are more display modules in the same row and the length of the second opening region 130 is longer, the mask body 110 between two adjacent rows of the second opening regions 130 may be displaced or deformed due to lack of support. Therefore, in the present embodiment, referring to fig. 7, each row of the first opening area 120 corresponds to at least two spaced apart second opening areas 130. Thus, a support region 111 is formed at the interval position of the second openings in the same row, which can reduce the displacement or deformation of the mask body 110 due to lack of support.
In a possible implementation manner, when the thin film encapsulation layer is formed by evaporation, it is required to ensure that the thin film encapsulation layer of the display area 210 has a clear boundary, and therefore, in this embodiment, there is a gap between the first opening area 120 and the second opening area 130, so that the thin film encapsulation layer of the display area 210 is not connected to the protection layer of the bonding area 220, and it is avoided that the boundary of the thin film encapsulation layer of the display area 210 needs to be further processed subsequently.
Based on the same inventive concept, the present embodiment further provides a method for manufacturing a display panel 200, where the display panel 200 may include a display area 210 and a integration circuit area 220, and referring to fig. 8, the method may include the following steps.
In step S110, a light emitting layer is formed on the array substrate.
In this embodiment, the display module may be manufactured first, the display module may be an OLED display module, and the display module may include an array substrate and a light emitting layer. Specifically, the display region 210 may include a layer structure of an array substrate, an anode layer, a hole injection layer, a hole transport layer, an electroluminescent material layer, an electron transport layer, an electron injection layer, a cathode layer, a capping layer, a lithium fluoride protective layer, and the like, which are sequentially stacked. The bonding area 220 may include exposed metal contacts. After the display module is formed, a thin film encapsulation layer needs to be manufactured for the display module through subsequent steps.
Step S120, the mask provided in this embodiment is disposed on a side of the light emitting layer away from the array substrate.
Step S130, performing evaporation of a thin film encapsulation material on the light emitting layer from a side of the mask plate away from the light emitting layer to form a thin film encapsulation layer on the display area 210 of the display panel and form a protection layer on the bonding area 220.
For example, in this embodiment, the light emitting layer may be subjected to evaporation of a thin film encapsulation material by chemical vapor deposition from a side of the mask plate away from the light emitting layer. Since the mask has the first opening region 120 and the second opening region 130, when evaporation is performed, a thin film encapsulation material may be simultaneously evaporated on the display region 210 and the bonding region 220, so as to form a thin film encapsulation layer on the display region 210 of the display panel and a protection layer on the bonding region 220. In the display region 210, the thin film encapsulation layer may cover the lithium fluoride protection layer; the protective layer may cover the metal contact placement area at the bonding area 220.
Step S140, a touch module is fabricated on the thin film encapsulation layer.
In this embodiment, since the bonding area 220 is already covered with the protection layer, when the touch module is manufactured, the metal layer can be directly manufactured based on the thin film encapsulation layer without manufacturing a touch buffer layer.
For example, a first metal layer (e.g., a first touch electrode layer) may be formed on the thin film encapsulation layer and patterned by etching, an insulating layer may be formed on the first metal layer, a second metal layer (e.g., a second touch electrode layer) may be formed on the insulating layer and patterned by etching, and an Optically Clear Adhesive (OCA) may be formed on the second metal layer.
Step S150, removing the protection layer on the bonding area 220.
After the touch film assembly is manufactured, the protective layer on the bonding area 220 may be removed, and the metal contact may be exposed again.
The present embodiment further provides a display panel 200, and the display panel 200 is manufactured by the manufacturing method of the display panel 200 provided in the present embodiment. The touch module of the display panel 200 may not have the touch buffer layer.
To sum up, the mask, the display panel manufacturing method and the display panel provided by the embodiment of the application can form the film packaging layer in the display area and simultaneously form the protective layer in the bonding area by using the mask with the first opening area and the second opening area when the film packaging layer of the display module is formed. When the touch module is manufactured, a touch buffer layer is not required to be formed, and the bonding area is protected from being etched through the protective layer. Therefore, on one hand, the manufacturing procedures can be reduced, the material cost can be reduced, on the other hand, the weight of the mask can be reduced, and the boundary precision of the thin film packaging layer in the evaporation process can be improved.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. The utility model provides a mask for make display module assembly's thin film encapsulation layer, the mask includes:
a mask body;
the mask plate comprises a mask plate body, at least one first opening area and a second opening area, wherein the first opening area is arranged on the mask plate body and corresponds to a display area of a display module;
and the second opening area corresponds to the bonding area of the display module.
2. The mask of claim 1, wherein the mask comprises a plurality of first opening regions, each of the first opening regions exposing a display area of one of the display modules; the second opening area exposes bonding areas of the display modules;
preferably, the display module is located on a module substrate, and the module substrate comprises display modules arranged in multiple rows and multiple columns; the plurality of second opening areas are arranged in multiple rows, and each second opening area exposes at least two bonding areas of the display modules, which are positioned on the same row.
3. The reticle of claim 2, wherein each row of the first open areas corresponds to at least two of the second open areas.
4. The reticle of claim 1, wherein the bonding area of the display module comprises a plurality of bonding contacts and the second opening comprises a plurality of sub-openings, each of the sub-openings exposing at least one of the bonding contacts.
5. The reticle of claim 1, wherein an area of the second open area is not less than an area of a metal contact placement area in the bonding area.
6. The reticle of claim 1, wherein a space exists between the first open area and the second open area.
7. The reticle of claim 1, wherein the second open area is a full-etch open area.
8. A method for manufacturing a display panel, wherein the display panel comprises a display area and a bonding area, the method comprising:
forming a light emitting layer on the array substrate;
placing the mask of any one of claims 1-7 on a side of the light-emitting layer away from the array substrate;
evaporating a film packaging material from one side of the mask plate, which is far away from the light-emitting layer, so as to form a film packaging layer on a display area of the display panel and form a protective layer on the bonding area;
manufacturing a touch module on the thin film packaging layer;
and removing the protective layer on the bonding area.
9. The method of claim 8, wherein the step of fabricating the touch module on the thin film encapsulation layer comprises:
manufacturing a first metal layer on the thin film packaging layer;
manufacturing an insulating layer on the first metal layer;
manufacturing a second metal layer on the insulating layer;
and manufacturing an optical transparent adhesive layer on the second metal layer.
10. A display panel produced by the display panel production method according to claim 8 or 9.
CN202210186934.3A 2022-02-28 2022-02-28 Mask, display panel manufacturing method and display panel Pending CN114574803A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210186934.3A CN114574803A (en) 2022-02-28 2022-02-28 Mask, display panel manufacturing method and display panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210186934.3A CN114574803A (en) 2022-02-28 2022-02-28 Mask, display panel manufacturing method and display panel

Publications (1)

Publication Number Publication Date
CN114574803A true CN114574803A (en) 2022-06-03

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Application Number Title Priority Date Filing Date
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105511221A (en) * 2016-01-05 2016-04-20 京东方科技集团股份有限公司 Film layer, preparation method of film layer, substrate and display device
CN105679967A (en) * 2014-11-18 2016-06-15 昆山国显光电有限公司 Mask plate and method for preparing organic light-emitting display device
CN109609902A (en) * 2018-10-26 2019-04-12 武汉华星光电半导体显示技术有限公司 A kind of mask plate and display panel packaging method
CN109616496A (en) * 2018-11-15 2019-04-12 武汉华星光电半导体显示技术有限公司 The production method of OLED touching display screen
CN110079763A (en) * 2019-05-15 2019-08-02 昆山维信诺科技有限公司 Mask plate and mask assembly
CN110212091A (en) * 2019-06-13 2019-09-06 京东方科技集团股份有限公司 Mask plate, oled display substrate and preparation method thereof, display device is deposited

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105679967A (en) * 2014-11-18 2016-06-15 昆山国显光电有限公司 Mask plate and method for preparing organic light-emitting display device
CN105511221A (en) * 2016-01-05 2016-04-20 京东方科技集团股份有限公司 Film layer, preparation method of film layer, substrate and display device
CN109609902A (en) * 2018-10-26 2019-04-12 武汉华星光电半导体显示技术有限公司 A kind of mask plate and display panel packaging method
CN109616496A (en) * 2018-11-15 2019-04-12 武汉华星光电半导体显示技术有限公司 The production method of OLED touching display screen
CN110079763A (en) * 2019-05-15 2019-08-02 昆山维信诺科技有限公司 Mask plate and mask assembly
CN110212091A (en) * 2019-06-13 2019-09-06 京东方科技集团股份有限公司 Mask plate, oled display substrate and preparation method thereof, display device is deposited

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