CN109801948B - Flexible display panel, preparation method thereof and flexible display device - Google Patents
Flexible display panel, preparation method thereof and flexible display device Download PDFInfo
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Abstract
The embodiment of the invention provides a flexible display panel, a preparation method thereof and a flexible display device, wherein the flexible display panel comprises: a display area and a package area; the display device further comprises a flexible substrate, wherein a display area and a packaging area are formed on the flexible substrate; a first metal layer extending from the display region to the encapsulation region; the inorganic film and/or the organic film layer comprises at least one first film layer positioned on the first metal layer, the first film layer extends from the display area to the packaging area, and the first film layer overhangs the first metal layer; and the second metal layer extends from the display area to the packaging area, and partially covers the first film layer. Through the overhang structure that sets up two-layer metal centre gripping first rete in the encapsulation region, flexible display panel can effectively prevent water oxygen erosion, produces the crack when preventing to form the perforating hole, improves flexible display device's life-span.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of display, in particular to a flexible display panel, a preparation method thereof and a flexible display device.
[ background of the invention ]
In recent years, the range of use of display devices has become more diversified. Since the display device has a slim outer profile and is lightweight, the range of use of the display device gradually widens. In particular, recently, display devices are used not only in monitors and mobile phones, but also in various types of apparatuses such as watches, clocks, shoes, clothes, and the like, and therefore, developers worldwide are actively researching various methods in terms of shape design of display devices.
[ summary of the invention ]
In view of this, embodiments of the present invention provide a flexible display panel, a manufacturing method thereof, and a flexible display device.
In one aspect, an embodiment of the present invention provides a display panel, where the display panel includes: a display area and a package area; the display panel further comprises a flexible substrate, and the display area and the encapsulation area are formed on the flexible substrate; a first metal layer extending from the display area to the encapsulation area; an inorganic film and/or an organic film layer, the inorganic film and/or the organic film layer including at least one first film layer on the first metal layer, the first film layer extending from the display region to the encapsulation region, the first film layer overhanging the first metal layer; a second metal layer extending from the display area to the encapsulation area, the second metal layer partially covering the first film layer.
Optionally, the flexible display panel includes a through hole penetrating through the flexible substrate, and the encapsulation region surrounds the through hole.
Optionally, the first metal layer and the second metal layer are formed of the same material.
Optionally, the thickness of the second metal layer is larger than that of the first metal layer.
Optionally, the first film layer has a first via hole on the first metal layer, the first via hole exposes the first metal layer, and the second metal layer covers the first via hole and is in contact with the first metal layer through the first via hole.
Optionally, a vertical projection of the first metal layer on the flexible substrate is a first projection, a vertical projection of the first via hole on the flexible substrate is a second projection, and the second projection falls within the first projection range.
Optionally, a vertical projection of the first film layer on the flexible substrate is a third projection, a vertical projection of the first metal layer on the flexible substrate is a first projection, and the first projection falls within a range of the third projection.
Optionally, a vertical projection of the second metal layer on the flexible substrate is a fourth projection, a vertical projection of the first film layer on the flexible substrate is a third projection, and the fourth projection falls within a range of the third projection.
Optionally, a vertical projection of the second metal layer on the flexible substrate is a fourth projection, a vertical projection of the first film layer on the flexible substrate is a third projection, and the fourth projection is overlapped with the third projection.
In another aspect, an embodiment of the present invention provides a flexible display device, which includes the flexible display panel described above.
In another aspect, an embodiment of the present invention provides a method for manufacturing a flexible display panel, where the method includes:
preparing a flexible substrate, wherein the flexible substrate comprises a display area and an encapsulation area; forming a first metal layer on the flexible substrate, the first metal layer extending from the display area to the encapsulation area; forming a first film layer on the first metal layer, the first film layer extending from the display area to the encapsulation area; forming a second metal layer on the first film layer, the second metal layer extending from the display area to the encapsulation area, the second metal layer partially covering the first film layer; and etching the second metal layer and the first metal layer simultaneously to form a structure that the first film layer overhangs the first metal layer.
Optionally, a through hole penetrating through the flexible substrate is formed on the flexible display panel.
Optionally, before the preparing the flexible substrate, a rigid substrate is further provided, and the flexible substrate is prepared on the rigid substrate.
Optionally, after the forming the through hole, the method further includes separating the rigid substrate and the flexible substrate.
According to the flexible display panel, the preparation method thereof and the flexible display device provided by the embodiment of the invention, the first film layer is arranged in the packaging area around the through hole penetrating through the flexible substrate and overhangs the first metal layer, and the second metal layer partially covers the structure of the first film layer, so that the stripping fault of the packaging area caused by the stripping and falling of the first film layer by etching liquid in the etching process is prevented, the problem that the service life of a light-emitting device in the flexible display panel is reduced because water vapor and oxygen enter the flexible display substrate through the stripping position of the packaging area is avoided, and the quality of the flexible display panel is improved.
Compared with the prior art, the manufacturing method of the flexible display panel provided by the invention does not add extra processes, and the beneficial effects of the manufacturing method of the flexible display panel provided by the technical scheme are the same as those of the flexible display panel provided by the technical scheme under the condition of not increasing the cost, and are not repeated herein.
Compared with the prior art, the beneficial effects of the flexible display device provided by the invention are the same as those of the flexible display panel provided by the technical scheme, and are not repeated herein.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a plan view of a flexible display panel according to an embodiment of the present invention
Fig. 2 is a plan view of the flexible display panel enlarged around a portion of the through hole H of fig. 1;
FIG. 3 is a cross-sectional view taken along line A-A' of FIG. 2 in one embodiment;
FIG. 4 is a sectional view taken along line A-A' of FIG. 2 in another embodiment;
FIG. 5 is a sectional view taken along line A-A' of FIG. 2 in a further embodiment;
FIG. 6 is a sectional view taken along line A-A' of FIG. 2 in a further embodiment;
fig. 7-11 illustrate a method for manufacturing a flexible display panel according to an embodiment of the present invention;
fig. 12 is a schematic view of a flexible display device according to an embodiment of the invention.
[ detailed description ] embodiments
For better understanding of the technical solutions of the present invention, the following detailed descriptions of the embodiments of the present invention are provided with reference to the accompanying drawings.
It should be understood that the described embodiments are only some embodiments of the invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terminology used in the embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the examples of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
It will be further understood that the terms including and/or comprising, as used herein, specify the presence of stated features or components, but do not preclude the presence or addition of one or more other features or components.
The dimensions of elements in the figures may be exaggerated or minimized for illustrative purposes. In other words, the sizes and thicknesses of the components in the drawings are arbitrarily shown for convenience of explanation, so the following embodiments are not limited thereto.
While certain embodiments may be implemented differently, certain process sequences may be executed differently than described. For example, two processes described consecutively may be performed substantially simultaneously or in reverse order to that described.
Example one
Referring to fig. 1 to 3, fig. 1 is a plan view illustrating a flexible display panel 1 according to an embodiment, fig. 2 is a plan view of the flexible display panel enlarged around a portion of a through hole H of fig. 1, and fig. 3 is a cross-sectional view taken along a line a-a' of fig. 2 in an embodiment. The flexible display panel 1 in this embodiment includes a display area PA and an encapsulation area NPA; the flexible display panel 1 further includes a flexible substrate 200, and a display area PA and an encapsulation area NPA are formed on the flexible substrate 200; a first metal layer 220 extending from the display area PA to the encapsulation area NPA; an inorganic film and/or an organic film layer including at least one first film layer 230 on the first metal layer 220, the first film layer 230 extending from the display area PA to the encapsulation area NPA, the first film layer 230 overhanging the first metal layer 220; the second metal layer 260 extends from the display area PA to the encapsulation area NPA, and the second metal layer 260 partially covers the first film layer 230.
The flexible substrate 200 is made of a flexible resin material, such as polyimide, polystyrene, polyethylene terephthalate, parylene, polyethersulfone, polyethylene naphthalate, and the like. According to an embodiment, the flexible substrate 200 may comprise an elastic material. For example, the flexible substrate 200 may include a material such as Polyimide (PI), which may be easily bent and bent or rolled, but this is merely exemplary, and the embodiment is not limited thereto.
The encapsulation area NPA is an area where no image is provided, and includes a first sub-encapsulation area NPA1 surrounding an outer edge of the display area PA and a second sub-encapsulation area NDA2 surrounding an outer edge of the through hole H.
The first metal layer 220 extends from the display area PA to the encapsulation area NPA, and at least one second film layer 210 is disposed between the first metal layer 220 and the flexible substrate 200, wherein the second film layer 210 and the first film layer 230 are part of the display film layer.
Specifically, in the flexible display panel provided in this embodiment, for example, a polysilicon TFT is provided, and a moisture barrier layer, a buffer layer, a semiconductor layer, a gate insulating layer, a gate layer, an interlayer insulating layer, a source drain layer, a passivation layer, an organic planarization layer, an anode layer, an organic light emitting layer, a cathode layer, and other film layers are sequentially disposed on a flexible substrate. In this embodiment, the first metal layer 220 is made of a metal material disposed on the same layer as the gate layer. Therefore, the first metal layer 220 is formed at the same time of forming the gate layer, and an additional process is not required. The at least one second film 210 in this embodiment includes a moisture barrier layer, a buffer layer, a semiconductor layer, a gate insulating layer, and other layers. Accordingly, the second metal layer 260 may be formed as a source/drain layer and a layer metal, and the first film layer 230 is an interlayer insulating layer. The second metal layer 260 is formed at the same time of forming the source/drain layer, and no additional process is required. The first film 230 overhangs the first metal layer 220, i.e. the first film 230 is formed on the first metal layer 220 but does not completely cover the first metal layer 220. It should be noted that, in the embodiment, the first metal layer 220 is formed in the same layer as the gate layer, and the second metal layer 260 is formed in the same layer as the source/drain layer. In other embodiments of the present invention, the first metal layer 220 may be formed by simultaneously forming other metal film layers such as a source/drain layer, and correspondingly, the second metal layer 260 is not limited to be formed simultaneously with the source/drain layer, and the corresponding first film layer 230 may be one or more of an inorganic film and/or an organic film layer.
In some embodiments, as shown in fig. 4, fig. 4 is a cross-sectional view taken along line a-a' of fig. 2 in another embodiment, wherein the first film layer 230 has a first via 2031 on the first metal layer 220, the first via 2301 exposes the first metal layer 220, the second metal layer 260 covers the first via 2301 and contacts the first metal layer 220 through the first via 2301, and a first thin film encapsulation layer 280 and a second thin film encapsulation layer 290 are formed on the second metal layer 260. In some embodiments, the first thin film encapsulation layer 280 is a single layer of inorganic material and the second encapsulation film layer 290 is multiple layers of inorganic and/or organic material. In some embodiments, the first metal layer 220 and the second metal layer 260 are made of the same material, and because the physical properties of the two layers of metals are the same, the first metal layer 220 and the second metal layer 260 can be combined together through the first via 2301, the edge of the second metal layer 260 is fixed on the display film layer, the first film layer 230 is sandwiched between the first metal layer 220 and the second metal layer 260 to form an "i" structure, when the "i" structure is formed through an etching process, the first film layer 230 can be sandwiched between the two layers of metals, because the metal layers have good ductility, the first film layer 230 can be prevented from being washed and peeled off by an etching solution, the protruding first film layer 230 forms an overhang structure, and it can be prevented that an organic material is evaporated to a position where the first film encapsulation layer 280 and the second film layer 210 contact when an organic material is subsequently evaporated, so that the first film encapsulation layer 280 and the second film layer 210 are sufficiently contacted, the adhesive force between the two film layers is increased, the edge reliability of film packaging is improved, the water and oxygen blocking capability of the flexible display panel 1 is further improved, and the display effect of the display device is ensured. The first thin film encapsulation layers 280 are formed on the upper and lower sides of the overhang structure formed by the first film layer 230, and the first encapsulation layers 280 formed between the overhang structure and the second film layer 210 are firmly clamped between the overhang structure and the second film layer 210 and are not easily peeled off. And because the adopted second metal layer 260 is made of a metal material, the second metal layer has good ductility, and is not easy to crack in the bending process, so that the edge crack of the flexible display panel 1 in the bending process is prevented. The second metal layer 260 is located in the encapsulation area NPA2, the metal material is opaque, and the encapsulation area is encapsulated by the opaque material, which does not affect the transmittance of the display device.
More specifically, the vertical projection of the first metal layer 220 on the flexible substrate 200 is a first projection, and the vertical projection of the first via 2301 on the flexible substrate 200 is a second projection, and the second projection falls within the first projection range. The contact holes of the first metal layer 220 and the second metal layer 260, the first via holes 2301 are arranged in the projection range of the first metal layer 220, so that the package area NPA space can be fully utilized, the package area NPA reserved space can be reduced, and the narrow frame of the flexible substrate can be facilitated.
The flexible substrate 200 includes a display area PA in which the pixel array 20 is disposed and an encapsulation area NPA. Each Pixel of the Pixel array 20 includes a Pixel circuit and a light emitting element, for example, an Organic Light Emitting Diode (OLED), electrically connected to the Pixel circuit, and each Pixel provides a predetermined image by using light emitted from the light emitting element. The pixel array 20 is sealed by a thin film encapsulation layer described below. The thin film encapsulation layer may be a multilayer including a layer including an organic material and a layer including an inorganic material.
The through hole H is located in the display area DA, and the second sub-encapsulation area NDA2 surrounds the through hole H. The through hole H is a hole passing through the flexible substrate 200, the thin film encapsulation layer, and various film layers disposed therebetween, and is located inside the display area PA and surrounded by the Pixel array 20 including a plurality of pixels.
The first sub-encapsulation area NPA1 may include a scan driver (not shown) and a data driver (not shown) for transmitting a predetermined signal to each Pixel of the display area PA. The second sub-encapsulation region NDA2 is disposed between the through hole H and the display region PA.
Although fig. 1 shows that the through hole H is located at the center of the display area DA of the flexible display panel 1, the embodiment is not limited thereto. The through holes H may be surrounded by the Pixel pixels and located in any position of the display area DA, and the specific position of the through holes H is not limited.
Although fig. 1 illustrates that the through-hole H is circular and formed with one through-hole H, the embodiment is not limited thereto. The through hole H may have various shapes such as a polygonal shape including a quadrangular shape or an elliptical shape. One or more through holes H may be formed.
Although fig. 1 shows that the display area DA is circular, the embodiment is not limited thereto. The display area DA may have various shapes such as a polygonal shape including a quadrangular shape or an elliptical shape, or a shape arbitrarily cut according to clothes, shoes, or the like.
Referring to fig. 2 and 3, the through-hole H is surrounded by the Pixel, and an area where the Pixel is not disposed (i.e., the second sub-encapsulation area NDA2) is located between the through-hole H and the Pixel.
In some embodiments, the perpendicular projection of the first film layer 230 on the flexible substrate 200 is a third projection, and the perpendicular projection of the first metal layer 220 on the flexible substrate 200 is a first projection, and the first projection falls within the third projection range. By arranging the overhang structure of the first metal layer 220 to support the first film layer 230, the OLED material can be prevented from being sputtered under the overhang structure of the first film layer 230 in the evaporation process, so that the subsequent film packaging layer can be conveniently contacted with the second film layer 210, and the packaging effect is ensured.
In some embodiments, the first film layer 230 entirely covers the display area PA to serve as a functional device when the display area PA displays an image. And the first film layer 230 extends from the display area PA to the encapsulation area NPA, covering the other areas except the first via 2301. It should be noted that the extension of the first film layer 230 from the display area PA to the package area NPA means that at least one first film layer 230 extends from the display area PA to the package area NPA, and not all first film layers 230 need to extend from the display area PA to the package area NPA.
As shown in fig. 3 and 4, a vertical projection of the second metal layer 260 on the flexible substrate 200 is a fourth projection, a vertical projection of the first film layer 230 on the flexible substrate 200 is a third projection, and the fourth projection falls within a range of the third projection. Due to the arrangement, the contact area between the film packaging layer and the first film layer 230 can be increased during subsequent packaging, and the film packaging layer and the first film layer 230 are both inorganic films and/or organic film layers, so that the adhesive force between the film packaging layer and the metal is better than that between the inorganic films and/or the organic film layers and the metal, the water and oxygen blocking capability of the flexible display panel 1 can be further improved, and the service life of the flexible display panel 1 is prolonged.
In some embodiments, as shown in fig. 5, fig. 5 is a cross-sectional view taken along line a-a' of fig. 2 in yet another embodiment, a perpendicular projection of the second metal layer 260 on the flexible substrate 200 is a fourth projection, and a perpendicular projection of the first film layer 230 on the flexible substrate 200 is a third projection, and the fourth projection coincides with the third projection. Such an arrangement of the second metal layer 260 completely covers the first film layer 230, because the metal has good ductility, such an arrangement can effectively protect the first film layer 230 from being peeled off in the subsequent processes, i.e. protect the first film layer 230 from being peeled off.
In some embodiments, as shown in fig. 6, fig. 6 is a cross-sectional view taken along line a-a' of fig. 2 in yet another embodiment, a plurality of loop-shaped first metal layers 220 or second metal layers 260 may be provided according to the area size of the second sub-encapsulation area NDA2, and the provision of the plurality of loop-shaped metal layers may also prevent cracks caused by impact generated during the process of forming the through-hole H from propagating toward the pixel P. The manner of disposing the plurality of annular first metal layers 220 or second metal layers 260 is not limited to that shown in the drawings, and the first film structure having two metal layers sandwiching the overhang should be considered as the protection scope of the present invention.
The invention also provides a method for manufacturing a flexible display panel, as shown in fig. 7-11, comprising the following steps:
s110: preparing a flexible substrate 200;
the flexible substrate comprises a display area and an encapsulation area.
S120: forming a first metal layer on a flexible substrate;
before forming the first metal layer 220, forming a second film layer 210 on the flexible substrate is further included. The second film 210 may include a moisture barrier layer, a buffer layer, a semiconductor layer, a gate insulating layer, and the like, and the preparation method thereof is the same as that of the films in the prior art, and is not described herein again. The first metal layer 220 extends from the display region to the package region, and the gate layer is formed at the same time as the first metal layer 220 is formed. Since the first metal layer 220 and the gate layer are disposed on the same layer in this embodiment, when the first metal layer 220 is prepared, a gate metal layer is physically deposited, and then the gate layer and the first metal layer 220 are etched by a wet etching method after exposure and development of a photoresist. It should be noted that this step is only described as an example of the manufacturing method of the flexible display panel shown in fig. 6, and in other embodiments of the present invention, when the first metal layer and the gate layer are changed, the specific steps for manufacturing the first metal layer 220 are slightly different. For example, when the flexible display panel is manufactured without the second film layer and with the gate layer, the gate layer and the first metal layer are directly manufactured on the flexible substrate 200; when the flexible display panel has no gate layer, the first metal layer is separately prepared on the flexible substrate or the second film layer.
S130: forming a first film layer 230 on the first metal layer 220;
the first film layer 230 extends from the display area to the encapsulation area, and the first film layer 230 includes film layers such as an interlayer insulating layer, and the preparation of these film layers is the same as the preparation method in the prior art, and is not described herein again. In other embodiments of the present invention, the forming method is slightly different according to the specific composition of the first film layer. A first via 2301 is formed on the first film layer 230, and the first via 2301 exposes the first metal layer 220.
S140: forming a second metal layer 260 on the first film layer 230;
the second metal layer 260 extends from the display area to the encapsulation area, the second metal layer 260 completely covers the first film layer 230, and the thickness of the second metal layer 260 is greater than that of the first metal layer 220.
S140: etching the second metal layer 260;
the second metal layer 260 is over-etched, and the first metal layer 220 is etched at the same time, so as to form a structure in which the first film layer 230 overhangs the first metal layer 220. In this embodiment, the thickness of the second metal layer 260 is greater than the thickness of the first metal layer 220, and when the second metal layer 260 is etched, a portion of the first metal layer 220 under the first film 230 is also etched to generate an overhang structure of the first film 230.
Further, the method for manufacturing the flexible display panel further comprises the steps of forming a through hole penetrating through the flexible substrate on the flexible display panel, and further forming the through hole in a laser cutting mode.
Wherein S110 further comprises providing a rigid substrate, and preparing a flexible substrate on the rigid substrate. Since the flexible substrate is bendable, in order to ensure that the flatness of the flexible substrate is maintained in the array process, it is necessary to form a composite substrate of a rigid substrate and a flexible substrate. The flexible substrate is usually formed on a rigid substrate, which may be a glass substrate or a quartz substrate, and a layer of the flexible substrate is formed on the rigid substrate by a spin coating method or a deposition method. The flexible substrate includes a display area and an encapsulation area.
Further, the method may further include, after the forming of the through hole, separating the rigid substrate and the flexible substrate. After the rigid substrate is separated, the flexible display panel is formed. Generally, the separation process can adopt physical cutting, laser cutting or chemical solution corrosion separation. In the manufacturing process, a plurality of display panels are generally manufactured on one large mother board, and in the cutting process, the display panels may be cut first and then the rigid substrate and the flexible substrate may be separated, or the rigid substrate and the flexible substrate may be separated first and then the display panels may be cut.
As shown in fig. 12, fig. 12 is a schematic structural diagram of a flexible display device provided in an embodiment of the present invention, where the display device includes the flexible display panel 200 and a through hole disposed on the flexible display panel 200. The specific structure of the flexible display panel 200 has been described in detail in the above embodiments, and is not described herein again. Of course, the display device shown in fig. 12 is only a schematic illustration, and the display device may be any electronic device having a display function, such as a mobile phone, a tablet computer, a notebook computer, an electronic book, a watch, a clock, a wearable garment, a shoe, or a television.
Because the flexible display device provided by the embodiment of the invention comprises the flexible display panel, the flexible display device can effectively prevent water and oxygen erosion by arranging the structure that the two layers of metal clamp the first film layer around the through hole, prevent cracks from being generated when the through hole is formed and prolong the service life of the flexible display device.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (12)
1. A flexible display panel comprising: a display area and a package area;
the flexible display panel further comprises a flexible display panel,
a flexible substrate on which the display region and the encapsulation region are formed;
a first metal layer extending from the display area to the encapsulation area;
an inorganic film and/or an organic film layer, the inorganic film and/or the organic film layer including at least one first film layer on the first metal layer, the first film layer extending from the display region to the encapsulation region, the first film layer overhanging the first metal layer;
a second metal layer extending from the display area to the encapsulation area, the second metal layer partially covering the first film layer;
the flexible display panel comprises a through hole penetrating through the flexible substrate, and the packaging area surrounds the through hole.
2. The flexible display panel of claim 1, wherein the first metal layer and the second metal layer are formed of the same material.
3. The flexible display panel of claim 2, wherein the second metal layer is thicker than the first metal layer.
4. The flexible display panel of claim 1, wherein the first film layer has a first via on the first metal layer, the first via exposing the first metal layer, and the second metal layer covers the first via and is in contact with the first metal layer through the first via.
5. The flexible display panel of claim 4, wherein a vertical projection of the first metal layer on the flexible substrate is a first projection, and a vertical projection of the first via on the flexible substrate is a second projection, and the second projection falls within the first projection range.
6. The flexible display panel of claim 1, wherein a vertical projection of the first film layer on the flexible substrate is a third projection, and wherein a vertical projection of the first metal layer on the flexible substrate is a first projection, and wherein the first projection falls within the third projection.
7. The flexible display panel of claim 1, wherein a vertical projection of the second metal layer on the flexible substrate is a fourth projection, a vertical projection of the first film layer on the flexible substrate is a third projection, and the fourth projection falls within the third projection range.
8. The flexible display panel of claim 1, wherein a vertical projection of the second metal layer on the flexible substrate is a fourth projection, a vertical projection of the first film layer on the flexible substrate is a third projection, and the fourth projection coincides with the third projection.
9. A method for manufacturing a flexible display panel includes:
preparing a flexible substrate, wherein the flexible substrate comprises a display area and an encapsulation area;
forming a through hole penetrating through the flexible substrate on the flexible display panel;
forming a first metal layer on the flexible substrate, the first metal layer extending from the display area to the encapsulation area;
forming a first film layer on the first metal layer, the first film layer extending from the display area to the encapsulation area;
forming a second metal layer on the first film layer, the second metal layer extending from the display area to the encapsulation area, the second metal layer partially covering the first film layer;
and etching the second metal layer and the first metal layer simultaneously to form a structure that the first film layer overhangs the first metal layer.
10. The method according to claim 9, further comprising, before the preparing the flexible substrate:
providing a rigid substrate;
preparing the flexible substrate on the rigid substrate.
11. The method according to claim 10, further comprising, after forming the through-hole:
separating the rigid substrate from the flexible substrate.
12. A flexible display device comprising the flexible display panel according to any one of claims 1 to 8.
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| CN113644105A (en) * | 2021-08-11 | 2021-11-12 | 苏州清越光电科技股份有限公司 | Lead structure of display panel, preparation method of lead structure and display panel |
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| CN108538907B (en) * | 2018-06-28 | 2021-01-05 | 武汉天马微电子有限公司 | Organic light emitting display panel and organic light emitting display device |
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