CN109378408B - Flexible OLED device preparation method, flexible OLED device and display device - Google Patents
Flexible OLED device preparation method, flexible OLED device and display device Download PDFInfo
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- CN109378408B CN109378408B CN201811186771.9A CN201811186771A CN109378408B CN 109378408 B CN109378408 B CN 109378408B CN 201811186771 A CN201811186771 A CN 201811186771A CN 109378408 B CN109378408 B CN 109378408B
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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Abstract
The invention provides a preparation method of a flexible OLED device, the flexible OLED device and a display device, wherein the preparation method comprises the following steps: providing a flexible substrate; sequentially forming an anode, a pixel spacing layer and a cathode isolation column in a display area of the flexible substrate; forming a low surface energy coating on a binding region of a flexible substrate; sequentially forming an organic material layer and a cathode in a display area of a flexible substrate; packaging the flexible rear cover on the flexible substrate; and cutting the part of the flexible rear cover corresponding to the binding area to form a large device. According to the preparation method, deviation between the hollow part and the binding area caused by inaccurate alignment in the process of packaging the flexible rear cover is avoided, the flexible rear cover can well cover the display area of the flexible substrate in the manufactured large-piece device, and the binding area can be completely exposed, so that the finally obtained flexible OLED device is high in packaging precision.
Description
Technical Field
The invention relates to the technical field of display, in particular to a flexible OLED device, a preparation method of the flexible OLED device and a display device.
Background
With the development of display technology, the requirements for color and lightness are higher and higher, and flexible OLED (Organic Light-Emitting Diode) displays are gradually entering the consumer electronics markets such as mobile devices and televisions.
In the method for manufacturing the flexible OLED product by using the water vapor barrier film as the flexible rear cover and in the surface-mount manner, the water vapor barrier film 10 corresponding to the binding region of the flexible substrate is cut (as shown in the left diagram in fig. 1 a), the hollow part 101 corresponding to the binding region is cut, and then the cut water vapor barrier film 10 is attached to the flexible substrate 20, so that the display region 201 of the flexible substrate 20 is covered by the cut water vapor barrier film 10, and the binding region 202 is exposed. However, when the conventional packaging and bonding device packages the flexible substrate in the above manner, the requirement on alignment accuracy cannot be met (as shown in fig. 1 b), so that the moisture barrier film cannot well cover the display area, and the reliability of the OLED product is affected.
Disclosure of Invention
In view of this, the present invention provides a method for manufacturing a flexible OLED device, and a display device, so as to solve the technical problem that a moisture barrier film cannot cover a display area well in the existing method for manufacturing a flexible OLED device.
In a first aspect, an embodiment of the present invention provides a method for manufacturing a flexible OLED device, including:
providing a flexible substrate, wherein the flexible substrate comprises a display area and a binding area;
sequentially forming an anode, an auxiliary metal, a pixel spacing layer and a cathode isolation column in a display area of the flexible substrate;
forming a low surface energy coating on a bonding region of the flexible substrate;
sequentially forming an organic material layer and a cathode in a display area of the flexible substrate, wherein the organic material layer is positioned on one side of the anode, which is far away from the flexible substrate, and is filled between pixel blocks in the pixel spacing layer;
packaging a flexible rear cover on the flexible substrate, wherein the part of the flexible rear cover corresponding to the binding region is attached to the low surface energy coating;
and cutting the part of the flexible rear cover corresponding to the binding region to form a large device.
With reference to the first aspect, an embodiment of the present invention provides a first possible implementation manner of the first aspect, where the method further includes:
removing the low surface energy coating in the binding region of the large device by a dry etching process;
performing device cutting on the large device to form a plurality of single devices;
and carrying out a crimping process on the binding region of the single device to form the flexible OLED device.
With reference to the first aspect, an embodiment of the present invention provides a second possible implementation manner of the first aspect, where removing the low surface energy coating in the bonding region of the large device by using a dry etching process includes:
and carrying out dry etching on the low surface energy coating in the binding region of the large device by using plasma to remove the low surface energy coating.
With reference to the first aspect, an embodiment of the present invention provides a third possible implementation manner of the first aspect, where forming a low surface energy coating on a bonding area of the flexible substrate includes:
shielding an area outside the binding area of the flexible substrate by using a mask plate;
coating a low surface energy material on the binding region through a spraying process or an evaporation process;
and curing the low surface energy material to form the low surface energy coating.
In combination with the first aspect, an embodiment of the present invention provides a fourth possible implementation manner of the first aspect, wherein the material of the low surface energy coating is a fluorine-containing organic substance or a fluorine-containing inorganic substance.
In combination with the first aspect, the present examples provide a fifth possible implementation manner of the first aspect, wherein the low surface energy coating has a water contact angle of not less than 90 degrees.
With reference to the first aspect, an embodiment of the present invention provides a sixth possible implementation manner of the first aspect, where before sequentially forming an organic material layer and a cathode in a display area of the flexible substrate, the method further includes:
and carrying out vacuum plasma treatment or atmospheric plasma treatment on the region outside the binding region of the flexible substrate.
With reference to the first aspect, an embodiment of the present invention provides a seventh possible implementation manner of the first aspect, where cutting a portion of the flexible rear cover corresponding to the binding region includes:
and cutting the part of the flexible rear cover corresponding to the binding region by a laser cutting process.
In a second aspect, an embodiment of the present invention further provides a flexible OLED device, where the flexible OLED device is prepared by using the method for preparing a flexible OLED device in the first aspect.
In a third aspect, an embodiment of the present invention further provides a display apparatus, including the flexible OLED device described in the second aspect.
The embodiment of the invention has the following beneficial effects:
in the preparation method of the flexible OLED device in the embodiment of the application, a flexible substrate comprising a display area and a binding area is provided, then an anode, an auxiliary metal, a pixel spacing layer and a cathode isolation column are sequentially formed in the display area of the flexible substrate, a low-surface-energy coating is further formed in the binding area of the flexible substrate, then an organic material layer and a cathode are sequentially formed in the display area of the flexible substrate, a flexible rear cover is further packaged on the flexible substrate, and finally the part, corresponding to the binding area, of the flexible rear cover is cut to form a large-piece device. According to the above description, in the preparation method, the low surface energy coating is formed in the binding region of the flexible substrate, so that the flexible rear cover can be packaged on the flexible substrate, and then the part of the flexible rear cover corresponding to the binding region is cut, and in the process of cutting the flexible rear cover (the water vapor barrier film), the low surface energy coating can ensure that the device structure in the binding region is not damaged.
Compared with the traditional preparation method (the hollow part corresponding to the binding area is cut on the flexible rear cover, and then the cut flexible rear cover is used for packaging the flexible substrate), the preparation method provided by the embodiment of the application avoids deviation between the hollow part and the binding area caused by inaccurate alignment when the flexible rear cover is packaged, and in the manufactured large-piece device, the flexible rear cover can well cover the display area of the flexible substrate, and the binding area can be completely exposed, so that the finally obtained flexible OLED device is high in packaging precision, and the technical problem that the existing flexible OLED device water vapor barrier film cannot well cover the display area is solved.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1a is a schematic diagram of a conventional method for manufacturing a flexible OLED device by surface mounting;
FIG. 1b is a schematic diagram illustrating a conventional flexible rear cover and a flexible substrate after being packaged and deflected;
fig. 2 to fig. 6 are schematic diagrams of stages in a method for manufacturing a flexible OLED device according to an embodiment of the present invention;
FIG. 7 is a schematic front view of a single device provided by an embodiment of the present invention;
FIG. 8 is a schematic side view of a single device provided by an embodiment of the present invention;
fig. 9 is a schematic diagram corresponding to step S218 in the method for manufacturing a flexible OLED device according to the embodiment of the invention.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The technical solutions in the present disclosure will be clearly and completely described below with reference to the accompanying drawings in the present disclosure. It is to be understood that the described embodiments are merely a subset of the disclosed embodiments and not all embodiments. The components of the present disclosure, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present disclosure, presented in the figures, is not intended to limit the scope of the claimed disclosure, but is merely representative of selected embodiments of the disclosure. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the disclosure without making creative efforts, shall fall within the protection scope of the disclosure.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
At present, when a surface mount method is adopted to prepare a flexible OLED device, a flexible substrate is provided, the flexible substrate includes a display area and a binding area, then an anode, an auxiliary metal, a pixel spacing layer and a cathode isolation column are sequentially formed in the display area of the flexible substrate, an organic material layer and a cathode are sequentially formed in the display area of the flexible substrate, a flexible rear cover corresponding to the binding area of the flexible substrate is further cut (as shown in a left figure in fig. 1 a), and finally the cut flexible rear cover is packaged on the flexible substrate, so that the display area of the flexible substrate is covered by the cut flexible rear cover, and the binding area is completely exposed.
However, the inventor finds that when the cut flexible rear cover is packaged on the flexible substrate, it is difficult to completely cover the display area of the flexible substrate with the cut flexible rear cover, and the bonding area is completely exposed, so that the device obtained by final packaging has a poor packaging effect, and the attachment size cannot meet the requirement of precision.
In order to solve the problems, the embodiment of the application provides a preparation method of a flexible OLED device, and the flexible OLED device obtained by the preparation method is good in packaging effect and high in precision.
For the convenience of understanding the present embodiment, a method for manufacturing a flexible OLED device disclosed in the embodiments of the present invention will be described in detail first.
The embodiment of the invention provides a preparation method of a flexible OLED device, which comprises the following steps:
step S202, as shown in fig. 2, providing a flexible substrate 20, where the flexible substrate 20 includes a display area 201 and a binding area 202;
in the embodiment of the present invention, the flexible substrate 20 may be made of an organic polymer material, which may be polyimide. In addition, the flexible substrate 20 includes a display region 201 and a bonding region 202, and specifically, the bonding region 202 includes a COG bonding region or a FOG bonding region.
It should be noted that, the flexible substrate 20 not only has the display area 201 and the bonding area 202, but also has a circle of non-display area on the periphery of the display area 201, and the non-display area is used for the layout of metal traces, that is, the following forming area of the auxiliary metal, and the non-display area is not explicitly indicated in the drawing.
In step S204, as shown in fig. 3, an anode 203, an auxiliary metal, a pixel spacer layer 204, and a cathode isolation column 205 are sequentially formed in the display region 201 of the flexible substrate 20 (only a partial cross-sectional view of the flexible substrate 20 is shown in the figure).
The anode 203 is firstly fabricated in the display region 201 of the flexible substrate 20, specifically, a layer of ITO (or other transparent conductive material) is formed on one side of the flexible substrate, then a layer of photoresist is coated on the ITO, a pattern of the anode is formed by using a mask plate composition process through steps of exposure, development, etching and the like, and finally the remaining photoresist is removed to form the anode 203.
Then, the auxiliary metal is formed in the non-display region. The anode electrode may have a portion located in a non-display region where an auxiliary metal (not shown) is formed in parallel with the anode electrode, thereby reducing the resistance of the anode electrode.
Then, the pixel spacer layer 204 is formed on the side of the flexible substrate 20 where the anode 203 is formed. Specifically, an insulating layer is formed on the flexible substrate, and the insulating layer itself can be made of a photosensitive material (e.g., a positive photoresist or a negative photoresist, so that the insulating layer can be directly exposed and developed to form the pattern of the pixel spacer layer 204.
The cathode spacer 205 is further fabricated on the pixel block of the pixel spacer layer 204. Specifically, an insulating layer is formed on the flexible substrate, and the insulating layer may also be made of a photosensitive material (e.g., a negative photoresist), and the pattern of the cathode isolation pillar 205 may be formed by directly exposing, baking after exposure (PEB), and developing the insulating layer.
At this point, an anode 203, a pixel spacer layer 204, and a cathode isolation column 205 may be formed in the display region 201 of the flexible substrate 20.
Step S206, forming a low surface energy coating on the binding region 202 of the flexible substrate 20;
specifically, the purpose of forming the low surface energy coating is to reduce the adhesion between the flexible rear cover in the binding region and the flexible substrate 20, so that after the flexible rear cover 10 corresponding to the binding region 202 is subsequently cut, the flexible rear cover 10 is very easy to peel off, the glue layer of the flexible rear cover 10 does not pull the PI film of the flexible substrate 20, and the flexible substrate 20 is prevented from being damaged.
The process of forming the low surface energy coating is described in detail below.
Step S206, forming a low surface energy coating on the bonding region 202 of the flexible substrate 20, includes the following steps:
step S2061, shielding a region of the flexible substrate 20 other than the binding region 202 with a mask plate;
step S2062, coating a low surface energy material on the binding region 202 by a spraying process or an evaporation process;
in embodiments of the present invention, the material of the low surface energy coating (i.e., the low surface energy material) is a fluorine-containing organic or inorganic. In particular, the silicon-fluorine-containing organic compound or inorganic compound is an organic compound or an inorganic compound which takes silicon and fluorine as basic components.
Step S2063, the low surface energy material is solidified to form the low surface energy coating.
In the curing, UV curing (i.e., ultraviolet curing) or thermal curing is performed according to the characteristics of the low surface energy material to form a low surface energy coating layer.
In addition, after the low surface energy coating is formed, the water contact angle of the low surface energy coating is not less than 90 degrees, so that after the flexible rear cover 10 is attached (i.e., encapsulated), in the area where the low surface energy coating is applied, the flexible rear cover 10 can be easily peeled off after being cut without damaging the underlying flexible substrate 20.
In other embodiments, the low surface energy coating layer may be formed by using other materials satisfying the above surface energy condition and by using corresponding preparation processes according to the material characteristics.
In step S208, as shown in fig. 4, an organic material layer 206 and a cathode 207 are sequentially formed in the display region 201 of the flexible substrate 20.
Wherein, the organic material layer 206 is located on the side of the anode 203 far away from the flexible substrate 20 and filled between the pixel blocks in the pixel spacing layer 204, and the cathode 207 covers the organic material layer 206 and the surface of the cathode isolation column 205. Specifically, the organic material layer 206 may exist in two forms: in this embodiment, the mask covers all of the pixel spacing layers 204, and the organic material layer 206 is only filled between the pixel blocks in the pixel spacing layers 204. In other embodiments, the mask may not cover the pixel spacer layer, and the organic material layer is formed at all positions of the display region.
Specifically, the organic material layer 206 and the cathode 207 may be sequentially formed by an evaporation process. As can be seen from the figure, the organic material layer 206 is a multi-layer structure including a hole injection layer, a hole transport layer, an electron injection layer, and the like.
As a preferable scheme, before the organic material layer 206 and the cathode 207 are sequentially formed in the display region 201 of the flexible substrate 20, the preparation method further includes: the region of the flexible substrate 20 other than the bonding region 202 is subjected to vacuum plasma processing or atmospheric plasma processing.
Specifically, the binding region 202 of the flexible substrate 20 is shielded by a mask, and then a region other than the binding region 202 of the flexible substrate 20 is subjected to vacuum plasma treatment or atmospheric plasma treatment to increase the work function of the anode 203. After the vacuum plasma treatment or the atmospheric plasma treatment is completed, the evaporation of the organic material layer 206 and the evaporation of the cathode 207 (i.e., the formation of the organic material layer 206 and the cathode 207) need to be performed within several hours (the specific time period depends on the actual requirements of the product), and the time period is set to prevent the anode 203 region from being contaminated again after the time period is too long, so that the effect of improving the work function of the anode is lost.
In step S210, as shown in fig. 5, the flexible rear cover 10 is encapsulated on the flexible substrate 20.
Wherein the portion of the flexible rear cover 10 corresponding to the bonded region 202 is affixed to the low surface energy coating.
In the embodiment of the present invention, the flexible rear cover 10 is embodied as a moisture barrier film, and the flexible rear cover 10 is the flexible rear cover 10 having the water absorbent glue layer 208. The moisture barrier film is to insulate oxygen and water from affecting the display lifetime of the flexible OLED device.
The flexible rear cover 10 can completely cover the flexible substrate 20 and can be attached to the flexible substrate 20.
In step S212, as shown in fig. 6, the portion of the flexible rear cover 10 corresponding to the binding region 202 is cut to form a large device 30.
Specifically, the portion of the flexible rear cover 10 corresponding to the binding region 202 is cut through a laser cutting process. In this process, the low surface energy coating can reduce the adhesion between the flexible rear cover 10 and the flexible substrate 20, so that the flexible rear cover 10 can be easily peeled off after being cut without damaging the underlying flexible substrate 20.
After the flexible rear cover 10 is encapsulated on the flexible substrate 20, the flexible rear cover 10 corresponding to the binding region 202 is cut such that the binding region 202 is completely exposed and the display region 201 is completely covered by the flexible rear cover 10.
In the preparation method of the flexible OLED device in the embodiment of the application, a flexible substrate 20 including a display area 201 and a binding area 202 is provided, then an anode 203, an auxiliary metal, a pixel spacing layer 204 and a cathode isolation column 205 are sequentially formed in the display area 201 of the flexible substrate 20, a low surface energy coating is formed in the binding area 202 of the flexible substrate 20, an organic material layer 206 and a cathode are sequentially formed in the display area 201 of the flexible substrate 20, the flexible rear cover 10 is further encapsulated on the flexible substrate 20, and finally the portion of the flexible rear cover 10 corresponding to the binding area 202 is cut to form a large-sized device 30. As can be seen from the above description, in the preparation method, the low surface energy coating is formed in the binding region 202 of the flexible substrate 20, so that the flexible rear cover 10 can be packaged on the flexible substrate 20, and then the portion of the flexible rear cover 10 corresponding to the binding region 202 is cut, and in the process of cutting the flexible rear cover 10 (the water vapor barrier film), the low surface energy coating can ensure that the device structure in the binding region is not damaged.
Compared with the conventional preparation method (firstly, a hollow part corresponding to the binding region 202 is cut on the flexible rear cover 10, and then the cut flexible rear cover 10 encapsulates the flexible substrate 20), the preparation method provided by the embodiment of the application avoids deviation between the hollow part and the binding region 202 caused by inaccurate alignment when the flexible rear cover 10 is encapsulated, and in the manufactured large-sized device, the flexible rear cover 10 can well cover the display region 201 of the flexible substrate 20, and the binding region 202 can be completely exposed, so that the finally obtained flexible OLED device has high encapsulation precision, and the technical problem that the existing flexible OLED device water vapor barrier film cannot well cover the display region 201 is solved.
Further, after step S212, the method for manufacturing a flexible OLED device further includes the steps of:
in step S214, the low surface energy coating in the bonding region 202 of the large device 30 is removed by a dry etching process.
After cutting the flexible back cover 10 corresponding to the bonding region 202, the low surface energy coating of the bonding region 202 is further removed by a dry etching process.
Specifically, the low surface energy coating in the bonding region 202 of the large device 30 is dry etched by using plasma to remove the low surface energy coating.
In step S216, as shown in fig. 7 and 8, device dicing is performed on the large sheet of devices 30 to form a plurality of individual devices 40.
Specifically, the large-scale device 30 includes a plurality of individual devices 40, each individual device 40 includes a display area 201 and a bonding area 202, and when the device is cut, the device is cut according to the composition of the individual device 40 to obtain a plurality of individual devices 40.
It should be noted that, in each single device 40, a circle of non-display area is further provided at the periphery of the display area 201, the non-display area is used for the layout of metal traces, and is shown and identified in the figure, and finally, the non-display area is also covered with a flexible back cover, that is, except for the binding area 202, the other areas need to have the package attachment of the flexible back cover 10.
In step S218, as shown in fig. 9, the bonding area 202 of the single device 40 is subjected to a crimping process to form the flexible OLED device 50.
After obtaining the plurality of individual devices 40, the bonding area 202 of each individual device 40 is subjected to a crimping process to form the flexible OLED device 50. The crimping process specifically refers to a process of crimping an IC (integrated Circuit) 209 or an FPC (Flexible Printed Circuit) 210 and a single device 40 together through an Anisotropic Conductive Film (ACF).
Specifically, the crimping process includes a COG crimping process and a FOG crimping process, and only the COG crimping process is shown in fig. 9, which includes an IC crimping process and an FPC crimping process.
The following is a specific comparison between the prior art and the present invention:
when a flexible OLED device is prepared in the existing surface-mount method, firstly, a flexible rear cover 10 corresponding to a binding area of a flexible substrate is cut, and a hollow part 101 corresponding to the binding area is cut, wherein a primary deviation is generated in the cutting process;
then, attaching the cut flexible rear cover 10 to the flexible substrate 20, so that the cut flexible rear cover 10 covers the display area 201 of the flexible substrate 20, and the binding area 202 is exposed to form a large device, and a primary deviation is generated in the attaching process;
finally, the formed large piece of device is subjected to cell cutting to obtain a plurality of single devices, and the process of obtaining the plurality of single devices by cutting also generates deviation. Moreover, the three deviations are accumulated continuously, so that a serious dislocation exists between the flexible rear cover 10 and the flexible substrate 20 in the finally obtained flexible OLED device, the reliability of the flexible OLED device is affected, and the precision requirement of industrial manufacturing is difficult to meet.
In the invention, the flexible substrate 20 is firstly attached and packaged by the flexible rear cover 10, the process has no deviation, then the flexible rear cover 10 corresponding to the binding region is cut to form a large-scale device, and the cutting process has one-time deviation; finally, the formed large piece of device is subjected to cell cutting to obtain a plurality of single devices, and the process of obtaining the plurality of single devices by cutting also generates deviation. However, the two deviations cannot be accumulated, so that the packaging effect between the flexible rear cover 10 and the flexible substrate 20 in the finally obtained flexible OLED device is better, and the attaching size completely meets the precision requirement of industrial manufacturing.
The preparation method of the flexible OLED device provided by the invention solves the problem of poor manufacturing process of the flexible OLED device, and ensures the attaching size of the flexible rear cover 10 after final packaging, thereby improving the reliability of the flexible OLED device.
The embodiment of the invention also provides a flexible OLED device, and the flexible OLED device is prepared by adopting the preparation method of the flexible OLED device in the embodiment.
The embodiment of the invention also provides a display device which comprises the flexible OLED device in the embodiment.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (9)
1. A preparation method of a flexible OLED device is characterized by comprising the following steps:
providing a flexible substrate, wherein the flexible substrate comprises a display area and a binding area;
sequentially forming an anode, an auxiliary metal, a pixel spacing layer and a cathode isolation column in a display area of the flexible substrate;
forming a low surface energy coating on a bonding region of the flexible substrate;
sequentially forming an organic material layer and a cathode in a display area of the flexible substrate, wherein the organic material layer is positioned on one side of the anode, which is far away from the flexible substrate, and is filled between pixel blocks in the pixel spacing layer;
packaging a flexible rear cover on the flexible substrate, wherein the part of the flexible rear cover corresponding to the binding region is attached to the low surface energy coating;
cutting the part of the flexible rear cover corresponding to the binding region to form a large device;
removing the low surface energy coating in the binding region of the large device by a dry etching process;
performing device cutting on the large device to form a plurality of single devices;
and carrying out a crimping process on the binding region of the single device to form the flexible OLED device.
2. The method of claim 1, wherein removing the low surface energy coating in the bonding region of the bulk device by a dry etching process comprises:
and carrying out dry etching on the low surface energy coating in the binding region of the large device by using plasma to remove the low surface energy coating.
3. The method of claim 1, wherein forming a low surface energy coating on the bonding region of the flexible substrate comprises:
shielding an area outside the binding area of the flexible substrate by using a mask plate;
coating a low surface energy material on the binding region through a spraying process or an evaporation process;
and curing the low surface energy material to form the low surface energy coating.
4. The method for preparing the low surface energy coating of claim 1, wherein the material of the low surface energy coating is fluorine-containing organic matter or fluorine-containing inorganic matter.
5. The method of claim 1, wherein the low surface energy coating has a water contact angle of not less than 90 degrees.
6. The method according to claim 1, further comprising, before the sequentially forming the organic material layer and the cathode electrode in the display region of the flexible substrate:
and carrying out vacuum plasma treatment or atmospheric plasma treatment on the region outside the binding region of the flexible substrate.
7. The method for preparing according to claim 1, wherein cutting the portion of the flexible rear cover corresponding to the binding region comprises:
and cutting the part of the flexible rear cover corresponding to the binding region by a laser cutting process.
8. A flexible OLED device, characterized in that it is manufactured using the flexible OLED device manufacturing method of any one of claims 1-7.
9. A display device comprising the flexible OLED device of claim 8.
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| CN102222684B (en) * | 2011-06-30 | 2013-08-07 | 信利半导体有限公司 | Organic electroluminescent display and manufacture method thereof |
| KR20150096995A (en) * | 2014-02-17 | 2015-08-26 | 호서대학교 산학협력단 | OLED providing controllable color |
| CN204088386U (en) * | 2014-06-25 | 2015-01-07 | 京东方科技集团股份有限公司 | OLED display device, non-contact IC card and flexible display apparatus |
| CN104538420A (en) * | 2014-12-12 | 2015-04-22 | 深圳市华星光电技术有限公司 | Flexible oled display device and manufacturing method thereof |
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