CN109830619B - Manufacturing method of flexible display device and flexible display device - Google Patents
Manufacturing method of flexible display device and flexible display device Download PDFInfo
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Abstract
The embodiment of the invention provides a manufacturing method of a flexible display device and the flexible display device, and relates to the field of manufacturing of display equipment. According to the invention, through improvement of the coating pattern of the packaging adhesive, the packaging adhesive is uniformly widened after the flexible rear cover is attached to the flexible display device array to be packaged, and independent and closed tiny spaces can be formed between adjacent flexible display devices, so that the air impact phenomenon is effectively prevented, and the manufacturing yield of the flexible display devices is improved.
Description
Technical Field
The invention relates to the field of display equipment manufacturing, in particular to a manufacturing method of a flexible display device and the flexible display device.
Background
In the process of manufacturing a flexible PM-OLED (Passive-Matrix Organic Light-Emitting Diode), since a packaging adhesive (such as a UV adhesive) and a desiccant need to be coated first and then packaged and attached, the packaging adhesive and the desiccant will expand during the packaging and attaching process, and in addition, an inert gas needs to be injected into the packaging cavity during the attaching process to enable the flexible rear cover to be attached to the substrate more tightly, so that the packaging adhesive frame at the attaching edge needs to bear a certain degree of pressure change inside and outside the packaging cavity, and the pressure change causes the expansion of the packaging adhesive frame to cause a phenomenon of gas burst (air burst), so that the PM-OLED fails at the final packaging stage.
Disclosure of Invention
In view of the above, the present invention provides a method for manufacturing a flexible display device and a flexible display device, which can effectively solve the above problems.
In one aspect, a preferred embodiment of the present invention provides a method for manufacturing a flexible display device, including:
providing a flexible rear cover and a flexible display device array to be packaged, wherein the flexible display device array comprises a plurality of display units arranged in an array and binding (binding) areas provided with low surface energy coatings, each binding area comprises a plurality of binding units arranged at intervals, and each binding unit is arranged corresponding to one display unit;
coating packaging glue on the flexible rear cover to form a packaging glue layer, wherein the packaging glue layer comprises a plurality of first glue lines arranged along a first direction and a plurality of second glue lines arranged along a second direction; the first glue lines and the second glue lines are intersected to form a plurality of first pattern areas and a plurality of second pattern areas which are arranged in an array;
attaching the flexible rear cover to the flexible display device array to be packaged through the packaging adhesive layer, so that each binding unit is located in a first pattern area and each display unit is located in a second pattern area;
and cutting off the part of the flexible rear cover corresponding to the binding region, and removing the low surface energy coating of the binding region.
Optionally, when the flexible rear cover is attached to the array of the to-be-packaged flexible display device through the packaging adhesive layer, the plurality of first pattern areas are arranged in an array to form a plurality of rows of first pattern areas, the plurality of second pattern areas are arranged in an array to form a plurality of rows of second pattern areas, the plurality of rows of first pattern areas and the plurality of rows of second pattern areas are alternately arranged at intervals, and only one second adhesive line is arranged between two adjacent rows of display units.
Optionally, the step of coating an encapsulation adhesive on the flexible rear cover to form an encapsulation adhesive layer includes:
shielding a partial area of the flexible rear cover by using a first mask plate;
and coating packaging glue at the position of the flexible rear cover which is not shielded by the mask plate to form the packaging glue layer.
Optionally, the manufacturing step of the flexible display device array to be packaged includes:
providing a flexible substrate, wherein the flexible substrate comprises a display area and a binding area;
sequentially manufacturing and forming an anode, auxiliary metal, a pixel spacing layer and a cathode isolation column in a display area of the flexible substrate;
manufacturing and forming a low surface energy coating in a binding region of the flexible substrate;
and sequentially manufacturing and forming an organic material layer and a cathode in a display area of the flexible substrate to obtain the flexible display device array to be packaged, wherein the organic material layer is positioned on one side of the anode, which is far away from the flexible substrate, and is filled between pixel blocks in the pixel spacing layer.
Optionally, the step of forming a low surface energy coating on the bonding region of the flexible substrate includes:
shielding an area outside the binding area on the flexible substrate by using a second mask plate;
coating a low surface energy material on the binding region through a spraying process or an evaporation process;
and curing the low-surface-energy material to form the low-surface-energy coating.
Optionally, the low surface energy coating has a water contact angle of 100 degrees or greater.
Optionally, the step of removing the low surface energy coating of the binding region comprises:
dry etching the low surface energy coating of the binding region with plasma to remove the low surface energy coating;
and cleaning the binding region from which the low-surface-energy coating is removed by using plasma, so that the water contact angle of the cleaned binding region is less than or equal to 20 degrees.
Optionally, before the step of attaching the flexible rear cover to the flexible display device array to be encapsulated through the encapsulation adhesive layer, the method further includes:
and coating a water vapor adsorption material for water vapor adsorption in each second pattern area to form a water vapor adsorption layer.
Optionally, the method further comprises:
and carrying out device cutting on the packaged flexible display device array to form a plurality of independent flexible display devices, and processing a binding unit of each flexible display device by using a crimping process, wherein each flexible display device comprises a display unit and a binding unit.
On the other hand, the embodiment of the invention also provides a flexible display device, which is manufactured by adopting the manufacturing method of the flexible display device.
Compared with the prior art, in the manufacturing method of the flexible display device and the flexible display device provided by the invention, the packaging adhesive is uniformly widened after the flexible rear cover is attached to the flexible display device array to be packaged through improving the coating pattern of the packaging adhesive, and independent and closed tiny spaces can be formed between adjacent flexible display devices, so that the air impact phenomenon in the attaching and packaging processes is effectively prevented, and the manufacturing yield of the flexible display device is improved.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a top view of a flexible rear cover provided by an embodiment of the present invention.
Fig. 2 is a top view of an array of flexible display devices to be encapsulated according to an embodiment of the present invention.
Fig. 3 is a schematic cross-sectional structure diagram of an array of flexible display devices to be packaged according to an embodiment of the present invention.
Fig. 4 is another top view of an array of flexible display devices to be packaged according to an embodiment of the present invention.
Fig. 5 is a top view of a flexible rear cover coated with an encapsulating adhesive layer according to an embodiment of the invention.
Fig. 6 is a top view of a prior art flexible back cover coated with an encapsulating adhesive layer.
Fig. 7 is a top view of a flexible back cover coated with an encapsulating glue layer and a moisture adsorbing layer according to an embodiment of the invention.
Fig. 8 is a schematic cross-sectional structure diagram of an array of packaged flexible display devices according to an embodiment of the present invention.
Fig. 9 is a perspective view of a part of the structure in the packaged flexible display device array provided by the embodiment of the invention.
Fig. 10 is a perspective view of the flexible display device array shown in fig. 9 with a portion of the flexible back cover removed.
Fig. 11 is a top view of an encapsulated flexible display device according to an embodiment of the present invention.
Fig. 12 is a schematic structural diagram of another viewing angle of the packaged flexible display device according to the embodiment of the present invention.
Fig. 13 is a schematic structural diagram of the encapsulated flexible display device shown in fig. 8 when undergoing a crimping process.
Icon: 10-an array of flexible display devices; 11-a flexible rear cover; 110-packaging adhesive layer; 1100-a first glue line; 1101-a second glue line; 1102 — a first pattern region; 1103-a second pattern area; 12-a flexible display device; 120-a flexible substrate; 121-anode; 122-pixel spacer layer; 123-cathode separation column; 124-organic material layer; 125-cathode; 13-a display unit; 14-a binding region; 140-a binding unit; 15-low surface energy coating; 16-a water vapor adsorption layer; 17-a printed circuit board; 18-integrated circuit.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures. In the description of the invention, the terms first, second, third, fourth, etc. are used only for distinguishing between descriptions and are not intended to be construed as limiting or implying only relative importance.
In the description of the present invention, unless otherwise expressly specified or limited, the terms "disposed," "connected," and "connected" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The embodiment of the invention provides a method for manufacturing a flexible display device, which aims to solve the problem of air impact when PM-OLED and other flexible display devices are manufactured in the prior art, and in detail, the method for manufacturing the flexible display device comprises the following steps:
step S1, providing a flexible rear cover 11 (as shown in fig. 1) and a flexible display device array 10 (as shown in fig. 2) to be packaged, where the flexible display device array 10 includes a plurality of display units 13 arranged in an array and a bonding region 14 provided with a low surface energy coating 15, each bonding region 14 includes a plurality of bonding units 140 arranged at intervals, and each bonding unit 140 is arranged corresponding to one display unit 13.
In this embodiment, the flexible rear cover 11 is used to insulate oxygen, water, and the like, so as to prolong the service life of the flexible display device 12. Optionally, the flexible rear cover 11 may be, but not limited to, a moisture barrier film, and in practical implementation, the flexible rear cover 11 may also be made of a material having a water-absorbent glue layer, so as to further prolong the service life of the flexible display device 12.
In addition, referring to fig. 2 again, the flexible display device array 10 is a large device including a plurality of flexible display devices 12, and in practical implementation, the flexible display device array 10 to be packaged which is packaged is cut to form the individual flexible display devices 12. Each binding unit 140 in the binding region 14 may be a cog (chinp on glass) binding unit or a fog (film on glass) binding unit. As an embodiment, the present embodiment describes a manufacturing process of the flexible display device array 10 to be packaged in combination with the following steps S11-S14 and fig. 3 and 4, which are described in detail as follows.
Step S11, providing a flexible substrate 120, where the flexible substrate 120 includes a display area and a bonding area 14.
The flexible substrate 120 may be made of, but not limited to, an organic polymer material such as polyimide. In practical implementation, the flexible substrate 120 may include not only the display region and the bonding region 14, but also a non-display region disposed at the periphery of the display region, where the non-display region is used for laying metal traces (such as auxiliary metal).
In step S12, an anode 121, an auxiliary metal, a pixel spacer 122, and a cathode isolation pillar 123 are sequentially formed in the display region of the flexible substrate 120.
First, as shown in fig. 3, a conductive material layer, such as an ITO (Indium Tin oxide) material layer, is formed on one side of the flexible substrate 120, a layer of photoresist is coated on one side of the conductive material layer away from the flexible substrate 120, a pattern of the anode 121 is formed through exposure, development, etching and other process steps by using a mask patterning process, and finally, the remaining photoresist is removed, so that the anode 121 shown in fig. 3 can be formed. It should be noted that the cross-sectional view shown in fig. 3 is only a cross-sectional view of a part of the structure of the flexible display device array 10 to be packaged.
Next, the auxiliary metal is formed in the non-display area, and it should be noted that, when the auxiliary metal is formed, since a part of the anode 121 is located in the non-display area, the auxiliary metal formed in the non-display area is connected in parallel with the anode 121, so that the impedance of the anode 121 can be effectively reduced.
Next, an insulating layer, which may be made of a photosensitive material such as a positive photoresist or a negative photoresist, is formed on the flexible substrate 120, and the pixel spacing layer 122 shown in fig. 3 is formed by exposing and developing the insulating layer.
Finally, an insulating layer is formed on the flexible substrate 120, the insulating layer may also be made of a photosensitive material such as a positive photoresist or a negative photoresist, and the insulating layer is exposed, baked and developed to form the cathode isolation pillar 123 shown in fig. 3.
In step S13, a low surface energy coating 15 is formed on the bonding region 14 of the flexible substrate 120.
In this embodiment, referring to fig. 4, the low surface energy coating 15 is used to reduce an adhesive force between the flexible substrate 120 and the flexible rear cover 11 when packaging and attaching are performed, so that when a portion of the flexible rear cover 11 corresponding to the bonding region 14 is cut and peeled, a glue layer on the flexible rear cover 11 does not pull a PI film on the flexible substrate 120, so as to ensure that the flexible rear cover 11 is easily peeled, and avoid damage to the flexible substrate 120. Alternatively, the low surface energy coating 15 may be made of a fluorine-containing compound, such as a fluorine-containing organic substance or a fluorine-containing inorganic substance.
In practice, the process of manufacturing the low surface energy coating 15 may include: shielding the region outside the binding region 14 on the flexible substrate 120 by using a second mask plate; coating a low surface energy material on the bonding region 14 by a spray coating process or an evaporation process; the low surface energy material is cured to form the low surface energy coating 15. When the coated low surface energy coating 15 is cured, a corresponding curing method, such as thermal curing or UV curing, may be selected according to the material characteristics of the low surface energy material, and this embodiment is not described herein again.
In addition, in order to further reduce the adhesion between the low surface energy coating 15 and the flexible rear cover 11, the water contact angle of the low surface energy coating 15 may be 100 degrees or more.
Step S14, sequentially forming an organic material layer 124 and a cathode 125 in the display area of the flexible substrate 120 to obtain the flexible display device array 10 to be packaged, wherein the organic material layer 124 is located on the side of the anode 121 away from the flexible substrate 120 and is filled between the pixel blocks in the pixel spacing layer 122.
Specifically, in this embodiment, except that the organic material layer 124 shown in fig. 3 may be filled between the pixel spacing layers 122, the organic material layer 124 may also completely cover the display region, which is not described herein again. In practical implementation, the organic material layer 124 may have a multi-layer structure as shown in fig. 3, and the organic material layer 124 may include an electron injection layer, a hole injection layer, and the like.
In addition, as shown in fig. 3, the cathode 125 is disposed on a side of the organic material layer 124 and the cathode isolation pillar 123 away from the flexible substrate 120. In practice, the preparation of the cathode 125 can be realized by, but not limited to, an evaporation process.
It should be noted that, before the preparation of the organic material layer 124 and the cathode 125 in step S14, the region outside the binding region 14 and the low surface energy coating layer 15 may be masked by a mask, and the unmasked region may be treated by plasma or atmospheric plasma to increase the work function of the anode 121. In addition, after the processing by the vacuum plasma or the atmospheric plasma, the fabrication of the organic material layer 124 and the cathode 125 needs to be performed within a preset time period (the specific time period may be determined according to the actual requirement of the product, such as 4 hours, etc.), so as to prevent the area for fabricating the organic material layer 124 and the cathode 125 from being contaminated again, and reduce the work function of the anode 121.
Step S2, applying a packaging adhesive on the flexible rear cover 11 to form a packaging adhesive layer 110.
In this embodiment, the encapsulation adhesive layer 110 described in step S2 may be made of, but not limited to, UV adhesive. In addition, when the encapsulating adhesive layer 110 is coated, a suitable coating manner may be selected according to parameter requirements of a product, for example, a first mask may be used to shield a partial region of the flexible rear cover 11, and then the encapsulating adhesive layer 110 may be formed by coating the encapsulating adhesive at a position where the flexible rear cover 11 is not shielded by the mask, or for example, the encapsulating adhesive layer 110 may be formed by directly coating the encapsulating adhesive on the flexible rear cover 11.
In detail, as shown in fig. 5, in the present embodiment, the encapsulation adhesive layer 110 may include a plurality of first adhesive lines 1100 arranged along a first direction and a plurality of second adhesive lines 1101 arranged along a second direction; the first glue lines 1100 and the second glue lines 1101 intersect to form a plurality of first pattern areas 1102 and a plurality of second pattern areas 1103 arranged in an array. It should be noted that, in practical implementation, the position relationship between the first glue line 1100 and the second glue line 1101 may be, but is not limited to, that shown in fig. 5, and may be specifically designed according to a specific result of the flexible display device array 10 to be packaged, and this embodiment is not described herein again.
It can be understood that, as shown in fig. 6, the pattern of the packaging adhesive when the packaging adhesive is coated on the flexible rear cover 11 in the prior art is shown, and as can be seen from comparing fig. 5 and fig. 6, the pattern of the packaging adhesive layer 110 provided by the present invention can make adjacent cells (a single flexible display device 12) share one adhesive line when packaging is attached, that is, compared with the prior art, the pattern of the adhesive line provided by the present invention adopts a widening design, thereby ensuring that the adhesive line is uniformly widened during the attaching and packaging process.
Further, according to actual requirements, after performing step S2, the method for manufacturing the flexible display device 12 may further include: a moisture adsorbing material for moisture adsorption is coated in each of the second pattern areas 1103 to form a moisture adsorbing layer 16 as shown in fig. 7. The moisture absorbing layer 16 is used to prevent oxygen and water from affecting the service life of the flexible display device 12, in practical application, a liquid desiccant may be used to make the moisture absorbing layer 16, and the pattern of the moisture absorbing layer 16 may be, but is not limited to, a "square" pattern as shown in fig. 7.
Step S3, attaching the flexible rear cover 11 to the flexible display device array 10 to be packaged through the packaging adhesive layer 110, so that each binding unit 140 is located in one first pattern region 1102 and each display unit 13 is located in one second pattern region 1103.
Specifically, referring to fig. 8 and 9, in this embodiment, after the flexible rear cover 11 is attached to the flexible display device array 10 to be packaged, an independent and sealed mesh space as shown in fig. 9 can be formed between adjacent cells in the flexible display device array 10, and meanwhile, the width of each widened glue line in the packaging glue layer 110 is about twice or more of the width of the glue line after packaging and attaching by using the prior art, and the widening of each glue line (such as the first glue line 1100 and the second glue line 1101) is uniform, so that the strength of the packaging glue for preventing air impact in a liquid state is greatly increased, and further, the occurrence of a device failure phenomenon of the flexible display device array 10 due to the air impact problem in a packaging stage is effectively avoided.
In addition, please refer to fig. 9 again, when the flexible rear cover 11 is attached to the flexible display device array 10 to be packaged through the packaging adhesive layer 110, a plurality of first pattern regions 1102 are arranged in an array to form a plurality of rows of first pattern regions 1102, a plurality of second pattern regions 1103 are arranged in an array to form a plurality of rows of second pattern regions 1103, the plurality of rows of first pattern regions 1102 and the plurality of rows of second pattern regions 1103 are alternately arranged at intervals, and only one second adhesive line 1101 is arranged between two adjacent rows of display units 13.
Step S4, cutting off a portion of the flexible rear cover 11 corresponding to the binding region 14, and removing the low surface energy coating 15 of the binding region 14.
Specifically, when the flexible rear cover 11 is partially cut, it can be achieved by, but not limited to, a laser cutting process, and since the low surface energy coating 15 is disposed on the binding region 14, the cut portion of the flexible rear cover 11 corresponding to the binding region 14 can be relatively easily peeled off from the binding region 14, and as shown in fig. 10, the display unit 13 is still completely covered by the flexible rear cover 11. Therefore, compared with the prior art, in the peeling process of the flexible rear cover 11 provided by the embodiment, the flexible substrate 120 is not damaged, and the yield in the manufacturing process of the flexible display device 12 is effectively improved.
Specifically, as an embodiment, the step of removing the low surface energy coating 15 of the binding region 14 may include: firstly, dry etching the low surface energy coating 15 of the binding region 14 by using plasma to remove the low surface energy coating 15; and then cleaning the bonding region 14 after removing the low surface energy coating 15 by using plasma, so that the water contact angle of the cleaned bonding region 14 is less than or equal to 20 degrees. After the low-surface-energy coating 15 is removed, the bonding region 14 is treated by plasma, so that residual low-surface-energy materials can be removed without damaging a circuit, the surface energy of the bonding region 14 is effectively improved, and the bonding strength during device bonding is enhanced.
Further, according to practical requirements, since the packaged flexible display device array 10 is a large device including a plurality of independent flexible display devices 12, after the steps S1-S4 are completed, the method for manufacturing the flexible display device 12 may further include: performing device cutting on the packaged flexible display device array 10 to form a plurality of individual flexible display devices 12 as shown in fig. 11 and 12, and processing the binding unit 140 of each flexible display device 12 by using a crimping process, wherein it should be noted that each flexible display device 12 includes one display unit 13 and one binding unit 140.
In detail, referring to fig. 13, the pressing process refers to a process of pressing an IC (integrated Circuit 18) or an FPC (Flexible Printed Circuit 17) onto the bonding unit 140 of the Flexible display device 12 through an Anisotropic Conductive Film (ACF). For example, fig. 13 illustrates the flexible display device 12 being crimped using a COG crimping process to form the final flexible display device 12, such as a flexible PM-OLED.
Further, based on the description of the manufacturing method of the flexible display device 12, the embodiment of the present invention further provides a flexible display device 12, where the flexible display device 12 is manufactured by using the manufacturing method of the flexible display device 12. It can be understood that, since the flexible display device 12 has the same or corresponding technical features as the manufacturing method of the flexible display device 12, reference may be made to the above detailed description of the manufacturing method of the flexible display device 12 for the description of the flexible display device 12, and the description of the embodiment is not repeated here.
In summary, in the manufacturing method of the flexible display device 12 and the flexible display device 12 provided by the invention, by improving the coating pattern of the encapsulation adhesive, the encapsulation adhesive is uniformly widened after the flexible rear cover 11 is attached to the flexible display device array 10 to be encapsulated, and independent and closed micro spaces can be formed between adjacent flexible display devices 12, so that the air impact phenomenon is effectively prevented, and the manufacturing yield of the flexible display device 12 is improved.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A method for manufacturing a flexible display device, comprising:
providing a flexible rear cover and a flexible display device array to be packaged, wherein the flexible display device array comprises a plurality of display units arranged in an array and binding regions provided with low surface energy coatings, each binding region comprises a plurality of binding units arranged at intervals, and each binding unit is arranged corresponding to one display unit;
coating packaging glue on the flexible rear cover to form a packaging glue layer, wherein the packaging glue layer comprises a plurality of first glue lines arranged along a first direction and a plurality of second glue lines arranged along a second direction; the first glue lines and the second glue lines are intersected to form a plurality of first pattern areas and a plurality of second pattern areas which are arranged in an array;
attaching the flexible rear cover to the flexible display device array to be packaged through the packaging adhesive layer, so that each binding unit is located in a first pattern area and each display unit is located in a second pattern area;
and cutting off the part of the flexible rear cover corresponding to the binding region, and removing the low surface energy coating of the binding region.
2. The method according to claim 1, wherein when the flexible rear cover is attached to the array of flexible display devices to be packaged by the packaging adhesive layer, the plurality of first pattern regions are arranged in an array to form a plurality of rows of first pattern regions, the plurality of second pattern regions are arranged in an array to form a plurality of rows of second pattern regions, the plurality of rows of first pattern regions and the plurality of rows of second pattern regions are alternately arranged at intervals, and only one second adhesive line is arranged between two adjacent rows of display units.
3. The method for manufacturing the flexible display device according to claim 1, wherein the step of coating the flexible rear cover with the packaging adhesive to form the packaging adhesive layer comprises:
shielding a partial area of the flexible rear cover by using a first mask plate;
and coating packaging glue at the position of the flexible rear cover which is not shielded by the mask plate to form the packaging glue layer.
4. The method for manufacturing the flexible display device according to claim 1, wherein the step of manufacturing the array of flexible display devices to be packaged comprises:
providing a flexible substrate, wherein the flexible substrate comprises a display area and a binding area;
sequentially manufacturing and forming an anode, a pixel spacing layer and a cathode isolation column in the display area of the flexible substrate;
manufacturing and forming a low surface energy coating in a binding region of the flexible substrate;
and sequentially manufacturing and forming an organic material layer and a cathode in a display area of the flexible substrate to obtain the flexible display device array to be packaged, wherein the organic material layer is positioned on one side of the anode, which is far away from the flexible substrate, and is filled between pixel blocks in the pixel spacing layer.
5. The method for manufacturing a flexible display device according to claim 4, wherein the step of forming a low surface energy coating on the bonding region of the flexible substrate comprises:
shielding an area outside the binding area on the flexible substrate by using a second mask plate;
coating a low surface energy material on the binding region through a spraying process or an evaporation process;
and curing the low-surface-energy material to form the low-surface-energy coating.
6. A method of manufacturing a flexible display device according to claim 1 or 4, wherein the low surface energy coating has a water contact angle of 100 degrees or more.
7. A method of manufacturing a flexible display device according to claim 1, wherein the step of removing the low surface energy coating of the binding region comprises:
dry etching the low surface energy coating of the binding region with plasma to remove the low surface energy coating;
and cleaning the binding region from which the low-surface-energy coating is removed by using plasma, so that the water contact angle of the cleaned binding region is less than or equal to 20 degrees.
8. The method for manufacturing the flexible display device according to claim 1, wherein before the step of attaching the flexible rear cover to the flexible display device array to be encapsulated through the encapsulation adhesive layer, the method further comprises:
and coating a water vapor adsorption material for water vapor adsorption in each second pattern area to form a water vapor adsorption layer.
9. A method of manufacturing a flexible display device according to claim 1, wherein the method further comprises:
and carrying out device cutting on the packaged flexible display device array to form a plurality of independent flexible display devices, and processing a binding unit of each flexible display device by using a crimping process, wherein each flexible display device comprises a display unit and a binding unit.
10. A flexible display device, characterized in that the flexible display device is manufactured by using the method for manufacturing a flexible display device according to any one of claims 1-9.
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