JP4255724B2 - Manufacturing method of organic EL display and organic EL display - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an organic EL (Electroluminescence) display manufacturing method and an organic EL display.
[0002]
[Prior art]
In recent years, organic EL displays using organic EL elements have been actively developed. An organic EL display has a wider viewing angle than liquid crystal display devices, has a high response speed, and is expected as a next-generation display device because of the variety of light-emitting properties of organic substances. An organic EL element used in an organic EL display has an anode formed on a substrate, a thin-film organic compound is laminated on the anode, and is opposed to the anode formed on the substrate on the organic compound layer. Thus, the cathode is formed. An organic EL element is a current-driven display element that emits light when a current is supplied to an organic compound layer disposed between an anode and a cathode. Hereinafter, a thin film of an organic compound to be laminated is referred to as an organic thin film layer. A display pixel is a portion where an anode, a plurality of organic thin film layers, and a cathode are stacked.
[0003]
When an organic compound is stacked on an electrode provided on a substrate, an organic thin film layer may be formed by vacuum evaporation of an organic material. However, when an organic material is deposited, if the surface of the electrode serving as the base of the organic thin film layer has foreign matter attached, protrusions, or depressions, the organic thin film layer may not be in a desired state due to the influence.
[0004]
As a method for solving this problem, a technique for forming a desired organic thin film layer by dispersing or dissolving an organic material to be an organic thin film layer in a liquid and coating it as a solution to cover foreign matters, protrusions, depressions, etc. A wet coating method, hereinafter simply referred to as a coating method) is known. For example, Patent Document 1 describes that at least one of the organic thin film layers is formed by a coating method.
[0005]
Examples of the coating method include an offset printing method, a relief printing method, and a mask spray method. In the offset printing method and the relief printing method, a layer of a solution in which an organic material is dispersed or dissolved in a solvent is formed only in a predetermined region. In the mask spray method, a metal mask or the like having an opening that matches a desired region is disposed, and a solution in which an organic material is dispersed or dissolved is sprayed. In this case, the solution is dispersed in a gaseous medium such as nitrogen, or the solution is atomized using a two-fluid nozzle or the like.
[0006]
In addition, in the organic EL display, a separation structure (hereinafter referred to as a partition) is provided so that the cathode wiring provided on the organic thin film layer is separately arranged. Such a configuration is described in Patent Document 1, for example. FIG. 16 is a cross-sectional view showing an example of a partition wall described in Patent Document 1. An anode wiring 101 is provided on the substrate 111, and then a partition wall 100 is provided. The partition wall 100 is formed, for example, so that the cross section increases as the distance from the substrate 11 increases. Such a structure of the partition wall 100 is called an inverted taper structure or an overhang structure. By making the partition wall 100 have an inversely tapered structure, the cathode wiring can be more reliably separated. When each organic thin film layer (hole injection transport layer 102, light emitting layer 103, electron injection transport layer 104) is formed by a coating method or the like with the partition wall 100 provided, the organic thin film layer is separated by the partition wall 100. As a result, Each organic thin film layer is formed between each partition wall 100. Thereafter, the cathode wiring 105 is formed by a vapor deposition method or the like. The cathode wiring 105 is also separated by the partition wall 100, and a patterned cathode wiring 105 is formed.
[0007]
In some cases, an insulating film having an opening is formed over the anode wiring, and a position to be a display pixel is determined by the position of the opening. FIG. 17 is an explanatory diagram illustrating a configuration example when an insulating film having an opening is provided in the configuration described in Patent Document 1. FIG. 17A is a schematic diagram illustrating a state where the substrate is observed from the side where the electrodes are arranged, and FIG. 17B is a cross-sectional view taken along line A-A ′ of FIG. FIG. 17A also shows components that are hidden by cathode wiring or the like provided in the upper layer.
[0008]
In the example shown in FIG. 17, first, the anode wiring 101 and the cathode connection wiring 121 connected to the cathode wiring are formed on the substrate 111. Subsequently, an insulating film 122 having an opening 123 is formed. The opening 123 is provided at a position where the anode wiring and the cathode wiring intersect. A partition wall 100 is formed so as to be orthogonal to the anode wiring 101. Subsequently, a solution of an organic material is applied or evaporated to form the organic thin film layer 124. Although a plurality of layers are formed as the organic thin film layer, in FIG. 17B, the plurality of layers are collectively shown as the organic thin film layer 124. The concentration of the organic material is adjusted so that the organic thin film layer is formed with a certain thickness in the region where the organic thin film layer is to be formed. After the organic thin film layer 124 is formed, the cathode wiring 105 is deposited on the organic thin film layer. The partition wall 100 separates the organic thin film layer 124 and the cathode wiring 105, whereby the organic thin film layer 124 is formed between the partition walls, and the patterned cathode wiring 105 is formed.
[0009]
After forming the cathode wiring 105, an organic thin film layer made of a polymer or the like may be formed on the cathode wiring 105 in order to protect the organic EL element. This organic thin film layer (not shown) is also formed by a coating method or the like.
[0010]
In addition, another substrate (not shown) is disposed so as to face the surface of the substrate 111 on which electrodes and the like are disposed. In this substrate, a sealing material (not shown) is applied to the outer periphery of the region of the substrate 111 facing the organic EL element. With this sealing material, the substrate 111 and another substrate are bonded. The organic EL element is kept from being exposed to moisture and oxygen by being sealed with a substrate and a sealing material.
[0011]
[Patent Document 1]
Japanese Patent Laid-Open No. 2001-351799 (paragraphs 0012-0017, FIGS. 1 and 2)
[0012]
[Problems to be solved by the invention]
When an organic material solution is applied after the partition wall 100 is formed, there is a problem that the applied solution spreads along the partition wall 100. For example, in the example illustrated in FIG. 17, the solution spreads along a portion where the side surface of the partition wall 100 and the insulating film 122 intersect. This is because a phenomenon similar to the capillary action is caused by the space near the portion where the side surface of the partition wall 100 and the surface of the insulating film 122 intersect. In particular, when the partition wall 100 is formed so as to have a reverse taper structure in order to reliably separate the cathode wiring 105 and the like, the space near the intersection of the side surface of the partition wall 100 and the surface of the insulating film 122 becomes narrower, and the solution is more concentrated. It becomes easy to spread.
[0013]
FIG. 18 is an explanatory view showing a state in which the organic material solution has spread along the partition walls. In FIG. 18, the partition wall 100 and the organic material solution 125 are shown, and the other components are not shown. In FIG. 17 and FIG. 18, a region indicated by a broken line indicates a range where the applied solution should remain without spreading. That is, the solution should ideally not expand beyond this dashed area. However, as already described, the solution 125 spreads along the partition wall 100. As a result, as shown in FIG. 18, the solution spreads beyond the range indicated by the broken line. Also in each figure shown below, the range where the solution should stay is shown with a broken line.
[0014]
Thus, the following problems arise when the solution spreads. When the solution spreads, a thin film is formed even at a position where the sealing material comes into contact when the two substrates face each other. When the sealing material for bonding the substrates is in contact with the thin film, the adhesive force of the sealing material is reduced. As a result, moisture and oxygen enter between the substrates, the organic EL element is exposed to moisture and oxygen, and the performance of the organic EL element is likely to deteriorate.
[0015]
When the solution spreads and an organic thin film is formed on the cathode connection wiring 121, the thin film becomes a resistor between the cathode connection wiring 121 and the deposited cathode wiring 105. The organic EL element is driven by passing a current between the cathode wiring 105 and the anode wiring 101. Therefore, if a resistor exists between the cathode connection wiring 121 and the cathode wiring 105, there arises a problem that heat is generated. In addition, a connection failure between the cathode wiring 105 and the cathode connection wiring 121 may occur due to the resistor.
[0016]
Further, the concentration and the like of the solution are adjusted so that a constant thickness can be obtained, but the solution spreads along the partition wall 100, making it difficult to achieve a desired thickness. In particular, since the solution near the outer periphery of the region indicated by the broken line spreads further outward, the thickness of the organic thin film layer becomes thinner toward the outer periphery of the region indicated by the broken line. As described above, unevenness occurs in the thickness of the organic thin film layer, and thus unevenness in light emission occurs when each display pixel emits light.
[0017]
The problem that the solution spreads also occurs when an organic thin film layer made of a polymer or the like is formed on the cathode wiring 105 by a coating method in order to protect the organic EL element.
[0018]
Therefore, the present invention prevents the spread of the liquid applied to form the organic thin film layer, and prevents the decrease in the adhesive strength of the sealing material, the generation of resistors, and the occurrence of uneven light emission. An object of the present invention is to provide a display and a method for manufacturing an organic EL display.
[0019]
[Means for Solving the Problems]
  Aspect 1 of the present invention is an organic EL display in which a first electrode is formed on a substrate, a plurality of organic compound layers are formed on the first electrode, and a second electrode is formed on the organic compound layer. A liquid material diffusion preventing portion for preventing the spread of the liquid material at a position other than the display pixel in the manufacturing method.As an opening through which liquid material flowsForming and then arranging at least one liquid material of the organic compound layer in a planar shape, or arranging the liquid material in a planar shape to form the organic compound layer on the second electrode. A method for producing an organic EL display is provided.
[0020]
  Aspect 2 of the present invention is the aspect 1The secondBefore forming a plurality of organic compound layers on one electrode, partition walls for separating adjacent second electrodes are formed on both sides of the second electrode arrangement position.OpenProvided is a method for manufacturing an organic EL display which is formed so that a mouth portion is located between partition walls. According to such a method, since the liquid material flows into the opening, it is possible to prevent the liquid material from spreading.
[0021]
  Aspect 3 of the present invention is an aspect.2InA plurality of openings are provided between the partition walls.Provide a method for manufacturing an organic EL display.
[0022]
  Aspect 4 of the present inventionAspect 2 or 3InBefore forming the partition wall, an insulating film is formed on the substrate at least at a position other than the display pixel, and thereafter, part of the insulating film is removed to form an opening.Provide a method for manufacturing an organic EL display.
[0025]
  Aspects of the invention5Is an organic EL display in which a first electrode, a plurality of organic compound layers, and a second electrode are sequentially laminated on a substrate, and at least one of the plurality of organic compound layers is formed of a liquid material in a planar shape. A liquid material diffusion prevention part that prevents the spread of the liquid material is provided at a position other than the display pixel, which is formed by arrangingThe liquid material diffusion preventing part is an opening through which the liquid material flows.An organic EL display is provided.
[0027]
  Aspects of the invention6Is an aspect5In this embodiment, a partition wall for separating adjacent second electrodes is provided on both sides of the second electrode.OpenAn organic EL display having a mouth portion between partition walls is provided. According to such a configuration, since the liquid material flows into the opening, it is possible to prevent the liquid material from spreading.
[0028]
  Aspects of the invention7Is an aspect6InA plurality of openings are provided between the partition walls.An organic EL display is provided.
  According to Aspect 8 of the present invention, in any one of Aspects 5 to 7, the opening is formed by removing a part of the insulating film from the insulating film provided at a position other than at least the display pixel on the substrate. An organic EL display having an opening is provided.
[0029]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[Embodiment 1] First, a first embodiment will be described. FIG. 1 is an explanatory diagram showing a configuration example of an organic EL display according to the present invention, and shows a situation in which a substrate is observed from the side where electrodes are arranged. FIG. 1 also shows components that are hidden by electrodes or the like provided in the upper layer.
[0030]
On the substrate 11, the anode wiring 1 and the cathode connection wiring 21 connected to the cathode are formed so as to be in contact with the surface of the substrate 11. An insulating film 22 is formed on the substrate on which the anode wiring 1 and the cathode connection wiring 21 are formed. The film thickness of the insulating film 22 is 0.7 μm, for example. A first opening 23 is provided in the insulating film 22 at a position where the anode wiring and the cathode wiring intersect (that is, a position serving as a display pixel). Further, a second opening 26 is provided in the insulating film 22 at a position other than the display pixel. The position other than the display pixel is an area outside the anode wiring at the end. For example, in the insulating film 22 shown in FIG. 1, the region 31 outside the endmost anode wiring corresponds to a region other than the display pixel, and the second opening 26 is formed in the region 31 outside the endmost anode wiring. Is provided.
[0031]
It is preferable that a plurality of second openings 26 are dispersed between the partition walls 10. In the example shown in FIG. 1, a case where four second openings 26 are provided between the partition walls is shown.
[0032]
The insulating film 22 is in contact with any of the anode wiring 1, the cathode connection wiring 21, and the substrate 11 except for the first opening 23 and the second opening 26.
[0033]
A plurality of organic thin film layers (organic compound layers) and the cathode wiring 5 are sequentially stacked on the insulating film 22. However, illustration of the organic thin film layer is omitted in FIG. Further, before the organic thin film layer is formed, a partition wall 10 for separating adjacent cathode wirings is provided. The partition 10 is formed in a desired pattern when the cathode wiring 5 is formed by vapor deposition or the like. For example, as shown in FIG. 1, a plurality of partition walls 10 orthogonal to the anode wiring 1 are formed so that a plurality of cathode wirings 5 orthogonal to the anode wiring 1 are formed. The partition wall 10 preferably has an inverted taper structure. That is, it is preferable that the cross-section is formed so as to be separated from the substrate 11. The height of the partition wall 10 is, for example, 3.4 μm.
[0034]
When the organic thin film layer is laminated by applying an organic material solution, the organic thin film layer is separated by the partition walls 10. Similarly, when the cathode wiring 5 is vapor-deposited, the cathode wiring is separated by each partition wall 10, and as a result, a plurality of cathode wirings 5 are formed as shown in FIG. The partition walls 10 are located on both sides of the cathode wiring 5. The film thickness of the organic thin film layer is, for example, 10 to 100 nm. Moreover, the thickness of the cathode wiring 5 is 100 nm, for example.
[0035]
By laminating the plurality of organic thin film layers and the cathode wiring 5 in this manner, a configuration in which a plurality of organic thin film layers are formed between the anode wiring 1 and the cathode wiring 5 in each first opening 23. Become. When a constant current is passed from the anode wiring side to the cathode wiring side in the first opening 23, the organic thin film layer (light emitting layer) located in the first opening 23 emits light.
[0036]
Further, another substrate (not shown) is disposed so as to face the surface of the substrate 11 shown in FIG. In this substrate, a sealing material (not shown) is applied to the outer periphery of the region of the substrate 11 facing the organic EL element. The two substrates are bonded by this sealing material.
[0037]
Each cathode connection wiring 21 is connected to a scanning electrode driver (not shown), and each anode wiring 1 is connected to a signal electrode driver (not shown). When driving the organic EL display, the scanning electrode driver sequentially selects each cathode wiring 5. Further, the signal electrode driver causes a current to flow from the anode wiring to the cathode wiring of the selected row so that the display pixels to be lit in the selected row emit light.
[0038]
When the organic material solution is applied, the solution tends to spread along a portion where the side surface of the partition wall 10 and the surface of the insulating film 22 intersect. However, since the solution that attempts to spread outside the insulating film 22 flows into the second opening 26, it is possible to prevent the solution from spreading over a wide range. Therefore, the solution does not spread to a position where it comes into contact with the sealing material when the two substrates are opposed to each other, and a decrease in the adhesive strength of the sealing material can be prevented. As a result, the organic EL element can be made difficult to come into contact with moisture and oxygen, and the deterioration of the performance of the organic EL element can be prevented. Further, since the solution can be prevented from spreading, an organic thin film serving as a resistor is not formed on the cathode connection wiring 21. Therefore, poor contact between the cathode connection wiring 21 and the cathode wiring 5 and heat generation during driving can be prevented. Furthermore, by preventing the solution from spreading, the unevenness of the film thickness of the organic thin film layer can be reduced, and the unevenness of light emission can also be reduced.
[0039]
In order to protect the organic EL display, an organic thin film layer such as a polymer may be formed on the cathode wiring 5. The film thickness of the insulating film (depth of the second opening 26) is, for example, 0.7 μm. The film thickness of the organic thin film layer and the thickness of the cathode wiring 5 are about 10 to 100 nm and 100 nm, respectively. Therefore, even after the cathode wiring 5 is formed, the second opening 26 maintains a concave shape. Therefore, even when the solution is applied to form the organic thin film layer on the upper layer of the cathode wiring 5, it is possible to prevent the solution from spreading.
[0040]
Next, the manufacturing method of the organic EL display of this Embodiment is demonstrated using FIG. 1 and FIG. FIG. 2 is a flowchart showing an example of a method for manufacturing the organic EL display of the present embodiment.
[0041]
First, the anode wiring 1 and the cathode connection wiring 21 are formed on the substrate 11 (step S101). As the substrate 11, for example, a transparent substrate such as a glass substrate is used. The anode wiring 1 and the cathode connection wiring 21 are formed by depositing ITO (Indium Tin Oxide) on the substrate 11 and performing etching.
[0042]
Next, the insulating film 22 is formed on the surface of the substrate 11 provided with the anode wiring 1 (step S102). The insulating film 22 is formed, for example, by applying a polyimide solution. The thickness of the insulating film 22 may be set to 0.7 μm, for example. In addition, after forming the insulating film layer, the insulating film at a position to be a display pixel is removed, and the first opening 23 is provided. The intersection of the cathode wiring 5 formed in step S105 described later and the anode wiring 1 is a position that becomes a display pixel. In addition, a part of the insulating film is removed and a second opening 26 is provided at a position other than the display pixel (region 31 outside the endmost anode wiring). At this time, it is preferable to provide a plurality of second openings 26 between the partition walls 10 so as to be spatially dispersed. For example, it is preferable to remove a part of the insulating film and provide a plurality of openings 26 so that the insulating film 22 remains in a ladder shape in a region between the partition walls. By providing a plurality of second openings 26, the effect of preventing the spread of the solution can be enhanced. By the process of step S102, the second opening 26 is provided in the region 31 outside the outermost anode wiring.
[0043]
FIG. 1 shows a case where the second opening 26 is provided in a region outside the leftmost anode wiring. However, the second opening 26 is provided in a region outside the leftmost anode wiring and a region outside the rightmost anode wiring, respectively. Two openings 26 are preferably provided.
[0044]
Subsequently, the partition wall 10 for separating adjacent cathode wirings is formed in the upper layer of the insulating film 22 (step S103). At this time, the partition 10 is formed at a position where the cathode wiring is to be separated (on both sides of the position where the cathode wiring is arranged). Since the cathode wiring 21 is formed to be orthogonal to the anode wiring 1, the partition wall 10 is also formed to be orthogonal to the anode wiring 1. As a material of the partition wall 10, for example, an acrylic resin film may be used. The height of the partition wall 10 may be set to 3.4 μm, for example. The partition wall 10 is preferably formed so as to have an inverted taper structure in which the cross section increases as the distance from the substrate 11 increases. By adopting the reverse taper structure, the organic thin film layer and the cathode wiring 5 can be reliably separated.
[0045]
After forming the partition, each organic thin film layer is laminated (step S104). A metal mask having an opening in the light emitting region is prepared in advance, and the metal mask is attached to the substrate 11 in step S104. Then, a solution for forming the hole injection layer is applied by, for example, a mask spray method. The solution can be arranged in a plane by a mask spray method. As a solution for forming the hole injection layer, for example, there is an ethyl benzoate solution in which polyvinyl carbazole is dissolved by 0.5% (mass percentage).
[0046]
At this time, the applied solution tends to spread along the partition wall 10. However, since the second opening 26 is provided in the region 31 outside the anode wiring at the extreme end, the solution flows into the second opening 26 and the position where the sealing material comes into contact with the cathode. The solution does not spread to the contact portion between the connection wiring 21 and the cathode wiring 5. Further, the unevenness of the film thickness of the organic thin film layer (in this case, the hole injection layer) in each first opening 23 is also reduced.
[0047]
On the hole injection layer, a hole transport layer and a light emitting layer are sequentially laminated. Even when these layers are formed by a coating method, the second opening 26 prevents the liquid material from spreading. You may laminate | stack a positive hole transport layer and a light emitting layer by a vapor deposition method.
[0048]
After forming the cathode interface layer, the cathode wiring 5 is formed (step S105). In step S105, the cathode interface layer is vapor-deposited on the upper layer of the light emitting layer, and the cathode wiring 5 is vapor-deposited on the upper layer. For example, LiF may be deposited as the cathode interface layer, and aluminum may be deposited as the cathode wiring. FIG. 3 is an explanatory view showing a mode in which the cathode wiring 5 is deposited. The material of the cathode wiring 5 (for example, aluminum) is ejected from the ejection unit 41 to the substrate 11. The support portion 42 that supports the substrate 11 rotates, and the cathode wiring 5 is uniformly formed at a predetermined position (between each partition wall) on the substrate 11 by this rotation.
[0049]
In step S <b> 104 and step S <b> 105, the organic thin film layer, the cathode interface layer, and the cathode wiring 5 are separated by the partition walls 10 and are formed in regions between the partition walls 10.
[0050]
Next, a sealing material is applied to the outer periphery of a region facing the organic EL element in a substrate (not shown) paired with the substrate 11. Then, the substrate coated with the sealing material and the substrate 11 are overlapped (step S106).
[0051]
According to such an organic EL display manufacturing method, when the organic material solution is applied in step S104, the second opening 26 prevents the solution from spreading. Therefore, since the organic thin film layer is not formed on the substrate 11 at the position where the sealing material comes into contact, the adhesive force of the sealing material does not decrease, and moisture and oxygen do not easily enter between the substrates. Therefore, it is possible to prevent a decrease in the performance of the organic EL display. In step S <b> 105, no organic thin film is formed at the connection portion between the cathode connection wiring 21 and the cathode wiring 5. Therefore, in step S105, the cathode wiring 5 and the cathode connection wiring 21 are connected in a good state. Accordingly, heat generation during driving can be prevented. Furthermore, since unevenness in the thickness of the organic thin film layer in the first opening 23 is also reduced, unevenness in light emission can also be reduced.
[0052]
Note that an organic thin film layer made of a polymer or the like may be formed on the cathode wiring 5 before the step S106 is performed. This organic thin film layer plays a role of protecting the organic EL element. Even when the organic thin film layer is formed by a coating method, the second opening 26 prevents the solution from spreading.
[0053]
Further, in a region (display area) where display is performed by each display pixel, a protrusion protruding between the pixels from the partition wall 10 may be provided. This protrusion may be provided not only between the pixels but also outside the display pixel on the anode wiring at the end. FIG. 4 is an explanatory diagram showing a configuration example of an organic EL display in the case where a protrusion protruding from the partition wall 10 is provided. The partition wall 10 is provided with protrusions 51 that project from the partition wall 10 to the outside of the display pixel between the pixels and on the anode wiring at the end. Further, each protrusion 51 is in contact with the insulating film 22. Each protrusion 51 preferably has an inversely tapered structure (a structure in which the cross section increases as the distance from the substrate side increases), as with the partition 10. That is, it is preferable to form each protrusion 51 so that the cross section of each protrusion 51 is the narrowest at the portion in contact with the insulating film 22 and becomes wider as the distance from the insulating film 22 increases.
[0054]
When forming the protrusion 51, for example, when the partition 10 is formed in step S103, the partition 10 and the protrusion 51 may be integrally formed of the same material at the same time. A manufacturing process can be simplified by forming with the same material, or forming simultaneously.
[0055]
The protrusion 51 exerts a function of blocking a solution that attempts to spread along the partition wall 10. Therefore, not only the second opening 26 but also the protrusion 51 can prevent the spread of the solution more effectively. As a result, as compared with the case where the protrusions 51 are not provided (configuration illustrated in FIG. 1), the unevenness of the film thickness of the organic thin film layer in each display pixel is further reduced, and the unevenness of light emission is further improved.
[0056]
FIG. 4 shows a configuration in which the protrusions 51 are provided outside the display pixels on the respective regions between the display pixels and the anode wiring at the end. However, if the protrusions 51 are provided in any of the regions between the pixels, there is a possibility that the cathode wiring 5 cannot be separated even if the partition wall 10 and the protrusions 51 have a reverse taper structure. The reason for this will be described.
[0057]
FIG. 5 is an explanatory diagram showing the state of the surface of the cathode wiring 5 and the side surfaces of the partition walls 10 and the protrusions 51 when the cathode wiring 5 is deposited. In FIG. 5, the surface of the cathode wiring 5 is indicated by oblique lines. In addition, since the material of the cathode wiring 5 is sprayed on the upper surface of the partition wall 10 during the deposition of the cathode wiring 5, a layer of the same material as the cathode wiring 5 is formed on the upper surface of the partition wall 10. As shown in FIG. 3, the material of the cathode wiring 5 is sprayed onto the substrate 11 so as to spread from the spraying part 41. Therefore, the material of the cathode wiring 5 is not necessarily sprayed perpendicularly to the substrate, and may be sprayed from an oblique direction. In this case, the presence of the protrusion 51 makes it easy to spray the material of the cathode wiring 5 also in the vicinity 32 of the region where the side surface of the partition wall 10 and the side surface of the protrusion 51 intersect. When the material of the cathode wiring 5 is sprayed on the vicinity 32, the cathode wiring 5 and the layer on the upper surface of the partition wall 10 (layer of the same material as the cathode wiring 5) are connected via the vicinity 32. Further, since the support table 42 shown in FIG. 3 is rotating, the cathode wiring and the upper layer of the partition wall 10 are also provided on the side of the cathode wiring (not shown in FIG. 5) adjacent to the cathode wiring 5 shown in FIG. May be connected. Accordingly, the cathode wiring 5 shown in FIG. 5 and the adjacent cathode wiring may not be sufficiently separated (short circuit).
[0058]
As the number of protrusions provided on both sides of the partition wall 10 increases, the probability of occurrence of a short circuit between adjacent cathode wirings also increases. Therefore, if the projections 51 are provided outside the respective display pixels on the respective regions between the respective display pixels and the anode wiring at the end as shown in FIG. 4, the probability of occurrence of a short circuit is increased. In order to reduce the probability of occurrence of a short circuit, the protrusions 51 may be provided at intervals wider than one pixel. FIG. 6 is an explanatory diagram showing a configuration example in the case where the protrusions 51 are provided at intervals of two pixels on each side surface of the partition wall 10. Also in this case, the presence of the protrusion 51 can prevent the solution from spreading. Further, since the number of protrusions 51 is smaller than in the configuration example shown in FIG. 4, the probability of occurrence of short circuit between the cathode wirings can be made lower than in the case shown in FIG.
[0059]
Although FIG. 6 shows a case where the protrusions 51 are provided at intervals of two pixels on both sides of the partition wall 10, the protrusions 51 may be provided at intervals of three pixels or more. Further, FIG. 6 shows a case where the protrusions protrude only on one side of the partition wall 10 at the positions where the individual protrusions 51 exist, but each protrusion 51 is provided so as to protrude from the same location of the partition wall 10 to both sides. Also good.
[0060]
In addition, if the protrusion 51 protrudes only on one side surface of one partition wall 10 and the protrusion 51 does not exist on the other side surface, the flow of the solution is biased on both sides of the partition wall. Therefore, when the solution is applied to both sides of the partition wall 10, the protrusions 51 are provided on both sides of the partition wall 10. This also applies to the second protrusion 52 described later. However, as shown in FIG. 6, there may be a case where the protrusions are present only on one side at the positions where the individual protrusions 51 are present.
[0061]
In the first embodiment, the anode wiring 1 corresponds to a first electrode, and the cathode wiring 5 corresponds to a second electrode. The second opening 26 corresponds to a liquid material diffusion preventing unit.
[0062]
[Embodiment 2(Reference form)Next, a second embodiment will be described. FIG. 7 is an explanatory diagram showing a configuration example of an organic EL display according to the present invention. FIG. 7 shows a situation where the substrate is observed from the side where the electrodes are arranged, as in FIG. Also shown are components that are hidden by an electrode or the like provided in the upper layer.
[0063]
The organic EL display in the second embodiment is different from the first embodiment in the configuration in the region 31 outside the anode wiring at the extreme end. Since other components are the same as those in the first embodiment, the same reference numerals as those in the first embodiment are used, and the description thereof is omitted. As shown in FIG. 7, in the second embodiment, the second opening is not provided in the region 31 outside the endmost anode wiring. The insulating film 22 provided on the upper layer of the anode wiring 1 and the cathode connection wiring 21 has only the first opening 23.
[0064]
As in the first embodiment, the partition wall 10 is formed in the upper layer of the insulating film 22. However, in the partition 10, a portion that belongs to the region 31 outside the outermost anode wiring is provided with a protrusion 52 that projects to the side where the display pixel exists. In the following description, the protrusion provided in the display area where the display pixel exists is referred to as a first protrusion, and the protrusion provided in the region 31 outside the anode wiring at the end is referred to as a second protrusion. The protrusion 51 described in the first embodiment corresponds to the first protrusion.
[0065]
The second protrusion 52 preferably has an inversely tapered structure like the partition wall 10. That is, it is preferable to form each of the second protrusions 52 so that the cross section of the second protrusion 52 is narrowest at a portion in contact with the insulating film 22 and becomes wider as the distance from the insulating film 22 increases.
[0066]
FIG. 8 is a flowchart showing an example of a method for manufacturing the organic EL display according to the second embodiment. First, the anode wiring 1 and the cathode connection wiring 21 are formed on the substrate 11 (step S111). This step is the same as step S101. Subsequently, the insulating film 22 is formed on the anode wiring 1 and the cathode connection wiring 21 (step S112). The process of step S112 is the same as that of step S102 except that the second opening is not provided.
[0067]
Subsequently, the partition walls 10 for separating adjacent cathode wirings are formed on both sides of the cathode wiring arrangement position (step S113). At this time, a second protrusion 52 protruding from the partition wall 10 is also formed in the region 31 outside the outermost anode wiring. The second protrusion 52 may be formed integrally with the partition 10 using the same material (for example, an acrylic resin film) as the partition 10. If the second protrusion 52 and the partition wall 10 are formed using the same material or are formed simultaneously, the manufacturing process can be simplified. The height of the partition wall 10 and the protrusion 52 may be set to 3.4 μm, for example. The partition wall 10 and the second protrusion 52 are preferably formed to have a reverse taper structure (a structure in which a cross section increases as the distance from the substrate side increases).
[0068]
Although FIG. 7 shows a case where the second protrusion 52 is provided so as to protrude from one place of the partition wall 10 to only one side, the second protrusion 52 extends from the same place of the partition wall 10 to both sides of the partition wall 10. The protrusion 52 may be provided.
[0069]
FIG. 7 shows the case where the second protrusion 52 is provided in a region outside the leftmost anode wiring. However, the second protrusion 52 is provided in a region outside the leftmost anode wiring and a region outside the rightmost anode wiring, respectively. It is preferable to provide the second protrusion 52.
[0070]
Then, each organic thin film layer is laminated | stacked similarly to step S104 in 1st embodiment (step S114). When an organic material solution is applied, the solution tends to spread along the partition wall 10. However, the second protrusion 52 blocks the solution that is about to spread along the partition wall 10. Therefore, the solution does not spread to the position where the sealing material comes into contact or the contact portion between the cathode connection wiring 21 and the cathode wiring 5. Further, the unevenness of the film thickness of the organic thin film layer in each first opening 23 is also reduced.
[0071]
Subsequently, the cathode interface layer and the cathode wiring 5 are formed (step S115), and the substrate 11 and another substrate (not shown) are bonded with a sealing material (step S116). Steps S115 and S116 are the same as steps S105 and S106.
[0072]
According to such a method for manufacturing an organic EL display, when the organic material solution is applied, the second protrusion 52 dams the solution, so that the solution is prevented from spreading. Therefore, similarly to the first embodiment, it is possible to prevent a decrease in the adhesive strength of the sealing material and to prevent a decrease in the performance of the organic EL display. In addition, the cathode wiring 5 and the cathode connection wiring 21 can be connected well to prevent heat generation during driving. Further, unevenness in light emission can be reduced.
[0073]
Note that an organic thin film layer (protective film for protecting the organic EL element) made of a polymer or the like may be formed in the upper layer of the cathode wiring 5 before performing the step S116. Even when the organic thin film layer is formed by a coating method, the second protrusion 52 prevents the solution from spreading.
[0074]
Further, as in the first embodiment, a first protrusion that protrudes between the display pixel may be formed on the partition wall 10 in the display area. FIG. 9 is an explanatory diagram showing a configuration example when the first protrusion is formed in the display area in the second embodiment. When the first protrusion 51 shown in FIG. 9 is formed, for example, in Step S113, the partition wall 10, the first protrusion 51, and the second protrusion 52 may be integrally formed of the same material at the same time. The first protrusions 51 may be provided so as to protrude from one place of the partition wall 10 only to one side, or the first protrusions 51 may be provided so as to protrude from the same place of the partition wall 10 to both sides of the partition wall 10. However, in order to prevent an increase in the probability of occurrence of a short circuit, it is preferable to provide the first protrusions 51 at intervals of two pixels or more on each side surface of the partition wall 10.
[0075]
When the first protrusion 51 is formed, the organic material solution is blocked not only by the second protrusion 52 but also by the first protrusion 51. Therefore, when the first protrusion 51 is formed, the effect of preventing the solution from spreading can be enhanced.
[0076]
In the second embodiment, the second protrusion 52 corresponds to a liquid material diffusion preventing portion.
[0077]
[Embodiment 3(Reference form)Next, a third embodiment will be described. FIG. 10 is an explanatory diagram showing a configuration example of an organic EL display according to the present invention. FIG. 10 shows a situation where the substrate is observed from the side where the electrodes are arranged, as in FIG. Also shown are components that are hidden by an electrode or the like provided in the upper layer.
[0078]
The organic EL display according to the third embodiment is different from the first embodiment and the second embodiment in the configuration of the region 31 outside the outermost anode wiring. The other components are the same as those in the first embodiment and the second embodiment, and thus the same reference numerals as those in the first embodiment are used, and the description thereof is omitted.
[0079]
As shown in FIG. 10, in the third embodiment, the second opening is not provided in the region 31 outside the outermost anode wiring. This point is the same as in the second embodiment. However, in the third embodiment, the third protrusion 53 is formed in the region 31 outside the outermost anode wiring. Unlike the first protrusion 51 and the second protrusion 52, the third protrusion 53 is formed as a protrusion separated from the partition wall 10. It is preferable that the third protrusion 53 also has an inversely tapered structure (a structure in which a cross section increases as the distance from the substrate side) is the same as that of the partition wall 10.
[0080]
However, the presence of the third protrusion 53 causes a hole in the cathode wiring 5 when the cathode wiring 5 is deposited. When such holes are densely packed, the resistance of the cathode wiring 5 becomes high, and current hardly flows during driving. Therefore, the third protrusions 53 are formed so as to be dispersed. FIG. 11 is an explanatory diagram showing an arrangement state of the third protrusions 53. As shown in FIG. 11, it is preferable to disperse the third protrusions 53 so that the number of the third protrusions 53 in an arbitrary cross section orthogonal to the longitudinal direction of the cathode wiring 5 to be deposited is one or less. . If a plurality of third protrusions 53 are present in the cross section perpendicular to the longitudinal direction of the cathode wiring 5, the resistance at that portion becomes high.
[0081]
The manufacturing method of the organic EL display of the third embodiment is the same as the manufacturing method (see FIG. 8) in the second embodiment. However, in step S113, when the partition 10 is formed, the third protrusion 53 separated from the partition 10 is formed. As shown in FIG. 11, the third protrusions 53 are formed to be dispersed. The material of the third protrusion 53 may be the same material as the partition wall 10 (for example, an acrylic resin film). Further, it is preferable to form the third protrusion 53 and the partition wall 10 at the same time. If the third protrusion 53 and the partition wall 10 are formed of the same material or are formed simultaneously, the manufacturing process can be simplified. The height of the third protrusion 53 may be the same as that of the partition wall 10, for example.
[0082]
FIG. 10 shows the case where the third protrusion 53 is provided in a region outside the leftmost anode wiring. However, the third projection 53 is provided in a region outside the leftmost anode wiring and a region outside the rightmost anode wiring, respectively. It is preferable to provide a third protrusion 53.
[0083]
In the process following step S113, each organic thin film layer is laminated (step S114). When an organic material solution is applied, the solution tends to spread along the partition wall 10. However, the third protrusion 53 blocks the solution that is about to spread along the partition wall 10. Therefore, the solution does not spread to the position where the sealing material comes into contact, the adhesive force of the sealing material is prevented from being lowered, and the performance of the organic EL display can be prevented from being lowered. In addition, since the solution does not spread to the contact portion between the cathode connection wiring 21 and the cathode wiring 5, the cathode wiring 5 and the cathode connection wiring 21 can be connected well, and heat generation during driving can be prevented. Moreover, since unevenness of the film thickness of the organic thin film layer in each first opening 23 is also reduced, unevenness in light emission can be reduced.
[0084]
Further, when the solution is applied to form an organic thin film layer (protective film for protecting the organic EL element) composed of a polymer or the like on the upper layer of the cathode wiring 5, the spread of the solution is prevented by the third protrusion 53. Is prevented.
[0085]
Further, similarly to the first embodiment and the second embodiment, in the display area, a first protrusion protruding between the display pixel and the display pixel may be formed on the partition wall 10. At this time, the first protrusion may be provided so as to protrude from one place of the partition wall 10 only to one side, or the first protrusion may be provided so as to protrude from both sides of the partition wall 10 from the same place of the partition wall 10. However, in order to prevent an increase in the probability of occurrence of a short circuit, it is preferable to provide the first protrusions at intervals of two pixels or more on each side surface of the partition wall 10. When the first protrusion is formed, the organic material solution is blocked not only by the third protrusion 53 but also by the first protrusion. Therefore, when the first protrusion is formed, the effect of preventing the solution from spreading can be enhanced.
[0086]
In the third embodiment, the third protrusion 53 corresponds to a liquid material diffusion preventing portion.
[0087]
In each of the above-described embodiments, the laminated structure from the anode wiring to the cathode wiring may be reversed so that a current flows from the upper electrode to the lower electrode.
[0088]
4, FIG. 6, and FIG. 9 show the case where the cross-sectional shape of the first protrusion 51 is rectangular. Similarly, FIGS. 7 and 9 show the case where the cross-sectional shape of the second protrusion 52 is rectangular. Further, when the first protrusion 51 and the second protrusion 52 have a reverse taper structure (a structure in which a cross section increases as the distance from the substrate side), the shape of these protrusions becomes a truncated pyramid (a truncated pyramid). However, the shape of the first protrusion 51 and the second protrusion 52 is not limited to a truncated pyramid having a rectangular cross-sectional shape in a plane parallel to the substrate 11. For example, the truncated pyramid may have a cross-sectional shape in a plane parallel to the substrate 11 such that the width increases as the distance from the partition wall 10 increases (see FIG. 12A). Further, the first protrusion 51 and the second protrusion 52 may be formed so that the surface opposite to the contact surface with the partition wall 10 is a conical curved surface. In this case, the cross-sectional shape in a plane parallel to the substrate 11 is as shown in FIG. In addition, when each protrusion does not have an inversely tapered structure, the shape of the protrusion is not a truncated pyramid but a column.
[0089]
The shape of the third protrusion 53 is, for example, a quadrangular frustum or a quadrangular column. In this case, the cross-sectional shape in a plane parallel to the substrate 11 is rectangular as shown in FIG. However, the third protrusion 53 is not limited to such a shape. For example, a triangular frustum or a triangular prism may be used. It is preferable that one side face in the direction in which the liquid material flows.
[0090]
7 and FIG. 9, the case where the width of the second protrusion 52 is narrower than the distance between the second protrusions 52 is shown. However, as shown in FIG. The distance between the second protrusions 52 may be wider.
[0091]
The cross section shown in FIGS. 12 and 13 is a cross section along a plane parallel to the substrate 11.
[0092]
Further, in each of the above embodiments, the partition wall 10 and various protrusions (the first protrusion 51, the second protrusion 52, or the third protrusion 53) are formed of the same material or simultaneously formed. Although it has been described that the process can be simplified, the partition wall 10 and the various protrusions may be formed of different materials. For example, the partition wall 10 may be formed of an acrylic resin film, and the protrusion may be formed of polyimide similarly to the insulating film 22. When the partition 10 and the various protrusions are formed of different materials, the partition 10 and the various protrusions are formed in separate steps. Further, the partition wall 10 and the various protrusions may be formed of the same material and formed in separate steps.
[0093]
Note that the partition 10 may be formed by a photolithography process. In the photolithography process, the partition wall 10 can have an inverted taper structure by causing the developer to wrap around the bottom of the partition wall 10. Further, when the protrusion is formed of polyimide, for example, a polyimide layer may be formed by a spin coating method, and the protrusion may be formed by a photolithography process. When polyimide is used, a protrusion having a height of 0.7 to 3.0 μm can be formed. Note that the height of the protrusion (the film thickness of the polyimide layer) varies, but the film thickness distribution is within 10%.
[0094]
When the partition wall 10 and the various protrusions are formed in separate steps, it is preferable to form the partition wall 10 first. If the protrusions are formed first, when the partition wall 10 is formed, the presence of the protrusions makes it difficult for the developer to flow into the bottom of the partition wall 10 and makes it difficult for the partition wall 10 to have an inverted taper structure in the vicinity of the protrusions.
[0095]
If the protrusion is formed first, the following problem also occurs. FIG. 14 is an explanatory view showing a problem when the protrusion is formed first. As shown in FIG. 14A, it is assumed that the second protrusion 52 is formed on the insulating film 22 first. In this case, as shown in FIG. 14B, the material for the partition wall 10 (here, acrylic resin) is disposed on the insulating film 22. In order to form the partition 10, when a mask is disposed at a position other than the position where the partition 10 is to be irradiated and light is irradiated, the material irradiated with the light is cured and the partition 10 is formed. At this time, as shown in FIG. 14C, if the region 71 where the mask is not provided is separated from the second protrusion 52, the partition wall 10 is formed away from the second protrusion 52. Further, as shown in FIG. 14D, it is assumed that the region 71 where the mask is not provided is too close to the second protrusion 52 and the second protrusion 52 enters the inside of the partition wall 10. . In this case, excess partition wall material 75 remains on the side surface of the partition wall 10. Even if the mask is arranged so that the side surface of the second protrusion 52 and the desired side surface of the partition wall 10 are in contact with each other, excess partition wall material 75 remains on the side surface of the partition wall 10 (FIG. 14E).
[0096]
On the other hand, FIG. 15 is explanatory drawing which shows the condition at the time of forming a partition first. As shown in FIG. 15A, it is assumed that the partition 10 is formed on the insulating film 22 first. In this case, as shown in FIG. 15B, the material of the second protrusion 52 (here, polyimide) is disposed on the insulating film 22. In order to form the second protrusion 52, a mask 73 is disposed at a position to be the second protrusion 52, and when the light is irradiated, a portion not irradiated with the light remains and the second protrusion 52 is formed. . At this time, it is assumed that the position of the mask 73 has moved away from the partition wall 10. In this case, even in the unmasked region, the second protrusion 52 is formed so as to be in contact with the partition wall 10 because the light is blocked by the partition wall 10 having the reverse taper structure (FIG. 15C). Further, it is assumed that the position of the mask 73 is too close to the partition wall 10. In this case, although the size of the protrusion protruding from the partition wall 10 is reduced, the second protrusion 52 in contact with the partition wall 10 can be formed (FIG. 15D). In addition, an extra partition material 75 as shown in FIGS. 14D and 14E does not remain. Therefore, it is preferable to form the second protrusion 52 after the partition wall 10 is formed. Although the second protrusion 52 has been described here, the first protrusion 51 is preferably formed after the partition wall 10 is formed.
[0097]
In FIGS. 14 and 15, the second protrusion 52 is a protrusion whose cross section becomes smaller as it is away from the substrate side. However, as already described, the shape of the protrusion is as it is away from the substrate side. It is preferable to have a shape with a wide cross section.
[0098]
Further, when the partition wall 10 and the protrusion are formed in separate steps, it is preferable that the height of the protrusion 10 is 50 to 75% of the height of the partition wall 10. When forming the protrusions, the protrusions higher than the desired height may be formed due to fluctuations in the film thickness. However, if the protrusion 10 is formed so that the height of the protrusion 10 is 75% or less of the height of the partition wall 10, even if a protrusion higher than the desired height is formed, the protrusion 10 will not be higher than the partition wall 10. If the height of the protrusion 10 is too low, the effect of blocking the liquid material is reduced. Therefore, it is preferable to form the protrusion so that the height of the protrusion is 50% or more of the height of the partition wall 10. When the height of the partition wall 10 is 3.4 μm, the height of the protrusion may be set to 2.4 μm, for example.
[0099]
In the case where the partition wall 10 and the protrusion are integrally formed of the same material at the same time, the partition wall 10 and the protrusion may be formed to have the same height.
[0100]
【Example】
[Example 1] ITO film was formed on a glass substrate and etched to form anode wiring and cathode connection wiring. The thickness of the cathode connection wiring was 300 nm.
[0101]
Next, a polyimide solution was applied to the surface of the substrate provided with the anode wiring to form an insulating film having a thickness of 0.7 μm. Subsequently, the polyimide at a position to be a display pixel was removed, and a first opening was provided. At this time, the polyimide was removed so that the first opening was a 300 μm × 300 μm square. Further, a part of the insulating film was removed so that the insulating film remained in a ladder shape in a region outside the endmost anode wiring, and a plurality of second openings were provided.
[0102]
Subsequently, partition walls were formed on the surface of the insulating film (polyimide layer) so that 64 cathode wirings could be separated and arranged. The partition was formed by applying an acrylic resin film on the upper layer of the insulating film. In addition, the partition walls have a reverse taper structure. The height of the partition wall was 3.4 μm.
[0103]
Thereafter, a metal mask having an opening was attached to the glass substrate. At this time, the metal mask opening and the organic thin film layer were disposed so as to overlap each other, and the metal mask was attached so that a space of 50 μm was left between the metal mask and the glass substrate. And the ethyl benzoate solution which melt | dissolved 0.5% (mass percentage) polyvinyl carbazole was apply | coated by the mask spray method, and the positive hole injection layer was formed.
[0104]
Subsequently, α-NPD (N, N′-di (naphthalen-1-yl) -N, N′-diphenyl-benzidine) is deposited on the upper layer of the hole injection layer to form a hole transport layer having a thickness of 40 nm. Formed. Further, Alq (tris (8-hydroxynato) aluminum) serving as the host compound of the light emitting layer and coumarin 6 serving as the fluorescent dye of the guest compound are simultaneously vapor deposited on the upper layer to form a light emitting layer having a thickness of 60 nm. Formed.
[0105]
Subsequently, LiF was vapor-deposited on the upper layer of the light emitting layer to form a cathode interface layer having a thickness of 0.5 nm. Then, aluminum was vapor-deposited and the cathode wiring with a film thickness of 100 nm was formed. As a result, the aluminum film was separated by the partition walls, and 64 cathode wirings were formed.
[0106]
A sealing material was applied to a substrate different from the glass substrate, and was made to face the glass substrate on which the organic EL element was arranged. An epoxy ultraviolet curable resin was used as the sealing material. Moreover, the sealing material was apply | coated to the outer periphery of the area | region facing an organic EL element. After making two board | substrates oppose, ultraviolet rays were irradiated, the sealing material was hardened, and board | substrates were adhere | attached. Thereafter, heat treatment was performed for 1 hour in a clean oven at 80 ° C. in order to further accelerate the curing of the sealing material. As a result, the sealing material and the pair of substrates separated the substrate where the organic EL element was present from the outside of the substrate.
[0107]
Unnecessary portions near the outer periphery of the substrate were cut and removed, a signal electrode driver was connected to the anode wiring, and a scanning electrode driver was connected to the cathode connection wiring.
[0108]
When applying a solution of an organic EL element, the solution is prevented from spreading to the position where the sealing material contacts and the contact portion between the cathode wiring and the cathode connection wiring, and a highly reliable organic EL display can be manufactured. It was. Further, the unevenness of the film thickness of the organic thin film layer was reduced, and the unevenness of light emission of each display pixel was able to be reduced when the organic EL display was driven.
[0109]
[Example 2] An organic EL display was produced in the same manner as in Example 1. However, only the first opening was provided in the insulating film, and the second opening was not provided. In addition, a protrusion (second protrusion) that protrudes to the side where the display pixel exists is formed in a portion belonging to a region outside the anode wiring at the end of the partition. In addition, the protrusion was formed so that the protrusion protruded only from one place of the partition to either side of the partition. Also in this case, as in Example 1, the spread of the solution could be prevented, and a highly reliable organic EL display could be manufactured. Further, when the organic EL display was driven, uneven light emission was not visually recognized.
[0110]
[Example 3] An organic EL display was produced in the same manner as in Example 2 except that a protrusion (third protrusion) separated from the partition was formed instead of the protrusion protruding from the partition. Also in this case, the spread of the solution could be prevented, and a highly reliable organic EL display could be manufactured. Further, when the organic EL display was driven, uneven light emission was not visually recognized.
[0111]
【The invention's effect】
  According to the method of manufacturing an organic EL display according to the present invention, the liquid material diffusion preventing unit for preventing the liquid material from spreading at positions other than the display pixels before the liquid material is arranged in a planar shape.As an opening through which liquid material flowsSince it forms, it can prevent that the arrange | positioned liquid material spreads. Therefore, it is possible to prevent the adhesive force of the sealing material from being lowered due to the spread of the liquid material, and as a result, the performance of the organic EL display is prevented from being lowered. In addition, it is possible to prevent the generation of a resistor in contact with the second electrode and to prevent heat generation during driving. In addition, unevenness in the thickness of the organic compound layer can be suppressed, and unevenness in light emission can be reduced.
[0112]
    According to the organic EL display according to the present invention, the liquid material diffusion preventing unit for preventing the liquid material from spreading is provided at a position other than the display pixel.The liquid material diffusion preventing part is an opening through which the liquid material flows.Therefore, it is possible to prevent the arranged liquid material from spreading. Therefore, it is possible to prevent the adhesive force of the sealing material from being lowered due to the spread of the liquid material, and as a result, the performance of the organic EL display is prevented from being lowered. In addition, it is possible to prevent the generation of a resistor in contact with the second electrode and to prevent heat generation during driving. In addition, unevenness in the thickness of the organic compound layer can be suppressed, and unevenness in light emission can be reduced.
[Brief description of the drawings]
FIG. 1 is an explanatory diagram illustrating a configuration example of an organic EL display according to a first embodiment.
FIG. 2 is a flowchart showing an example of a method for manufacturing the organic EL display according to the first embodiment.
FIG. 3 is an explanatory view showing a mode in which a cathode wiring is deposited.
FIG. 4 is an explanatory diagram showing a configuration example of an organic EL display when a protrusion is provided.
FIG. 5 is an explanatory diagram showing the state of the surface of the cathode wiring and the side surfaces of the partition walls and protrusions when the cathode wiring is deposited.
FIG. 6 is an explanatory diagram showing another configuration example of the organic EL display when a protrusion is provided.
FIG. 7 is an explanatory diagram illustrating a configuration example of an organic EL display according to a second embodiment.
FIG. 8 is a flowchart showing an example of a method for manufacturing an organic EL display according to the second embodiment.
FIG. 9 is an explanatory diagram showing a configuration example of an organic EL display when a protrusion is provided.
FIG. 10 is an explanatory diagram illustrating a configuration example of an organic EL display according to a third embodiment.
FIG. 11 is an explanatory diagram showing an arrangement state of third protrusions.
FIG. 12 is an explanatory diagram showing an example of a cross-sectional shape of a protrusion.
FIG. 13 is an explanatory diagram showing an example of the width of a second protrusion.
FIG. 14 is an explanatory diagram showing a situation when a protrusion is formed before a partition wall.
FIG. 15 is an explanatory view showing a situation when a partition wall is formed before a protrusion.
FIG. 16 is a cross-sectional view showing an example of a conventional partition wall.
FIG. 17 is an explanatory diagram showing a configuration example when an insulating film is arranged on a conventional organic EL display having a partition;
FIG. 18 is an explanatory view showing a state in which a solution of an organic material spreads along a partition wall.
[Explanation of symbols]
1 Anode wiring
5 Cathode wiring
10 Bulkhead
11 Substrate
21 Cathode connection wiring
22 Insulating film
23 First opening
26 Second opening

Claims (8)

A method for producing an organic EL display, comprising: forming a first electrode on a substrate; forming a plurality of organic compound layers on the first electrode; and forming a second electrode on the organic compound layer,
Forming a liquid material diffusion preventing portion that prevents the spread of the liquid material as an opening into which the liquid material flows , at a position other than the display pixel,
An organic EL characterized in that at least one liquid material of the organic compound layer is arranged in a planar shape, or a liquid material is arranged in a planar shape in order to form an organic compound layer on the second electrode. Display manufacturing method. Before forming a plurality of organic compound layers on the first electrode, on both sides of the arrangement position of the second electrode, a partition that separates adjacent second electrodes is formed,
The method for manufacturing an organic EL display according to claim 1, wherein the opening is formed so as to be positioned between the partition walls. The method for producing an organic EL display according to claim 2 , wherein a plurality of the openings are provided between the partition walls . 3. The insulating film is formed on at least a position other than the display pixel on the substrate before the partition is formed, and then the opening is formed by removing a part of the insulating film. 3. A method for producing an organic EL display according to 3 . An organic EL display in which a first electrode, a plurality of organic compound layers, and a second electrode are sequentially stacked on a substrate,
At least one of the plurality of organic compound layers is formed by disposing a liquid material in a planar shape,
Provided with a liquid material diffusion prevention part that prevents the spread of the liquid material at a position other than the display pixel ,
The organic EL display, wherein the liquid material diffusion preventing portion is an opening through which the liquid material flows . Provided on both sides of the second electrode with partition walls that separate adjacent second electrodes,
The opening is provided between the partition walls.
The organic EL display according to claim 5 . The organic EL display according to claim 6 , wherein a plurality of the openings are provided between the partition walls . The opening is an opening formed by removing a part of the insulating film from an insulating film provided at least on the substrate at a position other than the display pixel. The organic EL display according to any one of the above.

Images