CN108321308B - Packaging method and display device - Google Patents
Packaging method and display device Download PDFInfo
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- CN108321308B CN108321308B CN201810053557.XA CN201810053557A CN108321308B CN 108321308 B CN108321308 B CN 108321308B CN 201810053557 A CN201810053557 A CN 201810053557A CN 108321308 B CN108321308 B CN 108321308B
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- Prior art keywords
- barrier bed
- packaged
- binding
- dams
- dykes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
Abstract
The present invention provides a kind of packaging methods, are packaged for treating packaging, comprising the following steps: provide device to be packaged；Barrier bed is formed in the binding region of the device to be packaged；Encapsulated layer is formed in all areas of the device to be packaged；Remove the barrier bed of the binding region；Wherein, the material of the barrier bed is hot melt adhesive, light colloidal sol or soluble organic material.Above-mentioned packaging method, barrier bed is formed in binding region in advance before forming encapsulated layer, remove the barrier bed again after forming encapsulated layer to make binding region expose for binding, it can be avoided and blocked using exposure mask or adhesive tape blocks and is easy to produce the bad problem such as particle, the product yield for improving packaging method improves product quality and production efficiency.
Description
Technical field
The present invention relates to field of display technology, more particularly to a kind of packaging method and display device.
Background technique
The encapsulation of the displays such as Organic Light Emitting Diode, liquid crystal display is to utilize plasma enhanced chemical vapor deposition
Method (Plasma Enhanced Chemical Vapor Deposition, PECVD), atomic layer deposition method (Atomic Layer
Deposition, ALD), flash method, vapour deposition method, the technologies such as inkjet printing are by SiN, Al2O3, the insulating materials such as organic planarization layer
It is deposited on device to be packaged and forms encapsulated layer, to protect OLED device not corroded by water oxygen.
In order to avoid binding region be deposited encapsulated layer covering and cause it is subsequent can not bind, in encapsulation process, lead to
Often binding region is blocked using exposure mask (mask) or adhesive tape.But use mask first is that at high cost, second is that equipment
Design is challenged, and is easy to produce particle (Particle) in the pecvd process, and common ALD technique uses mask more
Add difficulty.And using adhesive tape one side Anawgy accuracy limited, another aspect needs after base-plate cleaning, encapsulation is preceding by adhesive tape gluing
Well, it is dirty to easily cause substrate, generates particle (Particle).Furthermore tearing-off adhesive tape is needed after the completion of packaging technology, thus
It easily causes other film layers to fall off, causes the damage of device.
Summary of the invention
Based on this, it is necessary to it is easy to produce the bad problem such as particle for traditional exposure mask or adhesive tape masking binding region,
A kind of packaging method and display device are provided.
A kind of packaging method provided by the invention, is packaged for treating packaging, comprising the following steps:
Device to be packaged is provided；
Barrier bed is formed in the binding region of the device to be packaged；
Encapsulated layer is formed in all areas of the device to be packaged；
Remove the barrier bed of the binding region；
Wherein, the material of the barrier bed is hot melt adhesive, light colloidal sol or the organic material that can be dissolved by an organic solvent.
It prints to form the barrier bed by inkjet printing mode in one of the embodiments,.
In one of the embodiments, the device to be packaged binding region formed barrier bed step before, further include with
Lower step:
Binding dykes and dams are formed on the binding region periphery.
The height of the binding dykes and dams is less than or equal to the thickness of the encapsulated layer and described ties up in one of the embodiments,
The height for determining dykes and dams is more than or equal to the thickness of the barrier bed.
The binding dykes and dams are the U-shaped dike being open to the device one side edge to be packaged in one of the embodiments,
Dam.
In one of the embodiments, the barrier bed with a thickness of 1~20 μm.
The material of the barrier bed is identical as the material of the encapsulated layer in one of the embodiments,.
In one of the embodiments, the removal binding region the barrier bed the following steps are included:
When the material of the barrier bed is the organic material that can be dissolved by an organic solvent, by described organic with can dissolve
The solvent soaking or the coating binding region of material are to remove the barrier bed；
When the material of the barrier bed is hot melt adhesive, melts the hot melt adhesive by heating and remove the barrier bed；
When the material of the barrier bed is light colloidal sol, the barrier bed is removed by photoetching.
The present invention also provides a kind of display devices, wherein the display device includes packaging, and the packaging is adopted
It is encapsulated with packaging method as described above.
Above-mentioned packaging method forms barrier bed in binding region in advance before forming encapsulated layer, goes again after forming encapsulated layer
Except the barrier bed is to making binding region expose for binding, it can be avoided and blocked using exposure mask or adhesive tape blocks easy production
The bad problems such as raw particle, improve the product yield of packaging, improve product quality and production efficiency.
Detailed description of the invention
In order to illustrate the technical solutions in the embodiments of the present application or in the prior art more clearly, below will be to institute in embodiment
Attached drawing to be used is needed to be briefly described, it should be apparent that, the accompanying drawings in the following description is only one recorded in the present invention
A little embodiments are also possible to obtain other drawings based on these drawings for those of ordinary skill in the art.
Fig. 1 is the flow diagram of one embodiment of packaging method of the present invention；
Fig. 2 is the structural schematic diagram of the display device of that present invention.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, by the following examples, it and combines attached
Figure, is further elaborated packaging method and display device of the invention.It should be appreciated that specific reality described herein
Example is applied only to explain the present invention, is not intended to limit the present invention.
Refering to Figure 1, the packaging method of an embodiment provided by the invention, is sealed for treating packaging
Dress.Wherein, comprising the following steps:
S100 provides device to be packaged；
S200 forms barrier bed in the binding region of device to be packaged；
S300 forms encapsulated layer in all areas of device to be packaged；
S400 removes the barrier bed of binding region；
Wherein, the material of barrier bed is hot melt adhesive, light colloidal sol or the organic material that can be dissolved by an organic solvent.
Above-mentioned packaging method forms barrier bed in binding region in advance before forming encapsulated layer, goes again after forming encapsulated layer
Except the barrier bed is to making binding region expose for binding, it can be avoided and blocked using exposure mask or adhesive tape blocks easy production
The bad problems such as raw particle, pollution, improve the product yield of packaging, improve product quality and production efficiency.More
Further, packaging method of the invention is the barrier bed for removing binding region again after forming encapsulated layer and encapsulation thereon
Layer, encapsulation is completed in device to be packaged at this time, will not introduce the bad problem such as project, pollution.
Optionally, above-mentioned packaging method can be used for film encapsulation method packaging.
Optionally, it prints to form above-mentioned barrier bed by inkjet printing mode.InkJet printing processes flexibility is high, passes through spray
Ink printing can simplify processing procedure, it is only necessary to which in predetermined position, layer material is blocked in printing, can be improved the efficiency to form barrier bed.
As a kind of optional embodiment, before the binding region of packaged device forms barrier bed step, further include with
Lower step:
Binding dykes and dams are formed on binding region periphery.
It, can be by barrier bed material by binding dykes and dams when binding region forms barrier bed by modes such as inkjet printings
Material is limited in binding region, avoids blocking layer material to other regional diffusions.It further, can be based on binding dykes and dams limit
System blocks the effect that layer material is flowed to other regions, properly increases the thickness of barrier bed, thicker barrier bed can be more into one
Step reduces the Step Coverage quality of the encapsulated layer of binding region, it is easier to which the later period removes barrier bed, is especially more advantageous to the later period
Barrier bed is removed by impregnating, coating solvent, while can correspondingly remove the encapsulated layer of binding region, thus exposed binding area
Domain.
Still optionally further, the material for binding dykes and dams is positivity photoresist, the binding formed using positivity photoresist
The section of the vertical substrate of dykes and dams is trapezoidal.Up-narrow and down-wide trapezoidal dykes and dams are more advantageous to solvent and immerse inside barrier bed, improve
Remove the efficiency of barrier bed.
As a kind of optional embodiment, the height for binding dykes and dams is less than or equal to the thickness of encapsulated layer and binds the thickness of dykes and dams
Degree is more than or equal to the thickness of barrier bed.The height for binding dykes and dams is set to be less than or equal to the thickness of encapsulated layer, to be conducive to subsequent tie up
The pressing of timing machine carries out convenient for process for pressing, and the thickness that the thickness of binding region is more than or equal to barrier bed can make to seal
The corresponding region connection that layer is filled in binding dykes and dams is more weak, and when removing the barrier bed of binding region, the envelope of binding region
Dress layer connect with remaining region of device to be packaged it is weaker, be more advantageous to reduction remove binding region barrier bed when to remaining region
Influence.
As a kind of optional embodiment, binding dykes and dams is the U-shaped dykes and dams being open to device one side edge to be packaged.Pass through
Binding dykes and dams are made to be set as the U-shaped dykes and dams being open to device one side edge to be packaged, to make the screening in binding dykes and dams region
Barrier is in open state in this one side edge of device to be packaged, is especially more advantageous to its later period by impregnating removal barrier bed
And the progress of binding technique.For example, the material of barrier bed is the organic material for being dissolvable in water chloroform, therefore can be by that will tie up
Determine region and be soaked in chloroform to dissolve the barrier bed of binding region.
As a kind of optional embodiment, barrier bed with a thickness of 1~20 μm.When barrier bed is with a thickness of 1~20 μm,
It can satisfy and block the demand of binding region under different encapsulation requirement conditions, and be also beneficial to subsequent removal barrier bed.
As a kind of optional embodiment, the material of barrier bed and the material of encapsulated layer are identical, can have optionally
Machine material.It such as can all be esters of acrylic acid.By keeping the material of barrier bed identical as the material of encapsulated layer, it is possible to reduce should
The material category that packaging method uses can simplify technique, reduce equipment, reduce production cost without being additionally carried out stock.
Optionally, when the material of barrier bed is the organic material that can be dissolved by an organic solvent, the screening of binding region is removed
Barrier can remove barrier bed by the way that binding region to be soaked in the solvent for can dissolve the organic material, can also be by can
The solvent for dissolving the organic material is coated in binding region and removes barrier bed.For example, barrier bed can be esters of acrylic acid, propylene
Esters of gallic acid is soluble in organic solvent chloroform.When using chloroform removal barrier bed, it is only necessary to area will be bound
Domain is immersed in chloroform.Wherein, this one side edge due to barrier bed in device to be packaged is in open state-i.e.
The side edge that dykes and dams are bound in device to be packaged has opening, and chloroform can be made to spread by the laterally inner side, completed
Remove the purpose of barrier bed, method simple possible.
Still optionally further, the material for binding dykes and dams is different from the material of barrier bed, by insoluble material or with screening
There is barrier the material of different dissolution conditions to be prepared.In this way, when using the barrier bed of solvent dissolution binding region, binding
Dykes and dams are not dissolved, and then can protect the encapsulated layer in other regions.For example, the material of substrate is polyimides, dykes and dams are bound
Material be polyimides, substrate and binding dykes and dams do not dissolve in chloroform, and the material of barrier bed is acrylate.Work as benefit
When the barrier bed prepared with chloroform removal acrylate, the barrier bed of binding dykes and dams side is immersed in chloroform, is tied up
The encapsulated layer for determining the dykes and dams other side is bound dykes and dams and blocks protection, can be avoided encapsulated layer and is destroyed by chloroform.
Optionally, when the material of barrier bed is hot melt adhesive, the barrier bed for removing binding region can make heat by heating
Melten gel melts to remove barrier bed.Optionally, temperature < 120 DEG C of heating.
Still optionally further, the material for binding dykes and dams is thermosetting material, or binds the melting temperature height of the material of dykes and dams
In the melting temperature for the hot melt adhesive for being used to prepare barrier bed.When layer region is blocked in heating, when binding dykes and dams are not heated
Heat influences.
Optionally, when the material of barrier bed is light colloidal sol, the barrier bed for removing binding region can pass through photoetching process
Remove barrier bed.
Still optionally further, the material for binding dykes and dams is positivity photoresist, when removing barrier bed by photoetching process,
What light colloidal sol was removed under specific illumination, and positivity photoresist is due to being the material different from light colloidal sol, in benefit
When the barrier bed formed with specific illumination removal light colloidal sol, binding dykes and dams can't be affected.The present invention also provides one
Kind display device, display device include packaging, and packaging is encapsulated using above-mentioned packaging method.
The encapsulating products block binding region using barrier bed, avoid material exposure mask or adhesive tape from blocking and are easy to produce
The bad problem such as particle, can significantly improve the product quality of the display device.
It please refers to shown in Fig. 2, display device of the invention is equipped with substrate, and device to be packaged is disposed on the substrate, to be packaged
Device has first edge 21, second edge 22, third edge 23 and the 4th edge 24, is equipped with binding area in first edge 21
Domain 25 is equipped with binding dykes and dams 26 on 25 periphery of binding region, and binding dykes and dams 26 are to be open towards the direction of first edge 21.Around
The vapor deposition region of device to be packaged is equipped with device dykes and dams 27, and region is deposited in the i.e. RGB in region which surrounds.
In conjunction with attached drawing 2, the packaging method of another embodiment that the present invention provides the following steps are included:
Substrate and device to be packaged are provided.
The vapor deposition region of device to be packaged is equipped with device dykes and dams on substrate, and optionally, the height of device dykes and dams is greater than
Equal to the thickness of the organic layer of packaging film, to form the organic of packaging film by inkjet printing mode for device to be packaged
Barrier effect is provided when layer, prevents organic layer material from spreading.
It is formed on the binding region periphery of device to be packaged towards the U-shaped of a side opening and binds dykes and dams.
RGB vapor deposition is carried out in the region that device dykes and dams surround.
In binding dykes and dams region, i.e., one layer of acrylate barrier bed is formed by inkjet printing technology in binding region,
Barrier bed with a thickness of 1~20 μm.Further, the thickness of barrier bed can be adjusted according to the thickness of subsequent encapsulated layer, subsequent envelope
It is thicker to fill layer, then uses thicker barrier bed, so that subsequent encapsulated layer has poor film quality in this region, is conducive to later use
Chloroform can quickly remove barrier bed when immersion.
Encapsulated layer is formed in all areas of device to be packaged, encapsulated layer can be organic layer and alternately set with inorganic layer
It sets, is also possible to single inorganic layer or organic layer；Encapsulated layer is formed using PECVD or ALD, which directly overlays
It states on barrier bed.
Binding region is immersed in chloroform, it, can be by acrylic acid since acrylate is dissolved in chloroform
The barrier bed that ester is formed dissolves removal；Correspondingly, the encapsulated layer being covered on barrier bed is also removed without attachment surface；More into
One step, due to binding the presence of dykes and dams, the encapsulated layer above barrier bed connect weaker and boundary with the encapsulated layer in remaining region
Limit is obvious, will not be right in removal so as to avoid influence of the encapsulated layer to the encapsulated layer in remaining region of removal binding region
The encapsulated layer in remaining region generates adverse effect, to improve package quality.
In the above preparation method, it is only necessary to which one layer of barrier bed, nothing are formed in binding region by the methods of inkjet printing
Exposure mask or docile adhesive tape need to be carried out to binding region, avoid and generate the adverse effects such as particle, pollution, substantially increase preparation effect
Rate and product quality.
Meanwhile cited such as "upper" in this specification, "lower", "left", "right", " centre " and " one " term, also
Only being illustrated convenient for narration, rather than to limit the scope of the invention, relativeness is altered or modified, in nothing
Under essence change technology contents, when being also considered as the enforceable scope of the present invention.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
Limitations on the scope of the patent of the present invention therefore cannot be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to guarantor of the invention
Protect range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (6)
1. a kind of packaging method is packaged for treating packaging, which comprises the following steps:
Device to be packaged is provided；
Binding dykes and dams are formed on the binding region periphery of the device to be packaged, the binding dykes and dams are to the device to be packaged
The U-shaped dykes and dams of one side edge opening, and the U-shaped dykes and dams both ends extend to the edge；
Barrier bed is directly formed in the binding region of the device to be packaged；
Encapsulated layer is formed in all areas of the device to be packaged, the height of the binding dykes and dams is less than or equal to the encapsulation
The height of the thickness of layer and the binding dykes and dams is more than or equal to the thickness of the barrier bed；
Remove the barrier bed of the binding region；
Wherein, the material of the barrier bed is hot melt adhesive, light colloidal sol or the organic material that can be dissolved by an organic solvent.
2. packaging method according to claim 1, which is characterized in that print to form described block by inkjet printing mode
Layer.
3. according to claim 1 to packaging method described in 2 any one, which is characterized in that the barrier bed with a thickness of 1~
20μm。
4. packaging method according to claim 3, which is characterized in that the material of the material of the barrier bed and the encapsulated layer
Expect identical.
5. packaging method according to claim 3, which is characterized in that the barrier bed of the removal binding region
The following steps are included:
When the material of the barrier bed is the organic material that can be dissolved by an organic solvent, by with can dissolve the organic material
Solvent soaking or the coating binding region to remove the barrier bed；
When the material of the barrier bed is hot melt adhesive, melts the hot melt adhesive by heating and remove the barrier bed；
When the material of the barrier bed is light colloidal sol, the barrier bed is removed by photoetching.
6. a kind of display device, which is characterized in that the display device includes packaging, and the packaging uses such as right
It is required that packaging method described in 1 to 5 any one encapsulates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810053557.XA CN108321308B (en) | 2018-01-19 | 2018-01-19 | Packaging method and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810053557.XA CN108321308B (en) | 2018-01-19 | 2018-01-19 | Packaging method and display device |
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| Publication Number | Publication Date |
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| CN108321308A CN108321308A (en) | 2018-07-24 |
| CN108321308B true CN108321308B (en) | 2019-12-03 |
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| CN201810053557.XA Active CN108321308B (en) | 2018-01-19 | 2018-01-19 | Packaging method and display device |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109378408B (en) * | 2018-10-11 | 2020-04-10 | 信利半导体有限公司 | Flexible OLED device preparation method, flexible OLED device and display device |
| CN110213905B (en) * | 2019-05-27 | 2021-01-08 | 维沃移动通信有限公司 | Packaging method of assembled circuit board, assembled circuit board and terminal |
| CN110224013B (en) * | 2019-06-19 | 2021-10-08 | 京东方科技集团股份有限公司 | Display panel, manufacturing method thereof and display device |
| CN112928231A (en) * | 2021-02-25 | 2021-06-08 | 安徽熙泰智能科技有限公司 | Method for opening terminal area of high-efficiency silicon-based micro-display device |
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| CN103915473A (en) * | 2013-12-13 | 2014-07-09 | 厦门天马微电子有限公司 | Flexible display panel composite protecting film, and manufacturing method and stripping method thereof |
| CN105322104A (en) * | 2015-12-08 | 2016-02-10 | 昆山工研院新型平板显示技术中心有限公司 | Packaging method of OLED (organic light emitting diode) display panel |
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| CN102983289B (en) * | 2011-09-06 | 2016-12-21 | 应用材料公司 | Method for maskless encapsulation |
| KR102284756B1 (en) * | 2014-09-23 | 2021-08-03 | 삼성디스플레이 주식회사 | display device |
| CN106328827B (en) * | 2016-10-26 | 2018-08-14 | 昆山工研院新型平板显示技术中心有限公司 | A kind of film encapsulation method |
| CN107204404B (en) * | 2017-04-11 | 2018-12-14 | 上海天马微电子有限公司 | Organnic electroluminescent device |
| CN107104202B (en) * | 2017-06-02 | 2019-09-17 | 京东方科技集团股份有限公司 | The encapsulating structure of OLED display device, packaging method, display device |
| CN107910452B (en) * | 2017-12-06 | 2021-03-19 | 京东方科技集团股份有限公司 | Display panel packaging method, display panel and display device |
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| CN103915473A (en) * | 2013-12-13 | 2014-07-09 | 厦门天马微电子有限公司 | Flexible display panel composite protecting film, and manufacturing method and stripping method thereof |
| CN105322104A (en) * | 2015-12-08 | 2016-02-10 | 昆山工研院新型平板显示技术中心有限公司 | Packaging method of OLED (organic light emitting diode) display panel |
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