CN102222684B - Organic electroluminescent display and manufacture method thereof - Google Patents
Organic electroluminescent display and manufacture method thereof Download PDFInfo
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- CN102222684B CN102222684B CN 201110181471 CN201110181471A CN102222684B CN 102222684 B CN102222684 B CN 102222684B CN 201110181471 CN201110181471 CN 201110181471 CN 201110181471 A CN201110181471 A CN 201110181471A CN 102222684 B CN102222684 B CN 102222684B
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Abstract
The invention provides an organic electroluminescent display and a manufacture method thereof. The manufacture method comprises the steps of: obtaining a first electrode pattern on a display zone wiring area of a substrate and a peripheral wiring area by using a photoetching technology; sequentially manufacturing an insulating layer and a cathode insulating post, and covering the display zone wiring area and the peripheral wiring area which do not contain the first electrode pattern; evaporating an organic functional material on the display zone wiring area of the substrate where the cathode insulating post is manufactured layer by layer; evaporating a cathode metal on the peripheral wiring area and the display zone wiring area of the substrate where the organic functional material is evaporated; and adhering a rear cover on the substrate where the cathode metal is evaporated by using an encapsulating adhesive. In the embodiment of the invention, the cathode metal is also evaporated on the peripheral wiring area, so that the resistance of peripheral wiring is lowered, and then the voltage of the peripheral wiring is lowered, the power consumption is reduced, and the luminance of the organic electroluminescent display is enhanced.
Description
Technical field
The present invention relates to display manufacture craft technical field, relate to a kind of display of organic electroluminescence manufacture method and display of organic electroluminescence in particular.
Background technology
Display of organic electroluminescence (OLED) is a kind of emerging flat-panel monitor since its can active illuminating, advantage such as contrast height, response speed be fast, frivolous, use more and more widely.Its basic structure comprises anode, negative electrode and the organic function layer that inserts between anode and negative electrode, comprise electric charge injection layer, charge transport layer and luminescent layer.Display of organic electroluminescence is when work, and by apply suitable voltage between electrode, display can be luminous.
The anode material of OLED generally adopts transparent electrically-conductive film tin indium oxide ITO, and negative electrode generally adopts the metal of low work function, and it is aluminium, silver, magnesium or their alloy etc. for example.In the manufacture method of existing OLED, sputtering ITO and make the ITO pattern by lithography on electrically-conductive backing plate normally, and in photoetching viewing area evaporation organic material and the cathodic metal of the substrate of ITO pattern, but because OLED is a kind of current mode device, and the resistance of ITO is bigger, cause the voltage ratio on the peripheral wiring bigger, make power consumption higher, influenced the luminosity of OLED.
Therefore, need at present the urgent technical problem that solves of those skilled in the art is exactly how to reduce peripheral wiring voltage, to reduce power consumption, improve the luminosity of OLED.
Summary of the invention
In view of this, the invention provides a kind of manufacture method and display of organic electroluminescence of display of organic electroluminescence, peripheral wiring voltage is higher, power consumption is bigger in order to solve, thereby influences the technical problem of the luminosity of display of organic electroluminescence.
For achieving the above object, the invention provides following technical scheme:
A kind of display of organic electroluminescence manufacture method comprises:
Utilize photoetching process to obtain first electrode pattern in wiring zone, substrate viewing area and peripheral wiring zone;
Make insulating barrier and cathode insulated column successively, cover described wiring zone, viewing area and the peripheral wiring zone that does not comprise first electrode pattern;
The viewing area of the substrate of cathode insulated column wiring zone evaporation organic functional material successively on making;
Regional evaporation cathodic metal connects up in the viewing area of the substrate of organic functional material on peripheral wiring region territory and evaporation;
Utilize packaging plastic that bonnet is fitted on the substrate after evaporation has cathodic metal.
Preferably, the described photoetching process of utilizing obtains also to comprise before first electrode pattern:
Utilize photoetching process to obtain the auxiliary electrode pattern in wiring zone, substrate viewing area and peripheral wiring zone.
Preferably, utilizing packaging plastic that glass back cover is fitted on the substrate behind the evaporation cathodic metal is specially:
Spot printing packaging plastic on described bonnet is fitted in bonnet on the described substrate, and described packaging plastic covers the cathodic metal in described peripheral wiring zone.
Preferably, post drier on the described glass back cover.
Preferably, the cabling live width of described first electrode pattern is 150 microns～200 microns, walks 10 microns～20 microns of distance between centers of tracks.
A kind of display of organic electroluminescence comprises substrate;
First electrode of photoetching on wiring zone, described substrate viewing area and peripheral wiring zone;
Be positioned at the insulating barrier on wiring zone, substrate viewing area and the peripheral wiring zone, described insulating barrier is between the first electrode cabling;
Be positioned at the cathode insulated column on the described insulating barrier;
The cathodic metal of evaporation on wiring zone, described viewing area and peripheral wiring zone;
Evaporation organic function layer in wiring zone, described viewing area and between first electrode and cathodic metal;
Be fitted in the bonnet on the described substrate.
Preferably, described first electrode material is tin indium oxide ITO.
Preferably, the cabling live width of described first electrode pattern is 150 microns～200 microns, walks 10 microns～20 microns of distance between centers of tracks.
Preferably, described substrate is glass substrate.
A kind of display of organic electroluminescence comprises substrate;
Auxiliary electrode and first electrode of photoetching on wiring zone, described substrate viewing area and peripheral wiring zone;
Be positioned at the insulating barrier on wiring zone, substrate viewing area and the peripheral wiring zone, described insulating barrier is between the first electrode cabling;
Be positioned at the cathode insulated column on the described insulating barrier;
The cathodic metal of evaporation on wiring zone, described viewing area and peripheral wiring zone;
The organic function layer of evaporation in wiring zone, described viewing area and between described first electrode and cathodic metal;
Be fitted in the bonnet on the described substrate.
Via above-mentioned technical scheme as can be known, compared with prior art, the invention provides a kind of display of organic electroluminescence manufacture method and display of organic electroluminescence, on display base plate, at first make first electrode pattern by lithography, and make insulating barrier and insulated column successively, the regional evaporation organic function layer that connects up in the viewing area then is at wiring zone, viewing area and the regional evaporation cathodic metal of peripheral wiring, the applying bonnet, packaging.Since cathodic metal also by evaporation in peripheral wiring region territory, cathodic metal is deposited on the peripheral wiring, can reduce peripheral wiring resistance, thereby can reduce peripheral wiring voltage, reduces power consumption, thereby improves the luminosity of display of organic electroluminescence.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art, to do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below, apparently, accompanying drawing in describing below only is embodiments of the invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to the accompanying drawing that provides.
Fig. 1 is the flow chart of a kind of display of organic electroluminescence manufacture method of the present invention embodiment 1;
Fig. 2 is the flow chart of a kind of display of organic electroluminescence manufacture method of the present invention embodiment 2;
Fig. 3 is the substrate wiring schematic diagram of display of organic electroluminescence of the present invention;
Fig. 4 is the structural representation of display of organic electroluminescence of the present invention;
Fig. 5 is the cutaway view of the substrate of display of organic electroluminescence of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that obtains under the creative work prerequisite.
Secondly, the present invention is described in detail in conjunction with schematic diagram, when the embodiment of the invention is described in detail in detail; for ease of explanation; the profile of expression device architecture can be done local the amplification with general ratio, and described schematic diagram is example, and it should not limit the scope of protection of the invention at this.The three dimensions size that in actual fabrication, should comprise in addition, length, width and the degree of depth.
The embodiment of the invention discloses a kind of manufacture method and display of organic electroluminescence of display of organic electroluminescence, display of organic electroluminescence is in manufacturing process, on display base plate, at first make first electrode pattern by lithography, and make insulating barrier and insulated column successively, regional evaporation organic function layer then connects up in the viewing area, at wiring zone, viewing area and the regional evaporation cathodic metal of peripheral wiring, applying bonnet, packaging.Since cathodic metal also by evaporation in peripheral wiring region territory, cathodic metal is deposited on the peripheral wiring, can reduce peripheral wiring resistance, thereby can reduce cabling voltage, reduces power consumption.
In order further to reduce voltage on the peripheral wiring, all right photoetching auxiliary electrode pattern on display base plate, thereby on the cabling in peripheral wiring region territory, not only comprise cathodic metal, also comprise the auxiliary electrode metal, walk line resistance thereby further reduced, reduce power consumption, improved the luminosity of display of organic electroluminescence.
Referring to Fig. 1, show the flow chart of a kind of display of organic electroluminescence manufacture method of the present invention embodiment 1, can may further comprise the steps:
Step 101: utilize photoetching process to obtain first electrode pattern in wiring zone, substrate viewing area and peripheral wiring zone.
In the embodiment of the invention, first electrode material is transparent electrically-conductive film, can select tin indium oxide ITO for use, and substrate can be selected glass material for use.
First electrode pattern that photoetching forms is viewing area cabling and the peripheral wiring of formation, being strip in wiring zone, viewing area with peripheral wiring zone distributes, described first electrode comprises anode and is used for the electrode that is connected with the negative electrode overlap joint, because display can only be powered by the substrate place, the negative electrode of substrate can be communicated with power supply by the connection electrode in first electrode, connect the wiring zone, periphery that electrode pattern is formed at substrate, anode pattern is formed at viewing area and the peripheral wiring zone of substrate, thereby the viewing area cabling is the anode cabling, and peripheral wiring comprises the anode cabling and is connected the electrode cabling.
In actual applications, utilize photoetching process obtain first electrode pattern process can for:
At first choose the flat glass of appropriate size and thickness, clean, described size and thickness can be chosen according to the demand of production line.
Wherein, arranged wiring zone, viewing area and peripheral wiring zone on the described flat glass, peripheral wiring zone is except extra-regional other outside line wiring zones of viewing area wiring.
Then described flat glass is moved into sputter transparent conductive film in the middle of the sputtering equipment, and carry out annealing in process, the thickness of described film is 100nm (nanometer)～180nm, described annealing temperature be 300 ℃ (degree centigrade)～500 ℃.
Wherein, transparent conductive film is that to sputter at whole base plate on glass.
To clean with the substrate of transparent conductive film, at last on described substrate gluing, expose, development treatment, and in acid solution etching, the demoulding in alkaline solution obtains the first required electrode pattern.
First electrode pattern of gained, cabling live width are 150um (micron)～200um, the spacing 10um between the cabling～20um.
Step 102: make insulating barrier and cathode insulated column successively, cover described wiring zone, viewing area and the peripheral wiring zone that does not comprise first electrode pattern.
In the present embodiment, because first electrode material has conductivity, before the evaporation cathodic metal, need to make earlier insulating barrier and cathode insulated column, separate between the cabling with first electrode, be deposited on regional and described first electrode of the whole wiring phenomenon that is short-circuited to avoid cathodic metal.
Wherein cathode insulated column is positioned on the described insulating barrier.
Described wiring zone, viewing area and the peripheral wiring zone that does not comprise first electrode pattern of described covering, that is to say at the insulating barrier in wiring zone, viewing area and peripheral wiring zone and cathode insulated column specifically between the first electrode cabling, need expose the first electrode cabling.
The detailed process of described making insulating barrier and cathode insulated column can for:
At first at wiring zone, viewing area and the regional spin coating photoresist of peripheral wiring, described photoresist can be polyimides PI, expose, develop, solidify, obtain insulating layer pattern, the insulating barrier that obtains covers described wiring zone, viewing area and the peripheral wiring zone that does not comprise the first electrode cabling pattern, and namely the insulating barrier of Xing Chenging need expose the first electrode cabling.
Wherein, the thickness of photoresist is 0.8um～1.5um.Described insulating barrier not only is made in wiring zone, viewing area, cover the wiring zone of described viewing area, need to be made in the wiring zone of peripheral wiring simultaneously, cover described peripheral wiring zone, and expose the first electrode cabling, also be that insulating barrier is between the first electrode cabling.
Region spin coating photoresist on described insulating barrier then, described photoresist is negative photoresist, the thickness of the photoresist of this spin coating is 3um～4um, expose then, photoetching process such as development, curing, obtain the cathode insulated column pattern, cathode insulated column is positioned on the insulating barrier, exposes the first electrode cabling.Wherein, cathode insulated column is down trapezoidal structure, negative electrode can be cut off.
Step 103: the viewing area of the substrate of cathode insulated column wiring zone evaporation organic functional material successively on making.
In the wiring zone, viewing area through the substrate after the operation of above-mentioned steps 101～step 103, successively the evaporation organic functional material comprises: hole-injecting material, hole mobile material, luminescent layer material, electron transport material, electronics injection material etc.
Wherein, needed also that before the evaporation organic function layer substrate is carried out plasma and clean, remove the impurity of substrate surface, improve work function.
Step 104: regional evaporation cathodic metal connects up in the viewing area of the substrate of organic functional material on peripheral wiring region territory and evaporation.
Behind evaporation organic functional material on the substrate, can make negative electrode, described cathode material can be selected Al, Mg, Ag etc. or alloy for use, cathodic metal thickness is 100nm (nanometer)～300nm, cathodic metal not only is positioned on the insulated column, also is deposited on the cabling that is separated by cathode insulated column and insulating barrier and expose.
In the present embodiment, regional evaporation cathodic metal not only connects up in the viewing area, also that described cathodic metal evaporation is regional to peripheral wiring, thereby deposit cathodic metal on the cabling in peripheral wiring zone, because the resistivity of metal is lower, behind the described metal of increase, can reduce the resistance on the peripheral wiring on the peripheral wiring, thereby make the voltage on the peripheral wiring reduce, reduced power consumption.
For the zone of described cathodic metal evaporation can being connected up to the periphery, can suitably increase the aperture area of metal mask version, reduce the scope of blocking in peripheral wiring zone, it is big that the aperture area of mask version becomes, thereby during the evaporation cathodic metal, cathodic metal can be plated to the zone that peripheral wiring zone is not blocked by the mask version, the concrete area of metal mask version can be set according to practical condition.
Step 105: utilize packaging plastic that bonnet is fitted on the substrate behind the evaporation cathodic metal.
Through the substrate after step 101～step 104 processing, can be packaged into device, form display of organic electroluminescence, utilize packaging plastic that bonnet is encapsulated on the described substrate, described packaging plastic need cover the cathodic metal in peripheral wiring zone fully, can effectively prevent the burning corrosion, specifically be on bonnet with baseplate-laminating place spot printing packaging plastic, bonnet is fitted on the described substrate then, the coating scope of packaging plastic need satisfy the cathodic metal that covers peripheral wiring zone fully, and described bonnet can be glass back cover or metal back cover.
Need to prove, in the present embodiment, on the cathodic metal evaporation connected up the zone to the periphery, the present invention does not limit the concrete evaporation scope in peripheral wiring region territory, only need satisfy and deposit cathodic metal on the peripheral wiring, make the resistance decline on the cabling get final product, concrete evaporation scope can be determined according to practical condition, thereby the area of metal mask version also can be set according to described evaporation scope, the insulating barrier of spin coating and cathode insulated column also need and cathodic metal evaporation scope is consistent on peripheral wiring region territory, make the peripheral zone of connecting up be unlikely to the phenomenon that is short-circuited.
The packaging plastic scope of spot printing need satisfy and can cover evaporation to the cathodic metal in peripheral wiring zone on the bonnet.
In the present embodiment, when carrying out the substrate manufacture of display of organic electroluminescence, the cathodic metal evaporation is regional to peripheral wiring, make and deposit described cathodic metal on the peripheral wiring, because the resistivity of metal is lower, thereby can reduce resistance on the regional cabling of peripheral wiring, reduce peripheral wiring voltage, thereby can reduce power consumption, improve the luminosity of display.
Referring to Fig. 2, show the flow chart of a kind of display of organic electroluminescence manufacture method of the present invention embodiment 2, described method can comprise:
Step 201: utilize photoetching process to obtain the auxiliary electrode pattern in wiring zone, substrate viewing area and peripheral wiring zone.
In the present embodiment, choose suitable substrate, sputter transparent conductive film on substrate, then on described transparent conductive film at one or more layers auxiliary electrode metal of sputter, at first make the auxiliary electrode pattern by lithography at substrate.
Step 202: utilize photoetching process to obtain first electrode pattern in wiring zone, substrate viewing area and peripheral wiring zone.
Make the auxiliary electrode pattern by lithography, utilize photoetching process photoetching first electrode pattern then.
In actual applications, the concrete flow process of the operation of step 201 and step 202 can for:
At first choose the substrate of appropriate size and thickness, can be glass substrate, described substrate is cleaned.
Substrate after the described cleaning is moved into sputtering equipment sputter transparent conductive film, can select the ITO transparent conductive film for use in the present embodiment, sputter thickness 100nm～180nm, and carry out annealing in process, 300 °～500 ° of annealing temperatures.
On described transparent conductive film at sputter auxiliary electrode metal; described auxiliary electrode metal can be metal materials such as chromium Cr, copper Cu, aluminium Al; on described auxiliary electrode metal, can also can be molybdenum Mo, chromium Cr etc. by sputter protective layer metal; not oxidized for the protection of the auxiliary electrode metal, described protective layer metal can be one or more layers.
With sputter have the auxiliary electrode metal substrate spin coating photoresist, expose, develop.Demoulding in etching, the alkaline solution in acid solution obtains required auxiliary electrode pattern, and the live width of auxiliary electrode cabling can be 130um～180um, the spacing 20um between the cabling～30um.
On the substrate that forms the auxiliary electrode pattern, carrying out gluing, exposure, development, and in acid solution photoetching process such as demoulding in etching, the alkaline solution, obtain first electrode pattern.Wherein, the live width of the first electrode cabling can be 150um～200um, the spacing 10um between the cabling～20um.
In the present embodiment, the cabling in peripheral wiring region territory has increased the auxiliary electrode metal, and the auxiliary electrode metal is selected the lower metal of resistivity, thereby can reduce the resistance on the peripheral wiring to a certain extent.
Step 203: make insulating barrier and cathode insulated column successively, cover described wiring zone, viewing area and the peripheral wiring zone that does not comprise first electrode pattern.
Because anode material has conductivity, before the evaporation cathodic metal, need to make earlier insulating barrier and cathode insulated column, will separate between the first electrode cabling, be deposited on regional and described first electrode of the whole wiring phenomenon that is short-circuited to avoid cathodic metal.
Concrete manufacturing process can be described referring to method embodiment 1, first electrode material can be ITO, and first electrode pattern in that substrate forms namely can refer to the ITO cabling, insulating barrier and cathode insulated column difference photoetching are successively exposed the ITO cabling between described ITO cabling.
Insulating barrier and cathode insulated column not only cover wiring zone, viewing area, and the protection viewing area needs photoetching in peripheral wiring region territory simultaneously, cover peripheral wiring zone.
Step 204: the viewing area of the substrate of insulating barrier and cathode insulated column wiring zone evaporation organic functional material successively on making.
Step 205: the viewing area of the substrate of organic functional material wiring zone and the regional evaporation cathodic metal material of peripheral wiring on evaporation.
In embodiments of the present invention, not only with the negative electrode of cathodic metal as display of organic electroluminescence, evaporation is in the wiring zone of viewing area, cathodic metal is also regional to peripheral wiring by evaporation simultaneously, the cathodic metal evaporation is on insulating barrier and cathode insulated column, be deposited on simultaneously and be insulated on layer and the peripheral wiring that separates of cathode insulated column, the auxiliary electrode metal is not only arranged on the peripheral wiring, transparent conductive film, also deposit cathodic metal simultaneously, thereby make the resistance of peripheral wiring reduce, reduced the voltage on the peripheral wiring, thereby reduced power consumption, improved the device luminosity.
Need to prove, when the evaporation cathodic metal of peripheral wiring region territory, concrete evaporation scope can be set according to actual conditions, the insulating barrier of spin coating and cathode insulated column need and cathodic metal evaporation scope are consistent on peripheral wiring region territory, make peripheral wiring zone be unlikely to the phenomenon that is short-circuited.
Step 206: utilize packaging plastic that bonnet is fitted on the evaporation on the substrate behind the cathodic metal.
Full-filling packaging plastic on the fit area of described bonnet and substrate, then described bonnet is fitted on the substrate, in order to prevent that effectively the cathodic metal oxidation is corroded, the coating scope of described packaging plastic need satisfy the cathodic metal that can cover peripheral wiring zone fully.
Described packaging plastic is generally UV glue, wherein, can also post drier on described bonnet.Be used for absorption and enter the interior steam of display of organic electroluminescence, oxygen etc.
In the present embodiment, in the manufacturing process of the substrate of display of organic electroluminescence, to peripheral wiring zone, make cathodic metal can be deposited on the peripheral wiring cathodic metal evaporation, thereby can be so that the resistance of peripheral wiring reduces, and, before the photoetching anode pattern, elder generation's photoetching auxiliary electrode on substrate, thereby make and comprised auxiliary electrode metal and cathodic metal on the peripheral wiring, thereby further reduced the resistance of peripheral wiring, made peripheral wiring voltage descend, power consumption reduces.
The present invention also provides the display of organic electroluminescence that utilizes said method to make, Fig. 3 shows the substrate wiring administrative division map of display of organic electroluminescence, as seen from the figure, described dashed region is wiring zone, viewing area 301, and remainder is peripheral wiring zone 302.Fig. 4 shows a structural representation of organic light emitting display of the present invention.
Fig. 5 illustrates the cutaway view of display of organic electroluminescence substrate of the present invention.
In conjunction with Fig. 3, Fig. 4 and Fig. 5, the structure of the embodiment 1 of display of organic electroluminescence provided by the invention can comprise:
First electrode comprises anode and is used for the electrode that is connected with the negative electrode overlap joint, because display can only be powered by the substrate place, the negative electrode of substrate can be communicated with power supply by the connection electrode in first electrode, connect the wiring zone, periphery that electrode pattern is formed at substrate, anode pattern is formed at viewing area and the peripheral wiring zone of substrate, thereby the viewing area cabling is the anode cabling, peripheral wiring comprises the anode cabling and is connected the electrode cabling, and the anode cabling of viewing area links to each other with anode cabling in the peripheral wiring.
The material of first electrode is transparent electrically-conductive film, can be ITO.
Be positioned at the insulating barrier 403 on wiring zone, substrate 401 viewing areas 301 and the peripheral wiring zone 302, described insulating barrier 403 is between first electrode, 402 cablings.
All make insulating barrier on wiring zone, viewing area and peripheral wiring zone, insulating barrier separates the first electrode cabling between the first electrode cabling.
Be positioned at the cathode insulated column 404 on the described insulating barrier 403.
The cathodic metal 405 of evaporation on wiring zone, viewing area 301 and peripheral wiring zone 302.
Cathodic metal is not only as the negative electrode of display, be positioned at wiring zone, viewing area, also be positioned at described peripheral wiring zone, be deposited on the peripheral wiring, for reducing the resistance of peripheral wiring, described with the cathodic metal evaporation in wiring zone, viewing area and peripheral wiring zone, that is to say that evaporation is in described insulating barrier and cathode insulated column in-scope.
The organic function layer 406 cathodic metal 405 and first electrode 402 between of evaporation in wiring zone, viewing area 301.
Because first electrode in wiring zone, viewing area is the anode as display, cathodic metal is the negative electrode as display, and described organic function layer namely is between the anode and negative electrode in wiring zone, viewing area.
Be fitted in the bonnet 407 on the described substrate 401.
Wherein, bonnet and baseplate-laminating place scribble packaging plastic 408, described packaging plastic coating scope need satisfy the cathodic metal that can cover described peripheral wiring zone fully, can also comprise drier 409 on the described bonnet, described drier is used for absorption and enters the interior steam of display of organic electroluminescence, oxygen etc.
In the present embodiment, the cathodic metal of described display of organic electroluminescence not only is positioned at wiring zone, viewing area, also be positioned at peripheral wiring zone, be that described cathodic metal is not only as the negative electrode of display, be deposited on simultaneously on the peripheral wiring in peripheral wiring zone, reduce the resistance on the peripheral wiring, thereby reduced peripheral wiring voltage, reduce power consumption, improved the luminosity of device.
The structure of a kind of display of organic electroluminescence embodiment 2 provided by the invention can comprise:
Substrate.
Auxiliary electrode and first electrode of photoetching on wiring zone, substrate viewing area and peripheral wiring zone.
Be positioned at the insulating barrier on wiring zone, substrate viewing area and the peripheral wiring zone, described insulating barrier is between the first electrode cabling.
Be positioned at the cathode insulated column on the described insulating barrier.
The cathodic metal of evaporation on wiring zone, described viewing area and peripheral wiring zone.
The evaporation organic function layer of regional meta between described cathodic metal and first electrode that connect up in described viewing area.
Be fitted in the bonnet on the described substrate.
In this enforcement, be with the structure difference of above-mentioned display of organic electroluminescence embodiment 1, also include auxiliary electrode, in the display of organic electroluminescence manufacturing process, behind sputter transparent conductive film on the substrate, can also be on described transparent conductive film sputter auxiliary electrode metal, carry out photoetching then, obtain auxiliary electrode and first electrode, making not only has transparent conductive film on the peripheral regional cabling that connects up, and also deposits one deck auxiliary electrode metal, because during the evaporation cathodic metal, cathodic metal also is deposited on the cabling in peripheral wiring zone, makes peripheral wiring resistance reduce, and increases the auxiliary electrode metal again, further reduced the resistance on the peripheral wiring, reduce pressure drop, reduced power consumption, improved the device luminosity.
In actual applications, organic electroluminescent device provided by the present invention is because cathodic metal also is positioned at peripheral wiring zone, and be deposited on the peripheral wiring, can therefore also can not comprise auxiliary electrode so that resistance reduces, thereby can save resource, reduce processing step, raise the efficiency.Certainly when comprise auxiliary electrode, can make that resistance further reduces on the peripheral regional cabling that connects up, thereby can further reduce power consumption.
Each embodiment adopts the mode of going forward one by one to describe in this specification, and what each embodiment stressed is and the difference of other embodiment that identical similar part is mutually referring to getting final product between each embodiment.For the disclosed device of embodiment, because it is corresponding with the embodiment disclosed method, so description is fairly simple, relevant part partly illustrates referring to method and gets final product.
To the above-mentioned explanation of the disclosed embodiments, make this area professional and technical personnel can realize or use the present invention.Multiple modification to these embodiment will be apparent concerning those skilled in the art, and defined General Principle can realize under the situation that does not break away from the spirit or scope of the present invention in other embodiments herein.Therefore, the present invention will can not be restricted to these embodiment shown in this article, but will meet the wideest scope consistent with principle disclosed herein and features of novelty.
Claims (10)
1. a display of organic electroluminescence manufacture method is characterized in that, comprising:
Utilize photoetching process to obtain first electrode pattern in wiring zone, substrate viewing area and peripheral wiring zone;
Make insulating barrier and cathode insulated column successively, cover the wiring zone, described viewing area and the peripheral wiring zone that do not comprise first electrode pattern;
The viewing area of the substrate of cathode insulated column wiring zone evaporation organic functional material successively on making;
Regional evaporation cathodic metal connects up in the viewing area of the substrate of organic functional material on peripheral wiring region territory and evaporation;
Utilize packaging plastic that bonnet is fitted on the substrate after evaporation has cathodic metal.
2. method according to claim 1 is characterized in that, the described photoetching process of utilizing obtains also to comprise before first electrode pattern:
Utilize photoetching process to obtain the auxiliary electrode pattern in wiring zone, substrate viewing area and peripheral wiring zone.
3. method according to claim 1 is characterized in that, utilizes packaging plastic that glass back cover is fitted on the substrate behind the evaporation cathodic metal and is specially:
Spot printing packaging plastic on described bonnet is fitted in bonnet on the described substrate, and described packaging plastic covers the cathodic metal in described peripheral wiring zone.
4. method according to claim 3 is characterized in that, posts drier on the described glass back cover.
5. method according to claim 1 is characterized in that, the cabling live width of described first electrode pattern is 150 microns～200 microns, walks 10 microns～20 microns of distance between centers of tracks.
6. a display of organic electroluminescence is characterized in that, comprises substrate;
Photoetching is formed on the wiring zone, viewing area of described substrate and first electrode on the peripheral wiring zone, and described first electrode comprises anode and is connected electrode;
Be positioned at the insulating barrier on wiring zone, substrate viewing area and the peripheral wiring zone, described insulating barrier is between the first electrode cabling, and the viewing area cabling is the anode cabling, and peripheral wiring comprises the anode cabling and is connected the electrode cabling;
Be positioned at the cathode insulated column on the described insulating barrier;
The cathodic metal of evaporation on wiring zone, described viewing area and peripheral wiring zone, described cathodic metal evaporation is in described insulating barrier and described cathode insulated column in-scope, and described insulating barrier and the described cathode insulated column of spin coating on described peripheral wiring zone are consistent with the scope of described cathodic metal evaporation;
Evaporation organic function layer in wiring zone, described viewing area and between first electrode and cathodic metal;
Be fitted in the bonnet on the described substrate.
7. display according to claim 6 is characterized in that, described first electrode material is tin indium oxide ITO.
8. display according to claim 6 is characterized in that, the cabling live width of described first electrode is 150 microns～200 microns, walks 10 microns～20 microns of distance between centers of tracks.
9. display according to claim 6 is characterized in that, described substrate is glass substrate.
10. a display of organic electroluminescence is characterized in that, comprises substrate;
Photoetching is formed on the wiring zone, viewing area of described substrate and auxiliary electrode and first electrode on the peripheral wiring zone, and described electrode comprises anode and is connected electrode;
Be positioned at the insulating barrier on wiring zone, substrate viewing area and the peripheral wiring zone, described insulating barrier is between the first electrode cabling, and the viewing area cabling is the anode cabling, and peripheral wiring comprises the anode cabling and is connected the electrode cabling;
Be positioned at the cathode insulated column on the described insulating barrier;
The cathodic metal of evaporation on wiring zone, described viewing area and peripheral wiring zone, described cathodic metal evaporation is in described insulating barrier and described cathode insulated column in-scope, and described insulating barrier and the described cathode insulated column of spin coating on described peripheral wiring zone are consistent with the scope of described cathodic metal evaporation;
The organic function layer of evaporation in wiring zone, described viewing area and between described first electrode and cathodic metal;
Be fitted in the bonnet on the described substrate.
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| CN103022375A (en) * | 2012-12-05 | 2013-04-03 | 昆山维信诺显示技术有限公司 | Organic light-emitting diode (OLED) device and preparation method thereof |
| CN103682159B (en) * | 2013-12-12 | 2018-05-01 | 固安翌光科技有限公司 | A kind of organic light emission lighting device and preparation method thereof |
| JP6331407B2 (en) * | 2014-01-16 | 2018-05-30 | 凸版印刷株式会社 | Light emitting device and method for manufacturing light emitting device |
| CN104538560A (en) * | 2015-01-06 | 2015-04-22 | 信利半导体有限公司 | Electrode substrate and processing method thereof |
| CN106848103B (en) * | 2017-03-30 | 2020-07-17 | 昆山维信诺科技有限公司 | O L ED substrate, manufacturing method thereof and display device |
| CN107359179A (en) * | 2017-07-07 | 2017-11-17 | 安徽熙泰智能科技有限公司 | A kind of preparation method of OLED micro-display devices |
| CN109599498B (en) * | 2017-09-30 | 2020-11-17 | 云谷（固安）科技有限公司 | Display panel and evaporation mask |
| CN109378408B (en) * | 2018-10-11 | 2020-04-10 | 信利半导体有限公司 | Flexible OLED device preparation method, flexible OLED device and display device |
| CN109309172A (en) * | 2018-10-11 | 2019-02-05 | 信利半导体有限公司 | Flexible OLED devices and its manufacturing method, display device |
| CN110071217B (en) * | 2019-03-29 | 2023-12-12 | 武汉华星光电半导体显示技术有限公司 | Mask plate, manufacturing method of display panel and display device |
| CN110176483B (en) * | 2019-06-24 | 2020-10-27 | 深圳市华星光电半导体显示技术有限公司 | Organic light emitting diode display |
| CN112331800A (en) * | 2020-10-26 | 2021-02-05 | 福建华佳彩有限公司 | Semiconductor device and manufacturing method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1329458A (en) * | 2001-04-27 | 2002-01-02 | 清华大学 | Preparation method of organic electroluminescent device |
| CN1416300A (en) * | 2002-11-12 | 2003-05-07 | 清华大学 | Orgnic electroluminescence device and its preparation device |
| CN101118953A (en) * | 2007-08-10 | 2008-02-06 | 信利半导体有限公司 | Organic electroluminescent device and method for producing the same |
| CN101800293A (en) * | 2010-03-15 | 2010-08-11 | 彩虹集团公司 | Manufacturing method of organic light emitting diode, insulation layer and isolation column thereof |
| CN101968948A (en) * | 2010-09-20 | 2011-02-09 | 四川虹视显示技术有限公司 | Auxiliary electrode structure for organic light emitting diode (OLED) illuminating panel |
| CN102013457A (en) * | 2010-10-29 | 2011-04-13 | 信利半导体有限公司 | Manufacture method of OLED (organic light emitting diode) device and OLED device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005183184A (en) * | 2003-12-19 | 2005-07-07 | Asahi Glass Co Ltd | Manufacturing method of organic el display device |
| JP2008181852A (en) * | 2006-12-26 | 2008-08-07 | Fuji Electric Holdings Co Ltd | Organic el display |
-
2011
- 2011-06-30 CN CN 201110181471 patent/CN102222684B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1329458A (en) * | 2001-04-27 | 2002-01-02 | 清华大学 | Preparation method of organic electroluminescent device |
| CN1416300A (en) * | 2002-11-12 | 2003-05-07 | 清华大学 | Orgnic electroluminescence device and its preparation device |
| CN101118953A (en) * | 2007-08-10 | 2008-02-06 | 信利半导体有限公司 | Organic electroluminescent device and method for producing the same |
| CN101800293A (en) * | 2010-03-15 | 2010-08-11 | 彩虹集团公司 | Manufacturing method of organic light emitting diode, insulation layer and isolation column thereof |
| CN101968948A (en) * | 2010-09-20 | 2011-02-09 | 四川虹视显示技术有限公司 | Auxiliary electrode structure for organic light emitting diode (OLED) illuminating panel |
| CN102013457A (en) * | 2010-10-29 | 2011-04-13 | 信利半导体有限公司 | Manufacture method of OLED (organic light emitting diode) device and OLED device |
Non-Patent Citations (2)
| Title |
|---|
| JP特开2005-183184A 2005.07.07 |
| JP特开2008-181852A 2008.08.07 |
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