CN113314582A - Flexible display substrate, manufacturing method thereof and display panel - Google Patents
Flexible display substrate, manufacturing method thereof and display panel Download PDFInfo
- Publication number
- CN113314582A CN113314582A CN202110586342.6A CN202110586342A CN113314582A CN 113314582 A CN113314582 A CN 113314582A CN 202110586342 A CN202110586342 A CN 202110586342A CN 113314582 A CN113314582 A CN 113314582A
- Authority
- CN
- China
- Prior art keywords
- layer
- substrate
- flexible
- cutting
- flexible display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention provides a flexible display substrate, a manufacturing method thereof and a display panel, wherein the flexible display substrate comprises: the flexible substrate comprises a display area, a non-display area surrounding the display area and a binding area located in the non-display area, wherein at least one cutting channel partially surrounding the binding area is arranged on at least one side of the binding area; the display area is provided with the multilayer insulating layer, and parts of the multilayer insulating layer and the at least two insulating layers are manufactured in the same layer. The method is used for improving the product yield of the display panel.
Description
Technical Field
The invention relates to the technical field of display, in particular to a flexible display substrate, a manufacturing method thereof and a display panel.
Background
In the conventional process of manufacturing flexible Organic Light-Emitting Diode (OLED), a plurality of OLED display panels are usually manufactured on a mother substrate, and after the evaporation and packaging processes are completed, the mother substrate is cut into a plurality of display panels.
In the laser cutting process, all the inorganic layers corresponding to the cutting channel positions are reserved, and only the organic layer parts are subjected to groove design, so that cracks are easily generated in the cutting process, and all the inorganic layers at the cutting channel positions are etched. Although the generation of cracks is avoided, due to the removal of all inorganic layers, when the rigid substrate is removed, other film layers at the cutting path cannot be adhered to the upper protective film and pulled up, wrinkles are generated, when the lower protective film is attached, attachment bubbles are generated at the cutting path, and even irregular warping occurs at two sides of the binding electrode in the binding area, so that the product is poor.
Disclosure of Invention
The invention provides a flexible display substrate, a manufacturing method thereof and a display panel, which are used for improving the product yield of the display panel.
In a first aspect, an embodiment of the present invention provides a flexible display substrate, including:
the flexible substrate comprises a display area, a non-display area surrounding the display area and a binding area located in the non-display area, wherein at least one cutting channel partially surrounding the binding area is arranged on at least one side of the binding area;
the display area is provided with the multilayer insulating layer, and parts of the multilayer insulating layer and the at least two insulating layers are manufactured in the same layer.
In one possible implementation manner, the multi-layer insulating layer includes a supporting layer, a buffer layer, a first gate insulating layer, a second gate insulating layer, an interlayer insulating layer, a planarization layer, a pixel defining layer, and a thin film encapsulation layer, which are sequentially disposed away from the flexible substrate.
In a possible implementation manner, the at least two insulating layers include the support layer, at least one of the buffer layers, and the flat layer, which are sequentially disposed away from the flexible substrate.
In a possible implementation manner, the thickness of the support layer and the buffer layer at the cutting channel ranges from 5000 angstroms to 8000 angstroms, and the thickness direction of the support layer and the buffer layer is along a direction perpendicular to the plane of the flexible substrate.
In a possible implementation manner, the multi-layer insulating layer further includes a passivation layer located between the interlayer insulating layer and the flat layer, and the at least two insulating layers include the passivation layer and the flat layer which are sequentially arranged away from the flexible substrate.
In a possible implementation manner, the thickness of the passivation layer ranges from 1500 angstroms to 2000 angstroms, and the thickness direction of the passivation layer is along a direction perpendicular to the plane of the flexible substrate.
In one possible implementation, the portion of the passivation layer at the scribe line is provided disconnected from other portions.
In a possible implementation manner, the multilayer insulating layer further includes a touch protection layer located on one side of the film packaging layer, which deviates from the flexible substrate, and the at least two insulating layers include a flat layer and the touch protection layer, which deviate from the flexible substrate in sequence.
In a possible implementation manner, the thickness of the flat layer at the cutting path is smaller than that of the flat layer at the display area.
In a second aspect, an embodiment of the present invention provides a display panel, including:
a flexible display substrate as described above.
In a third aspect, an embodiment of the present invention provides a method for manufacturing a flexible display substrate, where the method includes:
disposing a motherboard comprising the flexible substrate on a rigid substrate;
forming the multi-layered insulating layer on the flexible substrate;
etching a part of the multi-layer insulating layer, and forming a pattern comprising the at least two layers of insulating layers at each cutting path of the motherboard;
peeling the rigid substrate from the flexible substrate by adopting a laser peeling technology;
attaching a protective film to one side of the flexible substrate, which is far away from the multilayer insulating layer;
and cutting the motherboard into a plurality of flexible display substrates along the cutting channels.
The invention has the following beneficial effects:
the embodiment of the invention provides a flexible display substrate, a manufacturing method thereof and a display panel, wherein the flexible display substrate comprises a flexible substrate and a plurality of insulating layers arranged on the flexible substrate, the flexible substrate comprises a display area, a non-display area surrounding the display area and a binding area positioned in the non-display area, at least one cutting channel partially surrounding the binding area is arranged on at least one side of the binding area, at least two insulating layers are arranged at each cutting channel, the display area is provided with the plurality of insulating layers, and part of the plurality of insulating layers and the at least two insulating layers are manufactured in the same layer. Therefore, the thickness of at least two layers of insulation layers reserved at the cutting channel position of the flexible display substrate is smaller than the thickness of a plurality of layers of insulation layers reserved at the display area position, in this way, in the cutting process along the cutting channel, not only is the generation of cracks avoided, but also a part of insulation layers are reserved, so that the stress at the cutting channel position is enhanced, after rigid substrates such as glass are removed, the flatness of the surface of the attached protective film is ensured, the generation of attaching bubbles at the cutting channel position is avoided, even if the two sides of the bound electrode in the binding area are used, irregular warping is effectively avoided, and the product yield of the display panel is improved.
Drawings
FIG. 1 is a schematic structural diagram of a flexible OLED at a position of a scribe line in the related art;
FIG. 2 is a schematic structural view of a flexible substrate surface with wrinkles formed after removing the glass substrate of FIG. 1;
fig. 3 is a schematic structural diagram of a flexible display substrate according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of one distribution of a display area, a non-display area and a bonding area in the flexible display substrate shown in FIG. 3;
FIG. 5 is a schematic diagram of one distribution of a display area, a non-display area and a bonding area in the flexible display substrate shown in FIG. 3;
fig. 6 is a schematic structural diagram of a flexible display substrate in a display area according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of an insulating layer at a scribe line in a flexible display substrate according to a first implementation manner of the present invention;
fig. 8 is a schematic structural diagram of an insulating layer at a scribe line in a flexible display substrate according to a second implementation manner of the present invention;
fig. 9 is a schematic structural diagram of a flexible display substrate in a display area according to an embodiment of the present invention;
fig. 10 is a schematic structural diagram of an insulating layer at a scribe line in a flexible display substrate according to a third implementation manner of the present invention;
fig. 11 is a schematic structural diagram of a flexible display substrate in a display area according to an embodiment of the present invention;
fig. 12 is a schematic structural diagram of an insulating layer at a scribe line in a flexible display substrate according to a fourth implementation manner of the present invention;
fig. 13 is a schematic structural diagram of a flexible display substrate in a display area according to an embodiment of the present invention;
fig. 14 is a schematic structural diagram of a flexible display substrate in a display area according to an embodiment of the present invention;
fig. 15 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
fig. 16 is a schematic structural diagram of a display device according to an embodiment of the invention;
fig. 17 is a flowchart of a method for manufacturing a flexible display substrate according to an embodiment of the present invention.
Description of reference numerals:
01-a first flexible substrate layer; 02-a second flexible substrate layer; 03-a first support layer; 04-a second support layer; 05-an inorganic layer; 06-protective film is arranged; 07-a glass substrate; 08-other film layers; 1-a flexible substrate; 2-an insulating layer; 3-cutting a channel; 4-a support layer; 5-a buffer layer; 6-an active layer; 7-a first gate insulating layer; 8-a first gate layer; 9-a second gate insulating layer; 10-a second gate layer; 11-an interlayer insulating layer; 12-a source drain layer; 13-a planar layer; 14-a pixel defining layer; 15-an anode layer; 16-a light-emitting layer; 17-a cathode layer; 18-a thin film encapsulation layer; 19-a composite film layer; 20-a passivation layer; 21-a touch protection layer; 22-a touch functional layer; 221-a first metal layer; 222-a second metal layer; 220-touch control insulating layer; 23-touch buffer layer; 24-a protective film; 101-a first flexible substrate layer; 102-a second flexible substrate layer; 103-another support layer; 30-a flexible display substrate; 31-a cover plate; 40-display panel.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. And the embodiments and features of the embodiments may be combined with each other without conflict. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention without any inventive step, are within the scope of protection of the invention.
Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The use of the word "comprise" or "comprises", and the like, in the context of this application, is intended to mean that the elements or items listed before that word, in addition to those listed after that word, do not exclude other elements or items.
It should be noted that the sizes and shapes of the figures in the drawings are not to be considered true scale, but are merely intended to schematically illustrate the present invention. And the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout.
In the related art, in the process of manufacturing a flexible OLED, it is often necessary to remove a rigid substrate, such as a glass substrate, and use a flexible substrate as a substrate. In order to protect the flexible substrate from damage, a flexible protective film needs to be attached before and after the rigid substrate is removed. For example, when a flexible substrate is prepared by using a double-layer flexible substrate layer (a first flexible substrate layer 01 and a second flexible substrate layer 02) and a double-layer support layer (a first support layer 03 and a second support layer 04) as shown in fig. 1 and 2, the inorganic layer 05 and the second support layer 04 on the surface of the second flexible substrate layer 02 at the position of a cutting track of laser cutting (shown by a dotted line L in the figure) are completely etched away, for example, the etching thickness is 15000 angstroms, only the first flexible substrate layer 01, the first support layer 03 and the second flexible substrate layer 02 exist at the position of the cutting track, and the thickness of the film layer at the cutting track is lower than the thickness of two sides of the cutting track in the direction perpendicular to the plane of the first flexible substrate layer 01. Since the upper protective film (TPF)06 has a tack force of 1.1gf/25mm, which tends to be low, when the glass substrate 07 is removed using laser, stress is released in the display panel, and the film layer at the cutting street cannot be adhered to the upper protective film 06 to be pulled up, resulting in wrinkles (as shown by the dotted line frame a) as shown in fig. 2. Furthermore, the flexible OLED in fig. 1 and 2 comprises, in addition to the above-mentioned film layers, further film layers, which are indicated with reference numeral 08. In this way, after the lower protective film is attached, attachment bubbles are generated at the position of the wrinkles, and particularly, irregular warping occurs on two sides of the binding electrode in the binding area, thereby causing poor products.
In view of this, embodiments of the present invention provide a flexible display substrate, a manufacturing method thereof, and a display panel, which are used to avoid a bonding bubble between a lower protective film and a flexible substrate at a position of a scribe line, improve irregular warpage on two sides of a bonding electrode in a bonding region, and improve the product yield of the display panel.
As shown in fig. 3, a flexible display substrate according to an embodiment of the present invention includes:
the flexible substrate 1 comprises a display area A, a non-display area B surrounding the display area A, and a binding area C located in the non-display area B, wherein at least one cutting channel 3 partially surrounding the binding area C is arranged on at least one side of the binding area C;
at least two layers of insulating layers are arranged at the cutting channel 3, the multilayer insulating layers are arranged in the display area A, and parts of the multilayer insulating layers and the at least two layers of insulating layers are manufactured in the same layer.
In the embodiment of the present invention, the flexible substrate 1 may be a structure shown in fig. 1 and fig. 2 and including two layers of flexible substrates 1, may also be a structure including three layers of flexible substrates, and may also be a structure including one layer of flexible substrates and one layer of support layer, which is not limited herein, where the flexible substrates may be made of Polyimide (PI).
In a specific implementation process, the flexible display substrate includes the flexible substrate 1 and a plurality of insulating layers disposed on the flexible substrate 1, where the flexible substrate 1 includes a display area a, a non-display area B surrounding the display area a, and a bonding area C located in the non-display area B, where at least one side of the bonding area C is provided with at least one cutting street 3 partially surrounding the bonding area C, and one of distribution diagrams of the display area a, the non-display area B, and the bonding area C may be as shown in fig. 4, or as shown in fig. 5, and of course, specific distributions of the display area a, the non-display area B, and the bonding area C may be set according to actual application needs, which is not limited herein. In addition, the at least one cutting street 3 partially surrounding the bonding region C is disposed on the periphery of the bonding region C, the width of each cutting street 3 in the at least one cutting street 3 may be set by a person skilled in the art according to an actual application, the specific number of the at least one cutting street 3 may be determined according to the actual application, and fig. 4 and 5 respectively illustrate a case where the number of the cutting street 3 is two, which is not limited herein.
In a specific implementation process, at least two insulating layers are disposed at the cutting street 3, and each insulating layer of the at least two insulating layers may be an organic insulating layer or an inorganic insulating layer, which is not limited herein. The display area A is provided with the multiple insulating layers, and parts of the multiple insulating layers and the at least two insulating layers are manufactured in the same layer. Therefore, the thickness of the at least two insulating layers at the cutting path 3 is smaller than that of the multiple insulating layers at the display area A, so that in the cutting process along the cutting path 3, not only is the generation of cracks avoided, but also the stress at the position of the cutting path 3 is enhanced due to the existence of the at least two insulating layers at the cutting path 3, after a rigid substrate such as glass is removed, the flatness of the surface of the attached protective film is ensured, the generation of attaching bubbles at the cutting path 3 is avoided, and even if the two sides of the binding electrode at the binding area C are provided, irregular warping can be effectively avoided, so that the manufacturing yield of the flexible display substrate is improved.
It should be noted that the "same layer" in the embodiments of the present invention may refer to a film layer on the same structural layer. For example, the film layers in the same layer may be related film layers formed by the same film forming process, and then the film layers are patterned by the same mask plate through a single patterning process to form a layer structure with a specific pattern, the single patterning process may include multiple exposure, development or etching processes according to the difference of the specific pattern, the specific pattern in the formed layer structure may be continuous or discontinuous, and the specific patterns may be at different heights or have different thicknesses, and may be specifically set according to the actual application requirements.
In the embodiment of the present invention, as shown in fig. 6, a schematic structural diagram of the flexible display substrate in the display area a is shown, where the display area a includes a support layer 4, a buffer layer 5, an active layer 6, a first gate insulating layer 7, a first gate insulating layer 8, a second gate insulating layer 9, a second gate insulating layer 10, an interlayer insulating layer 11, a source/drain electrode layer 12, a planarization layer 13, a pixel defining layer 14, an anode layer 15, a light emitting layer 16, a cathode layer 17, and a Thin Film Encapsulation layer (TFE) 18, which are sequentially disposed away from the flexible substrate 1, and the display area a may further include other Film layers, and details of related Film layers are not described herein. Correspondingly, the multi-layer insulating layer 2 in the display area a includes the support layer 4, the buffer layer 5, the first gate insulating layer 7, the second gate insulating layer 9, the interlayer insulating layer 11, the planarization layer 13, the pixel defining layer 14, and the thin film encapsulation layer 18, which are sequentially disposed away from the flexible substrate 1. The film packaging layer effectively isolates external water and oxygen, and the service performance of the flexible display substrate is ensured.
In the embodiment of the present invention, when the display area a includes the relevant film layer as shown in fig. 6, the following four implementation manners may be adopted to set the insulating layer structure at the cutting street 3, but not limited to the following four implementation manners. The structure of the insulating layer at the cutting street 3 may also be implemented in other ways according to practical application requirements, and is not limited herein.
In a specific implementation process, the at least two insulating layers include the support layer 4, at least one of the buffer layer 5, and the planarization layer 13, which are sequentially disposed away from the flexible substrate 1, as shown in fig. 7, which is a schematic structural diagram in a first implementation manner, and the at least two insulating layers include the support layer 4, the buffer layer 5, and the planarization layer 13, which are sequentially disposed away from the flexible substrate 1, where reference numeral 19 in fig. 7 denotes a composite film layer, and a specific structure of the composite film layer 19 may be set according to related film layers in the display area a, for example, the composite film layer 19 includes the first gate insulating layer 7, the second gate insulating layer 9, and the interlayer insulating layer 11, which are sequentially disposed away from the flexible substrate 1, and may also include other film layer structures, which are not described in detail herein. Therefore, the supporting layer 4, the buffer layer 5 and the flat layer 13 which are sequentially arranged away from the flexible substrate 1 in the position 1 are reserved at the cutting channel 3, and due to the existence of the supporting layer 4, the buffer layer 5 and the flat layer 13 at the cutting channel 3, the stress at the position of the cutting channel 3 is enhanced, even after a rigid substrate such as glass is removed, the flatness of the surface of a bonded protective film can be still ensured, further, the generation of bonding bubbles at the cutting channel 3 is avoided, and the manufacturing yield of the flexible display substrate is improved.
In a specific implementation process, still referring to fig. 7, the thicknesses of the support layer 4 and the buffer layer 5 at the scribe line 3 range from 5000 angstroms to 8000 angstroms, the thickness directions of the support layer 4 and the buffer layer 5 are along a direction perpendicular to the plane of the flexible substrate 1, the thicknesses of the support layer 4 and the buffer layer 5 are shown by reference sign d in fig. 7, accordingly, the thickness of the multilayer insulating layer disposed in the display area a may be 15000 angstroms, and in a specific implementation process, the specific thicknesses of the support layer 4 and the buffer layer 5 at the scribe line 3 and the thicknesses of the multilayer insulating layers in the display area a may be set according to a practical application, and are not limited herein. Because the part of the insulating layer including at least one of the supporting layer 4 and the buffer layer 5 is remained at the cutting path 3 besides the flat layer 13, the generation of cracks in the cutting process is effectively avoided. The thickness of the supporting layer 4 and the buffer layer 5 reserved in the cutting channel 3 can be 7500 angstroms, and as a part of the insulating layer is reserved in the cutting channel 3, cracks are prevented from being generated in the cutting process, meanwhile, the stress at the cutting channel 3 is correspondingly enhanced, even after a rigid substrate such as glass is removed, the flatness of the surface of the attached protective film can be still ensured, the generation of attaching bubbles at the cutting channel 3 is avoided, and the manufacturing yield of the flexible display substrate is improved.
A second realization is shown in fig. 8, where the at least two insulating layers comprise a support layer 4 and a planar layer 13 arranged in succession away from the flexible substrate 1, wherein the thickness of the support layer 4 can be 2000 angstroms, the thickness direction of the support layer 4 is along the direction vertical to the plane of the flexible substrate 1, the thickness of the support layer 4 is indicated by reference character c in fig. 8, that is, the support layer 4 remains at the cutting lanes 3 in addition to the flat layer 13, due to the existence of the supporting layer 4 and the flat layer 13 at the cutting channel 3, the stress at the position of the cutting channel 3 is enhanced, even after a rigid substrate such as glass is removed, the flatness of the surface of the attached protective film can be ensured, and further, the generation of attaching bubbles at the cutting channel 3 is avoided, and the manufacturing yield of the flexible display substrate is improved.
In the embodiment of the present invention, as shown in fig. 9, the structure of the flexible display substrate in the display area a is schematically illustrated, the multi-layer insulating layer 2 further includes a passivation layer 20 located between the interlayer insulating layer 11 and the flat layer 13, and correspondingly, as shown in fig. 10, the structure of the insulating layer at the cutting street 3 is configured by adopting a third implementation manner, and the at least two layers of insulating layers include the passivation layer 20 and the flat layer 13 that are sequentially disposed away from the flexible substrate 1.
Still referring to fig. 10, the passivation layer 20 and the planarization layer 13 sequentially arranged away from the flexible substrate 1 remain at the cutting street 3, and due to the existence of the passivation layer 20 and the planarization layer 13 at the cutting street 3, the stress at the cutting street 3 is enhanced, and even after a rigid substrate such as glass is removed, the flatness of the surface of a bonded protective film can be ensured, so that the generation of bonding bubbles at the cutting street 3 is avoided, and the manufacturing yield of the flexible display substrate is improved.
In a specific implementation process, still referring to fig. 10, a thickness of the passivation layer 20 ranges from 1500 angstroms to 2000 angstroms, a thickness direction of the passivation layer 20 is along a direction perpendicular to a plane of the flexible substrate 1, a thickness of the passivation layer 20 is shown as reference f in fig. 10, accordingly, a thickness of the multi-layer insulating layer disposed in the display area a may be 15000 angstroms, and in a specific implementation process, a specific thickness of the passivation layer 20 at the scribe line 3 and a thickness of the multi-layer insulating layer in the display area a may be set according to a practical application, which is not limited herein. Since the part of the insulating layer including the passivation layer 20 is remained at the cutting line 3 in addition to the planarization layer 13, the generation of cracks during the cutting process is effectively avoided. The thickness of the passivation layer 20 can be 2000 angstroms, and since the passivation layer 20 is reserved at the cutting channel 3, the stress at the cutting channel 3 is correspondingly enhanced while cracks are prevented from being generated in the cutting process, even after a rigid substrate such as glass is removed, the flatness of the surface of the attached protective film can be still ensured, the generation of attaching bubbles at the cutting channel 3 is avoided, and the manufacturing yield of the flexible display substrate is improved.
In the embodiment of the present invention, as shown in fig. 10, the passivation layer 15 is separated from other portions of the scribe line 3. That is to say, the passivation layer 20 is discontinuously disposed at the cutting street 3, so that, in the process of laser cutting the cutting street 3, cracks caused by disposing the passivation layer 20 on the whole layer are avoided, the flatness of the surface of the attached protective film is ensured, meanwhile, the generation of attachment bubbles is avoided, and the production yield of the flexible display substrate is improved.
In an embodiment of the present invention, as shown in fig. 11, the multilayer insulating layer 2 further includes a touch protection layer 21(TOC) located on a side of the thin film encapsulation layer 18 away from the flexible substrate 1, and a touch functional layer 22 is further disposed between the touch protection layer 21 and the thin film encapsulation layer 18, as shown in fig. 12, the insulating layer structure at the cutting street 3 is set by a fourth implementation manner, and the at least two insulating layers include the flat layer 13 and the touch protection layer 21(TOC) which are sequentially away from the flexible substrate 1. The thickness range of the touch protection layer 21 is 2.1 μm to 3.3 μm, and the thickness direction of the touch protection layer 21 is along a direction perpendicular to the plane of the flexible substrate 1, as shown by reference sign h in fig. 12. The specific thickness of the touch protection layer 21 can be set according to practical applications. As shown in fig. 12, the flat layer 13 and the touch protection layer 21 sequentially departing from the flexible substrate 1 are retained at the cutting street 3, and due to the existence of the flat layer 13 and the touch protection layer 21 at the cutting street 3, the stress at the cutting street 3 is enhanced, so that even after a rigid substrate such as glass is removed, the flatness of the surface of the bonded protection film can be ensured, further, the generation of bonding bubbles at the cutting street 3 is avoided, and the manufacturing yield of the flexible display substrate is improved.
In a specific implementation process, the touch protection layer 21 may be an Over Coating (OC) layer, and the touch protection layer 21 is remained at the position of the cutting street 3 in addition to the flat layer 13 while the touch function layer 22 is protected, so that stress at the position of the cutting street 3 is enhanced, a manufacturing yield of the flexible display substrate is improved, and a manufacturing efficiency of a subsequent display panel is ensured.
As shown in fig. 13, which is a schematic structural diagram of the flexible display substrate in the display area a, wherein the touch functional layer 22 may be mutually compatible, and correspondingly, the touch functional layer 22 includes a first metal layer 221 and a second metal layer 222 which sequentially face away from the thin film encapsulation layer 18, and a touch insulating layer 220 disposed between the first metal layer 221 and the second metal layer 222, and the touch insulating layer 220 may be made of an inorganic insulating material, or an organic insulating material, and may be specifically selected according to actual application requirements, which is not limited herein.
Still referring to fig. 13, in the display area a, the flexible display substrate further includes a touch buffer layer 23 located between the touch functional layer 22 and the film encapsulation layer 18, in a specific implementation process, at least one of the touch insulating layer 220 and the touch buffer layer 23 may be filled in the cutting street 3, and a part of the insulating layer is also reserved while the flat layer 13 is reserved, so that while a manufacturing process is simplified, since the stress at the cutting street 3 is enhanced, generation of bubbles attached to the cutting street 3 is avoided, and a manufacturing yield of the flexible display substrate is considered.
In a specific implementation process, the film encapsulation layer 18 includes a first inorganic layer, an organic layer and a second inorganic layer which sequentially deviate from the flexible substrate 1, at least one of the first inorganic layer and the second inorganic layer in the film encapsulation layer 18 can be reserved at the cutting channel 3, and the touch protection layer 21 can be reserved on the reserved inorganic layer, so that the corrosion of external water and oxygen to related films is avoided while the manufacturing process is simplified, in addition, the stress at the cutting channel 3 is enhanced, the generation of bonding bubbles at the cutting channel 3 is avoided, and the manufacturing yield of the flexible display substrate is considered.
In a specific implementation process, besides the above implementation manner, the insulating layer structure at the cutting street 3 may be set, and the insulating layer structure at the cutting street 3 may also be set in other manners according to practical application requirements, which is not described in detail herein.
In the embodiment of the present invention, no matter which implementation manner is adopted to set the insulating layer structure at the cutting street 3, the thickness of the flat layer 13 at the cutting street 3 is smaller than that of the flat layer 13 at the display area. Therefore, the thickness of the film layer of the insulating layer reserved at the cutting channel 3 is reduced, cracks in the cutting process are avoided, the flatness of the surface of the attached protective film is guaranteed, attachment bubbles at the cutting channel 3 are avoided, and the manufacturing yield of the flexible display substrate is improved.
In the embodiment of the present invention, as shown in fig. 14, one of the structures of the flexible display substrate in the display area a is schematically shown, specifically, the flexible display substrate includes a protective film 24 disposed on a side of the flexible substrate 1 facing away from the multilayer insulating layer. The protective film 24 may be Polyethylene Terephthalate (PET), and effective protection of the relevant film layers in the flexible display substrate is achieved through the protective film 24.
It should be noted that besides the above-mentioned related film layers, other film layers may be disposed in the display area a according to practical application requirements, for example, the isolation pillars are disposed on the pixel defining layer 14, and detailed description thereof is omitted here.
Still referring to fig. 14, when the flexible substrate 1 is a structure including two flexible substrate layers, the flexible substrate 1 includes a first flexible substrate layer 101 and a second flexible substrate layer 102, and another support layer 4 is further disposed between the first flexible substrate layer and the second flexible substrate layer. Of course, the related structure of the flexible display substrate can also be designed according to the actual application requirement, and will not be described in detail herein.
When the flexible substrate 1 is a structure including three flexible substrate layers, a support layer 4 is disposed between any two adjacent flexible substrate layers, which is not limited herein. Wherein, any one of the support layers 4 may be made of silicon oxide (SiO)x) The buffer layer 5 may be made of silicon oxide (SiO)x) Made of silicon nitride (SiN)x) And is not limited herein. In addition, the specific materials used for the other film layers may be set by referring to the related art, and are not limited herein.
Based on the same inventive concept, as shown in fig. 15, an embodiment of the present invention further provides a display panel, where the display panel includes the flexible display substrate 30, the display panel includes a cover plate 31 located on the flexible display substrate 30, the display panel may be an OLED flexible display panel, and a principle of the display panel to solve the problem is similar to that of the flexible display substrate 30, so that the implementation of the display panel may refer to the implementation of the flexible display substrate 30, and repeated parts are not repeated.
Based on the same inventive concept, as shown in fig. 16, an embodiment of the present invention further provides a display device, where the display device includes a display panel 40 as shown in fig. 15, and in a specific implementation process, the display device may be a mobile phone as shown in fig. 16, and of course, the display device provided in the embodiment of the present invention may also be any product or component with a display function, such as a tablet computer, a television, a display, a notebook computer, a digital photo frame, and a navigator. Other essential components of the display device are understood by those skilled in the art, and are not described herein nor should they be construed as limiting the present invention.
Based on the same inventive concept, as shown in fig. 17, an embodiment of the present invention further provides a method flowchart of a method for manufacturing a flexible display substrate, where the method includes:
s101: disposing a motherboard comprising the flexible substrate on a rigid substrate;
s102: forming the multi-layered insulating layer on the flexible substrate;
s103: etching a part of the multi-layer insulating layer, and forming a pattern comprising the at least two layers of insulating layers at each cutting path of the motherboard;
s104: peeling the rigid substrate from the flexible substrate by adopting a laser peeling technology;
s105: attaching a protective film to one side of the flexible substrate, which is far away from the multilayer insulating layer;
s106: and cutting the motherboard into a plurality of flexible display substrates along the cutting channels.
In the specific implementation process, the specific implementation process of step S101 to step S106 is as follows:
first, a mother substrate including the flexible substrate 1 is disposed on a rigid substrate, which may be a substrate made of glass or a substrate made of single crystal silicon, and is not limited thereto. Then, the plurality of insulating layers are formed on the flexible substrate 1, each insulating layer may be provided in a whole layer by a method in the related art, and then, a portion of the plurality of insulating layers is etched to form a pattern including the at least two insulating layers at each of the scribe lines 3 of the mother substrate.
For example, the multilayer insulating layer at the cutting street 3 is etched, and the supporting layer 4 with a thickness ranging from 1000 angstroms to 2000 angstroms is also retained at the cutting street 3 in addition to the flat layer 13, at this time, the bubble defect rate of the flexible substrate 1 due to the wrinkles attached to the surface of the protective film 24 is reduced from 1% to 0.2%, and the manufacturing yield of the flexible display substrate is ensured. For another example, the multilayer insulating layer at the cutting street 3 is etched, and besides the flat layer 13, the supporting layer 4 and the buffer layer 5 with the thickness ranging from 5000 angstroms to 8000 angstroms are remained at the cutting street 3. For another example, the multilayer insulating layer at the scribe line 3 is etched, and the passivation layer 20 with a thickness ranging from 1500 angstroms to 2500 angstroms is remained at the scribe line 3 in addition to the planarization layer 13, and the passivation layer 20 may be remained at the scribe line 3 during the backplane process, so as to enhance the stress at the scribe line 3. For another example, the multiple insulating layers at the cutting street 3 are etched, and a touch protection layer 21(TOC) is remained at the cutting street 3 in addition to the flat layer 13. No matter which way is adopted to enhance the stress at the cutting path 3, the original film layer of the flexible display substrate can be correspondingly etched, so that the flatness of the surface of the bonding protective film 24 can be still ensured after rigid substrates such as glass are removed on the premise of not increasing the process cost, the generation of bonding bubbles at the cutting path 3 is avoided, and the manufacturing yield of the flexible display substrate is improved.
In a specific implementation process, after a pattern comprising at least two insulating layers is formed at each cutting path 3 of the motherboard, the rigid substrate is peeled off from the flexible substrate 1 by adopting a laser peeling technology, the flatness of the surface of one side, deviating from the multiple insulating layers, of the flexible substrate 1 is ensured due to the enhancement of the stress at the cutting path 3, and then the protective film 24 is attached to the side, deviating from the multiple insulating layers, of the flexible substrate 1, so that the flatness of the surface, deviating from the multiple insulating layers, of one side of the flexible substrate 1 is better, and after the protective film 24 is attached, the bad air bubbles between the protective film 24 and the flexible substrate 1 are avoided, thereby improving the manufacturing yield of the flexible display substrate. After the protective film 24 is attached, the motherboard is cut into a plurality of flexible display substrates along the cutting streets 3, and the size and the number of each flexible display substrate in each flexible display substrate may be set according to practical applications, which is not limited herein.
In the implementation process, in step S104: before the rigid substrate is peeled off from the flexible substrate 1 by using the laser peeling technique, the method further comprises: performing an evaporation process, a packaging process and a process of adding other functional film layers on the flexible substrate 1, etching the relevant film layers at the cutting channel 3 after the processes, and correspondingly forming an array layer, a light-emitting functional layer and a thin film packaging layer 18 relevant to the display function in the display area a after the etching, wherein the array layer comprises a pixel driving circuit, the pixel driving circuit comprises an active layer (P-Si)6, a first Gate insulating layer (GI 1)7, a first Gate layer (Gate 1)8, a second Gate insulating layer (GI 2)9, a second Gate layer (Gate 2)10, an interlayer Insulating Layer (ILD)11 and a source-drain electrode layer (SD)12, the light-emitting functional layer comprises an Anode layer (Anode)15, a light-Emitting Layer (EL)16 and a Cathode layer (Cathode)17, and the thin film packaging layer 18 comprises a first inorganic layer, a second inorganic layer, a light-emitting layer (Anode layer), a light-Emitting Layer (EL)16 and a Cathode layer (Cathode) 17), and the thin film packaging layer 18 comprises a first inorganic layer, The organic layer and the second inorganic layer effectively isolate external water and oxygen through the thin film packaging layer 18, and service performance of the flexible display substrate is guaranteed. The specific structure of the relevant film layer in the flexible display substrate may refer to the description of the foregoing part, and is not described herein again. In addition, another protective film can be arranged on one side of the film packaging layer 18, which is away from the flexible substrate 1, so that corrosion of external water and oxygen to the relevant film layer is further avoided through the other protective film, and the service performance of the flexible display substrate is ensured.
The embodiment of the invention provides a flexible display substrate, a manufacturing method thereof and a display panel, wherein the flexible display substrate comprises a flexible substrate 1 and a plurality of insulating layers 2 arranged on the flexible substrate 1, the flexible substrate 1 comprises a display area A, a non-display area B surrounding the display area A and a binding area C located in the non-display area B, at least one cutting channel 3 partially surrounding the binding area C is arranged on at least one side of the binding area C, at least two insulating layers are arranged at each cutting channel 3, the display area A is provided with the plurality of insulating layers, and part of the plurality of insulating layers and the at least two insulating layers are manufactured in the same layer. Therefore, the thickness of at least two layers of insulation layers reserved at the position of the cutting channel 3 of the flexible display substrate is smaller than the thickness of a plurality of layers of insulation layers reserved at the position of the display area A, therefore, in the process of cutting along the cutting channel 3, not only is the generation of cracks avoided, but also a part of insulation layers are reserved, so that the stress at the position of the cutting channel 3 is enhanced, after rigid substrates such as glass and the like are removed, the flatness of the surface of the attached protective film 10 is ensured, the generation of attaching bubbles at the position of the cutting channel 3 is avoided, even if the two sides of the bound electrode of the bound area C are arranged, irregular warping is effectively avoided, and the product yield of the display panel is improved.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.
Claims (11)
1. A flexible display substrate, comprising:
the flexible substrate comprises a display area, a non-display area surrounding the display area and a binding area located in the non-display area, wherein at least one cutting channel partially surrounding the binding area is arranged on at least one side of the binding area;
the display area is provided with the multilayer insulating layer, and parts of the multilayer insulating layer and the at least two insulating layers are manufactured in the same layer.
2. The flexible display substrate of claim 1, wherein the plurality of insulating layers comprise a support layer, a buffer layer, a first gate insulating layer, a second gate insulating layer, an interlayer insulating layer, a planarization layer, a pixel definition layer, and a thin film encapsulation layer disposed in sequence away from the flexible substrate.
3. The flexible display substrate of claim 2, wherein the at least two insulating layers comprise the support layer, at least one of the buffer layers, and the planarization layer disposed sequentially away from the flexible substrate.
4. The flexible display substrate of claim 3, wherein the support layer and the buffer layer have a thickness at the scribe line in a range from 5000 angstroms to 8000 angstroms, and the thickness direction of the support layer and the buffer layer is along a direction perpendicular to a plane of the flexible substrate.
5. The flexible display substrate of claim 2, wherein the multi-layer insulating layer further comprises a passivation layer between the interlayer insulating layer and the planarization layer, and wherein the at least two insulating layers comprise the passivation layer and the planarization layer sequentially disposed away from the flexible base.
6. The flexible display substrate of claim 5, wherein the passivation layer has a thickness in a range from 1500 angstroms to 2000 angstroms, and the passivation layer has a thickness direction along a direction perpendicular to a plane of the flexible substrate.
7. The flexible display substrate of claim 5, wherein a portion of the passivation layer at the scribe line is provided disconnected from other portions.
8. The flexible display substrate according to claim 2, wherein the plurality of insulating layers further comprises a touch protection layer disposed on a side of the thin film encapsulation layer facing away from the flexible substrate, and the at least two insulating layers comprise the planarization layer and the touch protection layer disposed facing away from the flexible substrate in sequence.
9. The flexible display substrate of claim 2, wherein a thickness of the planarization layer at the scribe line is less than a thickness of the planarization layer at the display area.
10. A display panel, comprising:
a flexible display substrate according to any one of claims 1-9.
11. A method of manufacturing a flexible display substrate according to any one of claims 1 to 9, comprising:
disposing a motherboard comprising the flexible substrate on a rigid substrate;
forming the multi-layered insulating layer on the flexible substrate;
etching a part of the multi-layer insulating layer, and forming a pattern comprising the at least two layers of insulating layers at each cutting path of the motherboard;
peeling the rigid substrate from the flexible substrate by adopting a laser peeling technology;
attaching a protective film to one side of the flexible substrate, which is far away from the multilayer insulating layer;
and cutting the motherboard into a plurality of flexible display substrates along the cutting channels.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110586342.6A CN113314582A (en) | 2021-05-27 | 2021-05-27 | Flexible display substrate, manufacturing method thereof and display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110586342.6A CN113314582A (en) | 2021-05-27 | 2021-05-27 | Flexible display substrate, manufacturing method thereof and display panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113314582A true CN113314582A (en) | 2021-08-27 |
Family
ID=77375698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110586342.6A Pending CN113314582A (en) | 2021-05-27 | 2021-05-27 | Flexible display substrate, manufacturing method thereof and display panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113314582A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113888971A (en) * | 2021-09-30 | 2022-01-04 | 京东方科技集团股份有限公司 | Flexible display panel and manufacturing method thereof |
| CN115064064A (en) * | 2022-06-06 | 2022-09-16 | 昆山国显光电有限公司 | Display mother plate and display panel |
-
2021
- 2021-05-27 CN CN202110586342.6A patent/CN113314582A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113888971A (en) * | 2021-09-30 | 2022-01-04 | 京东方科技集团股份有限公司 | Flexible display panel and manufacturing method thereof |
| CN113888971B (en) * | 2021-09-30 | 2023-11-17 | 京东方科技集团股份有限公司 | Flexible display panel and manufacturing method thereof |
| CN115064064A (en) * | 2022-06-06 | 2022-09-16 | 昆山国显光电有限公司 | Display mother plate and display panel |
| CN115064064B (en) * | 2022-06-06 | 2023-12-22 | 昆山国显光电有限公司 | Display mother board and display panel |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10510987B2 (en) | Display panel and manufacturing method therefor, and display device | |
| WO2018223721A1 (en) | Oled display substrate and manufacturing method therefor, and packaging structure and display apparatus | |
| JP7294808B2 (en) | Color film substrate and its manufacturing method, display panel and display device | |
| JP6863905B2 (en) | Display board, display panel, display device, and manufacturing method of display board and display panel | |
| CN108091675B (en) | Display substrate and manufacturing method thereof | |
| US20170040569A1 (en) | Display device and method of manufacturing the same | |
| US20160293884A1 (en) | Organic Light-Emitting Diode Displays with Crack Detection and Crack Propagation Prevention Circuitry | |
| JP4961271B2 (en) | Liquid crystal display panel manufacturing method and liquid crystal display panel | |
| CN110970576B (en) | Display panel, preparation method thereof and display device | |
| US11233217B2 (en) | Encapsulation structure, display panel and manufacturing method thereof each having edge encapsulation member on edge of encapsulation film | |
| CN113314582A (en) | Flexible display substrate, manufacturing method thereof and display panel | |
| KR102508329B1 (en) | Flexible Display Device | |
| JP2011257728A (en) | Thin-film transistor substrate, manufacturing method of the same and flat panel display element with the thin-film transistor | |
| CN105374946A (en) | Flexible display apparatus and preparation method therefor | |
| WO2019076103A1 (en) | Display substrate motherboard, manufacturing method therefor, display substrate, and display device | |
| WO2019227930A1 (en) | Electroluminescent display panel, manufacturing method thereof, and display device | |
| CN113241368B (en) | Display panel and display device | |
| JP4757550B2 (en) | Display device and manufacturing method thereof | |
| CN108417730B (en) | Flexible substrate, preparation method thereof and display device | |
| CN109962180B (en) | Preparation method of display panel | |
| US11081666B2 (en) | Film material and display device | |
| KR20160073531A (en) | Organic light emitting display device and method of manufacturing the same | |
| US11264439B2 (en) | Organic light-emitting diode array substrate and method of manufacturing the same | |
| CN113299856B (en) | Display substrate and display device | |
| KR20160066463A (en) | Organic light emitting display device and method of manufacturing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |