CN105374946A - Flexible display device and preparation method thereof - Google Patents
Flexible display device and preparation method thereof Download PDFInfo
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- CN105374946A CN105374946A CN201510794414.0A CN201510794414A CN105374946A CN 105374946 A CN105374946 A CN 105374946A CN 201510794414 A CN201510794414 A CN 201510794414A CN 105374946 A CN105374946 A CN 105374946A
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- 239000000758 substrate Substances 0.000 claims abstract description 106
- 238000005538 encapsulation Methods 0.000 claims abstract description 75
- 239000010409 thin film Substances 0.000 claims abstract description 57
- 238000004806 packaging method and process Methods 0.000 claims abstract description 45
- 239000007769 metal material Substances 0.000 claims description 9
- 230000015572 biosynthetic process Effects 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 239000013212 metal-organic material Substances 0.000 claims 2
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- 229910052760 oxygen Inorganic materials 0.000 abstract description 9
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention describes a flexible display device and a method for manufacturing the same, the flexible display device comprising: a flexible substrate including a display area and an encapsulation area; the packaging substrate is positioned in a packaging area of the flexible substrate; at least one first display film layer on the package substrate, the first display film layer having a first via on the package substrate to expose at least a portion of the package substrate; a thin film encapsulation layer covering the first display film layer and extending from the display area to the encapsulation area, the edge of the thin film encapsulation layer being closer to the display area than the encapsulation substrate; and the edge packaging structure is arranged along the edge of the film packaging layer, covers the edge area of the film packaging layer and the first through hole and is in contact with the packaging substrate through the first through hole. The flexible display device provided by the invention improves the edge reliability of film packaging, further improves the water and oxygen barrier capability and ensures the display effect of the display device.
Description
Technical field
The present invention relates to display field, particularly relate to a kind of flexible display apparatus, and the preparation method of this flexible display apparatus.
Background technology
Compared with all multi-displays, OLED (OrganicLightEmittingDiode, Organic Light Emitting Diode) display has active illuminating, high-contrast, without plurality of advantages such as angle limitations, especially flexible OLED display, its advantage is more obvious.Flexible OLED display is not only more frivolous on volume, also lower than original device in power consumption, contribute to the flying power of lifting means, simultaneously, characteristic that pliability good flexible based on it, its robustness is also much higher than screen in the past, reduces the probability of equipment accidental injury.Therefore, flexible OLED display has now been widely used in Display Technique field.
Flexible OLED display panel avoids water oxygen to invade in flexible OLED display panel, contact inner OLED element, have an impact to the photoelectric characteristic of OLED element by the mode of encapsulation, therefore, the effect of encapsulation is for particularly important flexible OLED display panel.At present, that mainly adopt for flexible OLED display panel packaging technology is thin-film package (thinfilmencapsulation, be called for short TFE) technique, its by alternating deposit plated film between inorganic layer and organic layer to flexible OLED display panel come anti-sealing oxygen enter flexible OLED display panel inside viewing area, play encapsulation effect, and improve its mechanical performance.But owing to adopting flexible base, board, due to bent, crackle or other defect the most easily appear in its marginal membrane bed boundary place, cause water oxygen to be invaded, and reducing encapsulation can be close, thus cause the deterioration of display display effect.
Summary of the invention
In view of this, the invention provides a kind of flexible display apparatus, and the preparation method of this flexible display apparatus.
The invention provides a kind of flexible display apparatus, comprising:
Flexible base, board, comprises viewing area and packaging area;
Package substrate, is positioned at the packaging area of described flexible base, board;
Display rete, described display rete comprise at least one deck be positioned in described package substrate first display rete, described first display rete in described package substrate, there is the first via hole, to be exposed to package substrate described in small part;
Thin-film encapsulation layer, covers described display rete, and extends to described packaging area from described viewing area, the edge of described thin-film encapsulation layer than described package substrate closer to described viewing area;
Edge seal structure, the edge along described thin-film encapsulation layer is arranged, and cover described thin-film encapsulation layer fringe region and described first via hole, described edge seal structure is contacted with described package substrate by described first via hole.
Present invention also offers a kind of preparation method of flexible display apparatus, comprising:
Prepare flexible base, board, described flexible base, board comprises viewing area and packaging area;
Packaging area on described flexible base, board forms package substrate;
Described package substrate is formed the first display rete, and described first display rete covers described package substrate;
Described first display rete forms the first via hole, to be exposed to package substrate described in small part;
Described first display rete forms thin-film encapsulation layer, and described thin-film encapsulation layer covers described display rete, and extends to described packaging area from described viewing area, the edge of described thin-film encapsulation layer than described package substrate closer to described viewing area;
Described thin-film encapsulation layer is formed edge seal structure, and described edge seal structure is formed along the edge of described thin-film encapsulation layer, covers described thin-film encapsulation layer fringe region and described first via hole, is contacted by described first via hole with described package substrate.
Compared with prior art, the present invention at least has one of following outstanding advantage:
The flexible display apparatus that the embodiment of the present invention provides, owing to being provided with package substrate under the first display rete, and the edge of final thin-film encapsulation layer is provided with edge seal structure, and edge seal structure to be sunk to the bottom with encapsulation by reaming and is connected, form bolt shape structure, improve the edge reliability of thin-film package, further increase water oxygen obstructing capacity, ensure the display effect of display unit.
Accompanying drawing explanation
Fig. 1 is a kind of flexible display apparatus plan structure schematic diagram provided in the embodiment of the present invention one;
Fig. 2 is the sectional structure schematic diagram along AA ' cross section in Fig. 1;
Fig. 3 is a kind of flexible display apparatus plan structure schematic diagram provided in the embodiment of the present invention two;
Fig. 4 is the sectional structure schematic diagram along BB ' cross section in Fig. 3;
Fig. 5 is the schematic flow sheet of the preparation method of a kind of flexible display apparatus provided in the embodiment of the present invention three;
Fig. 6 A ~ 6G is the sectional structure schematic diagram of the preparation method of a kind of flexible display apparatus provided in the embodiment of the present invention three.
Embodiment
For enabling above-mentioned purpose of the present invention, feature and advantage more become apparent, and below in conjunction with drawings and Examples, the present invention will be further described.
It should be noted that, set forth detail in the following description so that fully understand the present invention.But the present invention can be different from alternate manner described here to implement with multiple, those skilled in the art can when without prejudice to doing similar popularization when intension of the present invention.Therefore the present invention is not by the restriction of following public embodiment.
Embodiment one
Please refer to Fig. 1 and Fig. 2, Fig. 1 is a kind of flexible display apparatus plan structure schematic diagram provided in the embodiment of the present invention one, and Fig. 2 is the sectional structure schematic diagram along AA ' cross section in Fig. 1.A kind of flexible display apparatus that the present embodiment provides comprises: flexible base, board 100, comprises viewing area PA and packaging area PB; Package substrate 110, is positioned at the packaging area PB of flexible base, board 100; Display rete, this display rete comprise at least one deck be positioned in package substrate 110 first display rete 102, first show rete 102 there is the first via hole 1021 in package substrate 110, to be exposed to small part package substrate 110; Thin-film encapsulation layer 108, covers display rete, and extends to packaging area PB from viewing area PA, the edge of thin-film encapsulation layer 108 than package substrate 110 closer to viewing area PA; Edge seal structure 120, the edge along thin-film encapsulation layer 108 is arranged, and cover film encapsulated layer 108 fringe region and the first via hole 1021, edge seal structure 120 is contacted with package substrate 110 by the first via hole 1021.
Particularly, please continue to refer to Fig. 1 and Fig. 2, in the flexible display apparatus that the present embodiment provides, flexible base, board 100 adopts flexible resin material to prepare, the materials such as such as polyimides, polystyrene, PETG, Parylene, polyether sulfone, PEN.Flexible base, board 100 comprises viewing area PA and packaging area PB, and packaging area PB is around viewing area PA.Usually between packaging area PB and viewing area PA, also comprise the regions such as drive circuit area, the present embodiment only schematically illustrates viewing area PA and packaging area PB, can not using the structure of the present embodiment as limitation of the invention.
Package substrate 110, be positioned at the packaging area of flexible base, board 100, in conjunction with reference to figure 1 and Fig. 2, in the present embodiment, package substrate 110 adopts left oblique line pattern fills to represent, edge seal structure 120 adopts right oblique line pattern fills to represent, in a top view, encapsulates the overlapping region sinking to the bottom 110 and edge seal structure 120 and is expressed as cross oblique line.In the present embodiment, between package substrate 110 and flexible base, board 100, be provided with at least one deck second and show rete 104, the second rete 104 and the first rete 102 all belong to the part showing rete.In addition, in the present embodiment, be also provided with encapsulate sink to the bottom 110 arrange with layer the 3rd show rete 106.
More specifically, the flexible display apparatus that the present embodiment provides is flexible organic light-emitting display device, usually in flexible display apparatus, for polycrystalline silicon type TFT, be disposed with the retes such as aqueous vapor barrier layer, resilient coating, semiconductor layer, gate insulator, grid layer, interlayer insulating film, source-drain electrode layer, passivation layer, organic planarization layer, anode layer, organic luminous layer, cathode layer on flexible substrates.Correspond in the present embodiment, the 3rd display rete 106 of the present embodiment is grid layer, and encapsulation sinks to the bottom 110 for showing rete 106 with the 3rd, and the metal material that namely grid layer is arranged with layer is formed.Thus, while formation the 3rd shows rete 106, form encapsulation and sink to the bottom 110, do not need to increase extra operation.In addition, because grid layer needs and each image element circuit conducting, and need to be connected to external circuit, and package substrate arranges to strengthen packaging effect, do not need to connect external circuit, in order to avoid package substrate is on the impact of viewing area, the 3rd display rete 106 and package substrate 110 interval are arranged.In the present embodiment, said at least one deck second shows rete 104 and comprises the stratified films such as aqueous vapor barrier layer, resilient coating, semiconductor layer and gate insulator.Accordingly, the first display rete 102 is the retes such as interlayer insulating film, source-drain electrode layer, passivation layer, organic planarization layer, anode layer, organic luminous layer, cathode layer.
In the present embodiment, the first display rete 102 is positioned at encapsulation and sinks to the bottom on 110, and this first display rete 102 has the first via hole 1021, first via hole 1021 in package substrate 110 makes encapsulation at least partly sink to the bottom 110 to be exposed.
More specifically, in the present embodiment, the first display rete 102 entirety covers viewing area PA, components and parts during to show image as viewing area PA.And the first display rete 102 extends to encapsulation region PB from viewing area PA, cover other regions except crossing except the first hole outside 1021.It should be noted that, first display rete 102 extends to packaging area PB from viewing area PA and refers to that at least one deck first shows rete and extend to packaging area PB from viewing area PA, and first of not all the display rete all must extend to packaging area PB from viewing area PA.
Thin-film encapsulation layer 108, covers the first display rete 102, and extend to packaging area PB from viewing area PA, and the edge of coating encapsulated layer 108 sinks to the bottom 110 closer to viewing area PA than encapsulation.Please refer to Fig. 2, in the cross-section, the exterior contour of thin-film encapsulation layer 108 is less than the exterior contour of package substrate 110.In other words, thin-film encapsulation layer 108 extends to packaging area PB from viewing area PA, and is no more than the scope of the first via hole 1021.Similar to prior art, in order to improve packaging effect, thin-film encapsulation layer 108 comprises the organic of multiple-level stack and inorganic transparent rete, proposes to increase water oxygen obstructing capacity and material softness.
Edge seal structure 120, the edge along thin-film encapsulation layer 108 is arranged, cover film encapsulated layer 108 fringe region and the first via hole 1021, and is contacted with package substrate by the first via hole 1021.Particularly, the width of edge seal structure 120 cover film encapsulated layer 108 is limited with the edge of viewing area PA, extends, but be no more than the border of viewing area PA with edge seal structure 120 from packaging area PB to viewing area PA.Under the prerequisite on border being no more than viewing area PA, edge seal structure freely can arrange the width of cover film encapsulated layer 108.In order to improve package strength, the Internal periphery that can make edge seal structure 120 just in time with the contour convergence of viewing area PA.Edge seal structure 120 extends to the border of flexible display apparatus simultaneously, to covering the first via hole 1021, and sinks to the bottom 110 by the first via hole 1021 with encapsulation and is connected.
And, in the present embodiment, edge seal structure 120 is metal material, and package substrate 110 is also metal material simultaneously, and both physical propertys are close, edge seal structure 120 and encapsulation can be sunk to the bottom 110 by the first via hole 1021 to combine, form bolt shape structure, the edge of thin-film encapsulation layer 120 is fixed on display rete, improves the edge reliability of thin-film package, further increase water oxygen obstructing capacity, ensure the display effect of display unit.And because edge seal structure 120 is metal material, there is good ductility, in BENDING PROCESS, be also not easy cracking, prevent the crack at edge of flexible display apparatus in BENDING PROCESS.Further, edge seal structure is positioned at packaging area, and metal material is opaque material, and adopt opaque material to encapsulate at packaging area, can not affect similarly is the transmitance of device.
In the present embodiment, package substrate 110 is the first projection in the upright projection of flexible base, board 100, and the first via hole 1021 is the second projection near the bottom surface of flexible base, board 100 in the upright projection of flexible base, board 100, and the first projection and at least part of second projects and overlaps.Please refer to Fig. 1, in a top view, the downward projection that downward projection and the encapsulation of the first via hole 1021 sink to the bottom 110 overlaps at least partly.Alternatively, second projection drops in the scope of the first projection, when the second projection drops in the first drop shadow spread, it is " work " font bolt shape structure that encapsulation sinks to the bottom the 110 bolt shape structures formed with edge seal structure 120, binding ability is better, and thin-film encapsulation layer 108 can be made to be combined in display unit surface better.
It should be noted that, in the present embodiment, be show rete 106 to be described with the grid layer of layer with the 3rd for package substrate 110, but this only schematically illustrates, can not in this, as limitation of the invention.In other embodiments of the invention, the 3rd display rete can be other metallic diaphragms such as source-drain electrode layer or anode layer, and package substrate can be the metallic diaphragm with these rete identical layers.Third membrane layer can also be other organic material retes such as aqueous vapor barrier layer, organic planarization layer, then now encapsulation sinks to the bottom correspondence is also organic material, corresponding edge seal structure is also organic material, the bolt shape structure now formed is organic material, organic material has pliability more better than inorganic material usually, can improve the edge strength of flexible display apparatus.Even, package substrate can be the extra layer added, and does not sink to the bottom the display rete of same layer with encapsulation in a display device.Accordingly, when the layer at package substrate place is different, the rete also respective change that the second display rete and the first display rete comprise.Such as, when the layer that encapsulation sinks to the bottom place is aqueous vapor barrier layer, now just do not have the second display rete, other retes are the first display rete.As long as bolt shape structure can be formed in thin-film package both sides, all invention which is intended to be protected should be considered as.
Embodiment two
Please refer to Fig. 3 and Fig. 4, Fig. 3 is a kind of flexible display apparatus plan structure schematic diagram provided in the embodiment of the present invention two, and Fig. 4 is the sectional structure schematic diagram along BB ' cross section in Fig. 3.A kind of flexible display apparatus that the present embodiment provides comprises: flexible base, board 100, comprises viewing area PA and packaging area PB; Package substrate 110, is positioned at the packaging area PB of flexible base, board 100; Display rete, this display rete comprise at least one deck be positioned in package substrate 110 first display rete 102, first show rete 102 there is the first via hole 1021 in package substrate 110, to be exposed to small part package substrate 110; Thin-film encapsulation layer 108, covers display rete, and extends to packaging area PB from viewing area PA, the edge of thin-film encapsulation layer 108 than package substrate 110 closer to viewing area PA; Edge seal structure 120, the edge along thin-film encapsulation layer 108 is arranged, and cover film encapsulated layer 108 fringe region and the first via hole 1021, edge seal structure 120 is contacted with package substrate 110 by the first via hole 1021.
In the present embodiment, please refer to corresponding description to the same or analogous part of the embodiment that Fig. 1 and Fig. 2 provides, will simply describe at this, at this, emphasis is described structure divisions different in two embodiments.
In the present embodiment, the first via hole 1021 exposes whole package substrate 110, and edge seal structure 120 is connected to encapsulation by the first via hole 1021 and sinks to the bottom 110.
In the present embodiment, package substrate 110 is the first projection in the upright projection of flexible base, board, and the first via hole is the second projection near the bottom surface of flexible base, board 100 in the upright projection of flexible base, board 100, wherein the first projection and the coincidence of the second projection section.In other embodiments of the invention, can also be that the first projection can drop in the scope of the second projection, or the first projection and second project and overlap completely.
The flexible display apparatus that the present embodiment provides, owing to being provided with package substrate under the first display rete, and the edge of final thin-film encapsulation layer is provided with edge seal structure, and edge seal structure to be sunk to the bottom with encapsulation by reaming and is connected, form " Contraband " font bolt shape structure, improve the edge reliability of thin-film package, further increase water oxygen obstructing capacity, ensure the display effect of display unit.
Embodiment three
Please refer to Fig. 5 and Fig. 6 A ~ 6G, Fig. 5 is the schematic flow sheet of the preparation method of a kind of flexible display apparatus provided in the embodiment of the present invention three, and Fig. 6 A ~ 6G is the sectional structure schematic diagram of the preparation method of a kind of flexible display apparatus provided in the embodiment of the present invention three.In the present embodiment, the preparation method of flexible display apparatus is described for the flexible display apparatus shown in Fig. 2.The preparation method of a kind of flexible display apparatus that the present embodiment provides comprises: prepare flexible base, board 100, and this flexible base, board 100 comprises viewing area PA and packaging area PB; On this flexible base, board, the packaging area PB of 100 forms package substrate 110; This package substrate 110 is formed the first display rete 102, and this first display rete 102 covers package substrate 110; First display rete 102 forms the first via hole 1021, to be exposed to small part package substrate 110; First display rete 102 forms thin-film encapsulation layer 108, and this thin-film encapsulation layer 108 covers display rete, and extends to packaging area PB from viewing area PA, the edge of thin-film encapsulation layer 108 than package substrate 110 closer to viewing area PA; Thin-film encapsulation layer 108 is formed edge seal structure 120, and this edge seal structure 120 is formed along the edge of thin-film encapsulation layer 108, and cover film encapsulated layer 108 fringe region and the first via hole 1021, contacted with package substrate 110 by the first via hole 1021.
Concrete, incorporated by reference to reference to figure 5 and Fig. 6 A, carry out step S1: prepare flexible base, board 100.Because flexible base, board is flexible, in order to ensure the flatness keeping flexible base, board in array processes, need at the composite base plate forming rigid substrates and flexible base, board.As shown in Figure 6A, rigid substrates 200 forms flexible base, board 100, usual rigid substrates 200 can be glass substrate or quartz base plate, and rigid substrates 200 forms one deck flexible base, board 100 by spin-coating method or sedimentation.This flexible base, board 100 comprises viewing area PA and packaging area PB.
In conjunction with reference to figure 5 and Fig. 6 B, carry out step S2: the packaging area PB on flexible base, board 100 forms package substrate 110.The present embodiment illustrates the preparation method of flexible display apparatus with the flexible display apparatus shown in Fig. 2, therefore in the present embodiment, before formation package substrate 110, also comprises and forms the second display rete 104 on flexible substrates.Second display film 104 comprises the retes such as aqueous vapor barrier layer, resilient coating, semiconductor layer, gate insulator, and its preparation method is identical with the preparation method of these retes in prior art, does not repeat them here.The 3rd display rete 106 is formed while formation package substrate 110.Because in the present embodiment, the 3rd display layer 106 is grid layer, therefore when preparing package substrate 110, first physical deposition one deck gate metal layer, by after photoresist exposure imaging, adopts wet etching to etch the 3rd display layer 106 and package substrate 110.It should be noted that, this step is only be prepared method explanation for the flexible display apparatus shown in Fig. 2, in other embodiments of the invention, when the second rete and third membrane layer change to some extent, the step of concrete preparation package substrate 110 is slightly different.Such as, when the flexible display apparatus prepared does not have the second display rete and has the 3rd display rete, directly on flexible base, board 110, the 3rd display rete and package substrate is prepared; When flexible display apparatus does not have the 3rd display rete, on flexible display substrates or the second display rete, prepare package substrate separately.
In conjunction with reference to figure 5 and Fig. 6 C, carry out step S3: in package substrate 110, form the first display rete 102, this first rete 102 covers package substrate 110.In the present embodiment, the first display rete 102 comprises the retes such as interlayer insulating film, and the preparation of these retes is identical with preparation method of the prior art, does not repeat them here.Further, in other embodiments of the present invention, with the concrete composition rete change of the first display rete, formation method is slightly different.
In conjunction with reference to figure 5 and Fig. 6 D, carry out step S4: on the first display rete 102, form the first via hole 1021, to be exposed to small part package substrate 110.The method forming via hole is also identical with the method forming via hole in prior art, adopts dry quarter or wet etching to carry out.Because the first display rete 102 is multi-layer film structure, and tundish contains metallic diaphragm and nonmetal rete, therefore, in the present embodiment, needs to carry out multiple etching to be formed the first via hole 1021.In other embodiments of the invention, if the first display rete 102 is the sandwich construction that single layer structure or character are identical, then etching number of times can be reduced.
In conjunction with reference to figure 5 and Fig. 6 E, carry out step S5: on the first display rete 102, form thin-film encapsulation layer 108, make the edge of thin-film encapsulation layer 108 than package substrate 110 closer to viewing area PA.In the present embodiment, thin-film encapsulation layer 108 is multi-layer film structure, and form thin-film encapsulation layer 108 through plural layers deposition, its forming process is identical with the formation method of thin-film encapsulation layer in prior art, does not repeat them here.
In conjunction with reference to figure 5 and Fig. 6 E, carry out step S6: in thin-film encapsulation layer 108, form edge seal structure 120, this edge seal structure 120 is formed along the edge of thin-film encapsulation layer 108, cover film encapsulated layer 108 fringe region and the first via hole 1021, contacted with package substrate 110 by the first via hole 1021.In the present embodiment, edge seal structure 120 is metal material, first forms layer of metal material layer by physical deposition process is overall on the display apparatus, then by carrying out wet etching after photoresist exposure imaging, form edge seal structure 120 in forming process.In some other embodiment of the present invention, form edge seal structure according to organic material, then do not need to carry out wet etching, directly after formation organic material layer, carry out exposure imaging and can form edge seal structure.
After formation edge seal structure 120, also comprise: be separated rigid substrates 200 and flexible base, board 100.Please refer to Fig. 6 G, after being separated rigid substrates 200, namely define flexible display apparatus.Usual separation process can adopt physics cutting, laser cutting or chemical solution corrosion to be separated.And, in preparation process, usually at a large multiple display floater of substrate manufacture, in cutting process, first can carry out the cutting of each display floater, carry out being separated of rigid substrates and flexible base, board again, or first can carry out being separated of rigid substrates and flexible base, board, then carry out the cutting of each display floater.
By flexible display apparatus prepared by the present embodiment, owing to being provided with package substrate under the first display rete, and the edge of final thin-film encapsulation layer is provided with edge seal structure, and edge seal structure to be sunk to the bottom with encapsulation by reaming and is connected, form bolt shape structure, improve the edge reliability of thin-film package, further increase water oxygen obstructing capacity, ensure the display effect of display unit.
Above content is in conjunction with concrete preferred implementation further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, some simple deduction or replace can also be made, all should be considered as belonging to protection scope of the present invention.
Claims (12)
1. a flexible display apparatus, comprising:
Flexible base, board, comprises viewing area and packaging area;
Package substrate, is positioned at the packaging area of described flexible base, board;
Display rete, described display rete comprise at least one deck be positioned in described package substrate first display rete, described first display rete in described package substrate, there is the first via hole, to be exposed to package substrate described in small part;
Thin-film encapsulation layer, covers described display rete, and extends to described packaging area from described viewing area, the edge of described thin-film encapsulation layer than described package substrate closer to described viewing area;
Edge seal structure, the edge along described thin-film encapsulation layer is arranged, and cover described thin-film encapsulation layer fringe region and described first via hole, described edge seal structure is contacted with described package substrate by described first via hole.
2. flexible display apparatus as claimed in claim 1, it is characterized in that, described display rete also comprises at least one deck second and shows rete, and described second display rete is between described flexible base, board and described package substrate.
3. flexible display apparatus as claimed in claim 1, it is characterized in that, described package substrate is the first projection in the upright projection of described flexible base, board, described first via hole is the second projection near the bottom surface of described flexible base, board in the upright projection of described flexible base, board, described first projection with described second project and overlap at least partly.
4. flexible display apparatus as claimed in claim 1, it is characterized in that, described package substrate is the first projection in the upright projection of described flexible base, board, described first via hole is the second projection near the bottom surface of described flexible base, board in the upright projection of described flexible base, board, and described second projection drops in described first drop shadow spread.
5. flexible display apparatus as claimed in claim 1, it is characterized in that, described thin-film encapsulation layer comprises the organic of multiple-level stack or inorganic transparent rete.
6. flexible display apparatus as claimed in claim 1, it is characterized in that, described package substrate is metal material or organic material, and described edge seal structural material is metal material or organic material.
7. flexible display apparatus as claimed in claim 1, it is characterized in that, described package substrate is identical with described edge seal structural material.
8. flexible display apparatus as claimed in claim 1, is characterized in that, described display rete comprise arrange with layer with described package substrate the 3rd show rete.
9. flexible display apparatus as claimed in claim 8, is characterized in that, described 3rd display rete and described package substrate interval are arranged.
10. a preparation method for flexible display apparatus, comprising:
Prepare flexible base, board, described flexible base, board comprises viewing area and packaging area;
Packaging area on described flexible base, board forms package substrate;
Described package substrate is formed the first display rete, and described first display rete covers described package substrate;
Described first display rete forms the first via hole, to be exposed to package substrate described in small part;
Described first display rete forms thin-film encapsulation layer, and described thin-film encapsulation layer covers described display rete, and extends to described packaging area from described viewing area, the edge of described thin-film encapsulation layer than described package substrate closer to described viewing area;
Described thin-film encapsulation layer is formed edge seal structure, and described edge seal structure is formed along the edge of described thin-film encapsulation layer, covers described thin-film encapsulation layer fringe region and described first via hole, is contacted by described first via hole with described package substrate.
11. preparation methods as claimed in claim 10, is characterized in that, described prepare flexible base, board before, also comprise:
Rigid substrates is provided;
Described rigid substrates prepares described flexible base, board.
12. preparation methods as claimed in claim 11, is characterized in that, after described formation edge seal structure, also comprise:
Be separated described rigid substrates and described flexible base, board.
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