CN103956435A - Adhesive tape encapsulating structure of organic light emitting diode - Google Patents
Adhesive tape encapsulating structure of organic light emitting diode Download PDFInfo
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- CN103956435A CN103956435A CN201410173534.4A CN201410173534A CN103956435A CN 103956435 A CN103956435 A CN 103956435A CN 201410173534 A CN201410173534 A CN 201410173534A CN 103956435 A CN103956435 A CN 103956435A
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- adhesive tape
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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Abstract
The invention relates to an adhesive tape encapsulating structure of an organic light emitting diode (OLED). According to the adhesive tape encapsulating structure of the OLED, adhesive tape encapsulation is carried out on the OLED formed by a front electrode, an organic layer, a back electrode and a protection layer, the front electrode, the organic layer and the back electrode are arranged on the upper face of a substrate, the OLED is sealed through adhesive tape which is arranged on the upper face of the OLED and formed by an adhesive sticker and a flexible film strip capable of preventing water vapor and oxygen from passing through, an air barrier layer formed by multilayer films of multilayer thin films made of different materials is further arranged on the upper face or the lower face of the flexible film strip, a layer of filter film can be further arranged on the lower face of the flexible film strip, a sealing rubber ring is arranged on the periphery of the sealing adhesive tape to cover the adhesive tape and the substrate so that air cannot permeate into the OLED from the periphery, and a thin glass sheet or a thin metal sheet can be further arranged on the upper face of the sealing rubber ring to prevent air from entering from the upper face. According to the adhesive tape encapsulating structure of the OLED, due to the fact that the main encapsulating process is the adhesive tape adhering process, the technological process of the adhesive tape encapsulating structure is much simpler relative to a previous method, the production speed can be improved, production cost is lowered, and the adhesive tape encapsulating structure is especially suitable for large-area and large-batch production.
Description
Technical field
The present invention relates to a kind of adhesive tape encapsulating structure of Organic Light Emitting Diode, belong to plate device package field.
Background technology
Organic Light Emitting Diode (OLED) has had very fast development at present, has been widely used in the field such as flat panel display and illumination.But because it is very responsive to moisture and oxygen, therefore, in order to obtain the sufficiently long life-span, must encapsulate it, to isolate the impact on it of atmosphere and environment.Current main method for packing has: thin-film package is on OLED device, to prepare colorful organic and inorganic film, and with entering of moisture-barrier and oxygen, its patent is as CN201210057243; Air-tight packaging, as added some getters, dehumidizer by metal back cover or glass back cover and coating on the chimb of its periphery after ultraviolet photoresists (UV glue), in the glove box of high purity inert gas, encapsulate after pressing with OLED screen, through ultraviolet source irradiation, make UV adhesive curing complete encapsulation, relevant patent is as CN201010116683, CN200720106620, CN201210118435, CN201210118435, CN201110305187; Laser package, that low temperature glass slurry is placed between glass back cover and the glass substrate of OLED, use again laser rapid melting, the glass substrate of glass back cover and OLED is binded and sealed up, to stop entering of moisture and oxygen, relevant patent is as CN201310464410, CN201310464675, CN201310463979 etc.Although these methods are used in a large number in industry, its shortcoming is, complex process, and sealed in unit and related materials are all quite expensive, make the cost of device high.
Summary of the invention
The object of the invention is to the defect existing for prior art, a kind of adhesive tape encapsulating structure of Organic Light Emitting Diode is provided, on OLED device, stick air-locked adhesive tape and can reach entering of blocking harmful gas.Not only can reduce costs, increase productivity, be particularly suitable for the volume production technology of broad area device.
For achieving the above object, the present invention adopts following technical proposals:
A kind of adhesive tape encapsulating structure of Organic Light Emitting Diode, comprise by the front electrode above substrate, organic layer, the Organic Light Emitting Diode of rear electrode and protective layer composition is OLED, above described OLED, stop that by one deck non-drying glue layer and having the adhesive tape that flexible membrane belt that steam and oxygen pass through forms seals OLED, on flexible membrane belt or below also have the barrier layer for gases of multiple layers of different materials film composition, periphery at adhesive tape encapsulating structure has sealed rubber ring, its adhere on one side tape edge above, another side adheres on substrate, cover the gap between adhesive tape and substrate, make gas thoroughly not enter OLED device from periphery, whole encapsulation process is carried out in a vacuum or under high purity inert gas atmosphere.
In described front electrode and rear electrode, have at least one to be transparent.
Described substrate is rigid glass substrate or flexible substrate, is transparent or opaque.
Described non-drying glue layer is have lasting stickiness and there is no escaping gas and be very fine and closely not easy ventilative material, is organically a kind of or inorganic material, and its thickness is between 1 micron to 50 microns.In described non-drying glue layer, mix up the liquid hygroscopic agent that has a small amount of organic or inorganic, hygroscopic agent mixes uniformly with adhesive sticker or forms compound to adsorb inherent and external steam with adhesive sticker.
Described flexible membrane belt is that the organic film material low by air penetrability or the film of air-locked metallic foil or inorganic material are made.The organic film material that described air penetrability is low is PE, BOPP, MULTILAYER COMPOSITE glued membrane, polysulfones, polyimide, and its thickness is between 10 microns to 100 microns.Described air-locked metallic foil is if aluminium foil, Copper Foil, its thickness of stainless steel foil are between 10 microns to 50 microns.The film of described inorganic material is ultrathin bendable glass tape, ultrathin bendable quartz film band, and its thickness is between 5 microns to 50 microns.
Described barrier layer for gases is various inorganic oxide films, metallic film or organic film composition and can repeatedly repeats stack, and its thickness is between 1 nanometer to 10 micron.
The width of described sealed rubber ring is between 0.3 to 2mm, and thickness is between 0.3 to 2mm.Described sealed rubber ring is to be made up of epoxy resin, silica gel or heat-seal adhesive.
Below flexible membrane belt, also have one deck filter coating, described filter coating is monochromatic or is made up of the array of the color lump of different colours.
On described sealed rubber ring, also have cover plate to enter from above with barrier gas, described cover plate is thin sheet glass or sheet metal.
The present invention compared with prior art, has following apparent outstanding substantive distinguishing features and remarkable advantage:
The main encapsulation process of the present invention is the process of Continuous pressing device for stereo-pattern, and therefore its technical process is simply too much with respect to former method, both can improve the speed of production, has reduced again production cost, is particularly suitable for the large batch of production of large area.The present invention both can be used for the hard screen of OLED and had been more suitable for the soft screen technique in OLED, more can complete by the rolling process of the soft screen of OLED and sealant tape for the latter.
The present invention is with respect to the thin-film package technique of OLED, and it is the technical process of carrying out plural layers on OLED to be transferred to adhesive tape get on, and is particularly suitable for industrial production.Because the latter can realize by the vacuum moulding machine of in vacuum system, the substrate of adhesive tape being carried out to drum-type completely.The not only Packed function of tool but also the function of chromatic colour filter coating of adhesive tape.
Brief description of the drawings
Fig. 1 is the structural representation that Organic Light Emitting Diode of the present invention and adhesive tape add the encapsulation of multilayer film.
Fig. 2 is the structural representation that Organic Light Emitting Diode of the present invention and adhesive tape add the encapsulation of lower multilayer film.
Fig. 3 is the structural representation of the encapsulation of Organic Light Emitting Diode of the present invention and aluminum foil and adhesive tape.
Fig. 4 is that Organic Light Emitting Diode of the present invention and adhesive tape add that multilayer film adds the structural representation of the encapsulation of filter coating.
Fig. 5 is the structural representation that Organic Light Emitting Diode of the present invention and adhesive tape add the encapsulation of sheet glass.
Embodiment
The preferred embodiments of the present invention, details are as follows by reference to the accompanying drawings:
embodiment 1
As shown in Figure 1, a kind of adhesive tape encapsulating structure of Organic Light Emitting Diode, to there is the front electrode 2 of ITO above by glass substrate 1, and include organic hole implanted layer, organic cavity transmission layer, organic luminous layer, the organic layer 3 of organic electron transport layer and organic electron injecting layer, the Organic Light Emitting Diode OLED of the end transmitting of the glass substrate 1 that the protective layer 5 of metallic aluminium rear electrode 4 and organic material forms carries out adhesive tape encapsulation, to this OLED carry out adhesive tape encapsulate adhesive tape used 6 be a kind of adhesive tape it be better to stop below the polyimide flexible membrane belt 6-2 that steam and oxygen passes through and be coated with one deck non-drying glue layer 6-1 by having, on adhesive tape, also have multilayer film composition barrier layer for gases 7 it be by silicon nitride layer, alumina layer, silicon nitride layer, the repeated plural layers composition such as alumina layer.Silicon nitride layer is that aluminium oxide is with the preparation of molecular layer sedimentation with plasma enhanced vapor deposition legal system is standby.This adhesive tape 6 with barrier layer for gases 7 is made to sticking on OLED device of non-drying glue layer 6-1 densification by rolling process under high purity inert gas atmosphere, and the area of its adhesive tape 6 just in time covers the area of whole OLED device luminescent layer and goes out greatly 1-2 millimeter.At the periphery of sealant tape with sealed rubber ring 8 its width of point gum machine coating one circle UV epoxy resin in 1-2 millimeter, its half is bonded on adhesive tape second half and is bonded at and on substrate and after UV-irradiation is cured, forms sealing ring 8 and make gas thoroughly not enter OLED device from periphery.
embodiment 2
As shown in Figure 2, the difference of itself and embodiment 1 is, the barrier layer for gases 7 is here between polyimide flexible membrane belt 6-2 and non-drying glue layer 6-1.In the manufacturing process of adhesive tape 6, first under polyimide flexible membrane belt 6-2, prepare barrier layer for gases 7 and then coating non-drying glue layer 6-1.
embodiment 3
As shown in Figure 3, a kind of adhesive tape encapsulating structure of Organic Light Emitting Diode, to there is the front electrode 2 of ITO above by glass substrate 1, and include organic hole implanted layer, organic cavity transmission layer, organic luminous layer, the organic layer 3 of organic electron transport layer and organic electron injecting layer, the Organic Light Emitting Diode OLED of the end transmitting of the glass substrate that the protective layer 5 of metallic aluminium rear electrode 4 and organic material forms carries out adhesive tape encapsulation, to this OLED carry out adhesive tape encapsulate adhesive tape used 6 be a kind of be better to stop below the aluminium foil strip 6-2 that steam and oxygen passes through and be coated with one deck non-drying glue layer 6-1 by having, this adhesive tape 6 is made to sticking on OLED device of non-drying glue layer 6-1 densification by rolling process under high purity inert gas atmosphere, the area of its adhesive tape 6 just in time covers the area of whole OLED device luminescent layer and goes out greatly 1-2 millimeter.At the periphery of sealant tape with sealed rubber ring 8 its width of point gum machine coating one circle UV epoxy resin in 1-2 millimeter, its half is bonded on adhesive tape second half and is bonded at and on substrate and after UV-irradiation is cured, forms sealing ring 8 and make gas thoroughly not enter OLED device from periphery.
embodiment 4
As shown in Figure 4, a kind of adhesive tape encapsulating structure of Organic Light Emitting Diode, to there is the front electrode 2 of aluminium above by glass substrate 1, and include organic electron injecting layer, organic electron transport layer, organic luminous layer, the organic layer 3 of organic cavity transmission layer and organic hole implanted layer, the Organic Light Emitting Diode OLED of the top transmitting of the glass substrate that the protective layer 5 of ITO rear electrode 4 and organic material forms carries out adhesive tape encapsulation, to this OLED carry out adhesive tape encapsulate adhesive tape used 6 be a kind of adhesive tape it better stop flexible membrane belt 6-2 that steam and oxygen passes through above flexible tape, to also have barrier layer for gases that multilayer film forms 7 at this it is by silicon nitride layer by having, alumina layer, silicon nitride layer, the repeated plural layers composition such as alumina layer.Silicon nitride layer is that aluminium oxide is with the preparation of molecular layer sedimentation with plasma enhanced vapor deposition legal system is standby.Also have filter coating 11 these filter coatings to make at the another side of this flexible tape 6-2 and there are red bluish-green three color lump arrays.Be coated with one deck non-drying glue layer 6-1 below, this adhesive tape 6 with barrier layer for gases 7 and filter coating is made to sticking on OLED device of non-drying glue layer 6-1 densification by rolling process under high purity inert gas atmosphere, and the area of its adhesive tape 6 just in time covers the area of whole OLED device luminescent layer and goes out greatly 1-2 millimeter.At the periphery of sealant tape with sealed rubber ring 8 its width of point gum machine coating one circle UV epoxy resin in 1-2 millimeter, its half is bonded on adhesive tape second half and is bonded at and on substrate and after UV-irradiation is cured, forms sealed rubber ring 8 and make gas thoroughly not enter OLED device from periphery.
embodiment 5
As shown in Figure 5, a kind of adhesive tape encapsulating structure of Organic Light Emitting Diode, to having the front electrode 2 of ITO and include organic hole implanted layer above by glass substrate 1, organic cavity transmission layer, organic luminous layer, the organic layer 3 of organic electron transport layer and organic electron injecting layer, the Organic Light Emitting Diode OLED of the end transmitting of the glass substrate that the protective layer 5 of metallic aluminium rear electrode 4 and organic material forms carries out adhesive tape encapsulation, to this OLED carry out adhesive tape encapsulate adhesive tape used 6 be a kind of high temperature gummed tape it be better to stop below the polyimide flexible membrane belt 6-2 that steam and oxygen passes through and be coated with one deck non-drying glue layer 6-1 by having, this adhesive tape 6 is made to sticking on OLED device of non-drying glue layer 6-1 densification by rolling process under high purity inert gas atmosphere, the area of its adhesive tape 6 just in time covers the area of whole OLED device luminescent layer and goes out greatly 1-2 millimeter.Sealed rubber ring 8 its width that enclose UV epoxy resin with point gum machine coating one at the periphery of sealant tape are in 1-2 millimeter, its half is bonded on adhesive tape second half and is bonded at and on substrate, above it, presses glass back cover 10 that a slice is thin to make sealed rubber ring 8 be full of the space of glass back cover 10 and glass substrate 1 again, and after UV-irradiation is cured, form with the sealing of glass back cover make gas can not from periphery and above thoroughly enter OLED device.
Claims (14)
1. the adhesive tape encapsulating structure of an Organic Light Emitting Diode, comprise by substrate (1) front electrode (2) above, organic layer (3), the Organic Light Emitting Diode of rear electrode (4) and protective layer (5) composition is OLED, it is characterized in that, the adhesive tape (6) that has one deck non-drying glue layer (6-1) above described OLED and have flexible membrane belt (6-2) composition that stops steam and oxygen and pass through seals OLED, on flexible membrane belt (6-2) or below also have the barrier layer for gases (7) of multiple layers of different materials film composition, there is sealed rubber ring (8) at the periphery of adhesive tape encapsulating structure, its adhere on one side adhesive tape (6) edge above, another side adheres on substrate (1), cover the gap between adhesive tape (6) and substrate (1), make gas thoroughly not enter OLED device from periphery, whole encapsulation process is carried out in a vacuum or under high purity inert gas atmosphere.
2. the adhesive tape encapsulating structure of Organic Light Emitting Diode according to claim 1, is characterized in that, in described front electrode (2) and rear electrode (4), has at least one to be transparent.
3. the adhesive tape encapsulating structure of Organic Light Emitting Diode according to claim 1, is characterized in that, described substrate (1) is rigid glass substrate or flexible substrate, is transparent or opaque.
4. the adhesive tape encapsulating structure of Organic Light Emitting Diode according to claim 1, it is characterized in that, described non-drying glue layer (6-1) is have lasting stickiness and there is no escaping gas and be very fine and closely not easy ventilative material, be organically a kind of or inorganic material, its thickness is between 1 micron to 50 microns.
5. the adhesive tape encapsulating structure of Organic Light Emitting Diode according to claim 1, it is characterized in that, in described non-drying glue layer (6-1), mix up the liquid hygroscopic agent that has a small amount of organic or inorganic, hygroscopic agent mixes uniformly with adhesive sticker or forms compound to adsorb inherent and external steam with adhesive sticker.
6. the adhesive tape encapsulating structure of Organic Light Emitting Diode according to claim 1, is characterized in that, described flexible membrane belt (6-2) is that the organic film material low by air penetrability or the film of air-locked metallic foil or inorganic material are made.
7. the adhesive tape encapsulating structure of Organic Light Emitting Diode according to claim 6, is characterized in that, the organic film material that described air penetrability is low is PE, BOPP, MULTILAYER COMPOSITE glued membrane, polysulfones, polyimide, and its thickness is between 10 microns to 100 microns.
8. the adhesive tape encapsulating structure of Organic Light Emitting Diode according to claim 6, is characterized in that, described air-locked metallic foil is if aluminium foil, Copper Foil, its thickness of stainless steel foil are between 10 microns to 50 microns.
9. the adhesive tape encapsulating structure of Organic Light Emitting Diode according to claim 6, is characterized in that, the film of described inorganic material is ultrathin bendable glass tape, ultrathin bendable quartz film band, and its thickness is between 5 microns to 50 microns.
10. the adhesive tape encapsulating structure of Organic Light Emitting Diode according to claim 1, it is characterized in that, described barrier layer for gases (7) is various inorganic oxide films, metallic film or organic film composition and can repeatedly repeats stack, and its thickness is between 1 nanometer to 10 micron.
The adhesive tape encapsulating structure of 11. Organic Light Emitting Diodes according to claim 1, is characterized in that, the width of described sealed rubber ring (8) is between 0.3 to 2mm, and thickness is between 0.3 to 2mm.
The adhesive tape encapsulating structure of 12. Organic Light Emitting Diodes according to claim 1, is characterized in that, described sealed rubber ring (8) is to be made up of epoxy resin, silica gel or heat-seal adhesive.
The adhesive tape encapsulating structure of 13. Organic Light Emitting Diodes according to claim 1, it is characterized in that, below flexible membrane belt (6-2), also have one deck filter coating (11), described filter coating (11) is monochromatic or is made up of the array of the color lump of different colours.
The adhesive tape encapsulating structure of 14. Organic Light Emitting Diodes according to claim 1, is characterized in that, described sealed rubber ring (8) is upper also has cover plate (10) to enter from above with barrier gas, and described cover plate (10) is thin sheet glass or sheet metal.
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Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103972414A (en) * | 2014-04-29 | 2014-08-06 | 京东方科技集团股份有限公司 | Organic electroluminescent device and packaging method of organic electroluminescent device |
| CN104766876A (en) * | 2015-04-10 | 2015-07-08 | 京东方科技集团股份有限公司 | Organic light emitting diode substrate |
| CN104979492A (en) * | 2015-05-28 | 2015-10-14 | 京东方科技集团股份有限公司 | Encapsulated thin film and manufacturing method therefor, light emitting apparatus, display panel and display device |
| CN105374946A (en) * | 2015-11-18 | 2016-03-02 | 上海天马微电子有限公司 | Flexible display apparatus and preparation method therefor |
| WO2017210942A1 (en) * | 2016-06-07 | 2017-12-14 | 武汉华星光电技术有限公司 | Packaging structure of flexible oled device and display apparatus |
| CN108336215A (en) * | 2017-01-20 | 2018-07-27 | 联京光电股份有限公司 | Photoelectric packaging body and manufacturing method thereof |
| CN108695441A (en) * | 2017-04-05 | 2018-10-23 | 上海和辉光电有限公司 | A kind of OLED display |
| CN109061957A (en) * | 2018-10-30 | 2018-12-21 | 昆山国显光电有限公司 | A kind of preparation method of display device and display device |
| WO2019075854A1 (en) * | 2017-10-16 | 2019-04-25 | 深圳市华星光电半导体显示技术有限公司 | Encapsulation method and encapsulation structure for oled panel |
| CN109755408A (en) * | 2018-12-26 | 2019-05-14 | 深圳市华星光电半导体显示技术有限公司 | A kind of display panel and preparation method thereof, display device |
| CN110322784A (en) * | 2018-03-29 | 2019-10-11 | 上海和辉光电有限公司 | A kind of display device and a kind of compound adhesive tape |
| WO2020056862A1 (en) * | 2018-09-17 | 2020-03-26 | 武汉华星光电半导体显示技术有限公司 | Protective film of oled packaging structure, oled packaging structure, and fabricating method for protective film |
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| WO2023050267A1 (en) * | 2021-09-30 | 2023-04-06 | 京东方科技集团股份有限公司 | Display substrate and related display motherboard, and display panel |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1618134A (en) * | 2002-01-31 | 2005-05-18 | 3M创新有限公司 | Encapsulation of organic electronic devices using adsorbent loaded adhesives |
| CN102482295A (en) * | 2009-08-21 | 2012-05-30 | 可隆工业株式会社 | Absorbent and passivation layer for optical element comprising the same |
| WO2013053805A1 (en) * | 2011-10-11 | 2013-04-18 | Osram Opto Semiconductors Gmbh | Encapsulation for an organic electronic component |
| CN103456764A (en) * | 2013-09-09 | 2013-12-18 | 京东方科技集团股份有限公司 | OLED array substrate, manufacturing method thereof and display device |
| TW201402766A (en) * | 2012-06-29 | 2014-01-16 | Tesa Se | Adhesive tape for the encapsulation of an organic electronic assembly |
-
2014
- 2014-04-28 CN CN201410173534.4A patent/CN103956435A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1618134A (en) * | 2002-01-31 | 2005-05-18 | 3M创新有限公司 | Encapsulation of organic electronic devices using adsorbent loaded adhesives |
| CN102482295A (en) * | 2009-08-21 | 2012-05-30 | 可隆工业株式会社 | Absorbent and passivation layer for optical element comprising the same |
| WO2013053805A1 (en) * | 2011-10-11 | 2013-04-18 | Osram Opto Semiconductors Gmbh | Encapsulation for an organic electronic component |
| TW201402766A (en) * | 2012-06-29 | 2014-01-16 | Tesa Se | Adhesive tape for the encapsulation of an organic electronic assembly |
| CN103456764A (en) * | 2013-09-09 | 2013-12-18 | 京东方科技集团股份有限公司 | OLED array substrate, manufacturing method thereof and display device |
Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| WO2015165163A1 (en) * | 2014-04-29 | 2015-11-05 | 京东方科技集团股份有限公司 | Package structure, organic electroluminescent device and packaging method therefor |
| CN104766876A (en) * | 2015-04-10 | 2015-07-08 | 京东方科技集团股份有限公司 | Organic light emitting diode substrate |
| US10199604B2 (en) | 2015-04-10 | 2019-02-05 | Boe Technology Group Co., Ltd. | Organic light emitting diode substrate |
| US9698360B2 (en) | 2015-05-28 | 2017-07-04 | Boe Technology Group Co., Ltd. | Package thin film and manufacturing method thereof, light emitting device, display panel and display device |
| CN104979492A (en) * | 2015-05-28 | 2015-10-14 | 京东方科技集团股份有限公司 | Encapsulated thin film and manufacturing method therefor, light emitting apparatus, display panel and display device |
| CN105374946A (en) * | 2015-11-18 | 2016-03-02 | 上海天马微电子有限公司 | Flexible display apparatus and preparation method therefor |
| WO2017210942A1 (en) * | 2016-06-07 | 2017-12-14 | 武汉华星光电技术有限公司 | Packaging structure of flexible oled device and display apparatus |
| CN108336215A (en) * | 2017-01-20 | 2018-07-27 | 联京光电股份有限公司 | Photoelectric packaging body and manufacturing method thereof |
| CN108695441A (en) * | 2017-04-05 | 2018-10-23 | 上海和辉光电有限公司 | A kind of OLED display |
| WO2019075854A1 (en) * | 2017-10-16 | 2019-04-25 | 深圳市华星光电半导体显示技术有限公司 | Encapsulation method and encapsulation structure for oled panel |
| US10658611B2 (en) | 2017-10-16 | 2020-05-19 | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Encapsulation method of OLED panel and a encapsulation structure thereof |
| CN110322784A (en) * | 2018-03-29 | 2019-10-11 | 上海和辉光电有限公司 | A kind of display device and a kind of compound adhesive tape |
| WO2020056862A1 (en) * | 2018-09-17 | 2020-03-26 | 武汉华星光电半导体显示技术有限公司 | Protective film of oled packaging structure, oled packaging structure, and fabricating method for protective film |
| CN109061957A (en) * | 2018-10-30 | 2018-12-21 | 昆山国显光电有限公司 | A kind of preparation method of display device and display device |
| CN109061957B (en) * | 2018-10-30 | 2021-12-10 | 昆山国显光电有限公司 | Display device and preparation method thereof |
| CN109755408A (en) * | 2018-12-26 | 2019-05-14 | 深圳市华星光电半导体显示技术有限公司 | A kind of display panel and preparation method thereof, display device |
| CN109755408B (en) * | 2018-12-26 | 2021-01-15 | 深圳市华星光电半导体显示技术有限公司 | Display panel, manufacturing method thereof and display device |
| CN114518668A (en) * | 2020-11-19 | 2022-05-20 | 京东方科技集团股份有限公司 | Backlight module, manufacturing method and display device |
| CN113471395A (en) * | 2021-06-04 | 2021-10-01 | 西南大学 | Waterproof packaging method for flexible photoelectric device |
| WO2023050267A1 (en) * | 2021-09-30 | 2023-04-06 | 京东方科技集团股份有限公司 | Display substrate and related display motherboard, and display panel |
| CN116458280A (en) * | 2021-09-30 | 2023-07-18 | 京东方科技集团股份有限公司 | Display substrate and related display mother board and display panel |
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Application publication date: 20140730 |