CN105023848B - 基板结构的制造方法及基板结构 - Google Patents

基板结构的制造方法及基板结构 Download PDF

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CN105023848B
CN105023848B CN201410301559.8A CN201410301559A CN105023848B CN 105023848 B CN105023848 B CN 105023848B CN 201410301559 A CN201410301559 A CN 201410301559A CN 105023848 B CN105023848 B CN 105023848B
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protective layer
metal layer
layer
board structure
substrate
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CN105023848A (zh
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罗昱凯
陈世宏
郭昱甫
陈群霖
陈璟文
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Wistron Neweb Corp
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Wistron Neweb Corp
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
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    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
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Abstract

一种基板结构的制造方法及基板结构。该基板结构的制造方法包括：直接形成一第一金属层于一基底上；直接形成一第一保护层于该第一金属层上；藉由使用包括一硫醇基的一化合物来直接形成一第二保护层于该第一保护层上；图形化该第二保护层以形成具有暴露该第一保护层的一开口的一图案；以及形成一第二金属层于该第二保护层的该开口内，且直接形成于该第一保护层上。本发明是相比传统实际操作更有效率且更符合成本效益的方法来发展图形化结构于基板上。

Description

基板结构的制造方法及基板结构
技术领域
本发明涉及一种基板结构的制造方法及基板结构。
背景技术
一般而言，为了藉由使用最小化手动加工的过程来形成基板，此过程可涉及类似显影(Photolithography)、电镀(electroplating)、蚀刻(etching)等技术。显影已经是用以在基板(substrate)上形成结构图案的可靠方法，且在沉积(deposit)于基板上的物质的图案部分的制造过程中使用显影的过程基本上涉及一种或多种具有特定图案的光掩膜(photo mask)，其中此特定图案自光掩膜传送至光敏(light-sensitive)光致抗蚀剂。在曝光(exposure to light)周期之后，高强度光子(photon)经化学作用分解或软化光敏光致抗蚀剂的部分，以在基材上形成图形化区域而成为可接着沉积于光致抗蚀剂下方材料中的一种方式。
然而，此过程会涉及多种昂贵机器与光掩膜以及极为洁净的操作条件，以使得制造的整体花费将会增加。并且，为了固定光致抗蚀剂于基板上，将需要在固化前喷涂类似环氧树脂(epoxy)的聚合树脂(polymeric resin)于接合表面的部分。此过程会涉及额外的化学与额外的步骤。此外，传统电镀经由显影后再电镀的工艺，由于电镀设备、电极、电镀液等的使用，以上种种导致成本较高。
因此，需要提供一种基板结构的制造方法及基板结构来解决上述问题。
藉此，这会是相比前述传统实际操作更有效率且更符合成本效益的方法来发展图形化结构于基板上。
发明内容
本发明提供一种基板结构的制造方法及以此方法制造的基板结构。
依据本发明的一实施例，基板结构的制造方法包括：直接形成一第一金属层于一基底上；直接形成一第一保护层于该第一金属层上；藉由使用包括一硫醇基(thiol group)的一化合物(compound)来直接形成一第二保护层于该第一保护层上；图形化(patterning)该第二保护层以形成具有暴露该第一保护层的一开口的一图案；以及形成一第二金属层于该第二保护层的该开口内，且直接于该第一保护层上形成。
在本发明的一实施例中，本发明提供一种基板结构，此基板结构包括至少一个基底(base)、第一金属层、第一保护层、第二保护层以及第二金属层，但不仅限于此。此第一金属层配置于基底上。第一保护层配置于第一金属层上。第二保护层包括配置于第一保护层上的硫醇化合物，且具有包含暴露第一保护层的开口的图案。第二金属层配置于开口内，且配置于第一保护层上。
本发明还提供一种基板结构，该基板结构包括：一基底、一第一金属层、一第一保护层、一第二保护层以及一第二金属层；该第一金属层配置于该基底上；该第一保护层配置于该第一金属层上；该第二保护层包括配置于该第一保护层上的一硫醇化合物，且具有包含暴露该第一保护层的一开口的一图案；该第二金属层配置于该开口内，且配置于该第一保护层上。
本发明可更有效率且更符合成本效益地来将图形化结构发展于基板上。
为让本发明的上述特征和优点能更明显易懂，下文特举实施例，并配合所附附图做详细说明如下。需理解的是，上述一般说明及下述详细说明两者皆为实施例，且其意图提供要求保护的权利要求书的更进一步解释。
需理解的是，然而，此发明内容可能不包含所有层面及本发明的实施例，且因此不代表此发明内容限制或约束于任何方法。并且，本发明会包括本领域技术人员所认为显而易见的改进以及修改。
附图说明
附图用以提供本发明进一步的理解，且并入及构成此说明书的一部分。附图绘示本发明的实施例，并随同说明书，用于解释本发明的原理。
图1A为依据本发明一实施例所绘示的制造基板结构的第一步骤。
图1B为依据本发明一实施例所绘示的在基底上形成第一金属层。
图1C为依据本发明一实施例所绘示的在第一金属层上形成第一保护层。
图1D为依据本发明一实施例所绘示的在第一保护层上形成第二保护层。
图1E为依据本发明一实施例所绘示的图形化第二保护层。
图1F为依据本发明一实施例所绘示的形成第二金属层。
图2为依据本发明一实施例所绘示的制造基板结构的过程。
主要组件符号说明：
101 基底
102 第一金属层
103 第一保护层
104 第二保护层
105 图案部分
106 第二金属层
S201～S205 步骤
具体实施方式
将参考详细描述本发明的本优选实施例，其范例绘示于附图中。在可能的情况下，在附图与说明书中所使用相同的符号代表相同或相似的部件。
本发明提出一种藉由使用化学及激光处理的组合来在基板上形成图形化金属层结构制造方法。基板可以是(例如，金属的)且用来作为基板的金属可以是例如镍(Nickel)。在传统方法下，固定装置(fixtures)、设备以及光掩膜(mask)基本上会需要遮蔽且防止不该受到曝光成为形成介质的图案的区域。然而，本发明提出的方法不需要光掩膜及相关固定装置与设备，且形成保护层的图案可藉由化学化合物来制作。一个或多个保护层的开口可藉由激光形成及清除。
前述形成图案的保护层可藉由被称作硫醇(thiol)或硫醇衍生物的化学化合物来形成。硫醇化合物可具有多种类似十八烷硫醇(Octadecanethiol)、壬烷硫醇(Nonanethiol)、1-十六烷硫醇(1-Hexadecanethiol)、1-丁烷硫醇(1-Butanethiol)、叔壬基硫醇(tert-Nonyl mercaptan)、苄基硫醇(Benzyl mercaptan)以及硫酚(Thiophenol)的变体。保护层可伴随一个或这些变体的组合来形成。前述的包括硫醇或硫醇衍生物的化学溶液在本发明中可视为硫醇化合物。
在本发明的一实施例中，形成保护层的化学化合物大多可以是具有一些非活性(non-reactive)元素及杂质的硫醇化合物。在大量生产的过程中，硫醇化合物是可调整的，且不需要固化(curing)并依据树脂(resin)所需的固化后更进一步处理。硫醇化合物为可激光或对激光敏感的(laser sensitive)使硫醇化合物可轻易藉由激光处理来移除或清除的。且硫醇化合物具有良好附着于金属基板上且能够与电镀液之间形成扩散阻障层(diffusion barrier layer)。例如，硫醇化合物非常良好地连接于镍，其不仅视为防止无电解电镀液与镍层反应的扩散阻障层，亦会避免镍层的氧化。藉此，藉由应用一般二维(2D)或三维(3D)激光于包括硫醇化合物的化学保护层，复合图案会以保护层开口形成于保护层，以使得可藉由使用无电解电镀(electroless plating)来沉积金属至保护层的开口。此技术除了能够有非常高速率的生产之外，亦能够使用光点更小的激光，对于图形化具有高分辨率。
藉由使用本发明所提出的方法，可开发出一种基板结构。此基板结构可包括至少一个基底、第一金属层、第一保护层、第二保护层以及第二金属层，但不仅限于此。第一金属层可配置于基底上。第一保护层可配置于第一金属层上以作为扩散阻障层。第二保护层可以是硫醇化合物。藉由使用一般的激光来蚀刻第二保护层以形成图案，图形化的第二保护层可包括一个或多个开口，其中第二金属层可配置于开口中以附着至第一保护层。第二金属层可经由无电解电镀配置于开口中。基板结构可用于机械或电子结构的变种(例如，连接器、天线等)。然而，本发明的基板结构不仅限于如同可用于需要形成金属图案于基板上的任何结构或任何应用的基板结构的任何特定应用。
本发明所提出的方法可具有下列优点。第一，本发明提出的方法可藉由激光蚀刻将金属层形成任何复合结构或几何形状。第二，本发明提出的过程，所有需要的设备、固定装置以及无电解电镀液(electroless bath)可轻易地以低花费的方法取得，此过程亦可自动化于大量生产。第三，本发明提出的方法相比显影、电镀的传统方法更快速。第四，图形化金属层仅用于第二保护层的图形化开口中，相比旧有技术可节省下相当可观的金属材料。第五，当第二保护层浸入包括硫醇化合物的溶液以配置于第一保护层上时，不再需要送至第一保护层上类似环氧树脂的聚合树脂的喷涂。第六，当硫醇化合物在基板上形成外膜时，由于硫醇单一层形成的外模模厚并不会增加模具(mold)尺寸；相比既有涉及树脂的应用的技术时，光致抗蚀剂外模的厚度大。因此当基板与其他部分组合时，外模厚度将影响图形化金属层尺寸。
为了进步一步阐明本发明，本发明藉由图1A～图1F及这些附图所对应的说明而提出一实施例。请参照图1A，基板或基底(base)101可作为基底(foundation)且作为基板结构的一部分。基底101可为硬性或可调整的。基底101可由聚合物(polymer)制成。然而，只要基底101可为基板结构及为附着于其上的后续层提供足够的稳定，本发明不仅限于聚合物且任何金属的或非金属的材料皆可用于基底101。并依据图1A，藉由激光蚀刻于基底101形成凹槽部分以移除部分的基底101，且第一金属层接续配置于凹槽部分。然而，凹槽部分的形成是选择性的，且下一层可配置于基底101的表面上而不是凹槽部分。
然后，如图1B所示，第一金属层102可形成于基底101的表面上。例如，假设基底101已藉由激光蚀刻而形成凹槽，第一金属层102(例如，铜)可藉由电镀来配置于基底101的表面上。例如，假设本发明提出的基板结构用以作为天线，则第一金属层可以是用于天线的铜。然而，铜的使用仅为示例且不应被理解来限制本发明。第一金属层亦可为金、银或镍。
图1C为依据本发明一实施例所绘示的配置于第一金属层102上的第一保护层103的形成。因为第二金属层最终会是图形化层，则需要第一保护层103来防止第一金属层102及第二金属层之间的扩散。并且第一保护层103可防止第一金属层102的表面的氧化。藉此，第一保护层103可藉由使用例如无电解电镀来配置于第一金属层102上。然而，只要第一保护层103可附着于第一金属层102，亦可使用如同电镀或溅射(Sputtering)的传统技术。第一保护层103作为两金属层之间良好的扩散阻障层。然而，第一保护层103的材料亦可视为扩散阻障且防止金属层氧化的材料，第一保护层103可以是银或任何其他具有上述特性的材料。
接续于第一保护层103的形成，如图1D所示，第二保护层104可配置于第一保护层103上。第二保护层104可藉由涂布包括如同前述的硫醇或硫醇衍生物的液体溶液而配置于第一保护层103。例如，液体溶液可以藉由浸涂(dip coating)第一保护层103于溶液以形成第二保护层104来涂布于第一保护层103。若第一金属层102为镍层，则包括硫醇化合物的液体溶液可良好附着于镍。第二保护层104可简单地藉由让最近所浸涂的第二保护层104放置于室温下来固定于第一保护层103上，或者第二保护层104可放置于烘箱(oven)内以加速形成过程。如同本发明提出的第二保护层104的应用不需要涂布如同环氧树脂的聚合树脂喷涂的额外步骤。第二保护层104可视为光掩膜、阻障或遮蔽，以防止图形化第二保护层104后第二金属层配置于第一保护层的非预期的位置上。
图1E为依据本发明一实施例所绘示的第二保护层104固定于第一保护层103上后图形化第二保护层104。因为硫醇化合物对激光敏感，则可应用一般的激光来移除第二保护层104的图案部分105。图案部分105可包括通过可配置于附着于第一保护层103的第二金属层的一个或多个开口。此过程步骤可使用显影来置换传统技术，但无须任何光掩膜及固定装置，以如同可藉由应用激光束于图案部分105以激光蚀刻第二保护层104来形成图案部分105般的图形化第二保护层104。
在已藉由激光的应用来蚀刻出第二保护层104的图案部分105之后，图1F为依据本发明一实施例所绘示的第二金属层106的形成。第二金属层106可藉由配置第二金属层106于藉由图案部分105成形的一个或多个开口来形成。例如，第二金属层可藉由无电解电镀配置于第一保护层103上的一个或多个开口。(即，藉由暴露第二保护层104的一个或多个开口于无电解电镀液而不是电极(electrode)的应用。)第二金属层106可以是例如金。然而，用于第二金属层106的材料液可以是铜、银或任何其他高传导性的金属。
藉由本发明提出的方法所制造的基板结构可包括基底101、第一金属层102、第一保护层103、第二保护层104以及第二金属层106，其中第一金属层102配置于基底101上，第一保护层103配置于第一金属层102上，第二保护层104包括配置于第一保护层103上的硫醇化合物的化学溶液化合物所制成的，且第二金属层106配置于第一保护层103上。第二保护层104可包括图案部分105，此图案部分105包括暴露于第一保护层103的一个或多个开口。第二金属层106可配置于一个或多个开口内且配置于第一保护层103上。
图2为依据本发明的一实施例总结制造基板结构的过程的流程图。在步骤S201中，形成第一金属层于基底上。在步骤S202中，形成第一保护层于第一金属层上。在步骤S203中，藉由使用包括硫醇基的化合物来形成第二保护层于第一保护层上。在步骤S204中，图形化第二保护层以形成具有暴露第一保护层的开口的图案。在步骤S205中，形成第二金属层于第二保护层的该开口内，且直接形成于第一保护层上。
用于本发明的所公开实施例的详细描述中的组件、动作或指令不应解释为对本发明而言为绝对关键或必要的，除非明确地如此描述。而且，如本文中所使用，用词“一”可包含一个以上项目。如果希望仅一个项目，那么将使用术语“单一”或类似语言。此外，如本文中所使用，在多个项目和/或多个项目种类的列表之前的术语“中的任一者”希望包含所述项目和/或项目种类分别地或结合其他项目和/或其他项目种类“中的任一者”、“中的任何组合”、“中的任何多个”和/或“中的多个的任何组合”。另外，如本文中所使用，术语“集合”希望包含任何数量个项目，包含零个。另外，如本文中所使用，术语“数量”希望包含任何数量，包含零。
虽然本发明已以实施例公开如上，然而其并非用以限定本发明，任何本领域的技术人员，在不脱离本发明的精神和范围的情况下，应当可作些许的更动与润饰，故本发明的保护范围应当视所附的权利要求书所界定者为准。

Claims (19)

1.一种基板结构的制造方法，该方法包括：
直接形成一第一金属层于一基底上；
直接形成一第一保护层于该第一金属层上；
藉由使用包括一硫醇基的一化合物来直接形成一第二保护层于该第一保护层上；
图形化该第二保护层以形成具有暴露该第一保护层的一开口的一图案；以及
形成一第二金属层于该第二保护层的该开口内，且直接形成于该第一保护层上；
其中直接形成该第一金属层于该基底的步骤包括：使用激光以形成一凹槽于该基底；以及配置该第一金属层于该凹槽内。
2.如权利要求1所述的方法，其中该化合物选自由十八烷硫醇基、壬烷硫醇基、1-十六烷硫醇基、1-丁烷硫醇基、叔壬基硫醇基、苄基硫醇基以及硫酚基组成的组。
3.如权利要求1所述的方法，其中形成该第二保护层的步骤包括：
涂布该化合物的一溶液于该第一保护层。
4.如权利要求1所述的方法，其中图形化该第二保护层的步骤包括使用激光来蚀刻该第二保护层以形成该图案。
5.如权利要求1所述的方法，其中该第一金属层为铜或铝。
6.如权利要求1所述的方法，其中该第一保护层为一扩散阻障层，其中该扩散阻障层防止该第一金属层以及该第二金属层之间的扩散且防止该第一金属层的氧化。
7.如权利要求6所述的方法，其中该第一保护层为镍或银。
8.如权利要求1所述的方法，其中形成该第一金属层的步骤包括藉由使用无电解电镀来直接形成该第一金属层于该基底的该凹槽内。
9.如权利要求1所述的方法，其中形成该第二金属层的步骤包括藉由使用无电解电镀来直接形成该第二金属层于该第一保护层上。
10.如权利要求1所述的方法，其中图形化该第二保护层的步骤不包括光掩膜。
11.如权利要求1所述的方法，其中形成该第二保护层的步骤不包括聚合树脂的喷涂。
12.一种基板结构，该基板结构包括：
一具有凹槽的基底；
一第一金属层，该第一金属层配置于该基底的该凹槽内；
一第一保护层，该第一保护层配置于该第一金属层上；
一第二保护层，该第二保护层包括配置于该第一保护层上的一硫醇化合物，且具有包含暴露该第一保护层的一开口的一图案；以及
一第二金属层，该第二金属层配置于该开口内，且配置于该第一保护层上。
13.如权利要求12所述的基板结构，其中该硫醇化合物为十八烷硫醇。
14.如权利要求12所述的基板结构，其中该硫醇化合物选自由壬烷硫醇基、1-十六烷硫醇基、1-丁烷硫醇基、叔壬基硫醇基、苄基硫醇基以及硫酚基组成的组。
15.如权利要求12所述的基板结构，其中该第一金属层为铜或铝。
16.如权利要求12所述的基板结构，其中该第一保护层为一扩散阻障层，其中该扩散阻障层防止该第一金属层以及该第二金属层之间的扩散且防止氧化。
17.如权利要求16所述的基板结构，其中该第一保护层为镍、银或铬。
18.如权利要求12所述的基板结构，其中该基底为聚合物。
19.如权利要求12所述的基板结构，其中该第二金属层为金。
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