JP2005518086A5 - - Google Patents

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Publication number
JP2005518086A5
JP2005518086A5 JP2003504423A JP2003504423A JP2005518086A5 JP 2005518086 A5 JP2005518086 A5 JP 2005518086A5 JP 2003504423 A JP2003504423 A JP 2003504423A JP 2003504423 A JP2003504423 A JP 2003504423A JP 2005518086 A5 JP2005518086 A5 JP 2005518086A5
Authority
JP
Japan
Prior art keywords
photoresist
layer
nickel layer
substrate
nickel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003504423A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005518086A (ja
Filing date
Publication date
Priority claimed from US09/878,365 external-priority patent/US6763575B2/en
Application filed filed Critical
Publication of JP2005518086A publication Critical patent/JP2005518086A/ja
Publication of JP2005518086A5 publication Critical patent/JP2005518086A5/ja
Pending legal-status Critical Current

Links

JP2003504423A 2001-06-11 2002-05-24 集積化インダクタコアを有するプリント回路板 Pending JP2005518086A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/878,365 US6763575B2 (en) 2001-06-11 2001-06-11 Printed circuit boards having integrated inductor cores
PCT/US2002/016824 WO2002101766A1 (en) 2001-06-11 2002-05-24 Improved method for forming magnetic layers in printed circuit boards

Publications (2)

Publication Number Publication Date
JP2005518086A JP2005518086A (ja) 2005-06-16
JP2005518086A5 true JP2005518086A5 (enExample) 2005-12-22

Family

ID=25371891

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003504423A Pending JP2005518086A (ja) 2001-06-11 2002-05-24 集積化インダクタコアを有するプリント回路板

Country Status (7)

Country Link
US (1) US6763575B2 (enExample)
EP (1) EP1399935A1 (enExample)
JP (1) JP2005518086A (enExample)
CN (1) CN100440391C (enExample)
MY (1) MY138599A (enExample)
TW (1) TW546993B (enExample)
WO (1) WO2002101766A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030179816A1 (en) * 2002-03-21 2003-09-25 Broadcom Corporation Auto power down for forced speed modes
CN100580825C (zh) * 2003-08-26 2010-01-13 皇家飞利浦电子股份有限公司 超薄挠性电感器
JP4253644B2 (ja) * 2004-06-28 2009-04-15 理研鍛造株式会社 内燃機関用ピストンの製造方法
US20060109071A1 (en) * 2004-11-19 2006-05-25 Thongsouk Christopher H Circuit board inductor
US7410899B2 (en) * 2005-09-20 2008-08-12 Enthone, Inc. Defectivity and process control of electroless deposition in microelectronics applications
US7598596B2 (en) * 2006-11-21 2009-10-06 Freescale Semiconductor, Inc. Methods and apparatus for a dual-metal magnetic shield structure
JP6953279B2 (ja) * 2016-12-07 2021-10-27 日東電工株式会社 モジュールの製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL297713A (enExample) * 1962-09-10 1900-01-01
US3998601A (en) * 1973-12-03 1976-12-21 Yates Industries, Inc. Thin foil
US5403672A (en) * 1992-08-17 1995-04-04 Hitachi Chemical Co., Ltd. Metal foil for printed wiring board and production thereof
JP2762386B2 (ja) * 1993-03-19 1998-06-04 三井金属鉱業株式会社 銅張り積層板およびプリント配線板
DE4432725C1 (de) 1994-09-14 1996-01-11 Fraunhofer Ges Forschung Verfahren zur Herstellung eines dreidimensionalen Bauteils oder einer Bauteilgruppe
US6117300A (en) * 1996-05-01 2000-09-12 Honeywell International Inc. Method for forming conductive traces and printed circuits made thereby
US6191495B1 (en) * 1997-06-10 2001-02-20 Lucent Technologies Inc. Micromagnetic device having an anisotropic ferromagnetic core and method of manufacture therefor

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