TWI273147B - Method for plating on a substrate and conductive dry film used in the method - Google Patents

Abstract

A method for plating on substrate and a conductive dry film used in the method are disclosed. According to the method a conductive dry film is provided having a conductive surface and a non-conductive surface. When the conductive dry film is disposed on the substrate, the conductive surface tightly contacts the substrate. The conductive dry film is patterned to form a hollow pattern. By means of electrical connection of the conductive dry film on the substrate, at least a metal layer can be plated in the hollow pattern. Plating layers can be formed without connection of plating lines.

Description

1273147

BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a substrate plating method, and more particularly to a substrate electrowinning method for an electroless mine connection. [Prior Art] The conventional circuit substrate includes a plating operation in the back-end process to protect the exposed metal pad or circuit and improve the soldering characteristics. Therefore, the circuit substrate is designed with an appropriate plating line or a plating lead path to facilitate plating. As the circuit board is densed and used for special purposes, the circuit board needs to add independent pads or independent lines in the section where the plating line is missing, resulting in difficulty in post plating. V'' A conventional substrate plating method, as disclosed in the Republic of China Patent Publication No. 5 93 789 唬 "Substrate Plating Process", the process comprising the steps of: providing a substrate having a completed front-end process, the substrate having a meaning The inner circuit of the board, a first surface and a corresponding one of the second surfaces, the first surface has a plurality of first contact pads and a plurality of circuit patterns, wherein the surface has a plurality of second contact pads and a plurality of lines Κ and the second surface system respectively have a solder resist layer for covering the circuit patterns. And exposing the first contact pad and the second contact pad, for the purpose of electric ore bonding, a conductive seed layer is on the first surface of the substrate, and then electroplating to form a first The metal layer and a second metal layer are on the conductive seed layer and the second contact pads, and the first metal layer and the conductive seed layer are patterned. Therefore, with respect to the electroplating process in which the electroplating line is connected, the additional conductive seed layer formation and processing steps need to be additionally added, so the manufacturing cost will be greatly increased, which is disadvantageous.

Page 6 1273147 < Case No. 93131283_ Year Month 修正 Amendment _ V. Invention Description (2) Mass production. In addition, the method for forming the conductive seed layer is sputtering or electroless plating. Unlike the electroplating method of the conventional substrate, it is necessary to purchase an additional sputtering clock or electroless plating. device. The main purpose of the present invention is to provide a method for electrically forging a substrate by disposing a conductive photoresist film having a conductive surface and a non-conductive surface on a substrate, and the conductive photoresist is dried. The film is adhered to the substrate by the conductive surface. After the conductive photoresist dry film is patterned, at least one metal layer is plated on the substrate, and a plurality of independent lines can be formed by electroless plating. Independent. Another object of the present invention is to provide a method for plating a substrate by using a conductive photoresist film having a conductive surface and a non-conductive surface, and attaching the conductive surface of the V-electric photoresist film to the conductive surface On a substrate having a separate pad or a separate line, after patterning the conductive photoresist dry film, an electroless plating line connection can be used to form at least one metal layer on the substrate or a separate pad of the substrate, (2) μ w you take the fork for an isoelectric dry film, which contains - a conductive photosensitive layer and a non-conductive photosensitive layer; Yi + green, * social power and one of the substrate to be plated surface, in... A plurality of independent lines or independent pads are formed under the connection of the ore line. The purpose of the invention is to provide a conductive photoresist dry film, a photoconductive photosensitive layer and a non-conductive photosensitive layer, and the conductive surface of the conductive dry layer is attached to a substrate having independent pads or independent lines.

Page 7 1273147 Amendment 曰 虎 Tiger 93131283 V. INSTRUCTIONS (3) I want to make a metal layer on the substrate or independent line of the substrate by electroless plating. Firstly, according to the substrate electrowinning method of the invention, it mainly comprises the following steps: 1. The stomach i provides a conductive photoresist dry film having a plate 2 electric surface and a non-conductive surface; The conductive photoresist dry film is adhered to the conductive surface of the conductive photoresist film on a substrate, and then the conductive photoresist film is patterned to make the conductive light Forming a hollow pattern; thereafter, forming at least one metal layer in the hollow pattern by electro-V-plating of the conductive photoresist dry film to form 2 independent lines, independent connection pads or in electroless plating The line connecting the wires and the connection pads are plated to form a protective metal layer. [Embodiment] A first embodiment of the present invention, a substrate electro-recording method for electroless plating connection, first, referring to FIG. A, a conductive photoresist dry film 11 〇 'the conductive photoresist The dry film 丨 1 () comprises a non-conductive photosensitive layer m, a conductive photosensitive layer 112, a carrier film 113 (carrier film) and a cover film 114 (cover film), the conductive photoresist dry film 11 has A non-conductive surface 115 and a conductive surface 116, wherein the non-conductive surface 115 is a surface of the non-conductive photosensitive layer 111, and the conductive surface 116 is a surface of the conductive photosensitive layer 112, and the non-conductive surface 115 may not have The thickness of the conductive surface layer 11 is not more than one-half the thickness of the non-conductive photosensitive layer 111, and the material of the conductive photosensitive layer 112 is included. There is a photoresist material which is the same as the non-conductive photosensitive layer ill. In the embodiment, the thickness of the conductive photosensitive layer 丨丨2 is about

1273147 _ Case No. 93131283 V. Description of the invention (4) 1 · 0 // m is preferred; the carrier film 113 is disposed on the non-conductive surface 11 of the conductive photoresist film 11 , for carrying the non-conductive a photosensitive layer 丨丨丨 and the conductive photosensitive layer 112, the carrier film 113 may be a PET (polyethylene terephthalate) film, and the cover film 11 is disposed on the conductive photoresist dry film 丨丨The conductive surface 11 6 ′ is used to protect the non-conductive photosensitive layer 1丨1 and the conductive photosensitive layer 112. The & cover film 4 can be an LDPE (low density polyethylene) film: Please refer to FIG. 1B. The conductive photoresist film is disposed on a substrate 120, and the cover film 114 is removed, and the conductive surface 116 of the conductive photoresist film 110 is attached to one of the substrates 12 The upper surface 121 may be an epoxy resin or BT resin substrate, a polyimide film, a ceramic substrate, or another substrate of a semiconductor substrate in which a fiberglass reinforced fiber is mixed. After that, the conductive photoresist dry film 1 1 图案 is patterned to form a hollow pattern 117, and the patterning step is described later. Referring to FIG. lc, the photomask is disposed on the photomask. The film 11 is coated on the carrier film 13 and exposed to the conductive photoresist film 11A. In the present embodiment, the film 112b contains the same photoresist material as the non-conductive photosensitive layer 1U. The same ultraviolet light (UV light) simultaneously exposes the non-conductive photosensitive acoustic conductive layer 112; after that, please refer to the second, expose the non-conductive surface of the conductive photoresist dry film 11G. Raw* resisting dry film 110 is developed to form a line-like recess' to create an independent line of electroless plating connection #路17#

Page 9 1273147 V. Invention Description (5) ----- " (independence trace) ‘Or a separate pad with no electric shovel connection. Referring to FIG. 1F, the conductive photosensitive layer 112 of the conductive photoresist film 11 is electrically conductive on the substrate 120, and an electroplating technique may be applied on the surface of the substrate 12 121 is formed in the hollow pattern 117 to form at least one metal layer 141. At this time, the non-conductive surface 115 of the conductive photoresist film 110 is immersed in the plating solution, so that no metal is deposited on the conductive layer. The photoresist film 11 is coated, but in the hollow pattern 117, a suitable metal layer 141 such as copper, nickel, gold, aluminum, tin-lead or other suitable metal layer can be formed. In this embodiment, The metal layer 14 is a copper layer corresponding to the shape of the hollow pattern 117, and may constitute a separate line or a separate pad of the substrate 120. Preferably, referring to FIG. 1 , a nickel layer 142 can be re-plated onto the metal layer 14 by the electrical conduction of the conductive photoresist dry film 11 on the substrate 12 ;; The first layer of FIG. The metal layer 141 can be protected from the gold layer 143 to prevent oxidation of the metal layer 141. Please refer to FIG. 11 to remove the conductive photoresist dry film crucible, which can remove the non-conductive photosensitive layer 丨丨1 and the conductive photosensitive layer 112 by using the same photoresist cleaning agent, so that the gold layer 143 The nickel layer 142 or the metal layer 141 is exposed on the upper surface 121 of the substrate 120. Therefore, in the above substrate plating method, the conductive surface 116 of the conductive photoresist film 110 is attached to the substrate 12A, and the conductive light is used.

Page 10 1273147 - -~ Welcome to 283 - _ _ _ _ _ _ 5, invention description (6) ----- resistive dry film 11 〇 electrically conductive on the substrate 12 ,, in the electroless plating line Under the connection, a predetermined independent circuit or a separate pad can be formed on the circuit substrate 120 for use in a high-density printed circuit board, a semiconductor substrate, a ceramic substrate or a BT resin substrate, etc., so that the circuit design is performed. Can be more flexible and flexible. According to a second embodiment of the present invention, please refer to FIG. 2A to FIG. 2, which is a cross-sectional view of the substrate in another substrate plating process. Referring to FIG. 2a, a conductive photoresist dry film 21 (1) is provided. The conductive photoresist dry film 21 comprises a non-conductive photosensitive layer 2U, a conductive photosensitive layer 212, a carrier film 213 and a carrier film 213. Cover film 214. The conductive photoresist film 2 has a non-conductive surface 215 and a conductive surface 216, wherein the non-conductive surface 215 is a surface of the non-conductive photosensitive layer 211, and the conductive surface 216 is the conductive photosensitive layer. 21 2 one of the surfaces. The carrier film 213 is attached to the non-conductive surface 215 of the conductive photoresist film 21 0. The cover film 214 is attached to the conductive surface 216 of the conductive photoresist film 210. Referring to FIG. 2B, the conductive photoresist dry film 2 1 is disposed on the upper surface 221 of a substrate 220. The substrate 220 is provided with at least one connection pad 222 or other conductive pads or lines. In the present embodiment, the connection port 222 is a dummy pad which is not connected to any plating line. In the process of disposing the conductive photoresist film 21, the system is not shown. The cover film 2 14 is removed first, and the conductive surface 216 of the conductive photoresist dry film 210 is in close contact with the upper surface 221 of the substrate 220. Referring to FIG. 2C, the conductive photoresist dry film 210 is patterned such that the conductive light Ik dry film 210 is formed with a hollow pattern 217 to use the same

Page 11 1273147 MM_9313^283^--Yearly 曰__ Amendment 5, the ultraviolet light of the invention (7), the non-conductive photosensitive layer 211 and the conductive photosensitive layer 212 are patterned, in the present embodiment, the hollowing out The pattern 2 i 7 is a block-shaped recess and is aligned with the connection pad 222 , and the conductive photosensitive layer 21 2 of the conductive photoresist film 210 is electrically coupled to the connection pad 2 2 2 to form a power supply plating. A protective metal layer on the connection pad 222. In the second and second embodiments, the conductive photosensitive layer 212 of the conductive photoresist film 21 is electrically connected to the substrate 220, and at least one metal layer is formed in the hollow pattern 217 by electroplating. In this embodiment, the plating is formed on the tantalum connection pad 22 and includes a nickel layer 231 and a gold layer 232. 2, referring to FIG. 2F, the conductive photoresist dry film 21 is removed, so that the outermost gold layer 232 on the connection pad 222 is exposed. Thus, the % map can be on the upper surface 221 of the substrate 220. Covering a solder mask layer 240, the solder resist layer 24 can be formed after the step of removing the conductive photoresist film 2m, or preformed in the conductive photoresist film 21 prior to. By using the above substrate plating method, an appropriate gold layer can be formed by electroplating on a substrate or a separate line. The scope of the present invention is defined by the appended claims, and any changes and modifications made by those skilled in the art without departing from the scope of the invention are within the scope of the invention.巳

' 1273147

[Illustration of the diagram] 1A to 1 I············································· ·• 太 汰 口 _ 1 ^ Φ % 4 ^ The second specific embodiment of the current month, another substrate in a substrate plating process schematic diagram. Brief description of the components: 11 0 conductive photoresist dry 111 non-conductive photosensitive layer ii 2 114 cover film 117 hollow pattern 120 substrate 121 130 photomask 141 metal layer 142 21 0 conductive photoresist dry film 211 non-conductive photosensitive layer 212 214 cover film 215 21 7 hollow pattern 2 2 0 substrate 221 231 nickel layer 232 240 solder resist layer conductive photosensitive layer 113 carrier film non-conductive surface 116 conductive surface surface nickel layer 143 gold layer conductive photosensitive layer 213 carrier film non-conductive surface 216 Conductive surface 222 is connected to the gold layer

Page 13

Claims (1)

1273147 ___素号93131281-3 夕年[〇月α &曰_修正_6, application patent scope [application patent scope] 1, a substrate plating method, comprising: providing a conductive photoresist dry film 'this The conductive photoresist dry film has a conductive surface and a non-conductive surface; the conductive photoresist dry film is disposed on a substrate, wherein the conductive surface of the conductive photoresist is attached to the substrate; The conductive photoresist dry film 'so that the conductive photoresist dry film is formed with a hollow pattern; and 藉 electrically conductively conductive on the substrate by the conductive photoresist dry film, the electric ore forms at least one metal layer The openwork pattern. 2. The substrate electrical method of claim 1, wherein the conductive photoresist film comprises a conductive photosensitive layer and a non-conductive photosensitive layer. 3. The substrate electrowinning method according to claim 2, wherein the conductive photosensitive layer has a thickness of about 1.0 //m. 4. The substrate electric clock method of claim 2, wherein the conductive photosensitive layer comprises the same photoresist material as the non-conductive photosensitive layer. 5. The substrate plating method according to claim 2, wherein the conductive photosensitive layer and the non-conductive photosensitive layer are exposed using the same ultraviolet light (uv 1 ight). 6. The substrate plating method of claim 1, wherein the substrate comprises a connection pad exposed in the hollow pattern and electrically coupled to the conductive photoresist dry film. 7. The substrate plating method according to claim 1, wherein the method Page 14 1273147 Case No. 931 妁 曰 One Amendment VI. Patent Application The hollow pattern is a line-shaped depression. 8. The substrate plating method according to the above-mentioned patent application, wherein the hollow pattern in the bean is a block-shaped depression. 9. The substrate plating method of claim 2, wherein the metal layer is selected from the group consisting of copper, nickel and gold. The substrate electrowinning method according to claim 1, wherein the conductive photoresist film comprises a carrier film (carrier filn0, the bean system is attached to the non-conductive surface. 11. The substrate plating method of claim 10, wherein the conductive photoresist dry film comprises a cover film (c〇ver fu and is disposed on the conductive surface. 12, the substrate plating as described in claim 1 The method further includes a step of removing the conductive photoresist dry film. The method of substrate electroplating according to the above-mentioned claim, wherein the method for processing the conductive photoresist dry film comprises The substrate plating method according to claim 1, wherein before the removing the conductive photoresist (4), the layer formed in the hollow pattern comprises a nickel layer and a gold layer. The substrate plating method of claim 1, wherein the layer of the hollow pattern layer comprises a copper layer, a nickel layer and a gold layer before the 忒V electrical photoresist dry film is removed. To the 'electricity The light absorbing layer, to form a conductive surface; and a = A conductive dry film photoresist, which lines have a conductive surface and a non-conductive surface, the conductive lines dry film photoresist comprising: Page 15 1273147 修正 Correct the non-conductive photosensitive layer to form a non-conductive surface. [17] The conductive photoresist dry film of claim 6, wherein the conductive photosensitive layer has a thickness of about 10/zm. ^ The conductive photoresist dry film according to claim 16 of the patent application, each of which has a carrier film (carrier fi lm) and a cover film (cover, the carrier film is attached to the non-conductive surface, The cover film is attached to the conductive surface. The conductive photoresist dry film according to item 16 of the invention, wherein the quality 4 inductive light layer comprises the same photoresist as the non-conductive photosensitive layer 1273147 _ Case No. 93131283_ Year Month 曰 Amendment _ VI. Designated representative figure (1) The designated representative figure of this case is: 1F figure (2), the representative figure of this representative figure is a simple description: 110 Conductive photoresist dry film 111 non-conductive photosensitive layer 112 conductive photosensitive layer 115 non-conductive surface 116 conductive surface 117 hollow pattern 120 substrate 121 upper surface 141 metal layer