JP2002531915A - リソグラフィ接触要素 - Google Patents

リソグラフィ接触要素

Info

Publication number
JP2002531915A
JP2002531915A JP2000585674A JP2000585674A JP2002531915A JP 2002531915 A JP2002531915 A JP 2002531915A JP 2000585674 A JP2000585674 A JP 2000585674A JP 2000585674 A JP2000585674 A JP 2000585674A JP 2002531915 A JP2002531915 A JP 2002531915A
Authority
JP
Japan
Prior art keywords
contact element
component
substrate
mask material
conductive material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000585674A
Other languages
English (en)
Japanese (ja)
Inventor
マシュー，ゲータン，エル
エルドリッジ，ベンジャミン，エヌ
グルーブ，ゲーリー，ダブリュー
Original Assignee
フォームファクター，インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/205,023 external-priority patent/US6255126B1/en
Priority claimed from US09/205,022 external-priority patent/US6268015B1/en
Application filed by フォームファクター，インコーポレイテッド filed Critical フォームファクター，インコーポレイテッド
Publication of JP2002531915A publication Critical patent/JP2002531915A/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G01R1/06761—Material aspects related to layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Connecting Device With Holders (AREA)
JP2000585674A 1998-12-02 1999-12-01 リソグラフィ接触要素 Pending JP2002531915A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US09/205,022 1998-12-02
US09/205,023 US6255126B1 (en) 1998-12-02 1998-12-02 Lithographic contact elements
US09/205,023 1998-12-02
US09/205,022 US6268015B1 (en) 1998-12-02 1998-12-02 Method of making and using lithographic contact springs
PCT/US1999/028597 WO2000033089A2 (en) 1998-12-02 1999-12-01 Lithographic contact elements

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2003322281A Division JP2004186670A (ja) 1998-12-02 2003-09-12 リソグラフィ接触要素

Publications (1)

Publication Number Publication Date
JP2002531915A true JP2002531915A (ja) 2002-09-24

Family

ID=26900020

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2000585674A Pending JP2002531915A (ja) 1998-12-02 1999-12-01 リソグラフィ接触要素
JP2003322281A Pending JP2004186670A (ja) 1998-12-02 2003-09-12 リソグラフィ接触要素
JP2010182073A Pending JP2010266465A (ja) 1998-12-02 2010-08-17 電子デバイス

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2003322281A Pending JP2004186670A (ja) 1998-12-02 2003-09-12 リソグラフィ接触要素
JP2010182073A Pending JP2010266465A (ja) 1998-12-02 2010-08-17 電子デバイス

Country Status (9)

Country Link
US (2) US7553165B2 (enExample)
EP (2) EP1316803A3 (enExample)
JP (3) JP2002531915A (enExample)
KR (6) KR20010078403A (enExample)
CN (1) CN1276259C (enExample)
AU (1) AU2038000A (enExample)
DE (1) DE69908638T2 (enExample)
TW (1) TW589453B (enExample)
WO (1) WO2000033089A2 (enExample)

Cited By (20)

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JP2004309331A (ja) * 2003-04-08 2004-11-04 Micronics Japan Co Ltd 接触子の製造方法
JP2004317162A (ja) * 2003-04-11 2004-11-11 Masaki Esashi プローブカード、プローブピン及びその製造方法
JP2004317492A (ja) * 2003-04-11 2004-11-11 Yulim Hitech Inc プローブカードのニードルアセンブリ
WO2006085573A1 (ja) * 2005-02-10 2006-08-17 Tokyo Electron Limited インターポーザ、プローブカードおよびインターポーザの製造方法
JP2006215022A (ja) * 2005-02-03 2006-08-17 Mjc Probe Inc 嵌入式マイクロタッチユニット及びその製造法
JP2007309817A (ja) * 2006-05-19 2007-11-29 Seiko Instruments Inc 相互接続部材の製造方法
JP2008511007A (ja) * 2004-08-26 2008-04-10 エス・ブイ・プローブ・プライベート・リミテッド 積層された先端を有する片持ち梁電気コネクタ
JP2008513801A (ja) * 2004-09-22 2008-05-01 パイコム・コーポレーション 垂直型電気的接触体の製造方法及びこれによる垂直型電気的接触体
JP2008151573A (ja) * 2006-12-15 2008-07-03 Micronics Japan Co Ltd 電気的接続装置およびその製造方法
WO2009072368A1 (ja) * 2007-12-05 2009-06-11 Tokyo Electron Limited プローブ
JP2009145315A (ja) * 2007-12-12 2009-07-02 Phicom Corp 接続素子の整列方法
JP2010501115A (ja) * 2006-08-17 2010-01-14 エヌエックスピー ビー ヴィ 基板と基板上の突起電極との間の応力低減
JP2010038899A (ja) * 2008-08-05 2010-02-18 Samsung Electro-Mechanics Co Ltd セラミックプローブカードの製造方法
JP2010042500A (ja) * 2008-08-12 2010-02-25 Samsung Electro-Mechanics Co Ltd マイクロ電子機械的部品の製造方法
JP2010107245A (ja) * 2008-10-28 2010-05-13 Japan Electronic Materials Corp コンタクトプローブの製造方法
US7724006B2 (en) 2008-02-27 2010-05-25 Renesas Technology Corp. Probe card, manufacturing method of probe card, semiconductor inspection apparatus and manufacturing method of semiconductor device
JP2012014854A (ja) * 2010-06-29 2012-01-19 Molex Inc シート状コネクタ、及びその製造方法
JPWO2018003507A1 (ja) * 2016-06-28 2019-04-25 株式会社日本マイクロニクス 電気的接続装置及び接触子
KR20200029766A (ko) * 2018-09-11 2020-03-19 삼성전자주식회사 프로브 및 이를 포함하는 프로브 카드
KR20220153661A (ko) * 2014-12-30 2022-11-18 테크노프로브 에스.피.에이. 테스트 헤드용 접촉 프로브

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US7063541B2 (en) * 1997-03-17 2006-06-20 Formfactor, Inc. Composite microelectronic spring structure and method for making same
US6807734B2 (en) * 1998-02-13 2004-10-26 Formfactor, Inc. Microelectronic contact structures, and methods of making same
JP2002531915A (ja) * 1998-12-02 2002-09-24 フォームファクター，インコーポレイテッド リソグラフィ接触要素
US6255126B1 (en) * 1998-12-02 2001-07-03 Formfactor, Inc. Lithographic contact elements
US6888362B2 (en) 2000-11-09 2005-05-03 Formfactor, Inc. Test head assembly for electronic components with plurality of contoured microelectronic spring contacts
US6780001B2 (en) 1999-07-30 2004-08-24 Formfactor, Inc. Forming tool for forming a contoured microelectronic spring mold
US6939474B2 (en) * 1999-07-30 2005-09-06 Formfactor, Inc. Method for forming microelectronic spring structures on a substrate
US7189077B1 (en) 1999-07-30 2007-03-13 Formfactor, Inc. Lithographic type microelectronic spring structures with improved contours
US6290510B1 (en) 2000-07-27 2001-09-18 Xerox Corporation Spring structure with self-aligned release material
WO2002063682A2 (en) * 2000-11-09 2002-08-15 Formfactor, Inc. Lithographic type microelectronic spring structures with improved contours
KR100545073B1 (ko) * 2001-01-29 2006-01-24 스미토모덴키고교가부시키가이샤 콘택트프로브 및 그 제조방법 및 검사장치 및 검사방법
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JP2003028895A (ja) * 2001-07-17 2003-01-29 Kyushu Hitachi Maxell Ltd バンプ付きコンタクトプローブの製造方法
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