JP2002531915A - リソグラフィ接触要素 - Google Patents

リソグラフィ接触要素

Info

Publication number
JP2002531915A
JP2002531915A JP2000585674A JP2000585674A JP2002531915A JP 2002531915 A JP2002531915 A JP 2002531915A JP 2000585674 A JP2000585674 A JP 2000585674A JP 2000585674 A JP2000585674 A JP 2000585674A JP 2002531915 A JP2002531915 A JP 2002531915A
Authority
JP
Japan
Prior art keywords
contact element
component
substrate
mask material
conductive material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000585674A
Other languages
English (en)
Japanese (ja)
Inventor
マシュー，ゲータン，エル
エルドリッジ，ベンジャミン，エヌ
グルーブ，ゲーリー，ダブリュー
Original Assignee
フォームファクター，インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/205,022 external-priority patent/US6268015B1/en
Priority claimed from US09/205,023 external-priority patent/US6255126B1/en
Application filed by フォームファクター，インコーポレイテッド filed Critical フォームファクター，インコーポレイテッド
Publication of JP2002531915A publication Critical patent/JP2002531915A/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G01R1/06761—Material aspects related to layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Connecting Device With Holders (AREA)
JP2000585674A 1998-12-02 1999-12-01 リソグラフィ接触要素 Pending JP2002531915A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US09/205,022 US6268015B1 (en) 1998-12-02 1998-12-02 Method of making and using lithographic contact springs
US09/205,023 US6255126B1 (en) 1998-12-02 1998-12-02 Lithographic contact elements
US09/205,022 1998-12-02
US09/205,023 1998-12-02
PCT/US1999/028597 WO2000033089A2 (en) 1998-12-02 1999-12-01 Lithographic contact elements

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2003322281A Division JP2004186670A (ja) 1998-12-02 2003-09-12 リソグラフィ接触要素

Publications (1)

Publication Number Publication Date
JP2002531915A true JP2002531915A (ja) 2002-09-24

Family

ID=26900020

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2000585674A Pending JP2002531915A (ja) 1998-12-02 1999-12-01 リソグラフィ接触要素
JP2003322281A Pending JP2004186670A (ja) 1998-12-02 2003-09-12 リソグラフィ接触要素
JP2010182073A Pending JP2010266465A (ja) 1998-12-02 2010-08-17 電子デバイス

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2003322281A Pending JP2004186670A (ja) 1998-12-02 2003-09-12 リソグラフィ接触要素
JP2010182073A Pending JP2010266465A (ja) 1998-12-02 2010-08-17 電子デバイス

Country Status (9)

Country Link
US (2) US7553165B2 (enExample)
EP (2) EP1316803A3 (enExample)
JP (3) JP2002531915A (enExample)
KR (6) KR20080024236A (enExample)
CN (1) CN1276259C (enExample)
AU (1) AU2038000A (enExample)
DE (1) DE69908638T2 (enExample)
TW (1) TW589453B (enExample)
WO (1) WO2000033089A2 (enExample)

Cited By (21)

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JP2004309331A (ja) * 2003-04-08 2004-11-04 Micronics Japan Co Ltd 接触子の製造方法
JP2004317162A (ja) * 2003-04-11 2004-11-11 Masaki Esashi プローブカード、プローブピン及びその製造方法
JP2004317492A (ja) * 2003-04-11 2004-11-11 Yulim Hitech Inc プローブカードのニードルアセンブリ
WO2006085573A1 (ja) * 2005-02-10 2006-08-17 Tokyo Electron Limited インターポーザ、プローブカードおよびインターポーザの製造方法
JP2006215022A (ja) * 2005-02-03 2006-08-17 Mjc Probe Inc 嵌入式マイクロタッチユニット及びその製造法
JP2007309817A (ja) * 2006-05-19 2007-11-29 Seiko Instruments Inc 相互接続部材の製造方法
JP2008511007A (ja) * 2004-08-26 2008-04-10 エス・ブイ・プローブ・プライベート・リミテッド 積層された先端を有する片持ち梁電気コネクタ
JP2008513801A (ja) * 2004-09-22 2008-05-01 パイコム・コーポレーション 垂直型電気的接触体の製造方法及びこれによる垂直型電気的接触体
JP2008151573A (ja) * 2006-12-15 2008-07-03 Micronics Japan Co Ltd 電気的接続装置およびその製造方法
WO2009072368A1 (ja) * 2007-12-05 2009-06-11 Tokyo Electron Limited プローブ
JP2009145315A (ja) * 2007-12-12 2009-07-02 Phicom Corp 接続素子の整列方法
JP2010501115A (ja) * 2006-08-17 2010-01-14 エヌエックスピー ビー ヴィ 基板と基板上の突起電極との間の応力低減
JP2010038899A (ja) * 2008-08-05 2010-02-18 Samsung Electro-Mechanics Co Ltd セラミックプローブカードの製造方法
JP2010042500A (ja) * 2008-08-12 2010-02-25 Samsung Electro-Mechanics Co Ltd マイクロ電子機械的部品の製造方法
JP2010107245A (ja) * 2008-10-28 2010-05-13 Japan Electronic Materials Corp コンタクトプローブの製造方法
US7724006B2 (en) 2008-02-27 2010-05-25 Renesas Technology Corp. Probe card, manufacturing method of probe card, semiconductor inspection apparatus and manufacturing method of semiconductor device
JP2012014854A (ja) * 2010-06-29 2012-01-19 Molex Inc シート状コネクタ、及びその製造方法
JPWO2018003507A1 (ja) * 2016-06-28 2019-04-25 株式会社日本マイクロニクス 電気的接続装置及び接触子
KR20200029766A (ko) * 2018-09-11 2020-03-19 삼성전자주식회사 프로브 및 이를 포함하는 프로브 카드
KR20220153661A (ko) * 2014-12-30 2022-11-18 테크노프로브 에스.피.에이. 테스트 헤드용 접촉 프로브
KR20250005400A (ko) * 2023-04-26 2025-01-09 파크 테크-파카징 테크놀로지이스 게엠베하 전자기적 조작에 의한 능동적 사전 정렬을 통해 테스트 콘택트를 용이하게 수용하기 위한 테스트 콘택트, 테이블 장치, 테스트 콘택트 홀딩 장치 및 방법

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EP1316803A3 (en) * 1998-12-02 2005-11-09 Formfactor, Inc. Lithographic contact elements
US6255126B1 (en) * 1998-12-02 2001-07-03 Formfactor, Inc. Lithographic contact elements
US6939474B2 (en) 1999-07-30 2005-09-06 Formfactor, Inc. Method for forming microelectronic spring structures on a substrate
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US20080254651A1 (en) 2008-10-16
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